WO2005101446A3 - Light emitting diode arrays with improved light extraction - Google Patents

Light emitting diode arrays with improved light extraction Download PDF

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Publication number
WO2005101446A3
WO2005101446A3 PCT/US2005/012227 US2005012227W WO2005101446A3 WO 2005101446 A3 WO2005101446 A3 WO 2005101446A3 US 2005012227 W US2005012227 W US 2005012227W WO 2005101446 A3 WO2005101446 A3 WO 2005101446A3
Authority
WO
WIPO (PCT)
Prior art keywords
leds
light emitting
emitting diode
diode arrays
substrate
Prior art date
Application number
PCT/US2005/012227
Other languages
French (fr)
Other versions
WO2005101446A2 (en
Inventor
Edmar Amaya
Joseph Mazzochette
Original Assignee
Lamina Ceramics Inc
Edmar Amaya
Joseph Mazzochette
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lamina Ceramics Inc, Edmar Amaya, Joseph Mazzochette filed Critical Lamina Ceramics Inc
Priority to EP05736416A priority Critical patent/EP1738386A2/en
Priority to JP2007507565A priority patent/JP2007533082A/en
Publication of WO2005101446A2 publication Critical patent/WO2005101446A2/en
Publication of WO2005101446A3 publication Critical patent/WO2005101446A3/en

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

In accordance with the invention, an illumination device comprises a highly thermally conductive substrate having a surface, a plurality of light emitting diodes (LEDs) supported by the surface and arranged in an array to provide illumination. At least one reflective barrier at least partially surrounds each LED. The reflective barrier is shaped to reflect away from the LED light emitted by other LEDs in the array. Advantageously the substrate and reflective barrier are thermally coupled to a heat spreader to dissipate heat generated by the LEDs. The substrate preferably comprises an LTTC-M heat spreader, and the reflective thermal barriers preferably comprise metal ridges or cups.
PCT/US2005/012227 2004-04-09 2005-04-11 Light emitting diode arrays with improved light extraction WO2005101446A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05736416A EP1738386A2 (en) 2004-04-09 2005-04-11 Light emitting diode arrays with improved light extraction
JP2007507565A JP2007533082A (en) 2004-04-09 2005-04-11 Light-emitting diode array with improved light extraction

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/822,191 2004-04-09
US10/822,191 US20050225222A1 (en) 2004-04-09 2004-04-09 Light emitting diode arrays with improved light extraction

Publications (2)

Publication Number Publication Date
WO2005101446A2 WO2005101446A2 (en) 2005-10-27
WO2005101446A3 true WO2005101446A3 (en) 2006-08-03

Family

ID=35059909

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/012227 WO2005101446A2 (en) 2004-04-09 2005-04-11 Light emitting diode arrays with improved light extraction

Country Status (5)

Country Link
US (2) US20050225222A1 (en)
EP (1) EP1738386A2 (en)
JP (1) JP2007533082A (en)
KR (1) KR20070013294A (en)
WO (1) WO2005101446A2 (en)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7633093B2 (en) * 2003-05-05 2009-12-15 Lighting Science Group Corporation Method of making optical light engines with elevated LEDs and resulting product
US7528421B2 (en) * 2003-05-05 2009-05-05 Lamina Lighting, Inc. Surface mountable light emitting diode assemblies packaged for high temperature operation
US20070013057A1 (en) * 2003-05-05 2007-01-18 Joseph Mazzochette Multicolor LED assembly with improved color mixing
US7777235B2 (en) 2003-05-05 2010-08-17 Lighting Science Group Corporation Light emitting diodes with improved light collimation
US7300182B2 (en) * 2003-05-05 2007-11-27 Lamina Lighting, Inc. LED light sources for image projection systems
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
US7145125B2 (en) 2003-06-23 2006-12-05 Advanced Optical Technologies, Llc Integrating chamber cone light using LED sources
US7521667B2 (en) 2003-06-23 2009-04-21 Advanced Optical Technologies, Llc Intelligent solid state lighting
EP1515297B1 (en) * 2003-09-08 2013-03-06 Barco, naamloze vennootschap. A display pixel module for use in a configurable large-screen display application and display with such pixel modules
US7964883B2 (en) 2004-02-26 2011-06-21 Lighting Science Group Corporation Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
TW200605169A (en) * 2004-06-29 2006-02-01 Sanyo Electric Co Circuit device and process for manufacture thereof
US7252408B2 (en) * 2004-07-19 2007-08-07 Lamina Ceramics, Inc. LED array package with internal feedback and control
GB2417824A (en) * 2004-09-02 2006-03-08 Custom Interconnect Ltd LED light source
US7578058B2 (en) * 2005-04-19 2009-08-25 Tdk Corporation Production method of a multilayer ceramic substrate
WO2007005003A1 (en) * 2005-06-30 2007-01-11 Lamina Ceramics, Inc. Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
DE602006020484D1 (en) * 2005-11-28 2011-04-14 Nxp Bv DEVICE COMPRISING A SUBSTRATE WITH AN ELECTRICAL CONTACT AND TRANSPONDER
JP4996096B2 (en) * 2006-01-06 2012-08-08 新光電気工業株式会社 Light emitting device and manufacturing method thereof
JP2007201361A (en) * 2006-01-30 2007-08-09 Shinko Electric Ind Co Ltd Semiconductor device, and method of manufacturing semiconductor device
JP4828248B2 (en) * 2006-02-16 2011-11-30 新光電気工業株式会社 Light emitting device and manufacturing method thereof
US7638988B2 (en) * 2006-02-21 2009-12-29 Virginia Tech Intellectual Properties, Inc. Co-fired ceramic inductors with variable inductance, and voltage regulator having same
US7932800B2 (en) * 2006-02-21 2011-04-26 Virginia Tech Intellectual Properties, Inc. Method and apparatus for three-dimensional integration of embedded power module
KR101340682B1 (en) * 2006-05-05 2013-12-12 크리, 인코포레이티드 Lighting device
JP4808550B2 (en) * 2006-06-05 2011-11-02 株式会社フジクラ Light emitting diode light source device, lighting device, display device, and traffic signal device
KR101431224B1 (en) * 2006-06-08 2014-08-21 코닌클리케 필립스 엔.브이. Flexible display device
KR100904152B1 (en) * 2006-06-30 2009-06-25 서울반도체 주식회사 Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method
US7794114B2 (en) * 2006-10-11 2010-09-14 Cree, Inc. Methods and apparatus for improved heat spreading in solid state lighting systems
US20080149946A1 (en) * 2006-12-22 2008-06-26 Philips Lumileds Lighting Company, Llc Semiconductor Light Emitting Device Configured To Emit Multiple Wavelengths Of Light
EP2104797B1 (en) * 2007-01-11 2013-07-31 Panasonic Corporation Light source
JP5089212B2 (en) * 2007-03-23 2012-12-05 シャープ株式会社 LIGHT EMITTING DEVICE, LED LAMP USING THE SAME, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
EP2158079B1 (en) * 2007-06-08 2018-05-02 Philips Lighting Holding B.V. Light output device
DE102007036226A1 (en) * 2007-08-02 2009-02-05 Perkinelmer Elcos Gmbh LED mounting structure, LED assembly, LED assembly socket, method of forming a mounting structure
DE102007038514A1 (en) * 2007-08-16 2009-02-19 Robert Bosch Gmbh Electrical circuit arrangement and method for producing an electrical circuit arrangement
CN100546058C (en) * 2007-10-15 2009-09-30 佛山市国星光电股份有限公司 Power luminous diode packaging structure
US9461201B2 (en) 2007-11-14 2016-10-04 Cree, Inc. Light emitting diode dielectric mirror
ITPD20080068A1 (en) * 2008-02-26 2009-08-27 Easy Internat S R L LED LAMP AND METHOD FOR ITS DESIGN
US20090212309A1 (en) * 2008-02-27 2009-08-27 Jui-Lun Kuo Light emitting diode package structure and a packaging method thereof
US20100219441A1 (en) * 2008-02-27 2010-09-02 Ledtech Electronics Corp. Light emitting diode package structure
US8008682B2 (en) * 2008-04-04 2011-08-30 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Alumina substrate and method of making an alumina substrate
EP2274778B1 (en) * 2008-04-08 2020-08-05 Signify Holding B.V. Illumination device with led and a transmissive support comprising a luminescent material
CN101567366A (en) * 2008-04-25 2009-10-28 展晶科技(深圳)有限公司 Light emitting diode
KR101088910B1 (en) * 2008-05-29 2011-12-07 삼성엘이디 주식회사 LED package and method of manufacturing the same
JP5345363B2 (en) * 2008-06-24 2013-11-20 シャープ株式会社 Light emitting device
EP2294635A1 (en) * 2008-07-01 2011-03-16 Koninklijke Philips Electronics N.V. Close proximity collimator for led
JP5240839B2 (en) * 2008-08-22 2013-07-17 Ｎｅｃライティング株式会社 Surface light emitting device, illumination device including the same, and display device
KR100999699B1 (en) * 2008-09-01 2010-12-08 엘지이노텍 주식회사 Light emitting device package
FR2940679B1 (en) * 2008-12-31 2016-06-10 Finan Trading Company ELECTROLUMINESCENT DIODE LIGHTING SYSTEM.
JP2010199183A (en) * 2009-02-24 2010-09-09 Sanyo Electric Co Ltd Package for light emitting device and method of manufacturing the same
US8269248B2 (en) * 2009-03-02 2012-09-18 Thompson Joseph B Light emitting assemblies and portions thereof
DE102009021236A1 (en) * 2009-05-14 2010-12-02 Osram Gesellschaft mit beschränkter Haftung Light-emitting diode module and lighting unit with light-emitting diode module
US9362459B2 (en) 2009-09-02 2016-06-07 United States Department Of Energy High reflectivity mirrors and method for making same
US9435493B2 (en) 2009-10-27 2016-09-06 Cree, Inc. Hybrid reflector system for lighting device
TW201131804A (en) * 2010-03-12 2011-09-16 Gio Optoelectronics Corp Light emitting diode unit
JP5853374B2 (en) * 2010-03-12 2016-02-09 オムロン株式会社 Lighting device
JP5708983B2 (en) * 2010-03-29 2015-04-30 東芝ライテック株式会社 Lighting device
JP5747546B2 (en) * 2010-03-29 2015-07-15 東芝ライテック株式会社 Lighting device
US9105824B2 (en) * 2010-04-09 2015-08-11 Cree, Inc. High reflective board or substrate for LEDs
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
KR101039994B1 (en) 2010-05-24 2011-06-09 엘지이노텍 주식회사 Light emitting device and light unit having thereof
US8608340B2 (en) 2010-06-28 2013-12-17 Toshiba Lighting & Technology Corporation Light-emitting module and lighting apparatus with the same
US10037947B1 (en) * 2010-06-29 2018-07-31 Cooledge Lighting Inc. Electronic devices with yielding substrates
US8415704B2 (en) 2010-09-22 2013-04-09 Ut-Battelle, Llc Close-packed array of light emitting devices
US10243121B2 (en) 2011-06-24 2019-03-26 Cree, Inc. High voltage monolithic LED chip with improved reliability
US9728676B2 (en) 2011-06-24 2017-08-08 Cree, Inc. High voltage monolithic LED chip
JP5898881B2 (en) * 2011-07-24 2016-04-06 交和電気産業株式会社 Lighting device
JP2013179271A (en) * 2012-01-31 2013-09-09 Rohm Co Ltd Light emitting device and manufacturing method of the same
RU2645147C2 (en) 2012-03-08 2018-02-15 Филипс Лайтинг Холдинг Б.В. Light-emitting device and method of manufacture of light-emitting device
JP6169829B2 (en) * 2012-07-09 2017-07-26 交和電気産業株式会社 Lighting device
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source
TW201407810A (en) * 2012-08-14 2014-02-16 Lextar Electronics Corp Illumination module
KR101319360B1 (en) * 2013-03-04 2013-10-16 유버 주식회사 Chip on board type uv led package and method for making the same
KR20150006727A (en) * 2013-07-09 2015-01-19 삼성디스플레이 주식회사 Organic light emitting diode display and manufacturing method thereof
EP3158393B1 (en) * 2014-06-17 2021-02-24 Lumileds LLC A flash module containing an array of reflector cups for phosphor-converted leds
EP3177869B1 (en) * 2014-08-08 2017-09-27 Koninklijke Philips N.V. Led device with flexible thermal interface
US20170219202A1 (en) * 2014-08-28 2017-08-03 U.S. Applied Physics Group, Llc Optical lighting system and method
KR20160038568A (en) * 2014-09-30 2016-04-07 (주)포인트엔지니어링 Chip substrate comprising plural curve surface cavity
US10658546B2 (en) 2015-01-21 2020-05-19 Cree, Inc. High efficiency LEDs and methods of manufacturing
WO2017091051A1 (en) * 2015-11-27 2017-06-01 엘지이노텍 주식회사 Light-emitting element package and lighting device
EP3543599A1 (en) * 2018-03-20 2019-09-25 Shibakawa Manufacturing Co., Ltd. Led lighting device and plant cultivation shelf
TW202349084A (en) * 2022-06-13 2023-12-16 瑞儀光電股份有限公司 Reflector plate with three-dimensional structure, backlight module and display

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3711789A (en) * 1970-11-18 1973-01-16 Texas Instruments Inc Diode array assembly for diode pumped lasers
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
US6318886B1 (en) * 2000-02-11 2001-11-20 Whelen Engineering Company High flux led assembly
US20040222433A1 (en) * 2003-05-05 2004-11-11 Lamina Ceramics Light emitting diodes packaged for high temperature operation

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5140220A (en) * 1985-12-02 1992-08-18 Yumi Sakai Light diffusion type light emitting diode
CA1284536C (en) * 1987-07-03 1991-05-28 Akira Sasame Member for semiconductor apparatus
ATE106172T1 (en) * 1987-08-28 1994-06-15 Eev Ltd SPARK GAP DEVICE.
DE3736519A1 (en) 1987-10-28 1989-05-11 Standard Elektrik Lorenz Ag DC GENERATOR WITH PERMANENT MAGNETIC STAND
JP2503685B2 (en) * 1989-10-23 1996-06-05 日本電気株式会社 Semiconductor device with heat sink
US5122781A (en) * 1990-09-06 1992-06-16 Bolan Trading Inc. Hazard warning light
US5485037A (en) * 1993-04-12 1996-01-16 Amkor Electronics, Inc. Semiconductor device having a thermal dissipator and electromagnetic shielding
US5581876A (en) * 1995-01-27 1996-12-10 David Sarnoff Research Center, Inc. Method of adhering green tape to a metal support substrate with a bonding glass
US5725808A (en) * 1996-05-23 1998-03-10 David Sarnoff Research Center, Inc. Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US5745624A (en) * 1996-08-23 1998-04-28 The Boeing Company Automatic alignment and locking method and apparatus for fiber optic module manufacturing
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
US5847935A (en) * 1996-12-16 1998-12-08 Sarnoff Corporation Electronic circuit chip package
US5953203A (en) * 1997-03-06 1999-09-14 Sarnoff Corporation Multilayer ceramic circuit boards including embedded capacitors
US5841244A (en) * 1997-06-18 1998-11-24 Northrop Grumman Corporation RF coil/heat pipe for solid state light driver
CN1142598C (en) * 1997-07-25 2004-03-17 日亚化学工业株式会社 Nitride semiconductor device
US6016038A (en) * 1997-08-26 2000-01-18 Color Kinetics, Inc. Multicolored LED lighting method and apparatus
JP3618534B2 (en) 1997-11-28 2005-02-09 同和鉱業株式会社 Optical communication lamp device and manufacturing method thereof
US5977567A (en) * 1998-01-06 1999-11-02 Lightlogic, Inc. Optoelectronic assembly and method of making the same
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
WO2000017569A1 (en) * 1998-09-17 2000-03-30 Koninklijke Philips Electronics N.V. Led lamp
US6793374B2 (en) * 1998-09-17 2004-09-21 Simon H. A. Begemann LED lamp
WO2000023976A1 (en) * 1998-10-16 2000-04-27 Sarnoff Corporation Linear array of light-emitting elements
US6325524B1 (en) * 1999-01-29 2001-12-04 Agilent Technologies, Inc. Solid state based illumination source for a projection display
JP2000221736A (en) * 1999-02-03 2000-08-11 Fujitsu Ltd Image forming device
US6259846B1 (en) 1999-02-23 2001-07-10 Sarnoff Corporation Light-emitting fiber, as for a display
JP2000294701A (en) 1999-04-02 2000-10-20 Nkk Seimitsu Kk Case for semiconductor
US6607678B2 (en) * 1999-08-17 2003-08-19 Battelle Memorial Institute Catalyst and method of steam reforming
US6455930B1 (en) * 1999-12-13 2002-09-24 Lamina Ceramics, Inc. Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
US6885035B2 (en) 1999-12-22 2005-04-26 Lumileds Lighting U.S., Llc Multi-chip semiconductor LED assembly
US6362578B1 (en) 1999-12-23 2002-03-26 Stmicroelectronics, Inc. LED driver circuit and method
US6428189B1 (en) 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
DE10038213A1 (en) * 2000-08-04 2002-03-07 Osram Opto Semiconductors Gmbh Radiation source and method of making a lens mold
DE10051159C2 (en) * 2000-10-16 2002-09-19 Osram Opto Semiconductors Gmbh LED module, e.g. White light source
US6488623B1 (en) * 2000-11-09 2002-12-03 Hill-Rom Services, Inc. Skin perfusion evaluation apparatus
US7004613B2 (en) * 2000-12-28 2006-02-28 Au Optronics Corp. Display structure
EP1367935B1 (en) * 2001-03-15 2008-09-17 AMO WaveFront Sciences, LLC Tomographic wavefront analysis system and method of mapping an optical system
US6949771B2 (en) * 2001-04-25 2005-09-27 Agilent Technologies, Inc. Light source
US6518502B2 (en) * 2001-05-10 2003-02-11 Lamina Ceramics, In Ceramic multilayer circuit boards mounted on a patterned metal support substrate
KR100419611B1 (en) * 2001-05-24 2004-02-25 삼성전기주식회사 A Light Emitting Diode, a Lighting Emitting Device Using the Same and a Fabrication Process therefor
JP4452495B2 (en) * 2001-05-26 2010-04-21 ルミネイション リミテッド ライアビリティ カンパニー High power LED module for spot lighting
US6678622B2 (en) * 2001-07-31 2004-01-13 The Boeing Company FFT based digital radiometer
US6634770B2 (en) * 2001-08-24 2003-10-21 Densen Cao Light source using semiconductor devices mounted on a heat sink
US20030057421A1 (en) * 2001-09-27 2003-03-27 Tzer-Perng Chen High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate
US6692252B2 (en) * 2001-12-17 2004-02-17 Ultradent Products, Inc. Heat sink with geometric arrangement of LED surfaces
KR100439402B1 (en) * 2001-12-24 2004-07-09 삼성전기주식회사 Light emission diode package
US6480389B1 (en) * 2002-01-04 2002-11-12 Opto Tech Corporation Heat dissipation structure for solid-state light emitting device package
KR100567559B1 (en) * 2002-07-25 2006-04-05 마츠시다 덴코 가부시키가이샤 Device with photoelectric element
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
JP2004128273A (en) * 2002-10-03 2004-04-22 Sharp Corp Light emitting element
JP3829985B2 (en) * 2002-10-31 2006-10-04 ソニー株式会社 Image processing apparatus and method, recording medium, and program
US6827469B2 (en) 2003-02-03 2004-12-07 Osram Sylvania Inc. Solid-state automotive lamp
US7033060B2 (en) * 2003-05-23 2006-04-25 Gelcore Llc Method and apparatus for irradiation of plants using light emitting diodes
JP2005183531A (en) * 2003-12-17 2005-07-07 Sharp Corp Semiconductor light emitting device
US7964883B2 (en) 2004-02-26 2011-06-21 Lighting Science Group Corporation Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
US20050225222A1 (en) 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3711789A (en) * 1970-11-18 1973-01-16 Texas Instruments Inc Diode array assembly for diode pumped lasers
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
US6318886B1 (en) * 2000-02-11 2001-11-20 Whelen Engineering Company High flux led assembly
US20040222433A1 (en) * 2003-05-05 2004-11-11 Lamina Ceramics Light emitting diodes packaged for high temperature operation

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US20070064429A1 (en) 2007-03-22
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