USD662902S1 - LED package - Google Patents

LED package Download PDF

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Publication number
USD662902S1
USD662902S1 US29/377,708 US37770810F USD662902S US D662902 S1 USD662902 S1 US D662902S1 US 37770810 F US37770810 F US 37770810F US D662902 S USD662902 S US D662902S
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United States
Prior art keywords
led package
view
package shown
elevation view
perspective
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US29/377,708
Inventor
Yuh-Ren Shieh
Chi-Wing Leung
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Creeled Inc
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Cree Hong Kong Ltd
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Priority to US29/377,708 priority Critical patent/USD662902S1/en
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Assigned to CREE HONG KONG LIMITED reassignment CREE HONG KONG LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEUNG, CHI-WING, SHIEH, YUH-REN
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE HONG KONG LIMITED
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FIG. 1 is a perspective view of another embodiment of an LED package showing our design;
FIG. 2 is a top plan view of the LED package shown in FIG. 1;
FIG. 3 is a bottom plan view of the LED package shown in FIG. 1;
FIG. 4 is a front elevation view of the LED package shown in FIG. 1, with the back elevation view being substantially similar;
FIG. 5 is a side elevation view of the LED package shown in FIG. 1, with the opposite side elevation view being substantially similar;
FIG. 6 is a bottom perspective view of the LED package shown in FIG. 1;
FIG. 7 is a perspective view of another embodiment of an LED package showing our design;
FIG. 8 is a top plan view of the LED package shown in FIG. 7;
FIG. 9 is a bottom plan view of the LED package shown in FIG. 7;
FIG. 10 is a front elevation view of the LED package shown in FIG. 7, with the back elevation view being substantially similar;
FIG. 11 is a side elevation view of the LED package shown in FIG. 7, with the opposite side elevation view being substantially similar;
FIG. 12 is a bottom perspective view of the LED package shown in FIG. 7;
FIG. 13 is a perspective view of another embodiment of an LED package showing our design;
FIG. 14 is a bottom perspective view of the LED package shown in FIG. 13;
FIG. 16 is a top plan view of one component of the LED package shown in FIG. 13; and,
FIG. 17 is a bottom plan view of one component of the LED package shown in FIG. 13.
Any broken lines in FIGS. 1-16 are for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for LED package, as shown and described.
US29/377,708 2007-12-14 2010-10-25 LED package Active USD662902S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/377,708 USD662902S1 (en) 2007-12-14 2010-10-25 LED package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/293,900 USD633631S1 (en) 2007-12-14 2007-12-14 Light source of light emitting diode
US29/377,708 USD662902S1 (en) 2007-12-14 2010-10-25 LED package

Related Parent Applications (1)

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US29/293,900 Division USD633631S1 (en) 2007-12-14 2007-12-14 Light source of light emitting diode

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USD662902S1 true USD662902S1 (en) 2012-07-03

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US29/293,900 Active USD633631S1 (en) 2007-12-14 2007-12-14 Light source of light emitting diode
US29/377,708 Active USD662902S1 (en) 2007-12-14 2010-10-25 LED package

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US29/293,900 Active USD633631S1 (en) 2007-12-14 2007-12-14 Light source of light emitting diode

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD735683S1 (en) 2013-05-03 2015-08-04 Cree, Inc. LED package
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
USD879787S1 (en) * 2017-11-21 2020-03-31 Hangzhou Chipjet Technology Co., Ltd. Data processing equipment
USD880484S1 (en) * 2018-04-26 2020-04-07 Hangzhou Chipjet Technology Co., Ltd. Data processing equipment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device

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