US20140312367A1 - Light emitting diode package and method for manufacturing same - Google Patents
Light emitting diode package and method for manufacturing same Download PDFInfo
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- US20140312367A1 US20140312367A1 US14/118,784 US201214118784A US2014312367A1 US 20140312367 A1 US20140312367 A1 US 20140312367A1 US 201214118784 A US201214118784 A US 201214118784A US 2014312367 A1 US2014312367 A1 US 2014312367A1
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- led
- fluorescent layer
- pcb
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
Definitions
- the present invention relates to a Light-Emitting Diode (LED) package and a method of manufacturing the same and, more particularly, to an LED package of a Chip On Module (COM) form or a Chip On Board (COB) form using a Printed Circuit Board (PCB) and a method of manufacturing the same.
- LED Light-Emitting Diode
- COM Chip On Module
- COB Chip On Board
- an LED including an epitaxial layer made of GaN, InGaN, or AlGaN has excellent characteristics, a long life span, lower power consumption, higher brightness, and less harmless environmental factors, as compared with the existing incandescent.
- the LED is used in various fields, such as automotive lights, traffic signal lights, common lightings, and backlight units for liquid crystal displays, because of the advantages of the LED.
- the LED is fabricated by coating a fluorescent substance, designed according to the wavelength of an LED chip, on a surface of the LED chip using a method, such as dispensing, in order to form white light.
- the LED on which the fluorescent substance is coated is problematic in that the LED is deteriorated by heat generated therein.
- the present invention has been made in view of the above problems occurring in the prior art, and it is an object of the present invention to provide an LED package which is capable of effectively inhibiting a fluorescent layer from being deteriorated by heat generated from an LED.
- an LED package includes a PCB, an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting a wavelength of the light emitted from the LED, wherein the electrical pad of the LED and the electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.
- An LED package includes a PCB, a first LED mounted on the PCB, a second LED mounted on the PCB and spaced apart from the first LED, a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED, and a fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED or the second LED, wherein the electrical pad of the first LED and the electrical pad of the PCB are electrically connected to each other, the electrical pad of the second LED and the electrical pad of the PCB are electrically connected to each other, and the first and second LEDs and the fluorescent layer are spaced apart from each other.
- An LED package includes a PCB, a first LED mounted on the PCB, a second LED mounted on the PCB and spaced apart from the first LED, a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED, a first fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED, and a second fluorescent layer formed on the surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the second LED, wherein the electrical pad of the first LED and the electrical pad of the PCB are electrically connected to each other, the electrical pad of the second LED and the electrical pad of the PCB are electrically connected to
- a method of manufacturing an LED package includes the steps of mounting an LED on a PCB, having a pillar formed thereon, within the pillar, electrically connecting the electrical pad of the PCB and the electrical pad of the LED, disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED, and to transmit the light emitted from the LED, on the pillar so that the fluorescent layer faces the LED, and attaching the transparent plate to the pillar.
- a method of manufacturing an LED package includes the steps of mounting an LED on a PCB, having a pillar formed thereon, within the pillar, electrically connecting the electrical pad of the PCB and the electrical pad of the LED, disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED, and to transmit the light emitted from the LED, on the pillar so that the fluorescent layer faces the LED, measuring a wavelength of the light, emitted from the LED, after the light passes through the transparent plate, checking whether the light passing through the transparent plate satisfies a specific criterion, and if, as a result of the check, the light passing through the transparent plate satisfies the specific criterion, attaching the transparent plate to the pillar.
- FIG. 1 is a cross-sectional view of an LED package according to a first embodiment of the present invention
- FIG. 2 is a plan view of a modified embodiment of FIG. 1 ;
- FIG. 3 is a plan view of a modified embodiment of FIG. 1 ;
- FIG. 4 shows a combination ratio according to color coordinates and the scattering of wavelengths
- FIG. 5 is a cross-sectional view of an LED package according to an embodiment of the present invention.
- FIG. 6 is a plan view of a modified embodiment of FIG. 5 ;
- FIG. 7 a cross-sectional view of an LED package according to an embodiment of the present invention.
- FIG. 8 is a plan view of a modified embodiment of FIG. 7 .
- FIG. 1 is a cross-sectional view of an LED package according to a first embodiment of the present invention
- FIG. 2 is a plan view of a modified embodiment of FIG. 1
- FIG. 3 is a plan view of a modified embodiment of FIG. 1
- FIG. 4 shows a combination ratio according to color coordinates and the scattering of wavelengths.
- the LED package according to the first embodiment of the present invention may include a PCB 110 , an LED 130 , a pillar 120 , a transparent plate 150 , and a fluorescent layer 140 .
- the LED 130 is mounted on the PCB 110 .
- the electrical pad of the LED 130 and the electrical pad of the PCB 110 are electrically connected to each other.
- the pillar 120 is placed higher than the LED 130 around the LED 130 on the PCB 110 . Light generated from the LED 130 is reflected from the pillar 120 in the direction of the LED 130 when the light comes in contact with the pillar 120 .
- the pillar 120 When the pillar 120 reflects the light from the LED 130 in the direction of the LED 130 , the light emitted from the LED 130 can be effectively inhibited from leaking outside without passing through the fluorescent layer 140 .
- the pillar 120 may have a side facing the LED 130 at a specific angle ‘e’. More particularly, the side of the pillar 120 facing the LED 130 may be an angle of 15° to 90° to the PCB 110 .
- the side of the pillar 120 facing the LED 130 is formed at a specific angle, the light emitted from the LED 130 can be more effectively inhibited from leaking outside without passing through the fluorescent layer 140 .
- the pillar 120 may be integrally formed with the PCB 110 .
- the pillar 120 may be fabricated separately from the PCB 110 and attached on the PCB 110 .
- the pillar 120 may be formed in a ring shape or in various forms, such as a square belt form, as shown in FIGS. 2 and 3 .
- the transparent plate 150 is disposed on the pillar 120 with it spaced apart from the LED 130 .
- the transparent plate 150 transmits light emitted from the LED 130 .
- the transparent plate 150 may be formed of a lens or a transparent substrate made of glass or polymer.
- the fluorescent layer 140 is conformably coated with a substance for converting light, emitted from the LED 130 , into white light by changing a wavelength of the light and is formed on a surface of the transparent plate 150 which faces the LED 130 .
- the LED 130 and the fluorescent layer 140 are spaced apart from each other. More particularly, the distance ‘b’ between the fluorescent layer 140 and the LED 130 is 10 to 20,000 ⁇ m.
- the LED 130 is disposed within an area corresponding to the fluorescent layer 140 at an interval ‘a’ of about 0 to 500 ⁇ m from the fluorescent layer 140 .
- the pillar 120 is disposed at an interval ‘c’ of about 0 to 500 ⁇ m from the fluorescent layer 140 .
- the LED 130 and the fluorescent layer 140 are spaced apart from each other, the deterioration of the fluorescent layer 140 due to heat generated from the LED 130 can be effectively inhibited. Accordingly, a reduction in the light efficiency of the LED 130 can be minimized although the turn-on time of the LED 130 elapses.
- the fluorescent layer 140 includes silicon. In order to compensate for the scattering of a wavelength of light emitted from the LED 130 , a combination ratio of silicon included in the fluorescent layer 140 or the thickness of the fluorescent layer 140 may be controlled.
- a silicon combination ratio A may be used. If a color coordinate system of light emitted from the LED 130 is No. 2, a silicon combination ratio B may be used. If a color coordinate system of light emitted from the LED 130 is No. 3, a silicon combination ratio C may be used.
- the fluorescent layer 140 may have a circle as shown in FIG. 2 , a square as shown in FIG. 3 , or various forms.
- An LED package according to a second embodiment of the present invention is described below, and a difference between the LED packages according to the first and second embodiments is chiefly described.
- FIG. 5 is a cross-sectional view of the LED package according to the second embodiment of the present invention
- FIG. 6 is a plan view of a modified embodiment of FIG. 5 .
- the LED package according to the second embodiment of the present invention includes a first LED 231 mounted on a PCB 210 , a second LED 232 mounted on the PCB 210 and spaced apart from the first LED 231 , and a fluorescent layer 240 conformably coated with a substance for converting light, emitted from the first LED 231 or the second LED 232 , into white light by changing a wavelength of the light and formed on a surface of a transparent plate 250 which faces the first LED 231 and the second LED 232 .
- the first LED 231 , the second LED 232 , and the fluorescent layer 240 are disposed and spaced apart from one another.
- the LED package according to the second embodiment of the present invention includes the plurality of LEDs within an area corresponding to the one fluorescent layer 240 .
- An LED package according to a modified embodiment may include four LEDs 231 , 232 , 233 , and 234 , as shown in FIG. 6 .
- An LED package according to a third embodiment of the present invention is described below, and a difference between the LEDs according to the first and third embodiments is chiefly described.
- FIG. 7 is a cross-sectional view of the LED package according to the third embodiment of the present invention
- FIG. 8 is a plan view of a modified embodiment of FIG. 7 .
- the LED package according to the third embodiment of the present invention includes a first LED 331 mounted on a PCB 310 , a second LED 332 mounted on the PCB 310 and spaced apart from the first LED 331 , a first fluorescent layer 341 conformably coated with a substance for converting light emitted from the first LED 331 into white light by changing a wavelength of the light, and a second fluorescent layer 342 conformably coated with a substance for converting light emitted from the second LED 332 into white light by changing a wavelength of the light.
- the first fluorescent layer 341 is formed on a surface of the transparent plate 350 which faces the first LED 331 and the second LED 332 .
- the second fluorescent layer 342 is formed on a surface of the transparent plate 350 which faces the first LED 331 and the second LED 332 .
- the first LED 331 and the first fluorescent layer 341 are spaced apart from each other, and the second LED 332 and the second fluorescent layer 342 are spaced apart from each other. Furthermore, the first fluorescent layer 341 and the second fluorescent layer 342 are spaced apart from each other.
- the LED package according to the third embodiment of the present invention includes the plurality of fluorescent layers 341 and 342 and the plurality of LEDs 331 and 332 , corresponding to the respective fluorescent layers 341 and 342 , within one pillar 120 .
- An LED package according to a modified embodiment includes the four fluorescent layers 341 , 342 , 343 , and 344 and the four LEDs 331 , 332 , 333 , and 334 corresponding to the four fluorescent layers, respectively, as shown in FIG. 8 .
- a method of manufacturing the LED according to an embodiment of the present invention is described below with reference to FIG. 1 , for example.
- the LED 130 is mounted on the PCB 110 , having the pillar 120 formed thereon, within the pillar 120 .
- the electrical pad of the PCB 110 and the electrical pad of the LED 130 are electrically connected to each other.
- the transparent plate 150 is configured to include the fluorescent layer 140 conformably coated with the substance for converting light emitted from the LED 130 into white light by changing a wavelength of the light, and to transmit the light emitted from the LED 130 , and is disposed on the pillar 120 so that the fluorescent layer 140 faces the LED 130 . After the transparent plate 150 transmits the light emitted from the LED 130 , a wavelength of light is measured.
- the transparent plate 150 is attached to the pillar 120 .
- the embodiments of the present invention provide the LED package capable of effectively inhibiting the fluorescent layer from be deteriorated by heat generated from the LED.
- the LED package may be easily fabricated using the method of manufacturing the LED package according to the embodiments of the present invention.
Abstract
A Light Emitting Diode (LED) package comprises a Printed Circuit Board (PCB), an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting a wavelength of the light emitted from the LED, wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.
Description
- The present invention relates to a Light-Emitting Diode (LED) package and a method of manufacturing the same and, more particularly, to an LED package of a Chip On Module (COM) form or a Chip On Board (COB) form using a Printed Circuit Board (PCB) and a method of manufacturing the same.
- In general, an LED including an epitaxial layer made of GaN, InGaN, or AlGaN has excellent characteristics, a long life span, lower power consumption, higher brightness, and less harmless environmental factors, as compared with the existing incandescent. The LED is used in various fields, such as automotive lights, traffic signal lights, common lightings, and backlight units for liquid crystal displays, because of the advantages of the LED.
- Meanwhile, the LED is fabricated by coating a fluorescent substance, designed according to the wavelength of an LED chip, on a surface of the LED chip using a method, such as dispensing, in order to form white light.
- The LED on which the fluorescent substance is coated, however, is problematic in that the LED is deteriorated by heat generated therein.
- Accordingly, the present invention has been made in view of the above problems occurring in the prior art, and it is an object of the present invention to provide an LED package which is capable of effectively inhibiting a fluorescent layer from being deteriorated by heat generated from an LED.
- It is another object of the present invention to provide a method of manufacturing an LED package, which can easily fabricate the LED package.
- The technical objects to be achieved by the present invention are not limited to the above-mentioned objects, and other technical objects that have not been mentioned above will become evident to those skilled in the art from the following description.
- To achieve the above objects, an LED package according to an embodiment of the present invention includes a PCB, an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting a wavelength of the light emitted from the LED, wherein the electrical pad of the LED and the electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.
- An LED package according to another embodiment of the present invention includes a PCB, a first LED mounted on the PCB, a second LED mounted on the PCB and spaced apart from the first LED, a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED, and a fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED or the second LED, wherein the electrical pad of the first LED and the electrical pad of the PCB are electrically connected to each other, the electrical pad of the second LED and the electrical pad of the PCB are electrically connected to each other, and the first and second LEDs and the fluorescent layer are spaced apart from each other.
- An LED package according to another embodiment of the present invention includes a PCB, a first LED mounted on the PCB, a second LED mounted on the PCB and spaced apart from the first LED, a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED, a first fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED, and a second fluorescent layer formed on the surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the second LED, wherein the electrical pad of the first LED and the electrical pad of the PCB are electrically connected to each other, the electrical pad of the second LED and the electrical pad of the PCB are electrically connected to each other, the first LED and the first fluorescent layer are spaced apart from each other, the second LED and the second fluorescent layer are spaced apart from each other, and the first fluorescent layer and the second fluorescent layer are coated with them spaced apart from each other.
- A method of manufacturing an LED package according to an embodiment of the present invention includes the steps of mounting an LED on a PCB, having a pillar formed thereon, within the pillar, electrically connecting the electrical pad of the PCB and the electrical pad of the LED, disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED, and to transmit the light emitted from the LED, on the pillar so that the fluorescent layer faces the LED, and attaching the transparent plate to the pillar.
- A method of manufacturing an LED package according to another embodiment of the present invention includes the steps of mounting an LED on a PCB, having a pillar formed thereon, within the pillar, electrically connecting the electrical pad of the PCB and the electrical pad of the LED, disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED, and to transmit the light emitted from the LED, on the pillar so that the fluorescent layer faces the LED, measuring a wavelength of the light, emitted from the LED, after the light passes through the transparent plate, checking whether the light passing through the transparent plate satisfies a specific criterion, and if, as a result of the check, the light passing through the transparent plate satisfies the specific criterion, attaching the transparent plate to the pillar.
- Further objects and advantages of the invention can be more fully understood from the following detailed description taken in conjunction with the accompanying drawings in which:
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FIG. 1 is a cross-sectional view of an LED package according to a first embodiment of the present invention; -
FIG. 2 is a plan view of a modified embodiment ofFIG. 1 ; -
FIG. 3 is a plan view of a modified embodiment ofFIG. 1 ; -
FIG. 4 shows a combination ratio according to color coordinates and the scattering of wavelengths; -
FIG. 5 is a cross-sectional view of an LED package according to an embodiment of the present invention; -
FIG. 6 is a plan view of a modified embodiment ofFIG. 5 ; -
FIG. 7 a cross-sectional view of an LED package according to an embodiment of the present invention; and -
FIG. 8 is a plan view of a modified embodiment ofFIG. 7 . - Some exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The detailed contents of other embodiments are included in the detailed description and drawings. Merits and characteristics of the present invention and methods for achieving them will become more apparent from the following embodiments taken in conjunction with the accompanying drawings. The same reference numerals are used throughout the entire specification to refer to the same parts.
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FIG. 1 is a cross-sectional view of an LED package according to a first embodiment of the present invention,FIG. 2 is a plan view of a modified embodiment ofFIG. 1 ,FIG. 3 is a plan view of a modified embodiment ofFIG. 1 , andFIG. 4 shows a combination ratio according to color coordinates and the scattering of wavelengths. - The LED package according to the first embodiment of the present invention may include a
PCB 110, anLED 130, apillar 120, atransparent plate 150, and afluorescent layer 140. - The
LED 130 is mounted on the PCB 110. The electrical pad of theLED 130 and the electrical pad of thePCB 110 are electrically connected to each other. - The
pillar 120 is placed higher than theLED 130 around theLED 130 on thePCB 110. Light generated from theLED 130 is reflected from thepillar 120 in the direction of theLED 130 when the light comes in contact with thepillar 120. - When the
pillar 120 reflects the light from theLED 130 in the direction of theLED 130, the light emitted from theLED 130 can be effectively inhibited from leaking outside without passing through thefluorescent layer 140. - The
pillar 120 may have a side facing theLED 130 at a specific angle ‘e’. More particularly, the side of thepillar 120 facing theLED 130 may be an angle of 15° to 90° to the PCB 110. - When the side of the
pillar 120 facing theLED 130 is formed at a specific angle, the light emitted from theLED 130 can be more effectively inhibited from leaking outside without passing through thefluorescent layer 140. - Meanwhile, the
pillar 120 may be integrally formed with the PCB 110. Alternatively, thepillar 120 may be fabricated separately from the PCB 110 and attached on thePCB 110. Thepillar 120 may be formed in a ring shape or in various forms, such as a square belt form, as shown inFIGS. 2 and 3 . - The
transparent plate 150 is disposed on thepillar 120 with it spaced apart from theLED 130. Thetransparent plate 150 transmits light emitted from theLED 130. Thetransparent plate 150 may be formed of a lens or a transparent substrate made of glass or polymer. - The
fluorescent layer 140 is conformably coated with a substance for converting light, emitted from theLED 130, into white light by changing a wavelength of the light and is formed on a surface of thetransparent plate 150 which faces theLED 130. TheLED 130 and thefluorescent layer 140 are spaced apart from each other. More particularly, the distance ‘b’ between thefluorescent layer 140 and theLED 130 is 10 to 20,000 μm. TheLED 130 is disposed within an area corresponding to thefluorescent layer 140 at an interval ‘a’ of about 0 to 500 μm from thefluorescent layer 140. Thepillar 120 is disposed at an interval ‘c’ of about 0 to 500 μm from thefluorescent layer 140. - Since the
LED 130 and thefluorescent layer 140 are spaced apart from each other, the deterioration of thefluorescent layer 140 due to heat generated from theLED 130 can be effectively inhibited. Accordingly, a reduction in the light efficiency of theLED 130 can be minimized although the turn-on time of theLED 130 elapses. - The
fluorescent layer 140 includes silicon. In order to compensate for the scattering of a wavelength of light emitted from theLED 130, a combination ratio of silicon included in thefluorescent layer 140 or the thickness of thefluorescent layer 140 may be controlled. - For example, as shown in
FIG. 4 , if a color coordinate system of light emitted from theLED 130 is No. 1, a silicon combination ratio A may be used. If a color coordinate system of light emitted from theLED 130 is No. 2, a silicon combination ratio B may be used. If a color coordinate system of light emitted from theLED 130 is No. 3, a silicon combination ratio C may be used. - Meanwhile, the
fluorescent layer 140 may have a circle as shown inFIG. 2 , a square as shown inFIG. 3 , or various forms. - An LED package according to a second embodiment of the present invention is described below, and a difference between the LED packages according to the first and second embodiments is chiefly described.
-
FIG. 5 is a cross-sectional view of the LED package according to the second embodiment of the present invention, andFIG. 6 is a plan view of a modified embodiment ofFIG. 5 . - The LED package according to the second embodiment of the present invention includes a
first LED 231 mounted on aPCB 210, asecond LED 232 mounted on thePCB 210 and spaced apart from thefirst LED 231, and afluorescent layer 240 conformably coated with a substance for converting light, emitted from thefirst LED 231 or thesecond LED 232, into white light by changing a wavelength of the light and formed on a surface of atransparent plate 250 which faces thefirst LED 231 and thesecond LED 232. Thefirst LED 231, thesecond LED 232, and thefluorescent layer 240 are disposed and spaced apart from one another. - The LED package according to the second embodiment of the present invention includes the plurality of LEDs within an area corresponding to the one
fluorescent layer 240. An LED package according to a modified embodiment may include fourLEDs FIG. 6 . - An LED package according to a third embodiment of the present invention is described below, and a difference between the LEDs according to the first and third embodiments is chiefly described.
-
FIG. 7 is a cross-sectional view of the LED package according to the third embodiment of the present invention, andFIG. 8 is a plan view of a modified embodiment ofFIG. 7 . - The LED package according to the third embodiment of the present invention includes a
first LED 331 mounted on aPCB 310, asecond LED 332 mounted on thePCB 310 and spaced apart from thefirst LED 331, afirst fluorescent layer 341 conformably coated with a substance for converting light emitted from thefirst LED 331 into white light by changing a wavelength of the light, and asecond fluorescent layer 342 conformably coated with a substance for converting light emitted from thesecond LED 332 into white light by changing a wavelength of the light. Here, thefirst fluorescent layer 341 is formed on a surface of thetransparent plate 350 which faces thefirst LED 331 and thesecond LED 332. Furthermore, thesecond fluorescent layer 342 is formed on a surface of thetransparent plate 350 which faces thefirst LED 331 and thesecond LED 332. Thefirst LED 331 and thefirst fluorescent layer 341 are spaced apart from each other, and thesecond LED 332 and thesecond fluorescent layer 342 are spaced apart from each other. Furthermore, thefirst fluorescent layer 341 and thesecond fluorescent layer 342 are spaced apart from each other. - The LED package according to the third embodiment of the present invention includes the plurality of
fluorescent layers LEDs fluorescent layers pillar 120. An LED package according to a modified embodiment includes the fourfluorescent layers LEDs FIG. 8 . - A method of manufacturing the LED according to an embodiment of the present invention is described below with reference to
FIG. 1 , for example. - The
LED 130 is mounted on thePCB 110, having thepillar 120 formed thereon, within thepillar 120. Next, the electrical pad of thePCB 110 and the electrical pad of theLED 130 are electrically connected to each other. Thetransparent plate 150 is configured to include thefluorescent layer 140 conformably coated with the substance for converting light emitted from theLED 130 into white light by changing a wavelength of the light, and to transmit the light emitted from theLED 130, and is disposed on thepillar 120 so that thefluorescent layer 140 faces theLED 130. After thetransparent plate 150 transmits the light emitted from theLED 130, a wavelength of light is measured. - Next, it is checked whether the light passing through the
transparent plate 150 satisfies a specific criterion. Need an example? If, as a result of the check, the light passing through thetransparent plate 150 satisfies the specific criterion, thetransparent plate 150 is attached to thepillar 120. - As described above, the embodiments of the present invention provide the LED package capable of effectively inhibiting the fluorescent layer from be deteriorated by heat generated from the LED.
- Furthermore, the LED package may be easily fabricated using the method of manufacturing the LED package according to the embodiments of the present invention.
- While the some exemplary embodiments of the present invention have been described and shown in order to illustrate the principle of the present invention, the present invention is not to be restricted by the constructions and operations shown and described above. It is to be appreciated that those skilled in the art may change or modify the embodiments without departing from the scope and spirit of the present invention. Accordingly, it should be construed that all proper modification and changes and their equivalents fall within the scope of the present invention.
Claims (30)
1. A Light Emitting Diode (LED) package, comprising:
a Printed Circuit Board (PCB);
an LED mounted on the PCB;
a pillar placed higher than the LED around the LED on the PCB;
a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED; and
a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting a wavelength of the light emitted from the LED,
wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.
2. The LED package as claimed in claim 1 , wherein the fluorescent layer converts the light emitted from the LED into white light by changing a wavelength of the light.
3. The LED package as claimed in claim 1 , wherein the LED is disposed within an area corresponding to the fluorescent layer.
4. The LED package as claimed in claim 1 , wherein the fluorescent layer includes silicon.
5. The LED package as claimed in claim 1 , wherein the pillar reflects the light emitted from the LED in a direction of the LED when the light comes in contact with the pillar.
6. The LED package as claimed in claim 1 , wherein a face of the pillar, facing the LED, is formed at a specific angle.
7. The LED package as claimed in claim 6 , wherein the face of the pillar, facing the LED, is formed at an angle of about 15° to 90° to the PCB.
8. The LED package as claimed in claim 1 , wherein the transparent plate is formed of a lens or a transparent substrate.
9. The LED package as claimed in claim 1 , wherein a distance between the fluorescent layer and the LED is about 10 to 20,000 μm.
10. A Light Emitting Diode (LED) package, comprising:
a Printed Circuit Board (PCB);
a first LED mounted on the PCB;
a second LED mounted on the PCB and spaced apart from the first LED;
a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB;
a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED; and
a fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED or the second LED,
wherein an electrical pad of the first LED and an electrical pad of the PCB are electrically connected to each other, an electrical pad of the second LED and an electrical pad of the PCB are electrically connected to each other, and the first and second LEDs and the fluorescent layer are spaced apart from each other.
11. The LED package as claimed in claim 10 , wherein the fluorescent layer converts the light emitted from the first LED or the second LED into white light by changing a wavelength of the light.
12. The LED package as claimed in claim 10 , wherein the first LED and the second LED are disposed within an area corresponding to the fluorescent layer.
13. The LED package as claimed in claim 10 , wherein the fluorescent layer includes silicon.
14. The LED package as claimed in claim 10 , wherein the pillar reflects the light of the first LED or the second LED in a direction of the first LED or the second LED when the light comes in contact with the pillar.
15. The LED package as claimed in claim 10 , wherein a face of the pillar, facing the first LED and the second LED, is formed at a specific angle.
16. The LED package as claimed in claim 15 , wherein the face of the pillar, facing the first LED and the second LED, is formed at an angle of about 15° to 90° to the PCB.
17. The LED package as claimed in claim 10 , wherein the transparent plate is formed of a lens or a transparent substrate.
18. The LED package as claimed in claim 10 , wherein a distance between the fluorescent layer and the first LED and the second LED is about 10 to 20,000 μm.
19. A Light Emitting Diode (LED) package, comprising:
a Printed Circuit Board (PCB);
a first LED mounted on the PCB;
a second LED mounted on the PCB and spaced apart from the first LED;
a pillar placed higher than the first LED and the second LED around the first LED and the second LED on the PCB;
a transparent plate disposed on the pillar, spaced apart from the first LED and the second LED, and configured to transmit light emitted from the first LED or the second LED;
a first fluorescent layer formed on a surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the first LED; and
a second fluorescent layer formed on the surface of the transparent plate, facing the first LED and the second LED, and conformably coated with a substance for converting a wavelength of the light emitted from the second LED;
wherein an electrical pad of the first LED and an electrical pad of the PCB are electrically connected to each other, an electrical pad of the second LED and the electrical pad of the PCB are electrically connected to each other, the first LED and the first fluorescent layer are spaced apart from each other, the second LED and the second fluorescent layer are spaced apart from each other, and the first fluorescent layer and the second fluorescent layer are spaced apart from each other.
20. The LED package as claimed in claim 19 , wherein the first fluorescent layer converts the light emitted from the first LED into white light by changing a wavelength of the light.
21. The LED package as claimed in claim 19 , wherein the second fluorescent layer converts the light emitted from the second LED into white light by changing a wavelength of the light.
22. The LED package as claimed in claim 19 , wherein:
the first LED is disposed within an area corresponding to the first fluorescent layer; and
the second LED is disposed within an area corresponding to the second fluorescent layer.
23. The LED package as claimed in claim 18 , wherein the first fluorescent layer or the second fluorescent layer includes silicon.
24. The LED package as claimed in claim 19 , wherein the pillar reflects the light of the first LED or the second LED in a direction of the first LED or the second LED when the light comes in contact with the pillar.
25. The LED package as claimed in claim 19 , wherein a face of the pillar, facing the first LED and the second LED, is formed at a specific angle.
26. The LED package as claimed in claim 25 , wherein the face of the pillar, facing the first LED and the second LED, is formed at an angle of about 15° to 90° to the PCB.
27. The LED package as claimed in claim 19 , wherein the transparent plate is formed of a lens or a transparent substrate.
28. The LED package as claimed in claim 19 , wherein a distance between the first fluorescent layer and the first LED or a distance between the second fluorescent layer and the second LED is about 10 to 20,000 μm.
29. A method of manufacturing a Light Emitting Diode (LED) package, the method comprising the steps of:
mounting an LED on a Printed Circuit Board (PCB), having a pillar formed thereon, within the pillar;
electrically connecting an electrical pad of the PCB and an electrical pad of the LED;
disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED and to transmit the light emitted from the LED on the pillar so that the fluorescent layer faces the LED; and
attaching the transparent plate to the pillar.
30. A method of manufacturing a Light Emitting Diode (LED) package, the method comprising the steps of:
mounting an LED on a Printed Circuit Board (PCB) having a pillar formed thereon;
electrically connecting an electrical pad of the PCB and an electrical pad of the LED;
disposing a transparent plate configured to include a fluorescent layer conformably coated with a substance for converting a wavelength of light emitted from the LED and to transmit the light emitted from the LED on the pillar so that the fluorescent layer faces the LED;
measuring a wavelength of the light emitted from the LED after the light passes through the transparent plate;
checking whether the light passing through the transparent plate satisfies a specific criterion; and
if, as a result of the check, the light passing through the transparent plate satisfies the specific criterion, attaching the transparent plate to the pillar.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR10-2011-0048125 | 2011-05-20 | ||
KR1020110048125A KR101212654B1 (en) | 2011-05-20 | 2011-05-20 | Package for light emitting diode and method for manufacturing thereof |
PCT/KR2012/003939 WO2012161475A2 (en) | 2011-05-20 | 2012-05-18 | Light emitting diode package and method for manufacturing same |
Publications (1)
Publication Number | Publication Date |
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US20140312367A1 true US20140312367A1 (en) | 2014-10-23 |
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US13/342,653 Active 2032-10-27 US9257618B2 (en) | 2011-05-20 | 2012-01-03 | LED package and method of manufacturing the same |
US14/118,784 Abandoned US20140312367A1 (en) | 2011-05-20 | 2012-05-18 | Light emitting diode package and method for manufacturing same |
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US13/342,653 Active 2032-10-27 US9257618B2 (en) | 2011-05-20 | 2012-01-03 | LED package and method of manufacturing the same |
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US (2) | US9257618B2 (en) |
EP (1) | EP2711992A4 (en) |
JP (1) | JP2014513872A (en) |
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CN (1) | CN103563105A (en) |
WO (1) | WO2012161475A2 (en) |
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KR102114607B1 (en) * | 2013-04-01 | 2020-05-25 | 엘지전자 주식회사 | Laser Light Source |
WO2015011586A1 (en) * | 2013-07-26 | 2015-01-29 | Koninklijke Philips N.V. | Led dome with inner high index pillar |
JP6267011B2 (en) * | 2014-03-05 | 2018-01-24 | シチズン電子株式会社 | Semiconductor light emitting device manufacturing method and semiconductor light emitting device |
DE102014211833A1 (en) * | 2014-06-20 | 2015-12-24 | Osram Gmbh | Signaling by means of semiconductor light sources |
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- 2012-05-18 EP EP12788976.4A patent/EP2711992A4/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
---|---|
WO2012161475A3 (en) | 2013-01-17 |
KR101212654B1 (en) | 2012-12-14 |
WO2012161475A2 (en) | 2012-11-29 |
EP2711992A2 (en) | 2014-03-26 |
JP2014513872A (en) | 2014-06-05 |
US20120292644A1 (en) | 2012-11-22 |
US9257618B2 (en) | 2016-02-09 |
EP2711992A4 (en) | 2014-10-29 |
KR20120129688A (en) | 2012-11-28 |
CN103563105A (en) | 2014-02-05 |
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Owner name: LIGHTIZER KOREA CO., LTD., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHO, BYOUNG-GU;MIN, JAE-SIK;REEL/FRAME:031633/0213 Effective date: 20131113 |
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