WO2003019630A3 - Unified frame for semiconductor material handling system - Google Patents

Unified frame for semiconductor material handling system Download PDF

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Publication number
WO2003019630A3
WO2003019630A3 PCT/US2002/030297 US0230297W WO03019630A3 WO 2003019630 A3 WO2003019630 A3 WO 2003019630A3 US 0230297 W US0230297 W US 0230297W WO 03019630 A3 WO03019630 A3 WO 03019630A3
Authority
WO
WIPO (PCT)
Prior art keywords
efem
vertical struts
components
unified
align
Prior art date
Application number
PCT/US2002/030297
Other languages
French (fr)
Other versions
WO2003019630A2 (en
Inventor
Anthony C Bonora
Richard H Gould
Roger G Hine
Michael Krolak
Jerry Speasl
Original Assignee
Asyst Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asyst Technologies filed Critical Asyst Technologies
Priority to JP2003522990A priority Critical patent/JP4309263B2/en
Priority to KR1020047003050A priority patent/KR100809107B1/en
Priority to DE10297170T priority patent/DE10297170T5/en
Publication of WO2003019630A2 publication Critical patent/WO2003019630A2/en
Publication of WO2003019630A3 publication Critical patent/WO2003019630A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Abstract

The present invention is a unified spine structure that EFEM components, such as a wafer handling robot and a SMIF pod advance assembly, may mount to. The frame includes multiple vertical struts that are mounted to an upper support member and a lower support member. Structurally tying the vertical struts to the support members creates a rigid body to support the EFEM components. The vertical struts also provide a common reference that the EFEM components may align with. This eliminates the need for each EFEM component to align with respect to each other. Thus, if one EFEM component is removed it will not affect the alignment and calibration of the remaining secured EFEM components. The unified frame also creates an isolated storage area for the SMIF pod door and the port door within the environment that is isolated from the outside ambient conditions.
PCT/US2002/030297 2001-08-31 2002-08-30 Unified frame for semiconductor material handling system WO2003019630A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003522990A JP4309263B2 (en) 2001-08-31 2002-08-30 Semiconductor tool interface frame
KR1020047003050A KR100809107B1 (en) 2001-08-31 2002-08-30 Unified frame for semiconductor material handling system
DE10297170T DE10297170T5 (en) 2001-08-31 2002-08-30 Uniform framework for a handling system for semiconductor material

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US31672201P 2001-08-31 2001-08-31
US60/316,722 2001-08-31
US10/087,638 US7100340B2 (en) 2001-08-31 2002-03-01 Unified frame for semiconductor material handling system
US10/087,638 2002-03-01

Publications (2)

Publication Number Publication Date
WO2003019630A2 WO2003019630A2 (en) 2003-03-06
WO2003019630A3 true WO2003019630A3 (en) 2003-11-20

Family

ID=26777219

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/030297 WO2003019630A2 (en) 2001-08-31 2002-08-30 Unified frame for semiconductor material handling system

Country Status (6)

Country Link
US (2) US7100340B2 (en)
JP (1) JP4309263B2 (en)
KR (1) KR100809107B1 (en)
CN (1) CN100359634C (en)
DE (1) DE10297170T5 (en)
WO (1) WO2003019630A2 (en)

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US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
US8821099B2 (en) 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
US7637708B2 (en) * 2006-01-09 2009-12-29 Sumco Corporation Production system for wafer
KR100832772B1 (en) * 2006-05-22 2008-05-27 주식회사 나온테크 Semiconductor material handling system
JP4606388B2 (en) * 2006-06-12 2011-01-05 川崎重工業株式会社 Transfer system unit for substrate transfer equipment
US8021513B2 (en) * 2006-08-23 2011-09-20 Tokyo Electron Limited Substrate carrying apparatus and substrate carrying method
US7690881B2 (en) * 2006-08-30 2010-04-06 Asm Japan K.K. Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
US9117859B2 (en) 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US7934898B2 (en) * 2007-07-16 2011-05-03 Semitool, Inc. High throughput semiconductor wafer processing
WO2009014647A1 (en) * 2007-07-20 2009-01-29 Applied Materials, Inc. Dual-mode robot systems and methods for electronic device manufacturing
JP5185853B2 (en) * 2009-02-16 2013-04-17 アテル株式会社 Substrate transfer device
JP5603030B2 (en) * 2009-06-23 2014-10-08 Ｄｍｇ森精機株式会社 Temperature control device for processing machine
JP5445015B2 (en) 2009-10-14 2014-03-19 シンフォニアテクノロジー株式会社 Carrier transfer promotion device
JP5952526B2 (en) * 2011-02-04 2016-07-13 株式会社ダイヘン Work transfer system
US9545724B2 (en) * 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
CN103824794B (en) * 2014-03-07 2016-09-28 上海华虹宏力半导体制造有限公司 For controlling the control device of SMIF and board, conveying arrangement
KR101593386B1 (en) 2014-09-01 2016-02-15 로체 시스템즈(주) Purge module and load port having the same
EP3016136B1 (en) * 2014-10-27 2021-07-21 Robert Bosch GmbH Transport system with magnetically driven transport elements and according transportation method
US10177020B2 (en) 2015-02-07 2019-01-08 Kla-Tencor Corporation System and method for high throughput work-in-process buffer
KR101852323B1 (en) * 2016-07-05 2018-04-26 로체 시스템즈(주) Jig for purge module and purge module including the same
US10541165B2 (en) * 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
CN109065470B (en) * 2018-06-20 2024-03-19 常州瑞赛环保科技有限公司 Photovoltaic panel grinds separator
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CN109212703B (en) * 2018-11-06 2023-04-18 中国工程物理研究院激光聚变研究中心 Self-cleaning type automatic fixture library for offline precise assembly and calibration of optical elements
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Also Published As

Publication number Publication date
JP4309263B2 (en) 2009-08-05
KR100809107B1 (en) 2008-03-04
DE10297170T5 (en) 2004-07-29
US20060177289A1 (en) 2006-08-10
WO2003019630A2 (en) 2003-03-06
CN100359634C (en) 2008-01-02
KR20040048402A (en) 2004-06-09
CN1561537A (en) 2005-01-05
US20030044268A1 (en) 2003-03-06
US7100340B2 (en) 2006-09-05
JP2005525688A (en) 2005-08-25

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