USD735683S1 - LED package - Google Patents

LED package Download PDF

Info

Publication number
USD735683S1
USD735683S1 US29/453,958 US201329453958F USD735683S US D735683 S1 USD735683 S1 US D735683S1 US 201329453958 F US201329453958 F US 201329453958F US D735683 S USD735683 S US D735683S
Authority
US
United States
Prior art keywords
led package
view
elevation view
package shown
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/453,958
Inventor
Jesse Reiherzer
Mike Bergmann
Joseph Gates Clark
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creeled Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/453,958 priority Critical patent/USD735683S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: REIHERZER, JESSE, CLARK, JOSEPH GATES, BERGMANN, MIKE
Application granted granted Critical
Publication of USD735683S1 publication Critical patent/USD735683S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of an LED package according to one embodiment of the present invention.
FIG. 2 is a front elevation view of one side of the LED package shown in FIG. 1.
FIG. 3 is a back elevation view of the LED package as shown in FIG. 1.
FIG. 4 is an elevation view of one side of the LED package shown in FIG. 1, with the other side being a mirror image thereof.
FIG. 5 is a top view of the LED package shown in FIG. 1.
FIG. 6 is a bottom view of the LED package shown in FIG. 1.
FIG. 7 is a top perspective view of an LED package according to another embodiment of the present invention.
FIG. 8 is a front elevation view of one side of the LED package shown in FIG. 7.
FIG. 9 is a back elevation view of the LED package as shown in FIG. 7.
FIG. 10 is an elevation view of one side of the LED package shown in FIG. 7, with the other side being a mirror image thereof.
FIG. 11 is a top view of the LED package shown in FIG. 7.
FIG. 12 is a bottom view of the LED package shown in FIG. 7.
FIG. 13 is a top perspective view of an LED package according to another embodiment of the present invention.
FIG. 14 is a front elevation view of one side of the LED package shown in FIG. 13.
FIG. 15 is a back elevation view of the LED package as shown in FIG. 13.
FIG. 16 is an elevation view of one side of the LED package shown in FIG. 13, with the other side being a mirror image thereof.
FIG. 17 is a top view of the LED package shown in FIG. 13; and,
FIG. 18 is a bottom view of the LED package shown in FIG. 13.

Claims (1)

    CLAIM
  1. The ornamental design for an LED package, as shown and described herein.
US29/453,958 2013-05-03 2013-05-03 LED package Active USD735683S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/453,958 USD735683S1 (en) 2013-05-03 2013-05-03 LED package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/453,958 USD735683S1 (en) 2013-05-03 2013-05-03 LED package

Publications (1)

Publication Number Publication Date
USD735683S1 true USD735683S1 (en) 2015-08-04

Family

ID=53719325

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/453,958 Active USD735683S1 (en) 2013-05-03 2013-05-03 LED package

Country Status (1)

Country Link
US (1) USD735683S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
USD831592S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
USD832802S1 (en) * 2016-03-24 2018-11-06 Hamamatsu Photonics K.K. Optical semiconductor element

Citations (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040868A (en) 1989-05-31 1991-08-20 Siemens Aktiengesellschaft Surface-mountable opto-component
US6061160A (en) 1996-05-31 2000-05-09 Dowa Mining Co., Ltd. Component device for optical communication
JP2000188358A (en) 1998-12-22 2000-07-04 Rohm Co Ltd Semiconductor device
JP2000223752A (en) 1999-01-29 2000-08-11 Nichia Chem Ind Ltd Optical semiconductor device and its forming method
US6376902B1 (en) 1997-07-29 2002-04-23 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelectronic structural element
US20020123163A1 (en) 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
US20020163001A1 (en) 2001-05-04 2002-11-07 Shaddock David Mulford Surface mount light emitting device package and fabrication method
CN1417868A (en) 2001-10-29 2003-05-14 银河光电股份有限公司 Multiple-chip package structure of LED chip
JP2003197974A (en) 2001-12-24 2003-07-11 Samsung Electro Mech Co Ltd Light emitting diode package
US20040041222A1 (en) 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
US20040079957A1 (en) 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US20040126913A1 (en) 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
US20040227149A1 (en) * 2003-04-30 2004-11-18 Cree, Inc. High powered light emitter packages with compact optics
US6900511B2 (en) 2002-06-28 2005-05-31 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing it
US6940704B2 (en) 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
US20060049477A1 (en) 2002-11-29 2006-03-09 Karlheinz Arndt Optoelectronic component
US20060102917A1 (en) 2002-06-19 2006-05-18 Toshihiko Oyama Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device
US7066626B2 (en) 2003-04-09 2006-06-27 Citizen Electronics Co., Ltd. LED lamp
US7224000B2 (en) 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
CN1977399A (en) 2005-04-01 2007-06-06 松下电器产业株式会社 LED component and method for manufacturing same
US7282785B2 (en) 2004-01-05 2007-10-16 Stanley Electric Co., Ltd. Surface mount type semiconductor device and lead frame structure thereof
JP2007287981A (en) 2006-04-18 2007-11-01 Konica Minolta Opto Inc Light emitting device
US20070252250A1 (en) 2006-04-26 2007-11-01 Cotco Holdings Limited, A Hong Kong Corporation Apparatus and method for use in mounting electronic elements
JP2007299905A (en) 2006-04-28 2007-11-15 Nichia Chem Ind Ltd Semiconductor device
US7317181B2 (en) 2001-12-07 2008-01-08 Hitachi Cable, Ltd. Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
USD572210S1 (en) 2006-11-01 2008-07-01 Lg Innotek Co., Ltd. Light-emitting diode (LED)
EP1953834A1 (en) 2005-11-21 2008-08-06 Matsushita Electric Works, Ltd. Light-emitting device
USD576574S1 (en) 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module
US20090020778A1 (en) * 2007-07-19 2009-01-22 Nichia Corporation Light emitting device and method of manufacturing the same
US20090108281A1 (en) 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD591697S1 (en) 2006-08-09 2009-05-05 Cree, Inc. Lamp package
US20090283781A1 (en) 2008-05-16 2009-11-19 Cree Hong Kong Limited Mini V SMD
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
USD631020S1 (en) 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
USD645416S1 (en) * 2009-12-22 2011-09-20 Panasonic Corporation Light-emitting diode
US20110291154A1 (en) * 2009-02-10 2011-12-01 Nichia Corporation Semiconductor light emitting device
USD649943S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
US20120032202A1 (en) * 2009-04-14 2012-02-09 Sharp Kabushiki Kaisha Planar light source device and display device provided with the planar light source device
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD667802S1 (en) * 2011-03-09 2012-09-25 Citizen Electronics Co., Ltd. Light-emitting diode
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
USD691973S1 (en) * 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
US20130328074A1 (en) * 2012-06-11 2013-12-12 Cree, Inc. Led package with multiple element light source and encapsulant having planar surfaces
US20130328073A1 (en) * 2012-06-11 2013-12-12 Cree, Inc. Led package with multiple element light source and encapsulant having planar surfaces
US8624289B2 (en) * 2007-09-28 2014-01-07 Osram Opto Semiconductors Gmbh Optoelectronic component
USD698323S1 (en) * 2010-07-30 2014-01-28 Nichia Corporation Light emitting diode
USD698741S1 (en) * 2012-05-29 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD703348S1 (en) * 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD704154S1 (en) * 2012-04-06 2014-05-06 Cree, Inc. Light emitter package
US8779567B2 (en) * 2012-05-24 2014-07-15 Nichia Corporation Semiconductor device
USD709464S1 (en) * 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
USD711840S1 (en) * 2012-06-11 2014-08-26 Cree, Inc. LED package
USD718725S1 (en) * 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant

Patent Citations (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1187227A2 (en) 1989-05-31 2002-03-13 Osram Opto Semiconductors GmbH & Co. OHG Surface-mountable optical element and method of fabrication
US5040868A (en) 1989-05-31 1991-08-20 Siemens Aktiengesellschaft Surface-mountable opto-component
US6061160A (en) 1996-05-31 2000-05-09 Dowa Mining Co., Ltd. Component device for optical communication
US7183632B2 (en) 1997-07-29 2007-02-27 Osram Gmbh Surface-mountable light-emitting diode structural element
US6759733B2 (en) 1997-07-29 2004-07-06 Osram Opto Semiconductors Gmbh Optoelectric surface-mountable structural element
US6376902B1 (en) 1997-07-29 2002-04-23 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelectronic structural element
US20040238930A1 (en) 1997-07-29 2004-12-02 Osram Opto Semiconductors Gmbh Surface-mountable light-emitting diode structural element
US7102215B2 (en) 1997-07-29 2006-09-05 Osram Gmbh Surface-mountable light-emitting diode structural element
JP2000188358A (en) 1998-12-22 2000-07-04 Rohm Co Ltd Semiconductor device
JP2000223752A (en) 1999-01-29 2000-08-11 Nichia Chem Ind Ltd Optical semiconductor device and its forming method
US20020123163A1 (en) 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
US6940704B2 (en) 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
US20020163001A1 (en) 2001-05-04 2002-11-07 Shaddock David Mulford Surface mount light emitting device package and fabrication method
CN1417868A (en) 2001-10-29 2003-05-14 银河光电股份有限公司 Multiple-chip package structure of LED chip
US7317181B2 (en) 2001-12-07 2008-01-08 Hitachi Cable, Ltd. Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
US6707069B2 (en) 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
JP2003197974A (en) 2001-12-24 2003-07-11 Samsung Electro Mech Co Ltd Light emitting diode package
US20060102917A1 (en) 2002-06-19 2006-05-18 Toshihiko Oyama Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device
US6900511B2 (en) 2002-06-28 2005-05-31 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing it
US7224000B2 (en) 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US20040079957A1 (en) 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US20040041222A1 (en) 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
US7271425B2 (en) 2002-11-29 2007-09-18 Osram Opto Semiconductors Gmbh Optoelectronic component
US20060049477A1 (en) 2002-11-29 2006-03-09 Karlheinz Arndt Optoelectronic component
WO2004053933A3 (en) 2002-12-06 2004-09-16 Cree Inc Composite leadframe led package and method of making the same
US20040126913A1 (en) 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
US7066626B2 (en) 2003-04-09 2006-06-27 Citizen Electronics Co., Ltd. LED lamp
US20040227149A1 (en) * 2003-04-30 2004-11-18 Cree, Inc. High powered light emitter packages with compact optics
US7282785B2 (en) 2004-01-05 2007-10-16 Stanley Electric Co., Ltd. Surface mount type semiconductor device and lead frame structure thereof
CN1977399A (en) 2005-04-01 2007-06-06 松下电器产业株式会社 LED component and method for manufacturing same
EP1953834A1 (en) 2005-11-21 2008-08-06 Matsushita Electric Works, Ltd. Light-emitting device
JP2007287981A (en) 2006-04-18 2007-11-01 Konica Minolta Opto Inc Light emitting device
US20070252250A1 (en) 2006-04-26 2007-11-01 Cotco Holdings Limited, A Hong Kong Corporation Apparatus and method for use in mounting electronic elements
JP2007299905A (en) 2006-04-28 2007-11-15 Nichia Chem Ind Ltd Semiconductor device
USD591697S1 (en) 2006-08-09 2009-05-05 Cree, Inc. Lamp package
USD572210S1 (en) 2006-11-01 2008-07-01 Lg Innotek Co., Ltd. Light-emitting diode (LED)
USD576574S1 (en) 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module
US20090020778A1 (en) * 2007-07-19 2009-01-22 Nichia Corporation Light emitting device and method of manufacturing the same
US8624289B2 (en) * 2007-09-28 2014-01-07 Osram Opto Semiconductors Gmbh Optoelectronic component
US20090108281A1 (en) 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD662902S1 (en) 2007-12-14 2012-07-03 Cree Hong Kong Limited LED package
USD656906S1 (en) 2008-01-10 2012-04-03 Cree Hong Kong Limited LED package
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US20090283781A1 (en) 2008-05-16 2009-11-19 Cree Hong Kong Limited Mini V SMD
US20110291154A1 (en) * 2009-02-10 2011-12-01 Nichia Corporation Semiconductor light emitting device
US20120032202A1 (en) * 2009-04-14 2012-02-09 Sharp Kabushiki Kaisha Planar light source device and display device provided with the planar light source device
USD645416S1 (en) * 2009-12-22 2011-09-20 Panasonic Corporation Light-emitting diode
USD631020S1 (en) 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD649943S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
USD698323S1 (en) * 2010-07-30 2014-01-28 Nichia Corporation Light emitting diode
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD667802S1 (en) * 2011-03-09 2012-09-25 Citizen Electronics Co., Ltd. Light-emitting diode
USD691973S1 (en) * 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
USD704154S1 (en) * 2012-04-06 2014-05-06 Cree, Inc. Light emitter package
US8779567B2 (en) * 2012-05-24 2014-07-15 Nichia Corporation Semiconductor device
USD698741S1 (en) * 2012-05-29 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD709464S1 (en) * 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
US20130328073A1 (en) * 2012-06-11 2013-12-12 Cree, Inc. Led package with multiple element light source and encapsulant having planar surfaces
US20130328074A1 (en) * 2012-06-11 2013-12-12 Cree, Inc. Led package with multiple element light source and encapsulant having planar surfaces
USD711840S1 (en) * 2012-06-11 2014-08-26 Cree, Inc. LED package
USD703348S1 (en) * 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD718725S1 (en) * 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant

Non-Patent Citations (27)

* Cited by examiner, † Cited by third party
Title
Cree® XLamp® MC-E LEDs Product Info Sheets, 14 pages.
Decision of Registration from Japanese Design Patent Application No 2013-004502, dated Jun. 24, 2014.
Decision of Registration from Japanese Design Patent Application No. 2013-025955, dated Jun. 24, 2014.
Design of Registration Notice from Japanese Patent Appl. No. 2012-030304, dated Jan. 21, 2014.
Examination and Search Report from Taiwanese Patent Appl. No. 103300731, dated Jul. 21, 2014.
Examination Report from Taiwanese Patent appl. No 102308472, dated May 14, 2014.
Examination Report from Taiwanese Patent Appl. No. 102301478, dated Sep. 6, 2013.
First Office Action from Chinese Design Patent appl. No. 201330524820.7, dated Feb. 20, 2014.
First Office Action from Chinese Patent Appl. No. 201330052393.7, dated Jan. 9, 2014.
Letter of Examination Report from Taiwanese Patent appl. No. 101307391, dated Jun. 5, 2013.
Nichia Corporation LEDs, Models NSSM016G. NSSM227, NESM026X, NSSM026BB, NESM005A. 9 pages.
Notice of Allowance and Search Report for Taiwanese Patent Appl. No 101307391, dated Oct. 15, 2013.
Notice of Allowance from Chinese Patent Appl. No, 201330524820.7, Dated Aug. 5, 2014.
Notice of Allowance from Korean Patent Appl. No. 30-2013-0010610, dated Oct. 17, 2014.
Notice of Allowance from Korean Patent Appl. No. 30-2014-0006603, dated Apr. 2, 2015.
Notice of Allowance of Taiwanese Appl No. 103300731, dated Jan. 21, 2015.
Notice of Issuance of Chinese Patent Appl. No. 201430021459.0, dated May 21, 2014.
Notice to Submit a Response from Korean Design Appl. No. 30-2012-0059744 dated Apr. 28, 2014.
Notice to Submit a Response from Korean Design Appl. No. 30-2014-0016126, dated Nov. 7, 2014.
Notice to Submit a Response from Korean Patent Appl. No. 30-2012-0059744, dated Nov. 26, 2013.
Office Action from Korean Patent Appl. No. 30-2014-0006603, dated Nov. 12, 2014.
Office Action from Korean Patent Appl. No. 30-2014-0016126, dated Feb. 23, 2015.
Office Action from Korean Patent Design Appl. No. 30-2013-0010610, dated Jul. 8, 2014.
Office Action from U.S. Appl. No. 29/424.353. dated Dec. 26, 2013.
Patent Certificate from Chinese Design Patent Appl No. ZL 2013 3 0524820.7, dated Nov. 4, 2013.
Patent Issue Notice from Taiwanese Design Patent No. D-166931. dated Apr. 1, 2015.
Reasons for Rejection from Japanese Design Patent Appl. No. 2013-004502, dated Aug. 6, 2013.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
USD831592S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
USD832802S1 (en) * 2016-03-24 2018-11-06 Hamamatsu Photonics K.K. Optical semiconductor element
USD846512S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD846511S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element

Similar Documents

Publication Publication Date Title
USD709643S1 (en) Lamp cap
USD690875S1 (en) LED light reflector
USD757556S1 (en) Bottle
USD718725S1 (en) LED package with encapsulant
USD727385S1 (en) Optical component
USD736433S1 (en) Light head
USD675510S1 (en) All applications clip
USD745368S1 (en) Mounting device
USD727868S1 (en) Optical component
USD736657S1 (en) Optoelectronic sensor
USD705646S1 (en) Clip device
USD777121S1 (en) LED package
USD719696S1 (en) LED light
USD733954S1 (en) Cactus-shaped light
USD710210S1 (en) Gun-shaped bottle
USD736989S1 (en) LED lens
USD711840S1 (en) LED package
USD722490S1 (en) Sink clip
USD736970S1 (en) Light head
USD740475S1 (en) Lantern
USD710706S1 (en) Cross-shaped bottle
USD732209S1 (en) LED light bulb
USD733348S1 (en) Lamp
USD734945S1 (en) Carrying case
USD712245S1 (en) Package