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Patent

PublikationsnummerUSD553572 S1
Typ av kungörelseBeviljande
Ansökningsnummer29/215,156
Publiceringsdatum23 okt 2007
Registreringsdatum14 okt 2004
Prioritetsdatum
14 okt 2004
Uppfinnare
Ursprunglig innehavare
USA-klassificering
Externa länkar
Module assembly
US D553572 S1
Ritningar(6)
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Anspråk
  1. The ornamental design for a module assembly, as shown and described.

Beskrivning

FIG. 1 is a top plan view of a module assembly, showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a side elevation view thereof;

FIG. 5 is a side elevation view of the opposite side shown in FIG. 4;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a top, front and side perspective view thereof.

The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.