US20140312367A1 - Light emitting diode package and method for manufacturing same - Google Patents

Light emitting diode package and method for manufacturing same Download PDF

Info

Publication number
US20140312367A1
US20140312367A1 US14/118,784 US201214118784A US2014312367A1 US 20140312367 A1 US20140312367 A1 US 20140312367A1 US 201214118784 A US201214118784 A US 201214118784A US 2014312367 A1 US2014312367 A1 US 2014312367A1
Authority
US
United States
Prior art keywords
led
fluorescent layer
pcb
pillar
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/118,784
Inventor
Byoung-gu Cho
Jae-sik Min
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LIGHTIZER KOREA CO Ltd
Original Assignee
LIGHTIZER KOREA CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LIGHTIZER KOREA CO Ltd filed Critical LIGHTIZER KOREA CO Ltd
Assigned to LIGHTIZER KOREA CO., LTD. reassignment LIGHTIZER KOREA CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHO, BYOUNG-GU, MIN, JAE-SIK
Publication of US20140312367A1 publication Critical patent/US20140312367A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials

Definitions

  • the present invention relates to a Light-Emitting Diode (LED) package and a method of manufacturing the same and, more particularly, to an LED package of a Chip On Module (COM) form or a Chip On Board (COB) form using a Printed Circuit Board (PCB) and a method of manufacturing the same.
  • LED Light-Emitting Diode
  • COM Chip On Module
  • COB Chip On Board
  • an LED including an epitaxial layer made of GaN, InGaN, or AlGaN has excellent characteristics, a long life span, lower power consumption, higher brightness, and less harmless environmental factors, as compared with the existing incandescent.
  • the LED is used in various fields, such as automotive lights, traffic signal lights, common lightings, and backlight units for liquid crystal displays, because of the advantages of the LED.
  • the LED is fabricated by coating a fluorescent substance, designed according to the wavelength of an LED chip, on a surface of the LED chip using a method, such as dispensing, in order to form white light.
  • the LED on which the fluorescent substance is coated is problematic in that the LED is deteriorated by heat generated therein.
  • the present invention has been made in view of the above problems occurring in the prior art, and it is an object of the present invention to provide an LED package which is capable of effectively inhibiting a fluorescent layer from being deteriorated by heat generated from an LED.
  • an LED package includes a PCB, an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting a wavelength of the light emitted from the LED, wherein the electrical pad of the LED and the electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.
  • An LED package includes a PCB, a first LED mounted on the PCB, a second LED mounted on the PCB and spaced apart from the first LED, a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED, and a fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED or the second LED, wherein the electrical pad of the first LED and the electrical pad of the PCB are electrically connected to each other, the electrical pad of the second LED and the electrical pad of the PCB are electrically connected to each other, and the first and second LEDs and the fluorescent layer are spaced apart from each other.
  • An LED package includes a PCB, a first LED mounted on the PCB, a second LED mounted on the PCB and spaced apart from the first LED, a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED, a first fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED, and a second fluorescent layer formed on the surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the second LED, wherein the electrical pad of the first LED and the electrical pad of the PCB are electrically connected to each other, the electrical pad of the second LED and the electrical pad of the PCB are electrically connected to
  • a method of manufacturing an LED package includes the steps of mounting an LED on a PCB, having a pillar formed thereon, within the pillar, electrically connecting the electrical pad of the PCB and the electrical pad of the LED, disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED, and to transmit the light emitted from the LED, on the pillar so that the fluorescent layer faces the LED, and attaching the transparent plate to the pillar.
  • a method of manufacturing an LED package includes the steps of mounting an LED on a PCB, having a pillar formed thereon, within the pillar, electrically connecting the electrical pad of the PCB and the electrical pad of the LED, disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED, and to transmit the light emitted from the LED, on the pillar so that the fluorescent layer faces the LED, measuring a wavelength of the light, emitted from the LED, after the light passes through the transparent plate, checking whether the light passing through the transparent plate satisfies a specific criterion, and if, as a result of the check, the light passing through the transparent plate satisfies the specific criterion, attaching the transparent plate to the pillar.
  • FIG. 1 is a cross-sectional view of an LED package according to a first embodiment of the present invention
  • FIG. 2 is a plan view of a modified embodiment of FIG. 1 ;
  • FIG. 3 is a plan view of a modified embodiment of FIG. 1 ;
  • FIG. 4 shows a combination ratio according to color coordinates and the scattering of wavelengths
  • FIG. 5 is a cross-sectional view of an LED package according to an embodiment of the present invention.
  • FIG. 6 is a plan view of a modified embodiment of FIG. 5 ;
  • FIG. 7 a cross-sectional view of an LED package according to an embodiment of the present invention.
  • FIG. 8 is a plan view of a modified embodiment of FIG. 7 .
  • FIG. 1 is a cross-sectional view of an LED package according to a first embodiment of the present invention
  • FIG. 2 is a plan view of a modified embodiment of FIG. 1
  • FIG. 3 is a plan view of a modified embodiment of FIG. 1
  • FIG. 4 shows a combination ratio according to color coordinates and the scattering of wavelengths.
  • the LED package according to the first embodiment of the present invention may include a PCB 110 , an LED 130 , a pillar 120 , a transparent plate 150 , and a fluorescent layer 140 .
  • the LED 130 is mounted on the PCB 110 .
  • the electrical pad of the LED 130 and the electrical pad of the PCB 110 are electrically connected to each other.
  • the pillar 120 is placed higher than the LED 130 around the LED 130 on the PCB 110 . Light generated from the LED 130 is reflected from the pillar 120 in the direction of the LED 130 when the light comes in contact with the pillar 120 .
  • the pillar 120 When the pillar 120 reflects the light from the LED 130 in the direction of the LED 130 , the light emitted from the LED 130 can be effectively inhibited from leaking outside without passing through the fluorescent layer 140 .
  • the pillar 120 may have a side facing the LED 130 at a specific angle ‘e’. More particularly, the side of the pillar 120 facing the LED 130 may be an angle of 15° to 90° to the PCB 110 .
  • the side of the pillar 120 facing the LED 130 is formed at a specific angle, the light emitted from the LED 130 can be more effectively inhibited from leaking outside without passing through the fluorescent layer 140 .
  • the pillar 120 may be integrally formed with the PCB 110 .
  • the pillar 120 may be fabricated separately from the PCB 110 and attached on the PCB 110 .
  • the pillar 120 may be formed in a ring shape or in various forms, such as a square belt form, as shown in FIGS. 2 and 3 .
  • the transparent plate 150 is disposed on the pillar 120 with it spaced apart from the LED 130 .
  • the transparent plate 150 transmits light emitted from the LED 130 .
  • the transparent plate 150 may be formed of a lens or a transparent substrate made of glass or polymer.
  • the fluorescent layer 140 is conformably coated with a substance for converting light, emitted from the LED 130 , into white light by changing a wavelength of the light and is formed on a surface of the transparent plate 150 which faces the LED 130 .
  • the LED 130 and the fluorescent layer 140 are spaced apart from each other. More particularly, the distance ‘b’ between the fluorescent layer 140 and the LED 130 is 10 to 20,000 ⁇ m.
  • the LED 130 is disposed within an area corresponding to the fluorescent layer 140 at an interval ‘a’ of about 0 to 500 ⁇ m from the fluorescent layer 140 .
  • the pillar 120 is disposed at an interval ‘c’ of about 0 to 500 ⁇ m from the fluorescent layer 140 .
  • the LED 130 and the fluorescent layer 140 are spaced apart from each other, the deterioration of the fluorescent layer 140 due to heat generated from the LED 130 can be effectively inhibited. Accordingly, a reduction in the light efficiency of the LED 130 can be minimized although the turn-on time of the LED 130 elapses.
  • the fluorescent layer 140 includes silicon. In order to compensate for the scattering of a wavelength of light emitted from the LED 130 , a combination ratio of silicon included in the fluorescent layer 140 or the thickness of the fluorescent layer 140 may be controlled.
  • a silicon combination ratio A may be used. If a color coordinate system of light emitted from the LED 130 is No. 2, a silicon combination ratio B may be used. If a color coordinate system of light emitted from the LED 130 is No. 3, a silicon combination ratio C may be used.
  • the fluorescent layer 140 may have a circle as shown in FIG. 2 , a square as shown in FIG. 3 , or various forms.
  • An LED package according to a second embodiment of the present invention is described below, and a difference between the LED packages according to the first and second embodiments is chiefly described.
  • FIG. 5 is a cross-sectional view of the LED package according to the second embodiment of the present invention
  • FIG. 6 is a plan view of a modified embodiment of FIG. 5 .
  • the LED package according to the second embodiment of the present invention includes a first LED 231 mounted on a PCB 210 , a second LED 232 mounted on the PCB 210 and spaced apart from the first LED 231 , and a fluorescent layer 240 conformably coated with a substance for converting light, emitted from the first LED 231 or the second LED 232 , into white light by changing a wavelength of the light and formed on a surface of a transparent plate 250 which faces the first LED 231 and the second LED 232 .
  • the first LED 231 , the second LED 232 , and the fluorescent layer 240 are disposed and spaced apart from one another.
  • the LED package according to the second embodiment of the present invention includes the plurality of LEDs within an area corresponding to the one fluorescent layer 240 .
  • An LED package according to a modified embodiment may include four LEDs 231 , 232 , 233 , and 234 , as shown in FIG. 6 .
  • An LED package according to a third embodiment of the present invention is described below, and a difference between the LEDs according to the first and third embodiments is chiefly described.
  • FIG. 7 is a cross-sectional view of the LED package according to the third embodiment of the present invention
  • FIG. 8 is a plan view of a modified embodiment of FIG. 7 .
  • the LED package according to the third embodiment of the present invention includes a first LED 331 mounted on a PCB 310 , a second LED 332 mounted on the PCB 310 and spaced apart from the first LED 331 , a first fluorescent layer 341 conformably coated with a substance for converting light emitted from the first LED 331 into white light by changing a wavelength of the light, and a second fluorescent layer 342 conformably coated with a substance for converting light emitted from the second LED 332 into white light by changing a wavelength of the light.
  • the first fluorescent layer 341 is formed on a surface of the transparent plate 350 which faces the first LED 331 and the second LED 332 .
  • the second fluorescent layer 342 is formed on a surface of the transparent plate 350 which faces the first LED 331 and the second LED 332 .
  • the first LED 331 and the first fluorescent layer 341 are spaced apart from each other, and the second LED 332 and the second fluorescent layer 342 are spaced apart from each other. Furthermore, the first fluorescent layer 341 and the second fluorescent layer 342 are spaced apart from each other.
  • the LED package according to the third embodiment of the present invention includes the plurality of fluorescent layers 341 and 342 and the plurality of LEDs 331 and 332 , corresponding to the respective fluorescent layers 341 and 342 , within one pillar 120 .
  • An LED package according to a modified embodiment includes the four fluorescent layers 341 , 342 , 343 , and 344 and the four LEDs 331 , 332 , 333 , and 334 corresponding to the four fluorescent layers, respectively, as shown in FIG. 8 .
  • a method of manufacturing the LED according to an embodiment of the present invention is described below with reference to FIG. 1 , for example.
  • the LED 130 is mounted on the PCB 110 , having the pillar 120 formed thereon, within the pillar 120 .
  • the electrical pad of the PCB 110 and the electrical pad of the LED 130 are electrically connected to each other.
  • the transparent plate 150 is configured to include the fluorescent layer 140 conformably coated with the substance for converting light emitted from the LED 130 into white light by changing a wavelength of the light, and to transmit the light emitted from the LED 130 , and is disposed on the pillar 120 so that the fluorescent layer 140 faces the LED 130 . After the transparent plate 150 transmits the light emitted from the LED 130 , a wavelength of light is measured.
  • the transparent plate 150 is attached to the pillar 120 .
  • the embodiments of the present invention provide the LED package capable of effectively inhibiting the fluorescent layer from be deteriorated by heat generated from the LED.
  • the LED package may be easily fabricated using the method of manufacturing the LED package according to the embodiments of the present invention.

Abstract

A Light Emitting Diode (LED) package comprises a Printed Circuit Board (PCB), an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting a wavelength of the light emitted from the LED, wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.

Description

    BACKGROUND OF INVENTION
  • The present invention relates to a Light-Emitting Diode (LED) package and a method of manufacturing the same and, more particularly, to an LED package of a Chip On Module (COM) form or a Chip On Board (COB) form using a Printed Circuit Board (PCB) and a method of manufacturing the same.
  • In general, an LED including an epitaxial layer made of GaN, InGaN, or AlGaN has excellent characteristics, a long life span, lower power consumption, higher brightness, and less harmless environmental factors, as compared with the existing incandescent. The LED is used in various fields, such as automotive lights, traffic signal lights, common lightings, and backlight units for liquid crystal displays, because of the advantages of the LED.
  • Meanwhile, the LED is fabricated by coating a fluorescent substance, designed according to the wavelength of an LED chip, on a surface of the LED chip using a method, such as dispensing, in order to form white light.
  • The LED on which the fluorescent substance is coated, however, is problematic in that the LED is deteriorated by heat generated therein.
    • SUMMARY OF THE INVENTION
  • Accordingly, the present invention has been made in view of the above problems occurring in the prior art, and it is an object of the present invention to provide an LED package which is capable of effectively inhibiting a fluorescent layer from being deteriorated by heat generated from an LED.
  • It is another object of the present invention to provide a method of manufacturing an LED package, which can easily fabricate the LED package.
  • The technical objects to be achieved by the present invention are not limited to the above-mentioned objects, and other technical objects that have not been mentioned above will become evident to those skilled in the art from the following description.
  • To achieve the above objects, an LED package according to an embodiment of the present invention includes a PCB, an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting a wavelength of the light emitted from the LED, wherein the electrical pad of the LED and the electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.
  • An LED package according to another embodiment of the present invention includes a PCB, a first LED mounted on the PCB, a second LED mounted on the PCB and spaced apart from the first LED, a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED, and a fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED or the second LED, wherein the electrical pad of the first LED and the electrical pad of the PCB are electrically connected to each other, the electrical pad of the second LED and the electrical pad of the PCB are electrically connected to each other, and the first and second LEDs and the fluorescent layer are spaced apart from each other.
  • An LED package according to another embodiment of the present invention includes a PCB, a first LED mounted on the PCB, a second LED mounted on the PCB and spaced apart from the first LED, a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED, a first fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED, and a second fluorescent layer formed on the surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the second LED, wherein the electrical pad of the first LED and the electrical pad of the PCB are electrically connected to each other, the electrical pad of the second LED and the electrical pad of the PCB are electrically connected to each other, the first LED and the first fluorescent layer are spaced apart from each other, the second LED and the second fluorescent layer are spaced apart from each other, and the first fluorescent layer and the second fluorescent layer are coated with them spaced apart from each other.
  • A method of manufacturing an LED package according to an embodiment of the present invention includes the steps of mounting an LED on a PCB, having a pillar formed thereon, within the pillar, electrically connecting the electrical pad of the PCB and the electrical pad of the LED, disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED, and to transmit the light emitted from the LED, on the pillar so that the fluorescent layer faces the LED, and attaching the transparent plate to the pillar.
  • A method of manufacturing an LED package according to another embodiment of the present invention includes the steps of mounting an LED on a PCB, having a pillar formed thereon, within the pillar, electrically connecting the electrical pad of the PCB and the electrical pad of the LED, disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED, and to transmit the light emitted from the LED, on the pillar so that the fluorescent layer faces the LED, measuring a wavelength of the light, emitted from the LED, after the light passes through the transparent plate, checking whether the light passing through the transparent plate satisfies a specific criterion, and if, as a result of the check, the light passing through the transparent plate satisfies the specific criterion, attaching the transparent plate to the pillar.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Further objects and advantages of the invention can be more fully understood from the following detailed description taken in conjunction with the accompanying drawings in which:
  • FIG. 1 is a cross-sectional view of an LED package according to a first embodiment of the present invention;
  • FIG. 2 is a plan view of a modified embodiment of FIG. 1;
  • FIG. 3 is a plan view of a modified embodiment of FIG. 1;
  • FIG. 4 shows a combination ratio according to color coordinates and the scattering of wavelengths;
  • FIG. 5 is a cross-sectional view of an LED package according to an embodiment of the present invention;
  • FIG. 6 is a plan view of a modified embodiment of FIG. 5;
  • FIG. 7 a cross-sectional view of an LED package according to an embodiment of the present invention; and
  • FIG. 8 is a plan view of a modified embodiment of FIG. 7.
    •  DETAILED DESCRIPTION OF EMBODIMENTS
  • Some exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The detailed contents of other embodiments are included in the detailed description and drawings. Merits and characteristics of the present invention and methods for achieving them will become more apparent from the following embodiments taken in conjunction with the accompanying drawings. The same reference numerals are used throughout the entire specification to refer to the same parts.
  • FIG. 1 is a cross-sectional view of an LED package according to a first embodiment of the present invention, FIG. 2 is a plan view of a modified embodiment of FIG. 1, FIG. 3 is a plan view of a modified embodiment of FIG. 1, and FIG. 4 shows a combination ratio according to color coordinates and the scattering of wavelengths.
  • The LED package according to the first embodiment of the present invention may include a PCB 110, an LED 130, a pillar 120, a transparent plate 150, and a fluorescent layer 140.
  • The LED 130 is mounted on the PCB 110. The electrical pad of the LED 130 and the electrical pad of the PCB 110 are electrically connected to each other.
  • The pillar 120 is placed higher than the LED 130 around the LED 130 on the PCB 110. Light generated from the LED 130 is reflected from the pillar 120 in the direction of the LED 130 when the light comes in contact with the pillar 120.
  • When the pillar 120 reflects the light from the LED 130 in the direction of the LED 130, the light emitted from the LED 130 can be effectively inhibited from leaking outside without passing through the fluorescent layer 140.
  • The pillar 120 may have a side facing the LED 130 at a specific angle ‘e’. More particularly, the side of the pillar 120 facing the LED 130 may be an angle of 15° to 90° to the PCB 110.
  • When the side of the pillar 120 facing the LED 130 is formed at a specific angle, the light emitted from the LED 130 can be more effectively inhibited from leaking outside without passing through the fluorescent layer 140.
  • Meanwhile, the pillar 120 may be integrally formed with the PCB 110. Alternatively, the pillar 120 may be fabricated separately from the PCB 110 and attached on the PCB 110. The pillar 120 may be formed in a ring shape or in various forms, such as a square belt form, as shown in FIGS. 2 and 3.
  • The transparent plate 150 is disposed on the pillar 120 with it spaced apart from the LED 130. The transparent plate 150 transmits light emitted from the LED 130. The transparent plate 150 may be formed of a lens or a transparent substrate made of glass or polymer.
  • The fluorescent layer 140 is conformably coated with a substance for converting light, emitted from the LED 130, into white light by changing a wavelength of the light and is formed on a surface of the transparent plate 150 which faces the LED 130. The LED 130 and the fluorescent layer 140 are spaced apart from each other. More particularly, the distance ‘b’ between the fluorescent layer 140 and the LED 130 is 10 to 20,000 μm. The LED 130 is disposed within an area corresponding to the fluorescent layer 140 at an interval ‘a’ of about 0 to 500 μm from the fluorescent layer 140. The pillar 120 is disposed at an interval ‘c’ of about 0 to 500 μm from the fluorescent layer 140.
  • Since the LED 130 and the fluorescent layer 140 are spaced apart from each other, the deterioration of the fluorescent layer 140 due to heat generated from the LED 130 can be effectively inhibited. Accordingly, a reduction in the light efficiency of the LED 130 can be minimized although the turn-on time of the LED 130 elapses.
  • The fluorescent layer 140 includes silicon. In order to compensate for the scattering of a wavelength of light emitted from the LED 130, a combination ratio of silicon included in the fluorescent layer 140 or the thickness of the fluorescent layer 140 may be controlled.
  • For example, as shown in FIG. 4, if a color coordinate system of light emitted from the LED 130 is No. 1, a silicon combination ratio A may be used. If a color coordinate system of light emitted from the LED 130 is No. 2, a silicon combination ratio B may be used. If a color coordinate system of light emitted from the LED 130 is No. 3, a silicon combination ratio C may be used.
  • Meanwhile, the fluorescent layer 140 may have a circle as shown in FIG. 2, a square as shown in FIG. 3, or various forms.
  • An LED package according to a second embodiment of the present invention is described below, and a difference between the LED packages according to the first and second embodiments is chiefly described.
  • FIG. 5 is a cross-sectional view of the LED package according to the second embodiment of the present invention, and FIG. 6 is a plan view of a modified embodiment of FIG. 5.
  • The LED package according to the second embodiment of the present invention includes a first LED 231 mounted on a PCB 210, a second LED 232 mounted on the PCB 210 and spaced apart from the first LED 231, and a fluorescent layer 240 conformably coated with a substance for converting light, emitted from the first LED 231 or the second LED 232, into white light by changing a wavelength of the light and formed on a surface of a transparent plate 250 which faces the first LED 231 and the second LED 232. The first LED 231, the second LED 232, and the fluorescent layer 240 are disposed and spaced apart from one another.
  • The LED package according to the second embodiment of the present invention includes the plurality of LEDs within an area corresponding to the one fluorescent layer 240. An LED package according to a modified embodiment may include four LEDs 231, 232, 233, and 234, as shown in FIG. 6.
  • An LED package according to a third embodiment of the present invention is described below, and a difference between the LEDs according to the first and third embodiments is chiefly described.
  • FIG. 7 is a cross-sectional view of the LED package according to the third embodiment of the present invention, and FIG. 8 is a plan view of a modified embodiment of FIG. 7.
  • The LED package according to the third embodiment of the present invention includes a first LED 331 mounted on a PCB 310, a second LED 332 mounted on the PCB 310 and spaced apart from the first LED 331, a first fluorescent layer 341 conformably coated with a substance for converting light emitted from the first LED 331 into white light by changing a wavelength of the light, and a second fluorescent layer 342 conformably coated with a substance for converting light emitted from the second LED 332 into white light by changing a wavelength of the light. Here, the first fluorescent layer 341 is formed on a surface of the transparent plate 350 which faces the first LED 331 and the second LED 332. Furthermore, the second fluorescent layer 342 is formed on a surface of the transparent plate 350 which faces the first LED 331 and the second LED 332. The first LED 331 and the first fluorescent layer 341 are spaced apart from each other, and the second LED 332 and the second fluorescent layer 342 are spaced apart from each other. Furthermore, the first fluorescent layer 341 and the second fluorescent layer 342 are spaced apart from each other.
  • The LED package according to the third embodiment of the present invention includes the plurality of fluorescent layers 341 and 342 and the plurality of LEDs 331 and 332, corresponding to the respective fluorescent layers 341 and 342, within one pillar 120. An LED package according to a modified embodiment includes the four fluorescent layers 341, 342, 343, and 344 and the four LEDs 331, 332, 333, and 334 corresponding to the four fluorescent layers, respectively, as shown in FIG. 8.
  • A method of manufacturing the LED according to an embodiment of the present invention is described below with reference to FIG. 1, for example.
  • The LED 130 is mounted on the PCB 110, having the pillar 120 formed thereon, within the pillar 120. Next, the electrical pad of the PCB 110 and the electrical pad of the LED 130 are electrically connected to each other. The transparent plate 150 is configured to include the fluorescent layer 140 conformably coated with the substance for converting light emitted from the LED 130 into white light by changing a wavelength of the light, and to transmit the light emitted from the LED 130, and is disposed on the pillar 120 so that the fluorescent layer 140 faces the LED 130. After the transparent plate 150 transmits the light emitted from the LED 130, a wavelength of light is measured.
  • Next, it is checked whether the light passing through the transparent plate 150 satisfies a specific criterion. Need an example? If, as a result of the check, the light passing through the transparent plate 150 satisfies the specific criterion, the transparent plate 150 is attached to the pillar 120.
  • As described above, the embodiments of the present invention provide the LED package capable of effectively inhibiting the fluorescent layer from be deteriorated by heat generated from the LED.
  • Furthermore, the LED package may be easily fabricated using the method of manufacturing the LED package according to the embodiments of the present invention.
  • While the some exemplary embodiments of the present invention have been described and shown in order to illustrate the principle of the present invention, the present invention is not to be restricted by the constructions and operations shown and described above. It is to be appreciated that those skilled in the art may change or modify the embodiments without departing from the scope and spirit of the present invention. Accordingly, it should be construed that all proper modification and changes and their equivalents fall within the scope of the present invention.

Claims (30)

What is claimed is:
1. A Light Emitting Diode (LED) package, comprising:
a Printed Circuit Board (PCB);
an LED mounted on the PCB;
a pillar placed higher than the LED around the LED on the PCB;
a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED; and
a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting a wavelength of the light emitted from the LED,
wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.
2. The LED package as claimed in claim 1, wherein the fluorescent layer converts the light emitted from the LED into white light by changing a wavelength of the light.
3. The LED package as claimed in claim 1, wherein the LED is disposed within an area corresponding to the fluorescent layer.
4. The LED package as claimed in claim 1, wherein the fluorescent layer includes silicon.
5. The LED package as claimed in claim 1, wherein the pillar reflects the light emitted from the LED in a direction of the LED when the light comes in contact with the pillar.
6. The LED package as claimed in claim 1, wherein a face of the pillar, facing the LED, is formed at a specific angle.
7. The LED package as claimed in claim 6, wherein the face of the pillar, facing the LED, is formed at an angle of about 15° to 90° to the PCB.
8. The LED package as claimed in claim 1, wherein the transparent plate is formed of a lens or a transparent substrate.
9. The LED package as claimed in claim 1, wherein a distance between the fluorescent layer and the LED is about 10 to 20,000 μm.
10. A Light Emitting Diode (LED) package, comprising:
a Printed Circuit Board (PCB);
a first LED mounted on the PCB;
a second LED mounted on the PCB and spaced apart from the first LED;
a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB;
a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED; and
a fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED or the second LED,
wherein an electrical pad of the first LED and an electrical pad of the PCB are electrically connected to each other, an electrical pad of the second LED and an electrical pad of the PCB are electrically connected to each other, and the first and second LEDs and the fluorescent layer are spaced apart from each other.
11. The LED package as claimed in claim 10, wherein the fluorescent layer converts the light emitted from the first LED or the second LED into white light by changing a wavelength of the light.
12. The LED package as claimed in claim 10, wherein the first LED and the second LED are disposed within an area corresponding to the fluorescent layer.
13. The LED package as claimed in claim 10, wherein the fluorescent layer includes silicon.
14. The LED package as claimed in claim 10, wherein the pillar reflects the light of the first LED or the second LED in a direction of the first LED or the second LED when the light comes in contact with the pillar.
15. The LED package as claimed in claim 10, wherein a face of the pillar, facing the first LED and the second LED, is formed at a specific angle.
16. The LED package as claimed in claim 15, wherein the face of the pillar, facing the first LED and the second LED, is formed at an angle of about 15° to 90° to the PCB.
17. The LED package as claimed in claim 10, wherein the transparent plate is formed of a lens or a transparent substrate.
18. The LED package as claimed in claim 10, wherein a distance between the fluorescent layer and the first LED and the second LED is about 10 to 20,000 μm.
19. A Light Emitting Diode (LED) package, comprising:
a Printed Circuit Board (PCB);
a first LED mounted on the PCB;
a second LED mounted on the PCB and spaced apart from the first LED;
a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB;
a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED;
a first fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED; and
a second fluorescent layer formed on the surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the second LED;
wherein an electrical pad of the first LED and an electrical pad of the PCB are electrically connected to each other, an electrical pad of the second LED and the electrical pad of the PCB are electrically connected to each other, the first LED and the first fluorescent layer are spaced apart from each other, the second LED and the second fluorescent layer are spaced apart from each other, and the first fluorescent layer and the second fluorescent layer are spaced apart from each other.
20. The LED package as claimed in claim 19, wherein the first fluorescent layer converts the light emitted from the first LED into white light by changing a wavelength of the light.
21. The LED package as claimed in claim 19, wherein the second fluorescent layer converts the light emitted from the second LED into white light by changing a wavelength of the light.
22. The LED package as claimed in claim 19, wherein:
the first LED is disposed within an area corresponding to the first fluorescent layer; and
the second LED is disposed within an area corresponding to the second fluorescent layer.
23. The LED package as claimed in claim 18, wherein the first fluorescent layer or the second fluorescent layer includes silicon.
24. The LED package as claimed in claim 19, wherein the pillar reflects the light of the first LED or the second LED in a direction of the first LED or the second LED when the light comes in contact with the pillar.
25. The LED package as claimed in claim 19, wherein a face of the pillar, facing the first LED and the second LED, is formed at a specific angle.
26. The LED package as claimed in claim 25, wherein the face of the pillar, facing the first LED and the second LED, is formed at an angle of about 15° to 90° to the PCB.
27. The LED package as claimed in claim 19, wherein the transparent plate is formed of a lens or a transparent substrate.
28. The LED package as claimed in claim 19, wherein a distance between the first fluorescent layer and the first LED or a distance between the second fluorescent layer and the second LED is about 10 to 20,000 μm.
29. A method of manufacturing a Light Emitting Diode (LED) package, the method comprising the steps of:
mounting an LED on a Printed Circuit Board (PCB), having a pillar formed thereon, within the pillar;
electrically connecting an electrical pad of the PCB and an electrical pad of the LED;
disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED and to transmit the light emitted from the LED on the pillar so that the fluorescent layer faces the LED; and
attaching the transparent plate to the pillar.
30. A method of manufacturing a Light Emitting Diode (LED) package, the method comprising the steps of:
mounting an LED on a Printed Circuit Board (PCB) having a pillar formed thereon;
electrically connecting an electrical pad of the PCB and an electrical pad of the LED;
disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED and to transmit the light emitted from the LED on the pillar so that the fluorescent layer faces the LED;
measuring a wavelength of the light emitted from the LED after the light passes through the transparent plate;
checking whether the light passing through the transparent plate satisfies a specific criterion; and
if, as a result of the check, the light passing through the transparent plate satisfies the specific criterion, attaching the transparent plate to the pillar.
US14/118,784 2011-05-20 2012-05-18 Light emitting diode package and method for manufacturing same Abandoned US20140312367A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2011-0048125 2011-05-20
KR1020110048125A KR101212654B1 (en) 2011-05-20 2011-05-20 Package for light emitting diode and method for manufacturing thereof
PCT/KR2012/003939 WO2012161475A2 (en) 2011-05-20 2012-05-18 Light emitting diode package and method for manufacturing same

Publications (1)

Publication Number Publication Date
US20140312367A1 true US20140312367A1 (en) 2014-10-23

Family

ID=47174284

Family Applications (2)

Application Number Title Priority Date Filing Date
US13/342,653 Active 2032-10-27 US9257618B2 (en) 2011-05-20 2012-01-03 LED package and method of manufacturing the same
US14/118,784 Abandoned US20140312367A1 (en) 2011-05-20 2012-05-18 Light emitting diode package and method for manufacturing same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US13/342,653 Active 2032-10-27 US9257618B2 (en) 2011-05-20 2012-01-03 LED package and method of manufacturing the same

Country Status (6)

Country Link
US (2) US9257618B2 (en)
EP (1) EP2711992A4 (en)
JP (1) JP2014513872A (en)
KR (1) KR101212654B1 (en)
CN (1) CN103563105A (en)
WO (1) WO2012161475A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102114607B1 (en) * 2013-04-01 2020-05-25 엘지전자 주식회사 Laser Light Source
WO2015011586A1 (en) * 2013-07-26 2015-01-29 Koninklijke Philips N.V. Led dome with inner high index pillar
JP6267011B2 (en) * 2014-03-05 2018-01-24 シチズン電子株式会社 Semiconductor light emitting device manufacturing method and semiconductor light emitting device
DE102014211833A1 (en) * 2014-06-20 2015-12-24 Osram Gmbh Signaling by means of semiconductor light sources

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090065791A1 (en) * 2007-09-06 2009-03-12 Jui-Kang Yen White light led with multiple encapsulation layers
US20100091491A1 (en) * 2008-10-14 2010-04-15 Ledengin, Inc. Total internal reflection lens for color mixing

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110146A (en) * 2001-07-26 2003-04-11 Matsushita Electric Works Ltd Light-emitting device
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
JP4280050B2 (en) * 2002-10-07 2009-06-17 シチズン電子株式会社 White light emitting device
KR100691143B1 (en) * 2003-04-30 2007-03-09 삼성전기주식회사 Light emitting diode device with multi-layered phosphor
JP4238681B2 (en) * 2003-09-17 2009-03-18 豊田合成株式会社 Light emitting device
US20070018567A1 (en) * 2003-08-22 2007-01-25 National Institute For Material Science Oxynitride phosphor and light-emitting instrument
US7723740B2 (en) * 2003-09-18 2010-05-25 Nichia Corporation Light emitting device
EP1681728B1 (en) * 2003-10-15 2018-11-21 Nichia Corporation Light-emitting device
US7553683B2 (en) * 2004-06-09 2009-06-30 Philips Lumiled Lighting Co., Llc Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices
DE102004036157B4 (en) * 2004-07-26 2023-03-16 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Electromagnetic radiation emitting optoelectronic component and light module
JP2007059667A (en) * 2005-08-25 2007-03-08 Toshiba Lighting & Technology Corp Light emitting device
KR20070033801A (en) * 2005-09-22 2007-03-27 삼성전기주식회사 Light emitting diode package and manufacturing method thereof
JP2009512178A (en) * 2005-11-04 2009-03-19 パナソニック株式会社 LIGHT EMITTING MODULE AND DISPLAY DEVICE AND LIGHTING DEVICE USING THE SAME
JP2007220737A (en) * 2006-02-14 2007-08-30 Seiwa Electric Mfg Co Ltd Light emitting device
KR100875443B1 (en) * 2006-03-31 2008-12-23 서울반도체 주식회사 Light emitting device
US7655486B2 (en) * 2006-05-17 2010-02-02 3M Innovative Properties Company Method of making light emitting device with multilayer silicon-containing encapsulant
TWI367573B (en) * 2007-01-31 2012-07-01 Young Lighting Technology Inc Light emitting diode package and manufacturing method thereof
JP4330172B2 (en) * 2007-03-26 2009-09-16 Ｎｅｃライティング株式会社 Phosphor and light emitting device using the same
EP2193554B1 (en) 2007-09-20 2015-12-02 Philips Intellectual Property & Standards GmbH Light emitting diode package
JP2008305802A (en) * 2008-07-16 2008-12-18 Stanley Electric Co Ltd Led lighting tool
JP2010103522A (en) * 2008-10-21 2010-05-06 Seoul Opto Devices Co Ltd Ac drive type light-emitting element with delay phosphor and light-emitting element module
US7923739B2 (en) * 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8648372B2 (en) * 2009-04-14 2014-02-11 Panasonic Corporation Light-emitting device, method for adjusting optical properties, and method for manufacturing light-emitting devices
US7855394B2 (en) * 2009-06-18 2010-12-21 Bridgelux, Inc. LED array package covered with a highly thermal conductive plate
WO2011016295A1 (en) * 2009-08-05 2011-02-10 コニカミノルタオプト株式会社 Light emitting device and method for manufacturing light emitting device
TW201115788A (en) * 2009-10-30 2011-05-01 Kingbright Electronics Co Ltd Improved white light LED lighting device
JP5519440B2 (en) * 2010-08-03 2014-06-11 日東電工株式会社 Light emitting device
US8901578B2 (en) * 2011-05-10 2014-12-02 Rohm Co., Ltd. LED module having LED chips as light source

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090065791A1 (en) * 2007-09-06 2009-03-12 Jui-Kang Yen White light led with multiple encapsulation layers
US20100091491A1 (en) * 2008-10-14 2010-04-15 Ledengin, Inc. Total internal reflection lens for color mixing

Also Published As

Publication number Publication date
WO2012161475A3 (en) 2013-01-17
KR101212654B1 (en) 2012-12-14
WO2012161475A2 (en) 2012-11-29
EP2711992A2 (en) 2014-03-26
JP2014513872A (en) 2014-06-05
US20120292644A1 (en) 2012-11-22
US9257618B2 (en) 2016-02-09
EP2711992A4 (en) 2014-10-29
KR20120129688A (en) 2012-11-28
CN103563105A (en) 2014-02-05

Similar Documents

Publication Publication Date Title
US11739899B2 (en) Lighting device
TWI711787B (en) Optical lens and light emitting module having the same
US7888698B2 (en) Photoelectric semiconductor device capable of generating uniform compound lights
US9312458B2 (en) Lighting device
US7800125B2 (en) Light-emitting diode package
US9228714B2 (en) Lighting device
US9976706B2 (en) Lighting device having semiconductor light sources and a common diffusor
US9627595B2 (en) Lighting device
US8304798B2 (en) Light-emitting diode module and manufacturing method thereof
US9929328B2 (en) Lighting device
US8608340B2 (en) Light-emitting module and lighting apparatus with the same
US9257618B2 (en) LED package and method of manufacturing the same
US20160043062A1 (en) Light source device
US20120293980A1 (en) Light-emitting unit, backlight device and display apparatus
KR101081170B1 (en) Light emitting device packag and method for fabricating thereof
KR102400249B1 (en) Light emitting module and display including the module
WO2009096685A3 (en) Led package, and a production method therefor, and a device using the led package
KR101295773B1 (en) Package for light emitting diode and method for manufacturing thereof
TW201423955A (en) LED light source device
KR102127448B1 (en) Light Emitting Device package
KR20140092083A (en) Light emittintg device package and light emittintg device package module
CN203628452U (en) Novel backlight assembly

Legal Events

Date Code Title Description
AS Assignment

Owner name: LIGHTIZER KOREA CO., LTD., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHO, BYOUNG-GU;MIN, JAE-SIK;REEL/FRAME:031633/0213

Effective date: 20131113

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION