Sök Bilder Maps Play YouTube Nyheter Gmail Drive Mer »
Logga in
Använder du ett skärmläsningsprogram? Öppna boken i tillgänglighetsläge genom att klicka här. Tillgänglighetsläget har samma grundläggande funktioner men fungerar bättre ihop med skärmläsningsprogrammet.

Patent

  1. Avancerad patentsökning
PublikationsnummerWO2004053976 A3
Typ av kungörelseAnsökan
AnsökningsnummerPCT/US2003/038463
Publiceringsdatum5 aug 2004
Registreringsdatum2 dec 2003
Prioritetsdatum6 dec 2002
Även publicerat somCN1745307A, CN100538369C, DE60331243D1, EP1570277A2, EP1570277B1, US6920689, US7330039, US20040107568, US20050167816, US20080132095, WO2004053976A2
PublikationsnummerPCT/2003/38463, PCT/US/2003/038463, PCT/US/2003/38463, PCT/US/3/038463, PCT/US/3/38463, PCT/US2003/038463, PCT/US2003/38463, PCT/US2003038463, PCT/US200338463, PCT/US3/038463, PCT/US3/38463, PCT/US3038463, PCT/US338463, WO 2004/053976 A3, WO 2004053976 A3, WO 2004053976A3, WO-A3-2004053976, WO2004/053976A3, WO2004053976 A3, WO2004053976A3
UppfinnareIgor K Khandros, Gaetan L Mathieu, Carl V Reynolds
SökandeFormfactor Inc
Exportera citatBiBTeX, EndNote, RefMan
Externa länkar:  Patentscope, Espacenet
Method of making a socket to perform testing on integrated circuits and such a socket
WO 2004053976 A3
Sammanfattning  tillgängligt på engelska
Citat från patent
citerade patent Registreringsdatum Publiceringsdatum Sökande Titel
WO1996015458A1 *13 nov 199523 maj 1996Formfactor, Inc.Probe card assembly and kit, and methods of using same
US5917707 *15 nov 199429 jun 1999Formfactor, Inc.Flexible contact structure with an electrically conductive shell
US6292003 *1 jul 199818 sep 2001Xilinx, Inc.Apparatus and method for testing chip scale package integrated circuits
US20010009376 *22 jan 200126 jul 2001Kiyoshi TakekoshiProbe arrangement assembly, method of manufacturing probe arrangement assembly, probe mounting method using probe arrangement assembly, and probe mounting apparatus
US20020027445 *14 aug 20017 mar 2002Earl SausenContactor assembly for common grid array devices
Juridiska händelser
DatumKodHändelseBeskrivning
24 jun 2004AKDesignated states
Kind code of ref document: A2
Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW
24 jun 2004ALDesignated countries for regional patents
Kind code of ref document: A2
Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG
18 aug 2004121Ep: the epo has been informed by wipo that ep was designated in this application
3 jun 2005WWEWipo information: entry into national phase
Ref document number: 1020057010209
Country of ref document: KR
6 jun 2005WWEWipo information: entry into national phase
Ref document number: 2004559258
Country of ref document: JP
9 jun 2005WWEWipo information: entry into national phase
Ref document number: 2003796616
Country of ref document: EP
27 jul 2005WWEWipo information: entry into national phase
Ref document number: 20038A92994
Country of ref document: CN
29 aug 2005WWPWipo information: published in national office
Ref document number: 1020057010209
Country of ref document: KR
7 sep 2005WWPWipo information: published in national office
Ref document number: 2003796616
Country of ref document: EP