WO2003081725A3 - A miniaturized contact spring - Google Patents

A miniaturized contact spring Download PDF

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Publication number
WO2003081725A3
WO2003081725A3 PCT/US2003/008520 US0308520W WO03081725A3 WO 2003081725 A3 WO2003081725 A3 WO 2003081725A3 US 0308520 W US0308520 W US 0308520W WO 03081725 A3 WO03081725 A3 WO 03081725A3
Authority
WO
WIPO (PCT)
Prior art keywords
springs
miniaturized
contact spring
solution
miniaturized contact
Prior art date
Application number
PCT/US2003/008520
Other languages
French (fr)
Other versions
WO2003081725A2 (en
WO2003081725B1 (en
Inventor
Syamal Kumar Lahiri
Frank Swiatowiec
Fu-Chiung Chong
Sammy Mok
Erh-Kong Chieh
Roman L Milter
Joseph M Haemer
Chang-Ming Lin
Yi-Hseng Chen
David Thanh Doan
Original Assignee
Nanonexus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/178,103 external-priority patent/US6917525B2/en
Priority claimed from PCT/US2002/026785 external-priority patent/WO2003018865A1/en
Priority claimed from US10/390,098 external-priority patent/US6943149B2/en
Priority claimed from US10/390,994 external-priority patent/US7137830B2/en
Application filed by Nanonexus Inc filed Critical Nanonexus Inc
Priority to JP2003579319A priority Critical patent/JP2006508495A/en
Priority to KR10-2004-7014722A priority patent/KR20040093740A/en
Priority to DE10392441T priority patent/DE10392441T5/en
Priority to AU2003218288A priority patent/AU2003218288A1/en
Publication of WO2003081725A2 publication Critical patent/WO2003081725A2/en
Publication of WO2003081725A3 publication Critical patent/WO2003081725A3/en
Publication of WO2003081725B1 publication Critical patent/WO2003081725B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/01—Switches
    • B81B2201/012—Switches characterised by the shape
    • B81B2201/018—Switches not provided for in B81B2201/014 - B81B2201/016
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/01024—Chromium [Cr]
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    • H01—ELECTRIC ELEMENTS
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/0104—Zirconium [Zr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01044—Ruthenium [Ru]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01079—Gold [Au]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0494—4th Group
    • H01L2924/04941—TiN
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Abstract

This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs (507), which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs (507). In addition, the invention also presents a method to fabricate the springs (507) that allow passage of relatively higher current without significantly degrading their lifetime.
PCT/US2003/008520 2002-03-18 2003-03-18 A miniaturized contact spring WO2003081725A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003579319A JP2006508495A (en) 2002-03-18 2003-03-18 Miniaturized contact spring
KR10-2004-7014722A KR20040093740A (en) 2002-03-18 2003-03-18 A miniaturized contact spring
DE10392441T DE10392441T5 (en) 2002-03-18 2003-03-18 A miniaturized contact spring
AU2003218288A AU2003218288A1 (en) 2002-03-18 2003-03-18 A miniaturized contact spring

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US36562502P 2002-03-18 2002-03-18
US60/365,625 2002-03-18
US10/178,103 US6917525B2 (en) 2001-11-27 2002-06-24 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US10/178,103 2002-06-24
PCT/US2002/026785 WO2003018865A1 (en) 2001-08-24 2002-08-23 Method and apparatus for producing uniform isotropic stresses in a sputtered film
USPCT/US02/26785 2002-08-23
US10/390,098 US6943149B2 (en) 1999-06-29 2003-03-17 Benzimidazolone peptidomimetics as thrombin receptor antagonists
US10/390,098 2003-03-17
US10/390,994 US7137830B2 (en) 2002-03-18 2003-03-17 Miniaturized contact spring
US10/390,994 2003-03-17

Publications (3)

Publication Number Publication Date
WO2003081725A2 WO2003081725A2 (en) 2003-10-02
WO2003081725A3 true WO2003081725A3 (en) 2003-12-18
WO2003081725B1 WO2003081725B1 (en) 2004-03-25

Family

ID=28457983

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/008520 WO2003081725A2 (en) 2002-03-18 2003-03-18 A miniaturized contact spring

Country Status (3)

Country Link
AU (1) AU2003218288A1 (en)
DE (1) DE10392441T5 (en)
WO (1) WO2003081725A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101002103A (en) * 2004-08-05 2007-07-18 Sv探针私人有限公司 Probe tip plating
US7456092B2 (en) * 2004-10-07 2008-11-25 Palo Alto Research Center Incorporated Self-releasing spring structures and methods
JP2007187580A (en) * 2006-01-13 2007-07-26 Mikuni Kogyo:Kk Contact probe
US8853797B2 (en) 2008-05-12 2014-10-07 Nxp, B.V MEMS devices and fabrication thereof
US9102119B2 (en) 2012-06-26 2015-08-11 General Electric Company Encapsulated beam and method of forming
DE102021200510A1 (en) 2021-01-21 2022-07-21 BSH Hausgeräte GmbH Screen device with a screen surface

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166774A (en) * 1990-10-05 1992-11-24 Motorola, Inc. Selectively releasing conductive runner and substrate assembly having non-planar areas
US5280139A (en) * 1990-03-01 1994-01-18 Motorola, Inc. Selectively releasing conductive runner and substrate assembly
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US20010009724A1 (en) * 1995-05-26 2001-07-26 Chen Jimmy Kuo-Wei Method of making a product with improved material properties by moderate heat treatment of a metal incorporating a dilute additive
US20010009305A1 (en) * 1998-10-28 2001-07-26 Joseph Fjelstad Microelectronic elements with deformable leads

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5280139A (en) * 1990-03-01 1994-01-18 Motorola, Inc. Selectively releasing conductive runner and substrate assembly
US5166774A (en) * 1990-10-05 1992-11-24 Motorola, Inc. Selectively releasing conductive runner and substrate assembly having non-planar areas
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US20010009724A1 (en) * 1995-05-26 2001-07-26 Chen Jimmy Kuo-Wei Method of making a product with improved material properties by moderate heat treatment of a metal incorporating a dilute additive
US20010009305A1 (en) * 1998-10-28 2001-07-26 Joseph Fjelstad Microelectronic elements with deformable leads

Also Published As

Publication number Publication date
WO2003081725A2 (en) 2003-10-02
WO2003081725B1 (en) 2004-03-25
AU2003218288A1 (en) 2003-10-08
DE10392441T5 (en) 2005-07-07

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