WO2004044877A3 - A display device and method for making same - Google Patents

A display device and method for making same Download PDF

Info

Publication number
WO2004044877A3
WO2004044877A3 PCT/IB2003/005069 IB0305069W WO2004044877A3 WO 2004044877 A3 WO2004044877 A3 WO 2004044877A3 IB 0305069 W IB0305069 W IB 0305069W WO 2004044877 A3 WO2004044877 A3 WO 2004044877A3
Authority
WO
WIPO (PCT)
Prior art keywords
display device
front surface
back surface
making same
reflector body
Prior art date
Application number
PCT/IB2003/005069
Other languages
French (fr)
Other versions
WO2004044877A2 (en
Inventor
Hung Tao Suen
Zhu Qinghang Yi
Chuan Hang Yang
Original Assignee
Cotco Internat Ltd
Hung Tao Suen
Zhu Qinghang Yi
Chuan Hang Yang
Davies Paul Richard
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cotco Internat Ltd, Hung Tao Suen, Zhu Qinghang Yi, Chuan Hang Yang, Davies Paul Richard filed Critical Cotco Internat Ltd
Priority to AU2003276534A priority Critical patent/AU2003276534A1/en
Publication of WO2004044877A2 publication Critical patent/WO2004044877A2/en
Publication of WO2004044877A3 publication Critical patent/WO2004044877A3/en

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Abstract

A display device including a reflector body and a base member mounted with a plurality of light emitting components, wherein the reflector body includes a front surface, a back surface and a peripheral wall interconnecting the front surface and the back surface, the reflector also includes a plurality of through apertures extending from the back surface to the front surface, and the reflector body and the substrate member are held and tightened together by fastening means so that the light emitting device being disposed within the through aperture.
PCT/IB2003/005069 2002-03-28 2003-11-11 A display device and method for making same WO2004044877A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003276534A AU2003276534A1 (en) 2002-03-28 2003-11-11 A display device and method for making same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
HK02108169 2002-11-11
CN02108169.6 2002-11-11

Publications (2)

Publication Number Publication Date
WO2004044877A2 WO2004044877A2 (en) 2004-05-27
WO2004044877A3 true WO2004044877A3 (en) 2004-12-02

Family

ID=32310059

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2003/005069 WO2004044877A2 (en) 2002-03-28 2003-11-11 A display device and method for making same

Country Status (1)

Country Link
WO (1) WO2004044877A2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9076940B2 (en) 2005-01-10 2015-07-07 Cree, Inc. Solid state lighting component
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005290A (en) * 2004-06-21 2006-01-05 Citizen Electronics Co Ltd Light emitting diode
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US8669572B2 (en) * 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
US7635915B2 (en) 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
JP2008131012A (en) * 2006-11-24 2008-06-05 Sumitomo Metal Electronics Devices Inc Package for storing light-emitting element
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
TWI363432B (en) * 2007-02-26 2012-05-01 Everlight Electronics Co Ltd A structure of a light emitting diode and a method to assemble thereof
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224184A (en) * 1983-06-03 1984-12-17 Nec Corp Semiconductor display device
JPS61258484A (en) * 1985-05-13 1986-11-15 Toshiba Corp Light-emitting display device
EP0303741A1 (en) * 1987-08-12 1989-02-22 Shen-Yuan Chen Quickly formable light emitting diode display and its forming method
US5040868A (en) * 1989-05-31 1991-08-20 Siemens Aktiengesellschaft Surface-mountable opto-component
JPH08241976A (en) * 1995-03-06 1996-09-17 Nippon Chemicon Corp Resin sealing method of ccd module
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
US6345903B1 (en) * 2000-09-01 2002-02-12 Citizen Electronics Co., Ltd. Surface-mount type emitting diode and method of manufacturing same
US20030025117A1 (en) * 2001-07-19 2003-02-06 Shinji Isokawa Semiconductor light-emitting device having a reflective case
US20030030060A1 (en) * 2001-08-07 2003-02-13 Tadahiro Okazaki White semiconductor light-emitting device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224184A (en) * 1983-06-03 1984-12-17 Nec Corp Semiconductor display device
JPS61258484A (en) * 1985-05-13 1986-11-15 Toshiba Corp Light-emitting display device
EP0303741A1 (en) * 1987-08-12 1989-02-22 Shen-Yuan Chen Quickly formable light emitting diode display and its forming method
US5040868A (en) * 1989-05-31 1991-08-20 Siemens Aktiengesellschaft Surface-mountable opto-component
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
JPH08241976A (en) * 1995-03-06 1996-09-17 Nippon Chemicon Corp Resin sealing method of ccd module
US6345903B1 (en) * 2000-09-01 2002-02-12 Citizen Electronics Co., Ltd. Surface-mount type emitting diode and method of manufacturing same
US20030025117A1 (en) * 2001-07-19 2003-02-06 Shinji Isokawa Semiconductor light-emitting device having a reflective case
US20030030060A1 (en) * 2001-08-07 2003-02-13 Tadahiro Okazaki White semiconductor light-emitting device

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 0090, no. 99 (E - 311) 27 April 1985 (1985-04-27) *
PATENT ABSTRACTS OF JAPAN vol. 0111, no. 10 (E - 496) 7 April 1987 (1987-04-07) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 01 31 January 1997 (1997-01-31) *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9076940B2 (en) 2005-01-10 2015-07-07 Cree, Inc. Solid state lighting component
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate

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Publication number Publication date
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