WO2004057648A3 - Localized reflow for wire bonding and flip chip connections - Google Patents

Localized reflow for wire bonding and flip chip connections Download PDF

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Publication number
WO2004057648A3
WO2004057648A3 PCT/US2003/040638 US0340638W WO2004057648A3 WO 2004057648 A3 WO2004057648 A3 WO 2004057648A3 US 0340638 W US0340638 W US 0340638W WO 2004057648 A3 WO2004057648 A3 WO 2004057648A3
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WO
WIPO (PCT)
Prior art keywords
wire bonding
localized
flip chip
solder bump
chip connections
Prior art date
Application number
PCT/US2003/040638
Other languages
French (fr)
Other versions
WO2004057648A2 (en
Inventor
Hui Wang
Original Assignee
Acm Res Inc
Hui Wang
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Filing date
Publication date
Application filed by Acm Res Inc, Hui Wang filed Critical Acm Res Inc
Priority to AU2003303155A priority Critical patent/AU2003303155A1/en
Publication of WO2004057648A2 publication Critical patent/WO2004057648A2/en
Publication of WO2004057648A3 publication Critical patent/WO2004057648A3/en

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Abstract

A system for soldering electrical connection for a chip (300) includes a bonding pad (302), a solder bump (304), and an energy source (306). The energy source (306) is localized to the solder bump (304) without physically contacting the solder bump (304). Localized energy source (306) heat solder bump (340), to reflow the solder bump (304) on the bonding pad (302) without heating the entire chip (300).
PCT/US2003/040638 2002-12-18 2003-12-18 Localized reflow for wire bonding and flip chip connections WO2004057648A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003303155A AU2003303155A1 (en) 2002-12-18 2003-12-18 Localized reflow for wire bonding and flip chip connections

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43447402P 2002-12-18 2002-12-18
US60/434,474 2002-12-18

Publications (2)

Publication Number Publication Date
WO2004057648A2 WO2004057648A2 (en) 2004-07-08
WO2004057648A3 true WO2004057648A3 (en) 2005-02-17

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Country Status (3)

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AU (1) AU2003303155A1 (en)
TW (1) TW200421501A (en)
WO (1) WO2004057648A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10170665B2 (en) 2015-09-09 2019-01-01 Goertek.Inc Repairing method, manufacturing method, device and electronics apparatus of micro-LED
TWI698964B (en) * 2019-03-15 2020-07-11 台灣愛司帝科技股份有限公司 Chip fastening structure and chip fastening apparatus

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US4926022A (en) * 1989-06-20 1990-05-15 Digital Equipment Corporation Laser reflow soldering process and bonded assembly formed thereby
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
US5872405A (en) * 1996-05-28 1999-02-16 Micron Technology, Inc. Laser wire bonding for wire embedded dielectrics to integrated circuits
US5946553A (en) * 1991-06-04 1999-08-31 Micron Technology, Inc. Process for manufacturing a semiconductor package with bi-substrate die
US5985693A (en) * 1994-09-30 1999-11-16 Elm Technology Corporation High density three-dimensional IC interconnection
US6011313A (en) * 1997-06-23 2000-01-04 Ford Motor Company Flip chip interconnections on electronic modules
US6258627B1 (en) * 1999-01-19 2001-07-10 International Business Machines Corporation Underfill preform interposer for joining chip to substrate
US6334569B1 (en) * 1999-09-03 2002-01-01 Fujitsu Limited Reflow soldering apparatus and reflow soldering method
US6426241B1 (en) * 1999-11-12 2002-07-30 International Business Machines Corporation Method for forming three-dimensional circuitization and circuits formed
US6458623B1 (en) * 2001-01-17 2002-10-01 International Business Machines Corporation Conductive adhesive interconnection with insulating polymer carrier
US6500693B2 (en) * 2000-11-08 2002-12-31 Mitsubishi Denki Kabushiki Kaisha Electrode forming method and bump electrode formable base used therefor

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Publication number Priority date Publication date Assignee Title
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
US4926022A (en) * 1989-06-20 1990-05-15 Digital Equipment Corporation Laser reflow soldering process and bonded assembly formed thereby
US5946553A (en) * 1991-06-04 1999-08-31 Micron Technology, Inc. Process for manufacturing a semiconductor package with bi-substrate die
US5985693A (en) * 1994-09-30 1999-11-16 Elm Technology Corporation High density three-dimensional IC interconnection
US5872405A (en) * 1996-05-28 1999-02-16 Micron Technology, Inc. Laser wire bonding for wire embedded dielectrics to integrated circuits
US6011313A (en) * 1997-06-23 2000-01-04 Ford Motor Company Flip chip interconnections on electronic modules
US6258627B1 (en) * 1999-01-19 2001-07-10 International Business Machines Corporation Underfill preform interposer for joining chip to substrate
US6334569B1 (en) * 1999-09-03 2002-01-01 Fujitsu Limited Reflow soldering apparatus and reflow soldering method
US6426241B1 (en) * 1999-11-12 2002-07-30 International Business Machines Corporation Method for forming three-dimensional circuitization and circuits formed
US6500693B2 (en) * 2000-11-08 2002-12-31 Mitsubishi Denki Kabushiki Kaisha Electrode forming method and bump electrode formable base used therefor
US6458623B1 (en) * 2001-01-17 2002-10-01 International Business Machines Corporation Conductive adhesive interconnection with insulating polymer carrier

Also Published As

Publication number Publication date
AU2003303155A1 (en) 2004-07-14
TW200421501A (en) 2004-10-16
AU2003303155A8 (en) 2004-07-14
WO2004057648A2 (en) 2004-07-08

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