|
| US3956673 | 14 feb 1974 | 11 maj 1976 | Lockheed Aircraft Corporation | Printed circuit modules cooled by rack with forced air |
| US3962608 | 1 jul 1974 | 8 jun 1976 | Forster Electronic GmbH | Apparatus for holding and cooling electronic circuit boards in remote-controlled typewriters |
| US4006388 | 3 mar 1975 | 1 feb 1977 | Hughes Aircraft Company | Thermally controlled electronic system package |
| US4120020 | 11 aug 1976 | 10 okt 1978 | U.S. Philips Corporation | Electronic component with heat cooled substrates |
| US4120021 | 30 jun 1976 | 10 okt 1978 | Cray Research, Inc. | Cooling system for electronic assembly |
| US4122508 | 6 sep 1977 | 24 okt 1978 | Altec Corporation | Modular printed circuit board assembly having cooling means incorporated therein |
| US4135225 | 19 sep 1977 | 16 jan 1979 | | Pivotal structural enclosure |
| US4186422 | 1 aug 1978 | 29 jan 1980 | The Singer Company | Modular electronic system with cooling means and stackable electronic circuit unit therefor |
| US4283754 | 26 mar 1979 | 11 aug 1981 | Bunker Ramo Corporation | Cooling system for multiwafer high density circuit |
| US4393437 | 16 jul 1981 | 12 jul 1983 | Ferranti Limited | Cooling means for circuit assemblies each including hollow structures spaced apart in a container |
| US4503483 | 3 maj 1982 | 5 mar 1985 | Hughes Aircraft Company | Heat pipe cooling module for high power circuit boards |
| US5014904 | 16 jan 1990 | 14 maj 1991 | Cray Research, Inc. | Board-mounted thermal path connector and cold plate |
| US5099254 | 22 mar 1990 | 24 mar 1992 | Raytheon Company | Modular transmitter and antenna array system |
| US5159529 | 15 maj 1991 | 27 okt 1992 | International Business Machines Corporation | Composite liquid cooled plate for electronic equipment |
| US5274530 | 29 maj 1992 | 28 dec 1993 | | Module for protecting and cooling computer chip die mounted on a thin film substrate and a chassis for conduction cooling of such modules |
| US5343359 | 19 nov 1992 | 30 aug 1994 | Cray Research, Inc. | Apparatus for cooling daughter boards |
| US5473508 | 31 maj 1994 | 5 dec 1995 | AT&T Global Information Solutions Company | Focused CPU air cooling system including high efficiency heat exchanger |
| US5482109 | 15 mar 1994 | 9 jan 1996 | E-Systems, Inc. | Modular heat exchanger |
| US5493473 | 7 jun 1994 | 20 feb 1996 | NEC Corporation | Case for shielding electronic circuit members from electromagnetic waves |
| US5726857 | 22 feb 1996 | 10 mar 1998 | Cray Research, Inc. | Apparatus and method for mounting edge connectors within a circuit module |
| US5737186 | 22 apr 1996 | 7 apr 1998 | Daimler-Benz AG | Arrangement of plural micro-cooling devices with electronic components |
| US5740018 | 29 feb 1996 | 14 apr 1998 | The United States of America as represented by the Secretary of the Navy | Environmentally controlled circuit pack and cabinet |
| US5761035 | 28 jun 1996 | 2 jun 1998 | Motorola, Inc. | Circuit board apparatus and method for spray-cooling a circuit board |
| US5767443 | 12 dec 1994 | 16 jun 1998 | Micron Technology, Inc. | Multi-die encapsulation device |
| US5910640 | 20 feb 1998 | 8 jun 1999 | Micron Technology, Inc. | Electrical contact assembly for use in a multi-die encapsulation device |
| US5946189 | 5 okt 1998 | 31 aug 1999 | Compaq Computer Corporation | Pivotable support and heat sink apparatus removably connectable without tools to a computer processor |
| US5947188 | 9 mar 1998 | 7 sep 1999 | AB Volvo Penta | Method and a device for permitting cooling of heat-sensitive components |
| US6169247 | 11 jun 1998 | 2 jan 2001 | Lucent Technologies Inc. | Enclosure for electronic components |
| US6215658 | 7 okt 1999 | 10 apr 2001 | Negesat di Boer Fabrizio & C.S.N.C. | Structure for housing and heat sinking equipment pieces in an aeronautic or space vehicle |
| US6252302 | 19 sep 1996 | 26 jun 2001 | | Heat transfer material for an improved die edge contacting socket |
| US6297960 | 30 jun 1999 | 2 okt 2001 | Micron Technology, Inc. | Heat sink with alignment and retaining features |
| US6446334 | 7 maj 2001 | 10 sep 2002 | Micron Technology, Inc. | Heat transfer material for an improved die edge contacting socket |
| US6525943 | 29 aug 2001 | 25 feb 2003 | Micron Technology, Inc. | Heat sink with alignment and retaining features |
| US6578262 | 25 okt 2001 | 17 jun 2003 | Micron Technology, Inc. | Heat transfer material for an improved die edge contacting socket |
| US6735860 | 25 okt 2001 | 18 maj 2004 | Micron Technology, Inc. | Heat transfer material for an improved die edge contacting socket |
| US6760224 | 25 feb 2003 | 6 jul 2004 | Micron Technology, Inc. | Heat sink with alignment and retaining features |
| US6892453 | 7 mar 2003 | 17 maj 2005 | Micron Technology, Inc. | Method for forming an encapsulation device |
| US7019244 | 20 apr 2002 | 28 mar 2006 | Hewlett-Packard Development Company, L.P. | Electrostatic precipitator |
| US7254022 | 6 maj 2004 | 7 aug 2007 | Knuerr AG | Cooling system for equipment and network cabinets and method for cooling equipment and network cabinets |
| US7286365 | 10 okt 2003 | 23 okt 2007 | Thales | Electronic substrate for a three-dimensional electronic module |
| US7324336 | 27 sep 2005 | 29 jan 2008 | Lockheed Martin Corporation | Flow through cooling assemblies for conduction-cooled circuit modules |
| US7365974 | 14 okt 2005 | 29 apr 2008 | Smiths Aerospace LLC | Method for electronics equipment cooling having improved EMI control and reduced weight |
| US7671801 | 19 sep 2005 | 2 mar 2010 | Raytheon Company | Armor for an electronically scanned array |
| US7733648 | 12 mar 2008 | 8 jun 2010 | Fujitsu Limited | Electronic apparatus |
| US7835151 | 22 nov 2005 | 16 nov 2010 | Danfoss Silicon Power GmbH | Flow distribution module and a stack of flow distribution modules |
| US7869209 | 27 aug 2007 | 11 jan 2011 | Thales | Electronic rack combining natural convection and forced air circulation for its cooling |
| US7995346 | 1 apr 2008 | 9 aug 2011 | Northrop Grumman Systems Corporation | Ruggedized, self aligning, sliding air seal for removable electronic units |
| US8094451 | 4 aug 2009 | 10 jan 2012 | Thales | Onboard computer equipped with a stand-alone aeraulic cooling device |
| US8174826 | 27 maj 2010 | 8 maj 2012 | International Business Machines Corporation | Liquid cooling system for stackable modules in energy-efficient computing systems |
| US8179674 | 28 maj 2010 | 15 maj 2012 | International Business Machines Corporation | Scalable space-optimized and energy-efficient computing system |
