USD615504S1 - Emitter package - Google Patents

Emitter package Download PDF

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Publication number
USD615504S1
USD615504S1 US29/292,900 US29290007F USD615504S US D615504 S1 USD615504 S1 US D615504S1 US 29290007 F US29290007 F US 29290007F US D615504 S USD615504 S US D615504S
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United States
Prior art keywords
emitter package
view
package shown
elevation view
emitter
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US29/292,900
Inventor
Bernd Keller
Nicholas Medendorp, JR.
Thomas Cheng-Hsin Yuan
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Creeled Inc
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Cree Inc
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Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/292,900 priority Critical patent/USD615504S1/en
Assigned to CREE, INC reassignment CREE, INC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KELLER, BERND, YUAN, THOMAS CHENG-HSIN, MEDENDORP, NICHOLAS JR
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Publication of USD615504S1 publication Critical patent/USD615504S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Description

FIG. 1 is a perspective view of the first embodiment of an emitter package showing our design;
FIG. 2 is a top plan view of the emitter package shown in FIG. 1;
FIG. 3 is a bottom plan view of the emitter package shown in FIG. 1;
FIG. 4 is front elevation view of the emitter package shown in FIG. 1, with the back elevation view being a mirror image thereof;
FIG. 5 is a right side elevation view of the emitter package shown in FIG. 1, with the left side elevation view being a mirror image thereof;
FIG. 6 is a bottom perspective view of the emitter package shown in FIG. 1;
FIG. 7 is a top perspective view of the second embodiment of an emitter package showing our design;
FIG. 8 is a top plan view of the emitter package shown in FIG. 7;
FIG. 9 is a bottom plan view of the emitter package shown in FIG. 7;
FIG. 10 is front elevation view of the emitter package shown in FIG. 7, with the back elevation view being a mirror thereof;
FIG. 11 is a right side elevation view of the emitter package shown in FIG. 7, with the left side elevation view being a mirror image thereof;
FIG. 12 is a bottom perspective view of the emitter package shown in FIG. 7;
FIG. 13 is a perspective view of the third embodiment of an emitter package showing our design;
FIG. 14 is a top plan view of the emitter package shown in FIG. 13;
FIG. 15 is a bottom plan view of the emitter package shown in FIG. 13;
FIG. 16 is front elevation view of the emitter package shown in FIG. 13, with the back elevation view being a mirror image thereof;
FIG. 17 is a right side elevation view of the emitter package shown in FIG. 13, with the left side elevation view being a mirror image thereof;
FIG. 18 is a bottom perspective view of the emitter package shown in FIG. 13;
FIG. 19 is a perspective view of the fourth embodiment of an emitter package showing our design;
FIG. 20 is a top plan view of the emitter package shown in FIG. 19;
FIG. 21 is a bottom plan view of the emitter package shown in FIG. 19;
FIG. 22 is front elevation view of the emitter package shown in FIG. 19, with the back elevation view being a mirror image thereof;
FIG. 23 is a right side elevation view of the emitter package shown in FIG. 19, with the left side elevation view being a mirror image thereof;
FIG. 24 is a bottom perspective view of the emitter package shown in FIG. 19;
FIG. 25 is a perspective view of the fifth embodiment of an emitter package showing our design;
FIG. 26 is a top plan view of the emitter package shown in FIG. 25;
FIG. 27 is a bottom plan view of the emitter package shown in FIG. 25;
FIG. 28 is front elevation view of the emitter package shown in FIG. 25, with the back elevation view being a mirror image thereof;
FIG. 29 is a right side elevation view of the emitter package shown in FIG. 25, with the left side elevation view being a mirror image thereof;
FIG. 30 is a bottom perspective view of the emitter package shown in FIG. 25;
FIG. 31 is a perspective view of the sixth embodiment of an emitter package showing our design;
FIG. 32 is a top plan view of the emitter package shown in FIG. 31;
FIG. 33 is a bottom plan view of the emitter package shown in FIG. 31;
FIG. 34 is front elevation view of the emitter package shown in FIG. 31, with the back elevation view being a mirror image thereof;
FIG. 35 is a right side elevation view of the emitter package shown in FIG. 31, with the left side elevation view being a mirror image thereof; and,
FIG. 36 is a bottom perspective view of the emitter package shown in FIG. 31.
The broken line showing in the embodiments of FIGS. 1–6, 1318, 1924 and 2530 are for illustrative purposes only and forms no part of the claimed design. The external surface having stippling or irregular lines in the embodiments of FIGS. 25–30 and 3136 indicate a rough visual appearance of the side surfaces of the emitter package. The top layer can have be visually transparent or translucent as shown in the embodiments of FIGS. 1–6, 1318, 1924 and 2530, and in some embodiments can optically distort the layer below.

Claims (1)

  1. The ornamental design for an emitter package, as shown and described.
US29/292,900 2007-10-31 2007-10-31 Emitter package Active USD615504S1 (en)

Priority Applications (1)

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US29/292,900 USD615504S1 (en) 2007-10-31 2007-10-31 Emitter package

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Application Number Priority Date Filing Date Title
US29/292,900 USD615504S1 (en) 2007-10-31 2007-10-31 Emitter package

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USD615504S1 true USD615504S1 (en) 2010-05-11

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US29/292,900 Active USD615504S1 (en) 2007-10-31 2007-10-31 Emitter package

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Cited By (48)

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US20100133554A1 (en) * 2009-06-05 2010-06-03 Cree, Inc. Solid state lighting device
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
USD656906S1 (en) 2008-01-10 2012-04-03 Cree Hong Kong Limited LED package
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8492777B2 (en) 2010-04-09 2013-07-23 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8696159B2 (en) 2010-09-20 2014-04-15 Cree, Inc. Multi-chip LED devices
US9053958B2 (en) 2011-01-31 2015-06-09 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
USD741821S1 (en) 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
US9401103B2 (en) 2011-02-04 2016-07-26 Cree, Inc. LED-array light source with aspect ratio greater than 1
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
US9627361B2 (en) 2010-10-07 2017-04-18 Cree, Inc. Multiple configuration light emitting devices and methods
US9634209B2 (en) 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
US9640737B2 (en) 2011-01-31 2017-05-02 Cree, Inc. Horizontal light emitting diodes including phosphor particles
US9673363B2 (en) 2011-01-31 2017-06-06 Cree, Inc. Reflective mounting substrates for flip-chip mounted horizontal LEDs
US9685592B2 (en) 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US9831220B2 (en) 2011-01-31 2017-11-28 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
USD844183S1 (en) 2016-08-19 2019-03-26 Citizen Electronics Co., Ltd. Light emitting diode
USD844576S1 (en) 2017-07-25 2019-04-02 Citizen Electronics Co., Ltd. Light emitting diode
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
USD892066S1 (en) * 2014-12-11 2020-08-04 Cree, Inc. LED package
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
USD996377S1 (en) * 2022-02-17 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package

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