|
| US5284554 | 9 jan 1992 | 8 feb 1994 | International Business Machines Corporation | Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces |
| US6537144 | 17 feb 2000 | 25 mar 2003 | Applied Materials, Inc. | Method and apparatus for enhanced CMP using metals having reductive properties |
| US6561873 | 8 mar 2002 | 13 maj 2003 | Applied Materials, Inc. | Method and apparatus for enhanced CMP using metals having reductive properties |
| US6837983 | 22 jan 2002 | 4 jan 2005 | Applied Materials, Inc. | Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
| US6848970 | 16 sep 2002 | 1 feb 2005 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
| US6962524 | 15 aug 2003 | 8 nov 2005 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US6979248 | 7 maj 2002 | 27 dec 2005 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US6988942 | 20 jul 2004 | 24 jan 2006 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US6991526 | 16 sep 2002 | 31 jan 2006 | Applied Materials, Inc. | Control of removal profile in electrochemically assisted CMP |
| US7014538 | 5 mar 2003 | 21 mar 2006 | Applied Materials, Inc. | Article for polishing semiconductor substrates |
| US7029365 | 23 dec 2003 | 18 apr 2006 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
| US7059948 | 20 dec 2001 | 13 jun 2006 | Applied Materials | Articles for polishing semiconductor substrates |
| US7066800 | 27 dec 2001 | 27 jun 2006 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7070475 | 1 feb 2005 | 4 jul 2006 | Applied Materials | Process control in electrochemically assisted planarization |
| US7077721 | 3 dec 2003 | 18 jul 2006 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
| US7077725 | 7 sep 2001 | 18 jul 2006 | Applied Materials, Inc. | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus |
| US7084064 | 14 sep 2004 | 1 aug 2006 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
| US7112270 | 6 jun 2003 | 26 sep 2006 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
| US7125477 | 2 aug 2002 | 24 okt 2006 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US7137868 | 6 mar 2006 | 21 nov 2006 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
| US7137879 | 30 mar 2006 | 21 nov 2006 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7186164 | 3 dec 2003 | 6 mar 2007 | Applied Materials, Inc. | Processing pad assembly with zone control |
| US7207878 | 8 jan 2005 | 24 apr 2007 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7278911 | 30 aug 2005 | 9 okt 2007 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7285036 | 21 nov 2006 | 23 okt 2007 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical polishing |
| US7294038 | 20 jun 2006 | 13 nov 2007 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
| US7303462 | 22 mar 2005 | 4 dec 2007 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
| US7303662 | 2 aug 2002 | 4 dec 2007 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US7311592 | 2 nov 2006 | 25 dec 2007 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7323095 | 3 mar 2004 | 29 jan 2008 | Applied Materials, Inc. | Integrated multi-step gap fill and all feature planarization for conductive materials |
| US7344432 | 31 okt 2006 | 18 mar 2008 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
| US7374644 | 26 jun 2003 | 20 maj 2008 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7390744 | 16 maj 2005 | 24 jun 2008 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US7396448 | 29 sep 2004 | 8 jul 2008 | Think Laboratory Co., Ltd. | Method for roll to be processed before forming cell and method for grinding roll |
| US7422516 | 8 okt 2007 | 9 sep 2008 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7422982 | 7 jul 2006 | 9 sep 2008 | Applied Materials, Inc. | Method and apparatus for electroprocessing a substrate with edge profile control |
| US7427340 | 8 apr 2005 | 23 sep 2008 | Applied Materials, Inc. | Conductive pad |
| US7446041 | 21 jun 2006 | 4 nov 2008 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
| US7520968 | 4 okt 2005 | 21 apr 2009 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
| US7569134 | 14 jun 2006 | 4 aug 2009 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US7628905 | 27 jun 2006 | 8 dec 2009 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
| US7655565 | 26 jan 2005 | 2 feb 2010 | Applied Materials, Inc. | Electroprocessing profile control |
| US7670468 | 15 sep 2005 | 2 mar 2010 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
| US7678245 | 30 jun 2004 | 16 mar 2010 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
| US7709382 | 23 okt 2007 | 4 maj 2010 | Applied Materials, Inc. | Electroprocessing profile control |
| US7790015 | 31 okt 2007 | 7 sep 2010 | Applied Materials, Inc. | Endpoint for electroprocessing |
| US8070933 | 6 maj 2006 | 6 dec 2011 | Thielenhaus Microfinishing Corp. | Electrolytic microfinishing of metallic workpieces |
