USD738832S1 - Light emitting diode (LED) package - Google Patents
Light emitting diode (LED) package Download PDFInfo
- Publication number
- USD738832S1 USD738832S1 US29/444,591 US201329444591F USD738832S US D738832 S1 USD738832 S1 US D738832S1 US 201329444591 F US201329444591 F US 201329444591F US D738832 S USD738832 S US D738832S
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- United States
- Prior art keywords
- view
- led
- light emitting
- emitting diode
- package
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Description
The uniformly broken lines are for illustrative purposes only and form no part of the claimed design.
The dot-dash-dot broken lines (e.g., in FIG. 17 ) represent boundaries of the claimed design and form no part of the claimed design.
Claims (1)
- The ornamental design for a light emitting diode (LED) package, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/444,591 USD738832S1 (en) | 2006-04-04 | 2013-01-31 | Light emitting diode (LED) package |
TW102302923F TWD162119S (en) | 2013-01-31 | 2013-04-25 | Portion of a light emitting diode (led) package |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/398,214 US8969908B2 (en) | 2006-04-04 | 2006-04-04 | Uniform emission LED package |
US29/444,591 USD738832S1 (en) | 2006-04-04 | 2013-01-31 | Light emitting diode (LED) package |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/398,214 Continuation-In-Part US8969908B2 (en) | 2006-04-04 | 2006-04-04 | Uniform emission LED package |
Publications (1)
Publication Number | Publication Date |
---|---|
USD738832S1 true USD738832S1 (en) | 2015-09-15 |
Family
ID=54063881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/444,591 Active USD738832S1 (en) | 2006-04-04 | 2013-01-31 | Light emitting diode (LED) package |
Country Status (1)
Country | Link |
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US (1) | USD738832S1 (en) |
Cited By (13)
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USD768584S1 (en) * | 2014-11-13 | 2016-10-11 | Mitsubishi Electric Corporation | Light source module |
USD780704S1 (en) * | 2014-08-27 | 2017-03-07 | Mitsubishi Electric Corporation | Light source module |
US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US9780268B2 (en) | 2006-04-04 | 2017-10-03 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
USD826184S1 (en) * | 2016-03-24 | 2018-08-21 | Hamamatsu Photonics K.K. | Optical semiconductor element |
USD831593S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K | Optical semiconductor element |
USD831592S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K. | Optical semiconductor element |
USD832802S1 (en) * | 2016-03-24 | 2018-11-06 | Hamamatsu Photonics K.K. | Optical semiconductor element |
US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
US10222032B2 (en) | 2012-03-30 | 2019-03-05 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
USD844576S1 (en) * | 2017-07-25 | 2019-04-02 | Citizen Electronics Co., Ltd. | Light emitting diode |
US10797204B2 (en) | 2014-05-30 | 2020-10-06 | Cree, Inc. | Submount based light emitter components and methods |
USD996378S1 (en) * | 2022-03-09 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
Citations (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4946547A (en) | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
US5200022A (en) | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
USRE34861E (en) | 1987-10-26 | 1995-02-14 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
JP2000022218A (en) | 1998-07-01 | 2000-01-21 | Matsushita Electron Corp | Chip-type electronic component and its manufacture |
JP2001160630A (en) | 1999-12-03 | 2001-06-12 | Rohm Co Ltd | Chip type semiconductor device |
US20030067761A1 (en) | 2001-10-09 | 2003-04-10 | Citizen Electronics Co., Ltd. | Edge light for a lighting panel |
US6686609B1 (en) * | 2002-10-01 | 2004-02-03 | Ultrastar Limited | Package structure of surface mounting led and method of manufacturing the same |
US20040056265A1 (en) | 2000-08-24 | 2004-03-25 | Karlheinz Arndt | Component comprising a large number of light-emitting-diode chips |
US20050184387A1 (en) | 2004-02-25 | 2005-08-25 | Collins William D.Iii | Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection |
US6936855B1 (en) | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
US20050219835A1 (en) | 2004-03-25 | 2005-10-06 | Citizen Electronics Co. Ltd. | Light-emitting diode |
US20050221519A1 (en) | 2004-03-31 | 2005-10-06 | Michael Leung | Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same |
USD511328S1 (en) | 2004-06-23 | 2005-11-08 | Harvatek Corporation | Light-emitting diode |
US20060012299A1 (en) | 2003-07-17 | 2006-01-19 | Yoshinobu Suehiro | Light emitting device |
JP2006093435A (en) | 2004-09-24 | 2006-04-06 | Stanley Electric Co Ltd | Led device |
US20060113906A1 (en) | 2004-11-29 | 2006-06-01 | Satoru Ogawa | Light emitting device and method for manufacturing thereof |
US7066626B2 (en) * | 2003-04-09 | 2006-06-27 | Citizen Electronics Co., Ltd. | LED lamp |
US20060157722A1 (en) | 2004-12-03 | 2006-07-20 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
US20060220046A1 (en) * | 2005-03-04 | 2006-10-05 | Chuan-Pei Yu | Led |
US7213940B1 (en) | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
JP2007189006A (en) | 2006-01-12 | 2007-07-26 | Hitachi Aic Inc | Printed wiring board, and led device using it |
US20070228387A1 (en) | 2006-04-04 | 2007-10-04 | Gerald Negley | Uniform emission LED package |
US20080036362A1 (en) | 2004-11-22 | 2008-02-14 | Matsushita Electric Industrial Co., Ltd. | Light-Emitting Device, Light-Emitting Module, Display Unit, Lighting Unit and Method for Manufacturing Light-Emitting Device |
KR100829910B1 (en) | 2006-10-02 | 2008-05-19 | 주식회사 이노칩테크놀로지 | Ceramic package and method of manufacturing the same |
USD572210S1 (en) * | 2006-11-01 | 2008-07-01 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
US20080173884A1 (en) | 2007-01-22 | 2008-07-24 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US20080179611A1 (en) | 2007-01-22 | 2008-07-31 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US20080224608A1 (en) | 2007-03-15 | 2008-09-18 | Sharp Kabushiki Kaisha | Light emitting device and method for manufacturing the same |
US20090057699A1 (en) | 2007-09-04 | 2009-03-05 | Philips Lumileds Lighting Company, Llc | LED with Particles in Encapsulant for Increased Light Extraction and Non-Yellow Off-State Color |
US20090057901A1 (en) | 2001-09-17 | 2009-03-05 | Megica Corporation | Structure of high performance combo chip and processing method |
US20090108281A1 (en) | 2007-10-31 | 2009-04-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US20090315057A1 (en) | 2008-06-24 | 2009-12-24 | Sharp Kabushiki Kaisha | Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus |
KR100933920B1 (en) | 2009-06-05 | 2009-12-28 | 주식회사 케이아이자이맥스 | Light emitting unit and manufacturing thereof |
KR20100008509A (en) | 2008-07-16 | 2010-01-26 | 주식회사 이츠웰 | A surface mount device type light emmitting diode and backlight unit uusing the same |
USD615505S1 (en) * | 2009-07-27 | 2010-05-11 | Koninklijke Philips Electronics N.V. | LED package |
USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
US20100155763A1 (en) | 2008-01-15 | 2010-06-24 | Cree, Inc. | Systems and methods for application of optical materials to optical elements |
US20100212942A1 (en) | 2008-02-07 | 2010-08-26 | Wei-Hsing Tuan | Fully reflective and highly thermoconductive electronic module and method of manufacturing the same |
US7791061B2 (en) | 2004-05-18 | 2010-09-07 | Cree, Inc. | External extraction light emitting diode based upon crystallographic faceted surfaces |
US20100252851A1 (en) | 2007-10-31 | 2010-10-07 | Cree, Inc. | Led package with increased feature sizes |
US20100301367A1 (en) | 2009-06-01 | 2010-12-02 | Nitto Denko Corporation | Light-emitting device comprising a dome-shaped ceramic phosphor |
USD628966S1 (en) * | 2009-12-22 | 2010-12-14 | Panasonic Corporation | Light-emitting diode |
USD631020S1 (en) * | 2010-04-29 | 2011-01-18 | Edison Opto Corporation | LED package |
US20110018017A1 (en) | 2009-07-23 | 2011-01-27 | Koninklijke Philips Electronics N.V. | Led with molded reflective sidewall coating |
USD633631S1 (en) * | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
US20110062471A1 (en) * | 2009-09-17 | 2011-03-17 | Koninklijke Philips Electronics N.V. | Led module with high index lens |
US20110079801A1 (en) | 2009-10-01 | 2011-04-07 | Zhang Xianzhu | Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation |
US20110089465A1 (en) | 2008-03-25 | 2011-04-21 | Lin Charles W C | Semiconductor chip assembly with post/base heat spreader with esd protection layer |
USD637565S1 (en) * | 2010-11-02 | 2011-05-10 | Silitek Electronic (Guangzhou) Co., Ltd. | Light emitting diode |
USD642143S1 (en) * | 2010-07-07 | 2011-07-26 | Panasonic Corporation | Light emitting diode |
US20110220929A1 (en) * | 2010-03-09 | 2011-09-15 | Cree, Inc. | Warm white leds having high color rendering index values and related luminophoric mediums |
USD645416S1 (en) * | 2009-12-22 | 2011-09-20 | Panasonic Corporation | Light-emitting diode |
KR20110111941A (en) | 2010-04-06 | 2011-10-12 | 엘지이노텍 주식회사 | Light emitting device and method for fabricating the same |
US20110273079A1 (en) | 2006-01-20 | 2011-11-10 | Paul Pickard | Lighting Devices Having Remote Lumiphors that are Excited by Lumiphor-Converted Semiconductor Excitation Sources |
US8058088B2 (en) | 2008-01-15 | 2011-11-15 | Cree, Inc. | Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating |
USD649943S1 (en) * | 2010-07-07 | 2011-12-06 | Panasonic Corporation | Light emitting diode |
USD649944S1 (en) * | 2010-07-07 | 2011-12-06 | Panasonic Corporation | Light emitting diode |
US20110309396A1 (en) * | 2008-04-18 | 2011-12-22 | Ledon Lighting Jennersdorf Gmbh | Led Module having a Platform with a Central Recession |
USD656906S1 (en) * | 2008-01-10 | 2012-04-03 | Cree Hong Kong Limited | LED package |
USD660813S1 (en) * | 2010-08-26 | 2012-05-29 | Citizen Electronics Co., Ltd. | Light-emitting diode |
US8267550B2 (en) * | 2010-06-09 | 2012-09-18 | Chin-Wen Wang | LED lamp for easy assembly and fixation |
USD667802S1 (en) * | 2011-03-09 | 2012-09-25 | Citizen Electronics Co., Ltd. | Light-emitting diode |
USD670010S1 (en) * | 2010-07-23 | 2012-10-30 | Everlight Electronics Co., Ltd. | Light emitting diode |
US20120299022A1 (en) | 2011-02-16 | 2012-11-29 | Hussell Christopher P | Light emitting devices and methods |
US20120305949A1 (en) | 2011-01-31 | 2012-12-06 | Matthew Donofrio | Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies |
US20130087822A1 (en) * | 2011-10-06 | 2013-04-11 | Samsung Electronics Co., Ltd. | Light emitting diode package and fabrication method thereof |
USD680504S1 (en) * | 2010-07-30 | 2013-04-23 | Nichia Corporation | Light emitting diode |
US20130099265A1 (en) * | 2011-10-24 | 2013-04-25 | Sungmin HWANG | Light emitting device |
US20130193468A1 (en) | 2006-04-04 | 2013-08-01 | Cree, Inc. | Submount based surface mount device (smd) light emitter components and methods |
WO2013148823A1 (en) | 2012-03-30 | 2013-10-03 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
US20130256711A1 (en) | 2012-03-30 | 2013-10-03 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
WO2013148826A1 (en) | 2012-03-30 | 2013-10-03 | Cree, Inc. | Submount based surface mount device (smd) light emitter components and methods |
US8563339B2 (en) | 2005-08-25 | 2013-10-22 | Cree, Inc. | System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices |
USD698741S1 (en) * | 2012-05-29 | 2014-02-04 | Kabushiki Kaisha Toshiba | Light-emitting diode |
US8748915B2 (en) * | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
WO2014120256A1 (en) | 2013-01-31 | 2014-08-07 | Cree, Inc. | Submount based surface mount device (smd) light emitter components and methods |
USD711840S1 (en) * | 2012-06-11 | 2014-08-26 | Cree, Inc. | LED package |
US20140291715A1 (en) * | 2012-06-11 | 2014-10-02 | Cree, Inc. | Compact led package with reflectivity layer |
USD718258S1 (en) * | 2012-09-02 | 2014-11-25 | Cree, Inc. | LED package |
USD718725S1 (en) * | 2013-08-01 | 2014-12-02 | Cree, Inc. | LED package with encapsulant |
-
2013
- 2013-01-31 US US29/444,591 patent/USD738832S1/en active Active
Patent Citations (86)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE34861E (en) | 1987-10-26 | 1995-02-14 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
US4946547A (en) | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
US5200022A (en) | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
JP2000022218A (en) | 1998-07-01 | 2000-01-21 | Matsushita Electron Corp | Chip-type electronic component and its manufacture |
JP2001160630A (en) | 1999-12-03 | 2001-06-12 | Rohm Co Ltd | Chip type semiconductor device |
US20040056265A1 (en) | 2000-08-24 | 2004-03-25 | Karlheinz Arndt | Component comprising a large number of light-emitting-diode chips |
US20090057901A1 (en) | 2001-09-17 | 2009-03-05 | Megica Corporation | Structure of high performance combo chip and processing method |
US20030067761A1 (en) | 2001-10-09 | 2003-04-10 | Citizen Electronics Co., Ltd. | Edge light for a lighting panel |
US6953255B2 (en) | 2001-10-09 | 2005-10-11 | Citizen Electronics Co., Ltd. | Edge light for a lighting panel |
US6936855B1 (en) | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
US6686609B1 (en) * | 2002-10-01 | 2004-02-03 | Ultrastar Limited | Package structure of surface mounting led and method of manufacturing the same |
US7066626B2 (en) * | 2003-04-09 | 2006-06-27 | Citizen Electronics Co., Ltd. | LED lamp |
US20060012299A1 (en) | 2003-07-17 | 2006-01-19 | Yoshinobu Suehiro | Light emitting device |
US20050184387A1 (en) | 2004-02-25 | 2005-08-25 | Collins William D.Iii | Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection |
US20050219835A1 (en) | 2004-03-25 | 2005-10-06 | Citizen Electronics Co. Ltd. | Light-emitting diode |
US20050221519A1 (en) | 2004-03-31 | 2005-10-06 | Michael Leung | Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same |
US7791061B2 (en) | 2004-05-18 | 2010-09-07 | Cree, Inc. | External extraction light emitting diode based upon crystallographic faceted surfaces |
USD511328S1 (en) | 2004-06-23 | 2005-11-08 | Harvatek Corporation | Light-emitting diode |
JP2006093435A (en) | 2004-09-24 | 2006-04-06 | Stanley Electric Co Ltd | Led device |
US20080036362A1 (en) | 2004-11-22 | 2008-02-14 | Matsushita Electric Industrial Co., Ltd. | Light-Emitting Device, Light-Emitting Module, Display Unit, Lighting Unit and Method for Manufacturing Light-Emitting Device |
US20060113906A1 (en) | 2004-11-29 | 2006-06-01 | Satoru Ogawa | Light emitting device and method for manufacturing thereof |
US20060157722A1 (en) | 2004-12-03 | 2006-07-20 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
US20060220046A1 (en) * | 2005-03-04 | 2006-10-05 | Chuan-Pei Yu | Led |
US8563339B2 (en) | 2005-08-25 | 2013-10-22 | Cree, Inc. | System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices |
US7213940B1 (en) | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
JP2007189006A (en) | 2006-01-12 | 2007-07-26 | Hitachi Aic Inc | Printed wiring board, and led device using it |
US20110273079A1 (en) | 2006-01-20 | 2011-11-10 | Paul Pickard | Lighting Devices Having Remote Lumiphors that are Excited by Lumiphor-Converted Semiconductor Excitation Sources |
US20070228387A1 (en) | 2006-04-04 | 2007-10-04 | Gerald Negley | Uniform emission LED package |
US20130193468A1 (en) | 2006-04-04 | 2013-08-01 | Cree, Inc. | Submount based surface mount device (smd) light emitter components and methods |
US8748915B2 (en) * | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
KR100829910B1 (en) | 2006-10-02 | 2008-05-19 | 주식회사 이노칩테크놀로지 | Ceramic package and method of manufacturing the same |
USD572210S1 (en) * | 2006-11-01 | 2008-07-01 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
US20080173884A1 (en) | 2007-01-22 | 2008-07-24 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US20080179611A1 (en) | 2007-01-22 | 2008-07-31 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US20080224608A1 (en) | 2007-03-15 | 2008-09-18 | Sharp Kabushiki Kaisha | Light emitting device and method for manufacturing the same |
US20090057699A1 (en) | 2007-09-04 | 2009-03-05 | Philips Lumileds Lighting Company, Llc | LED with Particles in Encapsulant for Increased Light Extraction and Non-Yellow Off-State Color |
USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
US20100252851A1 (en) | 2007-10-31 | 2010-10-07 | Cree, Inc. | Led package with increased feature sizes |
US20090108281A1 (en) | 2007-10-31 | 2009-04-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
USD633631S1 (en) * | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
USD662902S1 (en) * | 2007-12-14 | 2012-07-03 | Cree Hong Kong Limited | LED package |
USD656906S1 (en) * | 2008-01-10 | 2012-04-03 | Cree Hong Kong Limited | LED package |
US8058088B2 (en) | 2008-01-15 | 2011-11-15 | Cree, Inc. | Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating |
US20100155763A1 (en) | 2008-01-15 | 2010-06-24 | Cree, Inc. | Systems and methods for application of optical materials to optical elements |
US20100212942A1 (en) | 2008-02-07 | 2010-08-26 | Wei-Hsing Tuan | Fully reflective and highly thermoconductive electronic module and method of manufacturing the same |
US20110089465A1 (en) | 2008-03-25 | 2011-04-21 | Lin Charles W C | Semiconductor chip assembly with post/base heat spreader with esd protection layer |
US20110309396A1 (en) * | 2008-04-18 | 2011-12-22 | Ledon Lighting Jennersdorf Gmbh | Led Module having a Platform with a Central Recession |
US20090315057A1 (en) | 2008-06-24 | 2009-12-24 | Sharp Kabushiki Kaisha | Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus |
KR20100008509A (en) | 2008-07-16 | 2010-01-26 | 주식회사 이츠웰 | A surface mount device type light emmitting diode and backlight unit uusing the same |
US20100301367A1 (en) | 2009-06-01 | 2010-12-02 | Nitto Denko Corporation | Light-emitting device comprising a dome-shaped ceramic phosphor |
KR100933920B1 (en) | 2009-06-05 | 2009-12-28 | 주식회사 케이아이자이맥스 | Light emitting unit and manufacturing thereof |
US20110018017A1 (en) | 2009-07-23 | 2011-01-27 | Koninklijke Philips Electronics N.V. | Led with molded reflective sidewall coating |
USD615505S1 (en) * | 2009-07-27 | 2010-05-11 | Koninklijke Philips Electronics N.V. | LED package |
US20110062471A1 (en) * | 2009-09-17 | 2011-03-17 | Koninklijke Philips Electronics N.V. | Led module with high index lens |
US20110079801A1 (en) | 2009-10-01 | 2011-04-07 | Zhang Xianzhu | Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation |
USD628966S1 (en) * | 2009-12-22 | 2010-12-14 | Panasonic Corporation | Light-emitting diode |
USD645416S1 (en) * | 2009-12-22 | 2011-09-20 | Panasonic Corporation | Light-emitting diode |
US20110220929A1 (en) * | 2010-03-09 | 2011-09-15 | Cree, Inc. | Warm white leds having high color rendering index values and related luminophoric mediums |
KR20110111941A (en) | 2010-04-06 | 2011-10-12 | 엘지이노텍 주식회사 | Light emitting device and method for fabricating the same |
USD631020S1 (en) * | 2010-04-29 | 2011-01-18 | Edison Opto Corporation | LED package |
US8267550B2 (en) * | 2010-06-09 | 2012-09-18 | Chin-Wen Wang | LED lamp for easy assembly and fixation |
USD642143S1 (en) * | 2010-07-07 | 2011-07-26 | Panasonic Corporation | Light emitting diode |
USD649944S1 (en) * | 2010-07-07 | 2011-12-06 | Panasonic Corporation | Light emitting diode |
USD649943S1 (en) * | 2010-07-07 | 2011-12-06 | Panasonic Corporation | Light emitting diode |
USD670010S1 (en) * | 2010-07-23 | 2012-10-30 | Everlight Electronics Co., Ltd. | Light emitting diode |
USD698323S1 (en) * | 2010-07-30 | 2014-01-28 | Nichia Corporation | Light emitting diode |
USD680504S1 (en) * | 2010-07-30 | 2013-04-23 | Nichia Corporation | Light emitting diode |
USD710810S1 (en) * | 2010-07-30 | 2014-08-12 | Nichia Corporation | Light emitting diode |
USD660813S1 (en) * | 2010-08-26 | 2012-05-29 | Citizen Electronics Co., Ltd. | Light-emitting diode |
USD637565S1 (en) * | 2010-11-02 | 2011-05-10 | Silitek Electronic (Guangzhou) Co., Ltd. | Light emitting diode |
US20120305949A1 (en) | 2011-01-31 | 2012-12-06 | Matthew Donofrio | Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies |
US20120299022A1 (en) | 2011-02-16 | 2012-11-29 | Hussell Christopher P | Light emitting devices and methods |
USD667802S1 (en) * | 2011-03-09 | 2012-09-25 | Citizen Electronics Co., Ltd. | Light-emitting diode |
US20130087822A1 (en) * | 2011-10-06 | 2013-04-11 | Samsung Electronics Co., Ltd. | Light emitting diode package and fabrication method thereof |
US20130099265A1 (en) * | 2011-10-24 | 2013-04-25 | Sungmin HWANG | Light emitting device |
WO2013148823A1 (en) | 2012-03-30 | 2013-10-03 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
US20130279169A1 (en) | 2012-03-30 | 2013-10-24 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
US20130270592A1 (en) | 2012-03-30 | 2013-10-17 | Cree, Inc. | Submount based surface mount device (smd) light emitter components and methods |
WO2013148826A1 (en) | 2012-03-30 | 2013-10-03 | Cree, Inc. | Submount based surface mount device (smd) light emitter components and methods |
US20130256711A1 (en) | 2012-03-30 | 2013-10-03 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
USD698741S1 (en) * | 2012-05-29 | 2014-02-04 | Kabushiki Kaisha Toshiba | Light-emitting diode |
USD711840S1 (en) * | 2012-06-11 | 2014-08-26 | Cree, Inc. | LED package |
US20140291715A1 (en) * | 2012-06-11 | 2014-10-02 | Cree, Inc. | Compact led package with reflectivity layer |
USD718258S1 (en) * | 2012-09-02 | 2014-11-25 | Cree, Inc. | LED package |
WO2014120256A1 (en) | 2013-01-31 | 2014-08-07 | Cree, Inc. | Submount based surface mount device (smd) light emitter components and methods |
USD718725S1 (en) * | 2013-08-01 | 2014-12-02 | Cree, Inc. | LED package with encapsulant |
Non-Patent Citations (13)
Title |
---|
Chinese Correction of Deficiencies for Application No. 201330359083.X dated Nov. 5, 2013. |
Chinese Notice of Grant for Application No. 201330359083.X dated Jan. 26, 2014. |
International Search Report and Written Opinion for Application No. PCT/US2013/034084 dated Jul. 25, 2013. |
International Search Report and Written Opinion for Application No. PCT/US2013/034087 dated Jul. 25, 2013. |
International Search Report and Written Opinion for Application No. PCT/US2013/035411 dated Oct. 15, 2013. |
Non-Final Office Action for Application No. 13/755,993 dated Nov. 5, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/800,284 dated Jun. 30, 2014. |
Restriction Requirement for U.S. Appl. No. 13/755,993 dated Jul. 10, 2014. |
Restriction Requirement for U.S. Appl. No. 13/800,284 dated Mar. 31, 2014. |
Restriction Requirement for U.S. Appl. No. 13/834,195 dated Jul. 21, 2014. |
Taiwanese Notice of Allowance for Application No. 102302923 dated Apr. 7, 2014. |
Taiwanese Office Action and Search Report for Application No. 102302923 dated Dec. 30, 2013. |
U.S Appl. No. 13/607,217 dated Sep. 7, 2012. |
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