WO2005093116A3 - Replacing chamber components in a vacuum environment - Google Patents

Replacing chamber components in a vacuum environment Download PDF

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Publication number
WO2005093116A3
WO2005093116A3 PCT/US2005/005374 US2005005374W WO2005093116A3 WO 2005093116 A3 WO2005093116 A3 WO 2005093116A3 US 2005005374 W US2005005374 W US 2005005374W WO 2005093116 A3 WO2005093116 A3 WO 2005093116A3
Authority
WO
WIPO (PCT)
Prior art keywords
transfer
items
module
replacement
component
Prior art date
Application number
PCT/US2005/005374
Other languages
French (fr)
Other versions
WO2005093116A2 (en
Inventor
Aelan Mosden
Original Assignee
Tokyo Electron Ltd
Tokyo Electron America Inc
Aelan Mosden
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Tokyo Electron America Inc, Aelan Mosden filed Critical Tokyo Electron Ltd
Publication of WO2005093116A2 publication Critical patent/WO2005093116A2/en
Publication of WO2005093116A3 publication Critical patent/WO2005093116A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Abstract

An apparatus (100) and method are provided for replacing parts in a vacuum chamber (131) without venting the vacuum. A transfer system (140) is used to transfer a removably mounted component (170) from a processing module (130) that is attached to a transfer system and replacing the component with another component from a maintenance system (110) that is connected through an isolation assembly to a transfer module. The maintenance system may include a supply of replacement parts and receive expended or otherwise serviceable items that are to be replaced. These serviceable items may include chamber component that has a tendency to degrade during processes being performed in the processing module. Typically, such items are etched or eroded away or accumulate coatings, requiring occasional removal and replacement. Focus rings (136), chamber shields, dark space shields, insulators, deposition baffles (146) and adaptors are some of the items requiring periodic replacement. Such items are installed in the process module in a way that permits their removal and replacement by a transfer arm or other transfer mechanism of the transfer system or otherwise by robotic mechanisms. The processing module may be an etching, deposition ALD, patterning, developing, metrology, thermal processing, cleaning or other module used in a vacuum process, particularly for processing of semiconductor wafers.
PCT/US2005/005374 2004-03-18 2005-02-22 Replacing chamber components in a vacuum environment WO2005093116A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/803,805 US20050205209A1 (en) 2004-03-18 2004-03-18 Replacing chamber components in a vacuum environment
US10/803,805 2004-03-18

Publications (2)

Publication Number Publication Date
WO2005093116A2 WO2005093116A2 (en) 2005-10-06
WO2005093116A3 true WO2005093116A3 (en) 2006-03-16

Family

ID=34984939

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/005374 WO2005093116A2 (en) 2004-03-18 2005-02-22 Replacing chamber components in a vacuum environment

Country Status (2)

Country Link
US (1) US20050205209A1 (en)
WO (1) WO2005093116A2 (en)

Families Citing this family (21)

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US7531470B2 (en) * 2005-09-27 2009-05-12 Advantech Global, Ltd Method and apparatus for electronic device manufacture using shadow masks
US7581916B2 (en) * 2006-07-14 2009-09-01 Ulvac-Phi, Inc. Sample introduction and transfer system and method
KR100992229B1 (en) * 2008-08-29 2010-11-05 삼성전기주식회사 Roll-to-roll type thin film formation apparatus
JP6003011B2 (en) * 2011-03-31 2016-10-05 東京エレクトロン株式会社 Substrate processing equipment
KR20150060605A (en) * 2012-10-04 2015-06-03 다이요닛산 가부시키가이샤 Vapor deposition apparatus
WO2016040547A1 (en) * 2014-09-11 2016-03-17 Massachusetts Institute Of Technology Processing system for small substrates
US9881820B2 (en) 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
US10124492B2 (en) * 2015-10-22 2018-11-13 Lam Research Corporation Automated replacement of consumable parts using end effectors interfacing with plasma processing system
US10062599B2 (en) * 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
US20170115657A1 (en) * 2015-10-22 2017-04-27 Lam Research Corporation Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ
WO2017131927A1 (en) 2016-01-26 2017-08-03 Applied Materials, Inc. Wafer edge ring lifting solution
JP6723889B2 (en) * 2016-09-28 2020-07-15 株式会社荏原製作所 Plating equipment
US20200365381A1 (en) 2019-05-14 2020-11-19 Mattson Technology, Inc. Systems And Methods For Transportation Of Replaceable Parts In a Vacuum Processing Apparatus
US20200373190A1 (en) * 2019-05-20 2020-11-26 Applied Materials, Inc. Process kit enclosure system
US11469123B2 (en) * 2019-08-19 2022-10-11 Applied Materials, Inc. Mapping of a replacement parts storage container
JP7419154B2 (en) 2020-05-01 2024-01-22 東京エレクトロン株式会社 Parts replacement system and equipment
JP7409976B2 (en) * 2020-06-22 2024-01-09 東京エレクトロン株式会社 How to replace plasma processing system, plasma processing equipment and edge ring
TW202203319A (en) * 2020-06-24 2022-01-16 日商東京威力科創股份有限公司 Substrate processing apparatus
TW202224882A (en) * 2020-11-12 2022-07-01 日商東京威力科創股份有限公司 Detection device, processing system, and transfer method
EP4264662A1 (en) * 2020-12-17 2023-10-25 Solayer GmbH Method and device for changing test substrates in a continuous-flow vacuum system, treatment method, and continuous-flow vacuum system
US20230260770A1 (en) * 2022-02-16 2023-08-17 Taiwan Semiconductor Manufacturing Company Limited Semiconductor tool for copper deposition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0511733A1 (en) * 1991-04-30 1992-11-04 Applied Materials, Inc. Removable shutter apparatus for a semiconductor process chamber
EP0824266A2 (en) * 1996-08-05 1998-02-18 Kokusai Electric Co., Ltd. Substrate processing apparatus
US6500742B1 (en) * 1994-11-14 2002-12-31 Applied Materials, Inc. Construction of a film on a semiconductor wafer

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US5085410A (en) * 1989-12-14 1992-02-04 Jersey Nuclear-Avco Isotopes, Inc. Modular processing system
JPH081923B2 (en) * 1991-06-24 1996-01-10 ティーディーケイ株式会社 Clean transfer method and device
US5826129A (en) * 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
TW359849B (en) * 1994-12-08 1999-06-01 Tokyo Electron Ltd Sputtering apparatus having an on board service module
US6267545B1 (en) * 1999-03-29 2001-07-31 Lam Research Corporation Semiconductor processing platform architecture having processing module isolation capabilities
US6095741A (en) * 1999-03-29 2000-08-01 Lam Research Corporation Dual sided slot valve and method for implementing the same
US6958098B2 (en) * 2000-02-28 2005-10-25 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
CN1178274C (en) * 2000-06-16 2004-12-01 东京毅力科创株式会社 Semiconductor mfg. apparatus detecting state of connection between controllers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0511733A1 (en) * 1991-04-30 1992-11-04 Applied Materials, Inc. Removable shutter apparatus for a semiconductor process chamber
US6500742B1 (en) * 1994-11-14 2002-12-31 Applied Materials, Inc. Construction of a film on a semiconductor wafer
EP0824266A2 (en) * 1996-08-05 1998-02-18 Kokusai Electric Co., Ltd. Substrate processing apparatus

Also Published As

Publication number Publication date
WO2005093116A2 (en) 2005-10-06
US20050205209A1 (en) 2005-09-22

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