|
| US3977130 | 12 maj 1975 | 31 aug 1976 | Semimetals, Inc. | Removal-compensating polishing apparatus |
| US4450652 | 4 sep 1981 | 29 maj 1984 | Monsanto Company | Temperature control for wafer polishing |
| US5605488 | 27 okt 1994 | 25 feb 1997 | Kabushiki Kaisha Toshiba | Polishing apparatus of semiconductor wafer |
| US5873253 | 3 apr 1997 | 23 feb 1999 | | Method and apparatus for cooling parts that are being worked |
| US5873769 | 30 maj 1997 | 23 feb 1999 | Industrial Technology Research Institute | Temperature compensated chemical mechanical polishing to achieve uniform removal rates |
| US6290583 | 10 sep 1998 | 18 sep 2001 | Ebara Corporation | Apparatus for holding workpiece |
| US6769966 | 26 nov 2001 | 3 aug 2004 | Shin-Etsu Handotai Co., Ltd. | Workpiece holder for polishing, polishing apparatus and polishing method |
