US20100025255A1 - Electroplating method for magnesium and magnesium alloy - Google Patents

Electroplating method for magnesium and magnesium alloy Download PDF

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Publication number
US20100025255A1
US20100025255A1 US12/498,455 US49845509A US2010025255A1 US 20100025255 A1 US20100025255 A1 US 20100025255A1 US 49845509 A US49845509 A US 49845509A US 2010025255 A1 US2010025255 A1 US 2010025255A1
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Prior art keywords
substrate
electroplating
mass concentration
coating
magnesium
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US12/498,455
Inventor
Jong-Yi Su
Cheng-Shin Chen
Ren-Ning Wang
Hong-Jun Qu
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Shenzhen Futaihong Precision Industry Co Ltd
FIH Hong Kong Ltd
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Shenzhen Futaihong Precision Industry Co Ltd
FIH Hong Kong Ltd
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Assigned to SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED reassignment SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHENG-SHIN, QU, Hong-jun, SU, JONG-YI, WANG, REN-NING
Publication of US20100025255A1 publication Critical patent/US20100025255A1/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/04—Electroplating: Baths therefor from solutions of chromium
    • C25D3/06—Electroplating: Baths therefor from solutions of chromium from solutions of trivalent chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Definitions

  • the present disclosure relates to an electroplating method for magnesium and magnesium alloys.
  • Magnesium and magnesium alloys are prone to corrosion such as galvanic corrosion and therefore, should be surface treated before being used.
  • a typical surface treatment method now for magnesium and magnesium alloys is electroplating. After electroplating, the corrosion resistance and the metallic appearance of the magnesium and magnesium alloys may be greatly improved. However, there are some difficulties for electroplating the magnesium and magnesium alloys because they are highly chemically active. Additionally, during electroplating, magnesium and magnesium alloys tend to react with metal ions contained in electrolytes, which will affect the quality of the electroplating.
  • the FIGURE is a flow chart of a present embodiment of an electroplating method for magnesium and magnesium alloys.
  • an electroplating method for magnesium and magnesium alloys may include the steps S 10 to S 70 .
  • a magnesium or a magnesium alloy substrate is provided.
  • the substrate may be a housing of a mobile phone, a digital camera, a personal digital assistant, or a note-book computer.
  • the substrate may also be a housing of a container.
  • the substrate is pretreated.
  • the pre-treating step may comprise degreasing and cleaning the substrate.
  • the degreasing process may be carried out by dipping the substrate in a degreasing solution for about 5-15 minutes.
  • the mass concentration of the degreasing solution is about 150-200 grams per liter (g/L).
  • the temperature of the degreasing solution is about 75-90° C.
  • the substrate is removed from the degreasing solution and bathed in water. Then, the substrate is dipped in a sodium hydroxide solution for about 4-10 minutes to be polished.
  • the sodium hydroxide solution may further include wax-removing agent(s).
  • the mass concentration of the sodium hydroxide is about 100-200 g/L, and the mass concentration of the wax-removing agent(s) in the solution is about 40-80 g/L.
  • the temperature of the sodium hydroxide solution is about 75-90° C. After the cleaning process, the substrate is again bathed in water.
  • step S 30 the surface of the substrate is roughened by dipping the substrate in a roughening solution containing roughening agent(s) and sodium carbonate for about 10-30 minutes.
  • the temperature of the roughening solution is about 55-65° C.
  • the mass concentration of the sodium carbonate in the roughening solution is about 50-100 g/L.
  • the roughening agent(s) may be pyrophosphate, the mass concentration of the pyrophosphate in the roughening solution is about 350-450 g/L.
  • the magnesium or magnesium alloy on the surface of the substrate will chemically react with the compounds in the roughening solution thereby becoming roughened.
  • the roughened surface of the substrate enhances the adhesion of metal plating to the substrate in a subsequent process.
  • step 40 the surface of the substrate is activated.
  • the activating process is carried out by dipping the substrate in an activating solution containing hydrofluoric acid for about 1-5 minutes.
  • the temperature of the activating solution is about 30-40° C.
  • Concentration by volume of the hydrofluoric acid in the activating solution is about 150-300 ml/L.
  • the solution may further include activating agent(s).
  • a magnesium fluoride film is formed on the surface of the substrate.
  • step S 50 the substrate is chemically plated to form a nickel coating on it's surface.
  • the chemical plating process is carried out by immersing the substrate in a solution containing sodium hypophosphite and basic nickel carbonate for about 20-60 minutes.
  • the mass concentration of the sodium hypophosphite in the solution is about 10-30 g/L, and the mass concentration of the basic nickel carbonate in the solution is about 20-50 g/L.
  • the temperature of the solution is about 70-90° C.
  • the magnesium fluoride film is dissolved, and then nickel iron in the solution is deoxidized to nickel and deposited on the substrate to form the nickel coating.
  • the substrate is repeatedly electroplated to form one or more metal coatings on the chemically produced nickel coating.
  • the electroplated coating may comprise a first nickel coating, a copper coating, a second nickel coating, and a chromium coating.
  • the electroplating process may comprise: electroplating the substrate to form a first nickel coating on the chemically produced nickel coating; electroplating the substrate to form a copper coating on the first nickel coating; electroplating the substrate to form a second nickel coating on the copper coating; and electroplating the substrate to form a chromium coating on the second nickel coating.
  • the electroplated coating presents good appearance and enhances the corrosion resistance of the substrate.
  • Electroplating the substrate to form the first nickel coating may be carried out in a first electrolyte, with the metallized surface of the substrate being a cathode, and a nickel anode being provided and immersed in the first electrolyte.
  • the first electrolyte may contain a nickel sulphate component in a mass concentration of about 240-300 g/L, a nickel chloride component in a mass concentration of about 30-50 g/L, and a boric acid component in a mass concentration of about 30-50 g/L.
  • the temperature of the first electrolyte is about 50-55° C.
  • Electroplating the substrate to form the copper coating may be carried out in a second electrolyte, with the metallized surface of the substrate being a cathode, and a copper anode being provided and immersed in the second electrolyte.
  • the second electrolyte may contain a copper sulphate component in a mass concentration of about 180-220 g/L, and a sulfuric acid component in a mass concentration of about 40-80 g/L.
  • the temperature of the electrolyte is about 20-25° C.
  • the electric current density through the second electrolyte is about 1-3 A/dm 2 .
  • Electroplating the substrate with the copper coating may last for about 5-30 minutes. Because the copper coating possesses good malleability and low porosity, the bonding of the copper coating and the first nickel coating is enhanced.
  • Electroplating the substrate to form the second nickel coating may be the same to the electroplating of forming the first nickel coating.
  • the second nickel coating further enhances the corrosion resistance of the substrate. Because of the copper coating's good malleability and low porosity, the bonding of the second nickel coating with the copper coating is enhanced.
  • Electroplating the substrate to form the chromium coating may be carried out in a third electrolyte, with the metallized surface of the substrate being a cathode, and a chromium anode being provided and immersed in the third electrolyte.
  • the third electrolyte may contain a chromium sulphate component in a mass concentration of about 240-300 g/L, and a boric acid component in a mass concentration of about 70-90 g/L.
  • the temperature of the third electrolyte is about 30-50° C.
  • the electric current density through the third electrolyte is about 1-15 A/dm 2 .
  • Electroplating the substrate with the chromium coating may last for about 1-15 minutes.
  • the chromium coating prepared by electroplating in such an electrolyte and under such an electric current density of the electrolyte has the property to bond well with the second nickel coating, as described above.
  • the chromium coating presents high gloss appearance.
  • the substrate After being electroplated, the substrate is bathed in water.
  • step S 70 the substrate is subjected to neutralization treatment.
  • the neutralization treatment is carried out by dipping the substrate in a neutralization solution for about 1-3 minutes to remove any residual electrolyte adhering to the substrate.
  • the neutralization solution includes a sulfuric acid component in a concentration by volume of about 20-50 ml/L, and an oxydol component in a concentration by volume of about 50-100 ml/L.
  • the temperature of the neutralization solution is about 20-30° C.

Abstract

An electroplating method for magnesium and magnesium alloys, comprising: providing a magnesium or magnesium alloy substrate and pre-treating it to be cleaned; roughening the surface of the substrate; activating the surface of the substrate; chemically plating the substrate to form a nickel coating on its surface; and electroplating the substrate to form, in order, a first nickel coating, a copper coating, a second nickel coating, and a chromium coating on the chemically produced nickel coating.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to an electroplating method for magnesium and magnesium alloys.
  • 2. Description of Related Art
  • Magnesium and magnesium alloys are prone to corrosion such as galvanic corrosion and therefore, should be surface treated before being used. A typical surface treatment method now for magnesium and magnesium alloys is electroplating. After electroplating, the corrosion resistance and the metallic appearance of the magnesium and magnesium alloys may be greatly improved. However, there are some difficulties for electroplating the magnesium and magnesium alloys because they are highly chemically active. Additionally, during electroplating, magnesium and magnesium alloys tend to react with metal ions contained in electrolytes, which will affect the quality of the electroplating.
  • Therefore, there is room for improvement within the art.
    • BRIEF DESCRIPTION OF THE DRAWING
  • Many aspects of the electroplating method for magnesium and magnesium alloys can be better understood with reference to the following drawing. The emphasis of the drawing is placed upon clearly illustrating the principles of the electroplating method for magnesium and magnesium alloys.
  • The FIGURE is a flow chart of a present embodiment of an electroplating method for magnesium and magnesium alloys.
    •  DETAILED DESCRIPTION
  • Referring to the FIGURE, an electroplating method for magnesium and magnesium alloys may include the steps S10 to S70.
  • In step S10, a magnesium or a magnesium alloy substrate is provided. The substrate may be a housing of a mobile phone, a digital camera, a personal digital assistant, or a note-book computer. The substrate may also be a housing of a container.
  • In step S20, the substrate is pretreated. The pre-treating step may comprise degreasing and cleaning the substrate. The degreasing process may be carried out by dipping the substrate in a degreasing solution for about 5-15 minutes. The mass concentration of the degreasing solution is about 150-200 grams per liter (g/L). The temperature of the degreasing solution is about 75-90° C. After the degreasing process, the substrate is removed from the degreasing solution and bathed in water. Then, the substrate is dipped in a sodium hydroxide solution for about 4-10 minutes to be polished. The sodium hydroxide solution may further include wax-removing agent(s). The mass concentration of the sodium hydroxide is about 100-200 g/L, and the mass concentration of the wax-removing agent(s) in the solution is about 40-80 g/L. The temperature of the sodium hydroxide solution is about 75-90° C. After the cleaning process, the substrate is again bathed in water.
  • In step S30, the surface of the substrate is roughened by dipping the substrate in a roughening solution containing roughening agent(s) and sodium carbonate for about 10-30 minutes. The temperature of the roughening solution is about 55-65° C. The mass concentration of the sodium carbonate in the roughening solution is about 50-100 g/L. The roughening agent(s) may be pyrophosphate, the mass concentration of the pyrophosphate in the roughening solution is about 350-450 g/L. During the roughening process, the magnesium or magnesium alloy on the surface of the substrate will chemically react with the compounds in the roughening solution thereby becoming roughened. The roughened surface of the substrate enhances the adhesion of metal plating to the substrate in a subsequent process.
  • In step 40, the surface of the substrate is activated. The activating process is carried out by dipping the substrate in an activating solution containing hydrofluoric acid for about 1-5 minutes. The temperature of the activating solution is about 30-40° C. Concentration by volume of the hydrofluoric acid in the activating solution is about 150-300 ml/L. The solution may further include activating agent(s). During the activating process, a magnesium fluoride film is formed on the surface of the substrate.
  • In step S50, the substrate is chemically plated to form a nickel coating on it's surface. The chemical plating process is carried out by immersing the substrate in a solution containing sodium hypophosphite and basic nickel carbonate for about 20-60 minutes. The mass concentration of the sodium hypophosphite in the solution is about 10-30 g/L, and the mass concentration of the basic nickel carbonate in the solution is about 20-50 g/L. The temperature of the solution is about 70-90° C. During the chemical plating, the magnesium fluoride film is dissolved, and then nickel iron in the solution is deoxidized to nickel and deposited on the substrate to form the nickel coating.
  • In step 60, the substrate is repeatedly electroplated to form one or more metal coatings on the chemically produced nickel coating. The electroplated coating may comprise a first nickel coating, a copper coating, a second nickel coating, and a chromium coating. The electroplating process may comprise: electroplating the substrate to form a first nickel coating on the chemically produced nickel coating; electroplating the substrate to form a copper coating on the first nickel coating; electroplating the substrate to form a second nickel coating on the copper coating; and electroplating the substrate to form a chromium coating on the second nickel coating. The electroplated coating presents good appearance and enhances the corrosion resistance of the substrate.
  • Electroplating the substrate to form the first nickel coating may be carried out in a first electrolyte, with the metallized surface of the substrate being a cathode, and a nickel anode being provided and immersed in the first electrolyte. The first electrolyte may contain a nickel sulphate component in a mass concentration of about 240-300 g/L, a nickel chloride component in a mass concentration of about 30-50 g/L, and a boric acid component in a mass concentration of about 30-50 g/L. The temperature of the first electrolyte is about 50-55° C. The electric current density through the first electrolyte is about 1-4 A/dm2. Electroplating the substrate with the first nickel coating may last for about 4-10 minutes. The first nickel coating enhances the corrosion resistance of the substrate.
  • Electroplating the substrate to form the copper coating may be carried out in a second electrolyte, with the metallized surface of the substrate being a cathode, and a copper anode being provided and immersed in the second electrolyte. The second electrolyte may contain a copper sulphate component in a mass concentration of about 180-220 g/L, and a sulfuric acid component in a mass concentration of about 40-80 g/L. The temperature of the electrolyte is about 20-25° C. The electric current density through the second electrolyte is about 1-3 A/dm2. Electroplating the substrate with the copper coating may last for about 5-30 minutes. Because the copper coating possesses good malleability and low porosity, the bonding of the copper coating and the first nickel coating is enhanced.
  • Electroplating the substrate to form the second nickel coating may be the same to the electroplating of forming the first nickel coating. The second nickel coating further enhances the corrosion resistance of the substrate. Because of the copper coating's good malleability and low porosity, the bonding of the second nickel coating with the copper coating is enhanced.
  • Electroplating the substrate to form the chromium coating may be carried out in a third electrolyte, with the metallized surface of the substrate being a cathode, and a chromium anode being provided and immersed in the third electrolyte. The third electrolyte may contain a chromium sulphate component in a mass concentration of about 240-300 g/L, and a boric acid component in a mass concentration of about 70-90 g/L. The temperature of the third electrolyte is about 30-50° C. The electric current density through the third electrolyte is about 1-15 A/dm2. Electroplating the substrate with the chromium coating may last for about 1-15 minutes. The chromium coating prepared by electroplating in such an electrolyte and under such an electric current density of the electrolyte has the property to bond well with the second nickel coating, as described above. The chromium coating presents high gloss appearance.
  • After being electroplated, the substrate is bathed in water.
  • In step S70, the substrate is subjected to neutralization treatment. The neutralization treatment is carried out by dipping the substrate in a neutralization solution for about 1-3 minutes to remove any residual electrolyte adhering to the substrate. The neutralization solution includes a sulfuric acid component in a concentration by volume of about 20-50 ml/L, and an oxydol component in a concentration by volume of about 50-100 ml/L. The temperature of the neutralization solution is about 20-30° C. After receiving neutralization treatment, the substrate is bathed in water to be cleaned.
  • The addition of chemically plating the substrate before electroplating prevents the problems that can occur from reaction between magnesium and its alloys with ions in the electrolyte used in electroplating. Thus producing better protected parts of magnesium and magnesium alloys.
  • It is believed that the present embodiment and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its advantages, the examples hereinbefore described merely being preferred or exemplary embodiment of the disclosure.

Claims (10)

1. An electroplating method for magnesium and magnesium alloys, comprising:
providing a magnesium or magnesium alloy substrate and pre-treating it to be cleaned;
roughening the surface of the substrate;
activating the surface of the substrate;
chemically plating the substrate to form a nickel coating on its surface; and
electroplating the substrate to form, in order, a first nickel coating, a copper coating, a second nickel coating, and a chromium coating on the chemically produced nickel coating.
2. The electroplating method as claimed in claim 1, wherein roughening the surface of the substrate is carried out by dipping the substrate in a roughening solution containing pyrophosphate in a mass concentration of about 350-450 g/L and sodium carbonate in a mass concentration of about 50-100 g/L for about 10-30 minutes at about 55-65° C.
3. The electroplating method as claimed in claim 1, wherein activating the surface of the substrate is carried out by dipping the substrate in an activating solution containing hydrofluoric acid in a concentration by volume of about 150-300 ml/L for about 1-5 minutes at about 30-40° C.
4. The electroplating method as claimed in claim 1, wherein chemically plating the substrate is carried out by immersing the substrate in a solution containing sodium hypophosphite in a mass concentration of about 10-30 g/L and basic nickel carbonate in a mass concentration of about 20-50 g/L for about 20-60 minutes at about 70-90° C.
5. The electroplating method as claimed in claim 1, wherein electroplating the substrate to form the first nickel coating is carried out in a first electrolyte containing a nickel sulphate component in a mass concentration of about 240-300 g/L, a nickel chloride component in a mass concentration of about 30-50 g/L, and a boric acid component in a mass concentration of about 30-50 g/L at about 50-55° C.; the electric current density through the first electrolyte is about 1-4 A/dm2; and the electroplating lasts for about 4-10 minutes.
6. The electroplating method as claimed in claim 1, wherein electroplating the substrate to form the copper coating is carried out in a second electrolyte containing a copper sulphate component in a mass concentration of about 180-220 g/L, and a sulfuric acid component in a mass concentration of about 40-80 g/L at about 20-25° C.; the electric current density through the second electrolyte is about 1-3 A/dm2; and the electroplating lasts for about 5-30 minutes.
7. The electroplating method as claimed in claim 5, wherein electroplating the substrate to form the second nickel coating is carried out in substantially the same way as was the forming the first nickel coating.
8. The electroplating method as claimed in claim 1, wherein electroplating the substrate to form the chromium coating is carried out in a third electrolyte containing a chromium sulphate component in a mass concentration of about 240-300 g/L, and a boric acid component in a mass concentration of about 70-90 g/L at about 30-50° C.; the electric current density through the third electrolyte is about 1-15 A/dm2; and the electroplating lasts for about 1-15 minutes.
9. The electroplating method as claimed in claim 8, wherein the substrate is subjected to neutralization treatment after the electroplating process in a neutralization solution including a sulfuric acid component in a concentration by volume of about 20-50 ml/L, and an oxydol component in a concentration by volume of about 50-100 ml/L for about 1-3 minutes at about 20-30° C.
10. The electroplating method as claimed in claim 1, wherein pre-treating the substrate includes degreasing and cleaning the substrate.
US12/498,455 2008-07-30 2009-07-07 Electroplating method for magnesium and magnesium alloy Abandoned US20100025255A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200810303204A CN101638790A (en) 2008-07-30 2008-07-30 Plating method of magnesium and magnesium alloy
CN200810303204.7 2008-07-30

Publications (1)

Publication Number Publication Date
US20100025255A1 true US20100025255A1 (en) 2010-02-04

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US11167343B2 (en) 2014-02-21 2021-11-09 Terves, Llc Galvanically-active in situ formed particles for controlled rate dissolving tools
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US9057242B2 (en) 2011-08-05 2015-06-16 Baker Hughes Incorporated Method of controlling corrosion rate in downhole article, and downhole article having controlled corrosion rate
US9033055B2 (en) 2011-08-17 2015-05-19 Baker Hughes Incorporated Selectively degradable passage restriction and method
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US10737321B2 (en) 2011-08-30 2020-08-11 Baker Hughes, A Ge Company, Llc Magnesium alloy powder metal compact
US9925589B2 (en) 2011-08-30 2018-03-27 Baker Hughes, A Ge Company, Llc Aluminum alloy powder metal compact
US9109269B2 (en) 2011-08-30 2015-08-18 Baker Hughes Incorporated Magnesium alloy powder metal compact
US9090956B2 (en) 2011-08-30 2015-07-28 Baker Hughes Incorporated Aluminum alloy powder metal compact
US11090719B2 (en) 2011-08-30 2021-08-17 Baker Hughes, A Ge Company, Llc Aluminum alloy powder metal compact
US9802250B2 (en) 2011-08-30 2017-10-31 Baker Hughes Magnesium alloy powder metal compact
US9643144B2 (en) 2011-09-02 2017-05-09 Baker Hughes Incorporated Method to generate and disperse nanostructures in a composite material
US9187990B2 (en) 2011-09-03 2015-11-17 Baker Hughes Incorporated Method of using a degradable shaped charge and perforating gun system
US9133695B2 (en) 2011-09-03 2015-09-15 Baker Hughes Incorporated Degradable shaped charge and perforating gun system
US9347119B2 (en) 2011-09-03 2016-05-24 Baker Hughes Incorporated Degradable high shock impedance material
US20130075271A1 (en) * 2011-09-22 2013-03-28 Sikorsky Aircraft Corporation Protection of magnesium alloys by aluminum plating from ionic liquids
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US9284812B2 (en) 2011-11-21 2016-03-15 Baker Hughes Incorporated System for increasing swelling efficiency
US9926766B2 (en) 2012-01-25 2018-03-27 Baker Hughes, A Ge Company, Llc Seat for a tubular treating system
US9068428B2 (en) 2012-02-13 2015-06-30 Baker Hughes Incorporated Selectively corrodible downhole article and method of use
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US9605508B2 (en) 2012-05-08 2017-03-28 Baker Hughes Incorporated Disintegrable and conformable metallic seal, and method of making the same
US9816339B2 (en) 2013-09-03 2017-11-14 Baker Hughes, A Ge Company, Llc Plug reception assembly and method of reducing restriction in a borehole
US10443142B2 (en) 2014-01-15 2019-10-15 Savroc Ltd Method for producing chromium-containing multilayer coating and a coated object
US10443143B2 (en) 2014-01-15 2019-10-15 Savroc Ltd Method for producing a chromium coating and a coated object
WO2015107255A1 (en) 2014-01-15 2015-07-23 Savroc Ltd Method for producing chromium-containing multilayer coating and a coated object
US11167343B2 (en) 2014-02-21 2021-11-09 Terves, Llc Galvanically-active in situ formed particles for controlled rate dissolving tools
US11365164B2 (en) 2014-02-21 2022-06-21 Terves, Llc Fluid activated disintegrating metal system
US11613952B2 (en) 2014-02-21 2023-03-28 Terves, Llc Fluid activated disintegrating metal system
US10597951B2 (en) 2014-07-02 2020-03-24 Superior Shot Peening, Inc Multi-layer coating and related methods of application
WO2016004393A1 (en) * 2014-07-02 2016-01-07 Superior Shot Peening, Inc. Multi-layer coating and related methods of application
US10006258B2 (en) 2014-07-02 2018-06-26 Superior Shot Peening, Inc. Multi-layer coating and related methods of application
US10487412B2 (en) 2014-07-11 2019-11-26 Savroc Ltd Chromium-containing coating, a method for its production and a coated object
US9910026B2 (en) 2015-01-21 2018-03-06 Baker Hughes, A Ge Company, Llc High temperature tracers for downhole detection of produced water
US10378303B2 (en) 2015-03-05 2019-08-13 Baker Hughes, A Ge Company, Llc Downhole tool and method of forming the same
US10777912B2 (en) 2015-06-08 2020-09-15 Te Connectivity Germany Gmbh Electrical contact element and method for altering mechanical and/or electrical properties of at least one area of such
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