WO2005102156A3 - Surface mount multi-channel optocoupler - Google Patents

Surface mount multi-channel optocoupler Download PDF

Info

Publication number
WO2005102156A3
WO2005102156A3 PCT/US2005/005133 US2005005133W WO2005102156A3 WO 2005102156 A3 WO2005102156 A3 WO 2005102156A3 US 2005005133 W US2005005133 W US 2005005133W WO 2005102156 A3 WO2005102156 A3 WO 2005102156A3
Authority
WO
WIPO (PCT)
Prior art keywords
optocoupler
surface mount
optical
mount multi
channel optocoupler
Prior art date
Application number
PCT/US2005/005133
Other languages
French (fr)
Other versions
WO2005102156A2 (en
Inventor
Maria Clemens Y Quinones
Rajeev Joshi
Original Assignee
Fairchild Semiconductor
Maria Clemens Y Quinones
Rajeev Joshi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Semiconductor, Maria Clemens Y Quinones, Rajeev Joshi filed Critical Fairchild Semiconductor
Priority to JP2007506175A priority Critical patent/JP2007531310A/en
Priority to DE112005000717T priority patent/DE112005000717T5/en
Publication of WO2005102156A2 publication Critical patent/WO2005102156A2/en
Publication of WO2005102156A3 publication Critical patent/WO2005102156A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

An optocoupler package is disclosed. The optocoupler package includes a substrate comprising a leadframe and a molding compound, and a plurality of optocouplers, each optocoupler including (i) an optical emitter, (ii) an optical receiver, (iii) and an optically transmissive medium disposed between the optical emitter and optical receiver, where the optical emitter and the optical receiver are electrically coupled to the leadframe.
PCT/US2005/005133 2004-04-02 2005-02-17 Surface mount multi-channel optocoupler WO2005102156A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007506175A JP2007531310A (en) 2004-04-02 2005-02-17 Surface-mount multichannel optical coupling device
DE112005000717T DE112005000717T5 (en) 2004-04-02 2005-02-17 Surface mounted multichannel optocoupler

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/817,195 US7196313B2 (en) 2004-04-02 2004-04-02 Surface mount multi-channel optocoupler
US10/817,195 2004-04-02

Publications (2)

Publication Number Publication Date
WO2005102156A2 WO2005102156A2 (en) 2005-11-03
WO2005102156A3 true WO2005102156A3 (en) 2006-01-26

Family

ID=35053264

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/005133 WO2005102156A2 (en) 2004-04-02 2005-02-17 Surface mount multi-channel optocoupler

Country Status (7)

Country Link
US (1) US7196313B2 (en)
JP (1) JP2007531310A (en)
CN (2) CN101893742B (en)
DE (1) DE112005000717T5 (en)
MY (1) MY139480A (en)
TW (1) TWI452715B (en)
WO (1) WO2005102156A2 (en)

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CN101893742A (en) 2010-11-24
MY139480A (en) 2009-10-30
TW200605391A (en) 2006-02-01
US7196313B2 (en) 2007-03-27
CN101893742B (en) 2013-12-18
CN1943004A (en) 2007-04-04
US20050218300A1 (en) 2005-10-06
DE112005000717T5 (en) 2008-07-03
TWI452715B (en) 2014-09-11
CN100590779C (en) 2010-02-17
WO2005102156A2 (en) 2005-11-03
JP2007531310A (en) 2007-11-01

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