US D480371 S1
FIG. 1 is a front, bottom and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof; and,
FIG. 5 is a rear elevational view thereof.
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