WO2006091316A3 - Improved rinsing step in supercritical processing - Google Patents

Improved rinsing step in supercritical processing Download PDF

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Publication number
WO2006091316A3
WO2006091316A3 PCT/US2006/002655 US2006002655W WO2006091316A3 WO 2006091316 A3 WO2006091316 A3 WO 2006091316A3 US 2006002655 W US2006002655 W US 2006002655W WO 2006091316 A3 WO2006091316 A3 WO 2006091316A3
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
processing chamber
rinsing step
supercritical processing
rinsing
Prior art date
Application number
PCT/US2006/002655
Other languages
French (fr)
Other versions
WO2006091316A2 (en
Inventor
Richard Brown
Joseph Hillman
Original Assignee
Supercritical Systems Inc
Richard Brown
Joseph Hillman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/065,377 external-priority patent/US20060185693A1/en
Priority claimed from US11/065,376 external-priority patent/US20060186088A1/en
Priority claimed from US11/065,636 external-priority patent/US20060185694A1/en
Application filed by Supercritical Systems Inc, Richard Brown, Joseph Hillman filed Critical Supercritical Systems Inc
Publication of WO2006091316A2 publication Critical patent/WO2006091316A2/en
Publication of WO2006091316A3 publication Critical patent/WO2006091316A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02101—Cleaning only involving supercritical fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents

Abstract

An apparatus for removing a residue from a surface of an object located on a support region within a processing chamber is disclosed. The apparatus comprises means for performing a dual-pressure rinsing process and means for performing a series of decompression cycles. The means for performing a dual-pressure rinsing process comprises: means for pressurizing the processing chamber to a first pressure; means for introducing a rinsing chemistry into the processing chamber; means for recirculating the rinsing chemistry within the processing chamber for a first period of time; means for increasing a pressure of the processing chamber to a second pressure; and means for recirculating the rinsing chemistry within the processing.
PCT/US2006/002655 2005-02-23 2006-01-24 Improved rinsing step in supercritical processing WO2006091316A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US11/065,376 2005-02-23
US11/065,377 2005-02-23
US11/065,636 2005-02-23
US11/065,377 US20060185693A1 (en) 2005-02-23 2005-02-23 Cleaning step in supercritical processing
US11/065,376 US20060186088A1 (en) 2005-02-23 2005-02-23 Etching and cleaning BPSG material using supercritical processing
US11/065,636 US20060185694A1 (en) 2005-02-23 2005-02-23 Rinsing step in supercritical processing

Publications (2)

Publication Number Publication Date
WO2006091316A2 WO2006091316A2 (en) 2006-08-31
WO2006091316A3 true WO2006091316A3 (en) 2007-03-22

Family

ID=36927880

Family Applications (3)

Application Number Title Priority Date Filing Date
PCT/US2006/002655 WO2006091316A2 (en) 2005-02-23 2006-01-24 Improved rinsing step in supercritical processing
PCT/US2006/002632 WO2006091312A2 (en) 2005-02-23 2006-01-24 Improved cleaning step in supercritical processing
PCT/US2006/006768 WO2006091909A2 (en) 2005-02-23 2006-02-22 Etching and cleaning bpsg material using supercritical processing

Family Applications After (2)

Application Number Title Priority Date Filing Date
PCT/US2006/002632 WO2006091312A2 (en) 2005-02-23 2006-01-24 Improved cleaning step in supercritical processing
PCT/US2006/006768 WO2006091909A2 (en) 2005-02-23 2006-02-22 Etching and cleaning bpsg material using supercritical processing

Country Status (1)

Country Link
WO (3) WO2006091316A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020014257A1 (en) * 1999-08-05 2002-02-07 Mohan Chandra Supercritical fluid cleaning process for precision surfaces
US6509141B2 (en) * 1997-05-27 2003-01-21 Tokyo Electron Limited Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
US6558475B1 (en) * 2000-04-10 2003-05-06 International Business Machines Corporation Process for cleaning a workpiece using supercritical carbon dioxide
US20040103922A1 (en) * 2001-12-03 2004-06-03 Yoichi Inoue Method of high pressure treatment
US20040211440A1 (en) * 2003-04-24 2004-10-28 Ching-Ya Wang System and method for dampening high pressure impact on porous materials

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6612317B2 (en) * 2000-04-18 2003-09-02 S.C. Fluids, Inc Supercritical fluid delivery and recovery system for semiconductor wafer processing
US20040003831A1 (en) * 2000-04-18 2004-01-08 Mount David J. Supercritical fluid cleaning process for precision surfaces
US6669785B2 (en) * 2002-05-15 2003-12-30 Micell Technologies, Inc. Methods and compositions for etch cleaning microelectronic substrates in carbon dioxide
US20040050406A1 (en) * 2002-07-17 2004-03-18 Akshey Sehgal Compositions and method for removing photoresist and/or resist residue at pressures ranging from ambient to supercritical
US20040177867A1 (en) * 2002-12-16 2004-09-16 Supercritical Systems, Inc. Tetra-organic ammonium fluoride and HF in supercritical fluid for photoresist and residue removal
US6857437B2 (en) * 2003-06-18 2005-02-22 Ekc Technology, Inc. Automated dense phase fluid cleaning system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6509141B2 (en) * 1997-05-27 2003-01-21 Tokyo Electron Limited Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
US20020014257A1 (en) * 1999-08-05 2002-02-07 Mohan Chandra Supercritical fluid cleaning process for precision surfaces
US6558475B1 (en) * 2000-04-10 2003-05-06 International Business Machines Corporation Process for cleaning a workpiece using supercritical carbon dioxide
US20040103922A1 (en) * 2001-12-03 2004-06-03 Yoichi Inoue Method of high pressure treatment
US20040211440A1 (en) * 2003-04-24 2004-10-28 Ching-Ya Wang System and method for dampening high pressure impact on porous materials

Also Published As

Publication number Publication date
WO2006091312A3 (en) 2007-03-01
WO2006091312A2 (en) 2006-08-31
WO2006091316A2 (en) 2006-08-31
WO2006091909A3 (en) 2007-07-19
WO2006091909A2 (en) 2006-08-31

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