US20080105922A1 - Method of Manufacturing a Semiconductor Device and Semiconductor Device Obtainable with Such a Method - Google Patents

Method of Manufacturing a Semiconductor Device and Semiconductor Device Obtainable with Such a Method Download PDF

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US20080105922A1
US20080105922A1 US11/960,382 US96038207A US2008105922A1 US 20080105922 A1 US20080105922 A1 US 20080105922A1 US 96038207 A US96038207 A US 96038207A US 2008105922 A1 US2008105922 A1 US 2008105922A1
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region
gate
semiconductor body
channel region
conductivity type
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Bartlomiej Pawlak
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Interuniversitair Microelektronica Centrum vzw IMEC
NXP BV
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Interuniversitair Microelektronica Centrum vzw IMEC
Koninklijke Philips Electronics NV
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823418—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
    • H01L21/823425—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures manufacturing common source or drain regions between a plurality of conductor-insulator-semiconductor structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823437—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823462—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
    • H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET

Definitions

  • the invention relates to a method of manufacturing a semiconductor device comprising a dual gate field effect transistor.
  • a method of manufacturing a semiconductor device comprising a dual gate field effect transistor is known from U.S. Pat. No. 6,580,137 B2 that has been issued on Jun. 17, 2003. Therein (see e.g. FIG. 12B and the description columns 7 to 14 ) a method is described in a dual gate transistor is provided in a trench. One of the gate regions is formed at the bottom part of the trench while the other gate region is formed in the upper part of the trench, the channel region being interposed between the two gate regions.
  • a drawback of the known method is that it is rather complicated and requires relatively many steps. Thus, there is still the need for a method for forming a dual gate transistor which can be easily incorporated in present and future CMOS technology.
  • the invention relates to a method of manufacturing a semiconductor device comprising a dual gate field effect transistor, in which method a semiconductor body with a surface and of silicon is provided with a source region and a drain region of a first conductivity type and with a channel region of a second conductivity type, opposite to the first conductivity type, between the source region and the drain region and with a first gate region separated from the channel region by a first gate dielectric and situated on one side of the channel region and with a second gate region separated from the channel region by a second gate dielectric and situated on an opposite side of the channel region and wherein both gate regions are formed within a trench formed in the semiconductor body.
  • FIGS. 1 through 5 are sectional views and FIGS. 6-8 are top views of a semiconductor device with a dual gate field effect transistor according to the invention at various stages in the manufacture of the device by means of a method in accordance with the invention.
  • the invention relates to a method of manufacturing a semiconductor device comprising a dual gate field effect transistor, in which method a semiconductor body with a surface and of silicon is provided with a source region and a drain region of a first conductivity type and with a channel region of a second conductivity type, opposite to the first conductivity type, between the source region and the drain region and with a first gate region separated from the channel region by a first gate dielectric and situated on one side of the channel region and with a second gate region separated from the channel region by a second gate dielectric and situated on an opposite side of the channel region and wherein both gate regions are formed within a trench formed in the semiconductor body.
  • the use of a double gate structure can generally be used to reduce leakage current when the transistor is off and increases drive current when the transistor is on. These aspects become increasingly important as demands on further miniaturization, lower power use and better high-frequency behavior in CMOS devices are still relevant.
  • the invention relates to a semiconductor device of the above construction.
  • a method of the type described in the opening paragraph is characterized in that the first gate region is formed within a first trench and the second gate region is formed within a second trench, the channel region is formed by the part of the semiconductor body between the first and second trench and the source and drain regions are formed at the surface of the semiconductor body.
  • Such a method is relatively simple and is very well compatible with present and most likely with future CMOS technology.
  • the dual gate transistor formed is on the one hand vertical since the channel in the channel region is formed in a plane perpendicular to the surface of the semiconductor body and on the other hand horizontal since the source and drain regions are formed at the surface of the semiconductor body in a conventional manner.
  • the dual gates that are present in two adjacent trenches offer a more efficient control over the channel.
  • two parallel trenches are formed in the surface of the semiconductor body of which the walls are provided with a dielectric layer and which are filled with a conductive material by depositing a conductive layer on the semiconductor body of which the parts on top of the surface of the semiconductor body are removed by chemical mechanical polishing.
  • the conductive material is preferable a metal.
  • the conductive material can be formed in two stages. E.g. by depositing a silicon layer and by depositing a metal layer, for example a nickel layer, on top of the silicon layer followed by a low temperature anneal, e.g. a few minutes at 300 degrees Celsius, in which a nickel silicide is formed offering a high conduction.
  • the source and drain regions are formed by depositing a strip-shaped mask layer on the surface of the semiconductor body which bridges the two regions were the trenches are formed or to be formed after which dopants of the first conductivity type are introduced into the semiconductor body on both sides of the strip-shaped mask layer.
  • the source and drain regions are formed after the trenches are formed and filled with the conductive material/metal. Ion implantation is a very suitable technique to form source and drain regions in a method according to the invention.
  • the channel and source and drain can be formed before the trenches are created.
  • two dual gate transistors are formed in the semiconductor body and next to each other by forming three trenches in the semiconductor body of which the middle one forms a common gate for both two dual gate transistors.
  • an inverter is formed in a simple manner which is also very compact.
  • one of the two dual gate transistors is formed as an npn transistor while the other one is formed as a pnp transistor.
  • the latter is easily obtainable in a method according to the invention as both the source and drain regions are formed at the surface of the semiconductor body.
  • the channel region of one of the two transistors may be provided with another—is opposite—conductivity type by a local implantation at the surface of the semiconductor body.
  • the source and drain regions of the dual gate transistor(s) are separated from the semiconductor body on a side opposite to the channel region(s) by further trenches.
  • the invention further relates to a semiconductor device comprising a dual gate field effect transistor, having a semiconductor body with a surface and of silicon and with a source region and a drain region of a first conductivity type and with a channel region of a second conductivity type, opposite to the first conductivity type, between the source region and the drain region and with a first gate region separated from the channel region by a first gate dielectric and situated on one side of the channel region and with a second gate region separated from the channel region by a second gate dielectric and situated on an opposite side of the channel region, and wherein both gate regions are formed within a trench formed in the semiconductor body.
  • such a device is characterized in that the first gate region is formed within a first trench and the second gate region is formed within a second trench, the channel region is formed by the part of the semiconductor body between the first and second trench and the source and drain regions are formed at the surface of the semiconductor body.
  • Such a device is very suitable for use in future CMOS ICs and may easily be obtained using a method according to the invention.
  • a device comprises two neighboring dual gate transistors having one gate in common.
  • FIGS. 1 through 8 are sectional ( FIGS. 1-5 ) or top ( FIGS. 6-8 ) views of a semiconductor device with a dual gate field effect transistor according to the invention at various stages in the manufacture of the device by means of a method in accordance with the invention.
  • FIGS. 1 through 8 are sectional ( FIGS. 1-5 ) or top ( FIGS. 6-8 ) views of a semiconductor device with a dual gate field effect transistor according to the invention at various stages in the manufacture of the device by means of a method in accordance with the invention.
  • the method for forming the device 10 starts (see FIG. 1 ) in this example with a substrate 11 which in this case, but not necessarily, comprises silicon and thus also forms part of the semiconductor body 1 of silicon and which in this example is of the p-type conductivity. It is to be noted here that the substrate 11 also can have the opposite conductivity type. Moreover, the region 11 may also be e.g.
  • the substrate/region 11 comprises the channel region 4 of the transistor to be formed in the form of an opposite conductivity type layer 12 , here of the n-type.
  • This layer may be formed by implantation, diffusion or epitaxy.
  • LOCOS Local Oxidation of Silicon
  • a mask 13 is deposited on the semiconductor body 1 which is formed by photolithography if desired after deposition of a dielectric material which then comprises a photoresist or a dielectric respectively.
  • the mask 13 is used to form in this example three trenches 7 A, 7 B, 7 C by means of anisotropic (plasma) etching.
  • the regions 4 , 4 ′ of the semiconductor body 1 between each pair of neighboring trenches 7 will form the channel regions of two dual gate transistors T 1 ,T 2 to be formed.
  • the depth of the trenches 7 is such that the pn-junction between regions 11 , 12 is crossed.
  • an dielectric layer 60 is deposited on the semiconductor body 1 , e.g. comprising silicondioxide.
  • a conducting layer 80 in this case a metal layer 80 which comprises in this example wolfram, is deposited on the semiconductor body 1 .
  • the thickness of layer 80 is chosen such that the trenches 7 are completely filled.
  • the layer 80 may be formed by CVD or by physical techniques like evaporation or sputtering.
  • the semiconductor body 1 is planarized by chemical-mechanical polishing such that the regions of the metal layer 80 outside the trenches 7 are removed.
  • the remaining parts of this layer 80 form the material 8 of four gate regions ( 5 A, 5 B),( 5 A′, 5 B′) of the two transistors T 1 ,T 2 to be formed, wherein the gate regions 5 B and 5 A′ form a common gate region for both transistors.
  • a mask 9 e.g. of silicondioxide or siliconnitride, is formed on top of the semiconductor body 1 .
  • the mask 9 is strip-shaped, has a small width and bridges the two channel regions 4 , 4 ′ of the two transistors to be formed.
  • dopant of a conductivity type opposite to that of the channel regions 4 , 4 ′ in this case p-type impurities like Boron, are introduced in the semiconductor body 1 , here by means of ion implantation.
  • source and drain regions 2 , 3 , 2 ′, 3 ′ of the two transistors are formed.
  • the mask 9 is removed again.
  • an additional implantation is used to create the channel region of one of the two transistors.
  • source and drain formation is done in separate steps during which one of the two transistors is masked
  • a further trench 17 is formed around the two transistors T 1 ,T 2 . This is done in a similar way as for the trenches 7 .
  • the further trench 17 may be partly or completely filled with an electrically insulating material, e.g. in the same way as described before for the trenches 7 .
  • n-MOSFET is completed by deposition of a pre-metal dielectric, e.g. of silicondioxide, followed by patterning thereof, deposition of a contact metal layer, e.g. of aluminum, again followed by patterning by which contact regions are formed.
  • a pre-metal dielectric e.g. of silicondioxide
  • a contact metal layer e.g. of aluminum
  • a (self-aligned) silicide process may further be used to contact the source- and drain regions 2 , 3 and the gate region 5 in case the latter comprises e.g. polysilicon as the conducting material 8 .

Abstract

A method of manufacturing a semiconductor device comprising a dual gate field effect transistor is disclosed, in which method a semiconductor body with a surface and of silicon is provided with a source region and a drain region of a first conductivity type and with a channel region of a second conductivity type, opposite to the first conductivity type, between the source region and the drain region and with a first gate region separated from the channel region by a first gate dielectric and situated on one side of the channel region and with a second gate region separated from the channel region by a second gate dielectric and situated on an opposite side of the channel region, and wherein both gate regions are formed within a trench formed in the semiconductor body.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The invention relates to a method of manufacturing a semiconductor device comprising a dual gate field effect transistor.
  • 2. Description of the Related Technology
  • A method of manufacturing a semiconductor device comprising a dual gate field effect transistor is known from U.S. Pat. No. 6,580,137 B2 that has been issued on Jun. 17, 2003. Therein (see e.g. FIG. 12B and the description columns 7 to 14) a method is described in a dual gate transistor is provided in a trench. One of the gate regions is formed at the bottom part of the trench while the other gate region is formed in the upper part of the trench, the channel region being interposed between the two gate regions.
  • A drawback of the known method is that it is rather complicated and requires relatively many steps. Thus, there is still the need for a method for forming a dual gate transistor which can be easily incorporated in present and future CMOS technology.
    • SUMMARY OF CERTAIN INVENTIVE EMBODIMENTS
  • The invention relates to a method of manufacturing a semiconductor device comprising a dual gate field effect transistor, in which method a semiconductor body with a surface and of silicon is provided with a source region and a drain region of a first conductivity type and with a channel region of a second conductivity type, opposite to the first conductivity type, between the source region and the drain region and with a first gate region separated from the channel region by a first gate dielectric and situated on one side of the channel region and with a second gate region separated from the channel region by a second gate dielectric and situated on an opposite side of the channel region and wherein both gate regions are formed within a trench formed in the semiconductor body.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIGS. 1 through 5 are sectional views and FIGS. 6-8 are top views of a semiconductor device with a dual gate field effect transistor according to the invention at various stages in the manufacture of the device by means of a method in accordance with the invention.
    • DETAILED DESCRIPTION OF CERTAIN INVENTIVE EMBODIMENTS
  • The invention relates to a method of manufacturing a semiconductor device comprising a dual gate field effect transistor, in which method a semiconductor body with a surface and of silicon is provided with a source region and a drain region of a first conductivity type and with a channel region of a second conductivity type, opposite to the first conductivity type, between the source region and the drain region and with a first gate region separated from the channel region by a first gate dielectric and situated on one side of the channel region and with a second gate region separated from the channel region by a second gate dielectric and situated on an opposite side of the channel region and wherein both gate regions are formed within a trench formed in the semiconductor body. The use of a double gate structure can generally be used to reduce leakage current when the transistor is off and increases drive current when the transistor is on. These aspects become increasingly important as demands on further miniaturization, lower power use and better high-frequency behavior in CMOS devices are still relevant. The invention relates to a semiconductor device of the above construction.
  • It is therefore an object of the present invention to avoid the above drawbacks and to provide a method for manufacturing a dual gate transistor which is relatively simple and is very well compatible with present and future CMOS technology.
  • To achieve this, a method of the type described in the opening paragraph is characterized in that the first gate region is formed within a first trench and the second gate region is formed within a second trench, the channel region is formed by the part of the semiconductor body between the first and second trench and the source and drain regions are formed at the surface of the semiconductor body. Such a method is relatively simple and is very well compatible with present and most likely with future CMOS technology. The dual gate transistor formed is on the one hand vertical since the channel in the channel region is formed in a plane perpendicular to the surface of the semiconductor body and on the other hand horizontal since the source and drain regions are formed at the surface of the semiconductor body in a conventional manner. The dual gates that are present in two adjacent trenches offer a more efficient control over the channel.
  • In a preferred embodiment of a method according to the invention two parallel trenches are formed in the surface of the semiconductor body of which the walls are provided with a dielectric layer and which are filled with a conductive material by depositing a conductive layer on the semiconductor body of which the parts on top of the surface of the semiconductor body are removed by chemical mechanical polishing. Such a method is very well compatible with standard CMOS technology. The conductive material is preferable a metal. Alternatively the conductive material can be formed in two stages. E.g. by depositing a silicon layer and by depositing a metal layer, for example a nickel layer, on top of the silicon layer followed by a low temperature anneal, e.g. a few minutes at 300 degrees Celsius, in which a nickel silicide is formed offering a high conduction.
  • In a further embodiment the source and drain regions are formed by depositing a strip-shaped mask layer on the surface of the semiconductor body which bridges the two regions were the trenches are formed or to be formed after which dopants of the first conductivity type are introduced into the semiconductor body on both sides of the strip-shaped mask layer. Preferably the source and drain regions are formed after the trenches are formed and filled with the conductive material/metal. Ion implantation is a very suitable technique to form source and drain regions in a method according to the invention. A low temperature so-called SPE (=Solid Phase Epitaxy) regrowth process may be used to allow for a low thermal budget. In a manufacturing process using high temperature activation of junctions, the channel and source and drain can be formed before the trenches are created.
  • In another preferred embodiment two dual gate transistors are formed in the semiconductor body and next to each other by forming three trenches in the semiconductor body of which the middle one forms a common gate for both two dual gate transistors. In this way, e.g. an inverter is formed in a simple manner which is also very compact. This requires that one of the two dual gate transistors is formed as an npn transistor while the other one is formed as a pnp transistor. The latter is easily obtainable in a method according to the invention as both the source and drain regions are formed at the surface of the semiconductor body. Also the channel region of one of the two transistors may be provided with another—is opposite—conductivity type by a local implantation at the surface of the semiconductor body.
  • Preferably the source and drain regions of the dual gate transistor(s) are separated from the semiconductor body on a side opposite to the channel region(s) by further trenches.
  • The invention further relates to a semiconductor device comprising a dual gate field effect transistor, having a semiconductor body with a surface and of silicon and with a source region and a drain region of a first conductivity type and with a channel region of a second conductivity type, opposite to the first conductivity type, between the source region and the drain region and with a first gate region separated from the channel region by a first gate dielectric and situated on one side of the channel region and with a second gate region separated from the channel region by a second gate dielectric and situated on an opposite side of the channel region, and wherein both gate regions are formed within a trench formed in the semiconductor body. According to the invention such a device is characterized in that the first gate region is formed within a first trench and the second gate region is formed within a second trench, the channel region is formed by the part of the semiconductor body between the first and second trench and the source and drain regions are formed at the surface of the semiconductor body.
  • Such a device is very suitable for use in future CMOS ICs and may easily be obtained using a method according to the invention. Preferably such a device comprises two neighboring dual gate transistors having one gate in common.
  • These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter, to be read in conjunction with the drawing, in which FIGS. 1 through 8 are sectional (FIGS. 1-5) or top (FIGS. 6-8) views of a semiconductor device with a dual gate field effect transistor according to the invention at various stages in the manufacture of the device by means of a method in accordance with the invention.
  • The figures are diagrammatic and not drawn to scale, the dimensions in the thickness direction being particularly exaggerated for greater clarity. Corresponding parts are generally given the same reference numerals and the same hatching in the various figures.
  • FIGS. 1 through 8 are sectional (FIGS. 1-5) or top (FIGS. 6-8) views of a semiconductor device with a dual gate field effect transistor according to the invention at various stages in the manufacture of the device by means of a method in accordance with the invention. The method for forming the device 10 starts (see FIG. 1) in this example with a substrate 11 which in this case, but not necessarily, comprises silicon and thus also forms part of the semiconductor body 1 of silicon and which in this example is of the p-type conductivity. It is to be noted here that the substrate 11 also can have the opposite conductivity type. Moreover, the region 11 may also be e.g. an n-well (or p-well for that matter) within a silicon substrate of the opposite conductivity type, e.g. p-type and n-type respectively. Furthermore, in this case the substrate/region 11 comprises the channel region 4 of the transistor to be formed in the form of an opposite conductivity type layer 12, here of the n-type. This layer may be formed by implantation, diffusion or epitaxy. The device 10 to be formed, which is in this case comprises a (dual gate) NMOST, contains in practice near its borders isolation regions 12 such as a so-called trench or LOCOS (=Local Oxidation of Silicon) isolation, the former being preferred in an advanced technology node. In practice the device 10 often will be an IC (=Integrated Circuit) and thus contains many transistors. In a CMOS device 10 transistors of both of the NMOS and PMOS type will be present.
  • At the surface of the semiconductor body 1 (see FIG. 2) a mask 13 is deposited on the semiconductor body 1 which is formed by photolithography if desired after deposition of a dielectric material which then comprises a photoresist or a dielectric respectively. The mask 13 is used to form in this example three trenches 7A,7B,7C by means of anisotropic (plasma) etching. The regions 4,4′ of the semiconductor body 1 between each pair of neighboring trenches 7 will form the channel regions of two dual gate transistors T1,T2 to be formed. The depth of the trenches 7 is such that the pn-junction between regions 11,12 is crossed.
  • After removal of the mask 13 (see FIG. 3) an dielectric layer 60 is deposited on the semiconductor body 1, e.g. comprising silicondioxide. Layer 60 may be formed by CVD (=Chemical Vapor Deposition) but also a thermal oxidation is suitable for that purpose.
  • Subsequently (see FIG. 4) a conducting layer 80, in this case a metal layer 80 which comprises in this example wolfram, is deposited on the semiconductor body 1. The thickness of layer 80 is chosen such that the trenches 7 are completely filled. The layer 80 may be formed by CVD or by physical techniques like evaporation or sputtering.
  • Next (see FIG. 5) the semiconductor body 1 is planarized by chemical-mechanical polishing such that the regions of the metal layer 80 outside the trenches 7 are removed. The remaining parts of this layer 80 form the material 8 of four gate regions (5A,5B),(5A′,5B′) of the two transistors T1,T2 to be formed, wherein the gate regions 5B and 5A′ form a common gate region for both transistors.
  • Thereafter (see FIG. 6 which shows a top view of the device 10) a mask 9, e.g. of silicondioxide or siliconnitride, is formed on top of the semiconductor body 1. The mask 9 is strip-shaped, has a small width and bridges the two channel regions 4,4′ of the two transistors to be formed.
  • Subsequently (see FIG. 7) dopant of a conductivity type opposite to that of the channel regions 4,4′, in this case p-type impurities like Boron, are introduced in the semiconductor body 1, here by means of ion implantation. In this way source and drain regions 2,3,2′,3′ of the two transistors are formed. After the implantation (and annealing thereof) the mask 9 is removed again. In a case where the two dual gate transistors T1,T2 are required to be of opposite structure, implying that one of the two is of the npn-type and the other of the pnp-type, an additional implantation is used to create the channel region of one of the two transistors. Also source and drain formation is done in separate steps during which one of the two transistors is masked
  • Next (see FIG. 8) in this example a further trench 17 is formed around the two transistors T1,T2. This is done in a similar way as for the trenches 7. The further trench 17 may be partly or completely filled with an electrically insulating material, e.g. in the same way as described before for the trenches 7.
  • Finally the manufacturing of the n-MOSFET is completed by deposition of a pre-metal dielectric, e.g. of silicondioxide, followed by patterning thereof, deposition of a contact metal layer, e.g. of aluminum, again followed by patterning by which contact regions are formed. These steps are not shown in the drawing. A (self-aligned) silicide process may further be used to contact the source- and drain regions 2,3 and the gate region 5 in case the latter comprises e.g. polysilicon as the conducting material 8.
  • While the above detailed description has shown, described, and pointed out novel features of the invention as applied to various embodiments, it will be understood that various omissions, substitutions, and changes in the form and details of the device or process illustrated may be made by those skilled in the art without departing from the spirit of the invention. The scope of the invention is indicated by the appended claims rather than by the foregoing description. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims (3)

1-9. (canceled)
10. A semiconductor device comprising a dual gate field effect transistor, wherein the dual gate field effect transistor comprises:
a semiconductor body with a surface and comprising silicon;
a source region and a drain region of a first conductivity type;
a channel region of a second conductivity type, opposite to the first conductivity type, between the source region and the drain region;
a first gate region separated from the channel region by a first gate dielectric and situated on one side of the channel region, wherein the first gate region is formed within a first trench;
a second gate region separated from the channel region by a second gate dielectric and situated on an opposite side of the channel region, wherein the second gate region is formed within a second trench, wherein both gate regions are formed within a trench formed in the semiconductor body, and wherein the channel region is formed by the part of the semiconductor body between the first and second trench and the source and drain regions are formed at the surface of the semiconductor body.
11. The semiconductor device as claimed in claim 10, further comprising a second neighboring dual gate transistor with one gate region in common to both transistors.
US11/960,382 2004-03-12 2007-12-19 Method of Manufacturing a Semiconductor Device and Semiconductor Device Obtainable with Such a Method Abandoned US20080105922A1 (en)

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US10593592B2 (en) * 2015-01-09 2020-03-17 Applied Materials, Inc. Laminate and core shell formation of silicide nanowire
US11110065B2 (en) 2018-03-06 2021-09-07 Profeat Biotechnology Co., Ltd. Sintered ferrous amino acid particles and use of the same against a virus
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