US20070169333A1 - Microstructured arrays for cortex interaction and related methods of manufacture and use - Google Patents
Microstructured arrays for cortex interaction and related methods of manufacture and use Download PDFInfo
- Publication number
- US20070169333A1 US20070169333A1 US11/723,999 US72399907A US2007169333A1 US 20070169333 A1 US20070169333 A1 US 20070169333A1 US 72399907 A US72399907 A US 72399907A US 2007169333 A1 US2007169333 A1 US 2007169333A1
- Authority
- US
- United States
- Prior art keywords
- electrodes
- array
- electrode
- wiring
- nonconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
- A61B5/6847—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive mounted on an invasive device
- A61B5/685—Microneedles
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/07—Endoradiosondes
- A61B5/076—Permanent implantations
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
- A61B2562/125—Manufacturing methods specially adapted for producing sensors for in-vivo measurements characterised by the manufacture of electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
Definitions
- microdrive mechanisms allow one to vertically position the electrodes in the brain tissue.
- a user can actively search for neurons of interest and accurately position the electrode tip near the soma of the neuron to improve the signal-to-noise ratio.
- These systems have their disadvantages.
- First, even individual microdrive systems are bulky and cannot be fully implanted in a human.
- Second, microdrive systems typically cannot use more than a few dozen electrodes due to space limitations and the time it takes to independently position each electrode near a neuron.
- Fixed electrode array systems overcome some of these problems, but have their own problems as well. Once placed in the brain, fixed electrode arrays can not be repositioned, so they rely on chance proximity to neurons. The most basic fixed electrode arrays record neural activity using multiple micro-wires or hatpin-like electrodes individually inserted into the brain. Because it can take a relatively significant amount of time to insert each electrode, however, these systems have not been widely used. More recently, wire bundles have been developed which are inserted into the cortex as a unit, but they lack features of ideal recording electrodes, such as tip shape, overall size, and impedance. In particular, the common square tip of such microwires can damage the cortex and can have difficulty penetrating the tough cerebral membranes, as well as brain tissue.
- a major disadvantage of these fixed array systems is that they do not offer the ability to actively hunt for neurons since the electrode tips cannot be easily placed near the soma of the neurons. To help overcome this, large numbers of electrodes are inserted to increase the chance that the electrodes are positioned in close proximity to neurons.
- the input impedances of the electrodes may also be lowered to enhance their ability to record distant signals. Lowering the input impedance, however, also lowers the signal-to-noise ratio.
- a fixed microelectrode array system may have numerous electrodes providing a high signal-to-noise ratio. Further, there is a need for a fixed array system that has a flexible design and that does not rely upon percutaneous cabling systems to communicate with a data acquisition system.
- a method of manufacturing an electrode array system includes machining a work piece of an electrically conductive substance to create a plurality of electrodes extending from a base member. Each electrode has a corresponding base section. A nonconductive layer is provided around at least a portion of the base sections of the plurality of electrodes. The base member is removed from the plurality of electrodes, such that the plurality of electrodes are supported by the nonconductive layer.
- the array includes a flexible nonconductive support layer and an array of electrodes.
- Each electrode has a base section and a tip section, where the base section of each electrode is inserted into the nonconductive layer, such that the electrodes are held together by the nonconductive layer.
- An electrical connection located on the base section of each electrode communicates with the respective electrode.
- a brain implant system comprises an electrode configured to be inserted in a brain and for sensing electrical signals generated by brain neurons.
- a flexible wiring circuit is connected to the electrode and adapted to receive the neuron electrical signals sensed by the electrode.
- a processing unit receives the neuron electrical signals from the flexible wiring circuit.
- the processing unit further includes a detection module for detecting the occurrence of a neuron spike in the received neuron electrical signals.
- the processing unit also includes a transmitter for transmitting data reflecting the occurrence of each detected neuron spike.
- a method for operating a brain implant system comprises: providing an electrode configured to be inserted in a brain and for sensing electrical signals generated by brain neurons; receiving the neuron electrical signals sensed by the electrode over a flexible wiring; receiving the neuron electrical signals from the flexible wiring and detecting the occurrence of a neuron spike in the received neuron electrical signals; and transmitting data reflecting the occurrence of each detected neuron spike.
- FIG. 1 is a diagram illustrating an exemplary brain implant system consistent with an embodiment of the present invention
- FIG. 2A is a block diagram of a neuron signal processing system consistent with an embodiment of the present invention.
- FIG. 2B is a block diagram of a power supply system consistent with an embodiment of the present invention.
- FIGS. 3A to 3 D illustrate exemplary process for making an electrode array consistent with an embodiment of the present invention
- FIGS. 4A to 4 G illustrate an alternative, exemplary process for making an electrode array consistent with an embodiment of the present invention
- FIGS. 5A and 5B illustrate an exemplary wiring, consistent with an embodiment of the present invention, for attachment to an electrode array
- FIG. 6 illustrates an exemplary method, consistent with an embodiment of the present invention, for connecting an electrode to a wiring.
- FIG. 1 generally illustrates a brain implant system consistent with an embodiment of the present invention.
- the system includes an electrode array 110 inserted into a patient's cerebral cortex 120 through an opening in the skull 122 .
- Array 110 may include a plurality of electrodes 112 for detecting electrical brain signals or impulses. While FIG. 1 shows array 110 inserted into cerebral cortex 120 , array 110 may be placed in any location of a patient's brain allowing for array 110 to detect electrical brain signals or impulses.
- Each electrode 112 may be connected to a processing unit 114 via wiring 116 .
- Processing unit 114 may be secured to skull 122 by, for example, the use of an adhesive or screws, and may even be placed inside the skull if desired.
- a protective plate 130 may then be secured to skull 122 underneath the surface of the patient's skin 124 .
- plate 130 may be made of titanium and screwed to skull 120 using screws 132 .
- the invention may use any of a number of known protective plates, such as a biological material, and methods for attaching the same to a patient's skull.
- processing unit 114 and other surgically implanted components may be placed within a hermetically sealed housing to protect the components from biological materials.
- Electrode array 110 serves as the sensor for the brain implant system. While the various figures in this specification illustrate electrode array 110 as having sixty-four electrodes 112 arranged in an 8 ⁇ 8 matrix, array 110 may include one or more electrodes having a variety of sizes, lengths, shapes, forms, and arrangements. Each electrode 112 extends into brain 120 to detect the electrical neural signals generated from the neurons located in proximity to the electrode's placement within the brain. Neurons may generate such signals when, for example, the brain instructs a particular limb to move in a particular way. Electrode array 110 is described in more detail with respect to FIGS. 3A to 3 D and FIGS. 4A to 4 G.
- Electrodes 112 transfer the detected neural signals to processing unit 114 over wiring 116 .
- wiring 116 may pass out of the opening in skull 122 beneath protective plate 130 .
- Wiring 116 may then run underneath the patient's skin 124 to connect to processing unit 114 .
- Wiring 116 is described in more detail below with respect to FIGS. 5A and 5B .
- Processing unit 114 may preprocess the received neural signals (e.g., impedance matching, noise filtering, or amplifying), digitize them, and further process the neural signals to extract neural information that it may then transmit to an external computing device (not shown). For example, the external device may decode the received neural information into motor control signals for controlling a motorized prosthetic device or analyze the neural information for a variety of other purposes. Processing unit 114 is described in further detail with respect to FIG. 2A .
- FIG. 2A is a block diagram of a processing unit 114 consistent with an embodiment of the present invention.
- processing unit 114 may further include an analog-to-digital (A/D) interface 210 , a detection module 220 , a buffer 230 , a controller 240 , and a transceiver 250 .
- A/D analog-to-digital
- interface 210 , module 220 , and buffer 230 each may be implemented by a common field programmable gate array (FPGA), although other embodiments are possible.
- FPGA field programmable gate array
- alternative embodiments may include dedicated hardware or software components for implementing subcomponents 210 , 220 , or 230 , such as by using a microprocessor.
- A/D interface 210 may include a plurality of A/D converters, each of which may receive the analog output from a corresponding electrode 112 or group of electrodes 112 . Each A/D converter may amplify, digitize, and multiplex the signals received from the corresponding electrode(s) 112 .
- an amplification stage of A/D interface 210 may be implemented using a CMOS-based two-stage operational amplifier known to those skilled in the art, and selected to have a bandwidth of approximately 300-10 kHz and a gain of about 5000.
- processing units consistent with the present invention may also process other electrical neural signals, such as those in the 0-100 Hz range, for example.
- A/D interface 210 may include eight 12-bit, 37.5 kHz A/D converters, each of which receives the analog outputs from eight corresponding electrodes. In such a case, each A/D converter may multiplex the electrode channel signals received from a corresponding row or column of array 110 .
- A/D interface 210 may, however, multiplex other groupings of the electrode channels using any number of A/D converters. For instance, A/D interface 210 may include one A/D converter that receives the analog outputs from all of the electrode channels to multiplex those signals into one signal. Alternatively, A/D interface 210 may simply convert the electrode channels into digital signals without multiplexing. In either case, interface 210 may then provide the digital signals to detection module 220 .
- Detection module 220 detects when a neuron has fired.
- the signal from a single neuron essentially comprises a series of electrical spikes.
- the brain encodes information according to the frequency or firing rate of these spikes, which is typically between 0 to 300 Hz.
- the spike itself may last about 1.5 ms and may have a peak-to-peak voltage of about 100 ⁇ V.
- detection module 220 may detect the time a spike occurs since the neural information content is encoded in the timing between the spikes. Alternatively, module may detect the spike count over a predetermined time period or may detect instantaneous neural frequencies.
- module 220 may optimize the wireless communication bandwidth and minimize the storage requirements of the brain implant system.
- Buffer 230 may, however, also record information sufficient to determine the shape of the spike. The ability to determine the spike's shape may be needed in certain applications, such as when sorting which spikes come from which neurons.
- detection module 220 may detect whether the channel signal from A/D interface 210 meets a triggering event. Spike detection may be based on time, amplitude, or other aspects of the shape of the waveform. For example, module 220 may detect when the rising edge of a neural signal detected with a particular electrode 112 exceeds a predetermined threshold value in amplitude or time, or a combination of the two. Since the spike amplitude may vary among neurons, module 220 may vary the threshold value for each electrode 112 based on the particular neuron(s) being detected by that electrode. In an exemplary embodiment, detection module 220 may include a programmable 12-bit threshold for setting the threshold level(s).
- Buffer 230 may be implemented by using a pre-trigger and a post-trigger buffer memory.
- a small ring buffer may temporarily pre-store the digital data of a channel prior to a triggering event detected by detection module 220 .
- the pre-trigger buffer memory may thus store those samples corresponding to the spike's shape or other features (e.g., spike slope), prior to the triggering event.
- Buffer 230 may also include a separate pre-trigger buffer for each channel or electrode 112 , which may store the samples from each channel, according to an exemplary embodiment.
- Channel data obtained after the triggering event may then be stored directly in the post-trigger buffer memory to record the time each spike occurs and/or the spike shape.
- buffer 230 stores 1.65 ms of recorded data per spike.
- buffer 230 may then output the data of both the pre-trigger and post-trigger buffer memories to transceiver 250 . If buffer 230 outputs neural information faster than transceiver 250 may transmit that information, then buffer 230 may temporarily store the outputted data in a transmit buffer (not shown). Further, transceiver 250 may also transmit only the time of the triggered event of each detected neuron signal to increase the transmission rate.
- Controller 240 may act as an interface between transceiver 250 and A/D interface 210 , detection module 220 , and buffer 230 . Controller 240 may also perform certain other control functions, such as setting the trigger threshold level of module 220 or setting the size of pre-trigger or post-trigger buffers of buffer 230 . In addition, controller 240 may be used to select particular electrode channels for processing and outputting by transmitter 250 . Controller 240 may also manage the power resources of the electrode array system 100 . To each of these ends, controller 240 may include an I/O interface allowing a user to program controller 240 to perform the above or other control functions. A user may thus program controller 240 by transmitting control signals from an external control device (not shown) to transceiver 250 , which may then forward the control information to controller 240 .
- an external control device not shown
- Transceiver 250 provides a wireless communication link between processing unit 114 and an external device (not shown).
- transceiver 250 receives the pre-trigger and post-trigger data stored in buffer 230 for transmission to the external device for further processing and storage.
- Transceiver 250 may transmit the data using “Bluetooth” technology or according to any other type of wireless communication standard, including, for example, code division multiple access (CDMA), wireless application protocol (WAP), or infrared telemetry.
- CDMA code division multiple access
- WAP wireless application protocol
- Transceiver 250 may also receive control information using either of the above communication techniques.
- FIG. 2B is a block diagram of an exemplary power supply system consistent with an embodiment of the present invention. While the power supply system of FIG. 2B allows the implanted power supply to be recharged, other power supply systems may be used (such as a typical battery source) that need to be replaced when their power is exhausted.
- a power supply system consistent with the invention may include a power supply 260 , an amplifier 262 , an outside coil or inductor 264 , an inside coil or inductor 266 , a rectifier circuit 268 , a battery recharging circuit 270 , and a battery 272 .
- Components 260 , 262 , and 264 are located outside of the patient's body (i.e., outside skin 124 ) and components 266 , 268 , 270 , and 272 are located inside the patient's body.
- components 266 , 268 , 270 , and 272 may be advantageously chosen based on size, heat requirements, and biocompatibility.
- a preferred embodiment would implement components 266 , 268 , 270 , and 272 by using hardware having a small size, low heat dissipation, and a high biocompatibility with the natural tissue inside the patient.
- Power supply 260 may be any AC power supply, such as a standard 120 volt AC power source.
- Amplifier 262 receives an AC voltage signal from supply 260 , amplifies it, and applies the amplified AC voltage signal to inductor 264 .
- inductor 264 When inductor 264 is activated and placed in close proximity to inductor 266 , inductor 264 will induce a current in inductor 266 . The induced current then creates an AC voltage on the output terminals of inductor 266 , which is then applied to rectifier circuit 268 .
- Rectifier 268 then converts the induced AC voltage signal to a DC voltage signal in a manner known to those skilled in the art.
- FIG. 2B further shows an optional capacitor 269 for filtering the rectified voltage signal.
- capacitor 269 may further limit any AC voltage signal levels that may still be present on the rectified output signal and thereby present a cleaner DC voltage signal.
- Battery recharging circuit 270 then receives the DC voltage signal for charging battery 272 located inside the patient.
- battery 272 is a lithium-polymer 3.6 V battery.
- FIGS. 3A to 3 G illustrate exemplary manufacturing processing steps for preparing an electrode array consistent with an embodiment of the present invention.
- FIG. 3A shows a work piece or block of electrically conductive material 310 including a plurality of electrodes 112 .
- an exemplary embodiment includes using titanium as material 310
- a number of other conductive materials may be used, including, for example, stainless steel, steel, titanium nitride, a titanium-aluminum-vanadium alloy, tungsten carbide, copper, or doped silicon.
- Electrodes 112 may be formed from material 310 by applying a wire electrical discharge machining (wire EDM) technique known to those skilled in the art.
- wire EDM wire electrical discharge machining
- wire EDM may be used to precisely machine a raw block of electrically conductive material 310 to form electrodes 112 .
- Array 110 may be formed by performing a wire EDM cut through one plane, rotating array 110 ninety degrees, and then performing a second wire EDM cut through a second plane.
- Other known manufacturing methods may, however, be used to micro-machine conductive material 310 , such as by using a laser or a diamond saw.
- a chemical etching process may also be applied to further machine electrodes 112 .
- the machined array of FIG. 3A may be placed in an etching bath to further etch the electrode surfaces.
- material 310 is titanium, for example, a heated hydrochloric or hydrofluoric acid bath may be used to etch the electrode surfaces.
- electrodes 112 of finer widths may be obtained. This process also removes the oxide layer from the electrode surfaces and smoothes those surfaces, a desirable step before forming additional coatings on array 110 .
- FIG. 3A shows electrodes 112 as having a tapered shape at their tips.
- each electrode 112 may have a width of about 80 ⁇ m and taper to a point over the top 50 ⁇ m of its length.
- FIG. 3A also shows that a base section of electrodes 112 may have a platform portion 312 .
- Portions 312 may serve as a platform for securing a support layer, which is described below with respect to FIGS. 3B and 3C .
- electrodes 112 may include a stepped lower base portion (e.g., as shown in FIG. 3A-1 ) or a rounded lower base portion (e.g., as shown in FIG.
- electrodes 112 may have a variety of shapes, such as a continuous width shape (i.e., with no platform or stepped base section), a conical shape, a stepped-pyramidal shape, or a tapered shape different than that shown in FIG. 3A . Electrodes 112 may also have a variety of cross-sectional shapes, such as a rounded cross-section (which may be formed by a chemical etching process) or a rectangular, square, or hexagonal cross-section (which may be formed by the wire EDM technique). Moreover, as used herein, an electrode's “base section” refers broadly to the end portion of electrode 112 opposite the electrode's tip, without referring to the electrode's shape or width.
- Electrodes 112 of array 110 may also differ in length to sense particular neurons located at different depths in cortex 120 .
- electrodes 112 may increase in length from one side of array 110 to the other.
- Electrodes 112 may also vary in both length and width from other electrodes in array 110 , such that a given electrode 112 is either longer or shorter, or wider or narrower, than the electrode adjacent to it.
- array 110 may include shorter electrodes between 0.1 mm to 8 mm in length and/or longer electrodes between 0.3 mm to 50 mm in length.
- the spacing between electrodes may be less than 50 ⁇ m, while the spacing may be more than 400 ⁇ m when electrodes 112 record signals from different neurons.
- Electrode arrays 110 consistent with the invention may also arrange electrodes 112 in a number of ways.
- electrodes 112 may be arranged in a one-dimensional or two-dimensional matrix, according to a predefined pattern, or in a random order.
- One exemplary pattern in which electrodes 112 may be arranged is a honeycomb-like hexagonal pattern. As described above, however, any type of pattern or arrangement of electrodes 112 may be used to form array 110 .
- electrodes 112 may be coated with a separate conductive layer (not shown).
- the conductive layer may only be necessary if conductive material 310 is not biocompatible with the neural tissue and cerebro-spinal fluid or if the electrical characteristics require a coating (e.g., to avoid junction potentials at the electrode tips).
- An exemplary embodiment may include coating electrodes 112 with platinum by an electroplating process or other deposition method. The deposited layer may also improve the sensitivity of the electrode and may also prevent oxidation of the electrode.
- Electrode arrays 110 consistent with the present invention may also use other conductor materials besides platinum, such as gold or titanium nitride, formed by electroplating or other types of formation processes, such as vapor deposition or electron beam deposition. Further, the entire structure of FIG. 3A or just the tips of electrodes 112 may be coated with the conductive material.
- An insulating layer may also be applied to electrodes 112 . Except for the electrode tip used to record the neural signals, the insulating layer may cover the whole electrode. The insulating layer may be removed from the electrode tips (e.g., by laser ablation, plasma etching, or chemical etching), or may be prevented from being formed on the tips (e.g., by a masking procedure). In this, way, conduction is allowed only through the tips and single neurons can be better isolated from one another. In the exemplary embodiment, all but the top 50 ⁇ m of each electrode 112 are insulated with Paralene by a vapor deposition process. Other insulating materials, such as glass, silicon nitride, polyimide, an epoxy, or other plastics or ceramics, may be used instead.
- a support layer 320 may then be placed over electrodes 112 to electrically isolate electrodes 112 and to support electrodes 112 during the cutting process described below with respect to FIG. 3C .
- Layer 320 may have a number of corresponding openings for receipt of electrodes 112 .
- Support layer 320 may slide down over electrodes 112 until, for example, it reaches the bottom platform sections 312 of each electrode 112 .
- Each hole or opening in layer 320 may have a diameter sized to securely receive each electrode 112 , while compensating for any positional tolerances from a drilling or laser process when forming the holes.
- support layer 320 is a flexible material, such as polyimide, parylene, or silicone.
- Layer 320 may also be formed using materials having a flexibility that changes over time or under some other condition (e.g., having a flexibility that changes in response to the brain's heat).
- An optional step may include applying an epoxy coating (not shown) to electrodes 112 and support layer 320 .
- the epoxy coating may, however, be applied after electrodes 112 are cut as described below with respect to FIG. 3C .
- the bases of electrodes 112 may be cut using a wire EDM technique to separate electrodes 112 from block 310 .
- FIG. 3C illustrates array 110 after electrodes 112 have been cut or separated from block 310 .
- wiring 116 may then be placed over the cut ends of electrodes 112 , as shown in FIG. 3D , to connect electrodes to processing unit 114 .
- wiring 116 may have a number of corresponding openings for receipt of electrodes 112 . While FIG. 3 shows these openings as passing entirely through wiring 116 , the openings may alternatively be formed as depressions in wiring 116 , such that electrodes 112 may fit within the opening or depression, but not pass entirely through wiring 116 . In either case, each hole or opening may have a diameter sized to securely receive each electrode 112 , while compensating for any positional tolerances from a drilling or laser process when forming the holes.
- Wiring 116 may then slide over electrodes 112 until, for example, it reaches the platform sections 312 of each electrode 112 . Wiring 116 may then be electrically connected to electrodes 112 . Further, the cut array assembly may be placed in a holder (not shown) to hold electrodes 112 in place when aligning and lowering wiring 116 over electrodes 112 .
- wiring 116 may also be formed of a flexible material, such as polyimide, parylene, or silicone. Wiring 116 is described in more detail below with respect to FIGS. 5A and 5B .
- FIGS. 4A to 4 G illustrate alternative, exemplary manufacturing processing steps, consistent with an embodiment of the present invention, for making an electrode array.
- FIG. 4A shows a block of electrically conductive material 310 including a plurality of electrodes 112 .
- the electrodes of FIG. 4A may be formed using the processes described above with respect to FIG. 3A .
- electrodes 112 have a stepped-pyramidal shape similar to that shown in FIG. 3A-1 , in which the electrodes 112 have stepped decreases in width from bottom to top.
- each electrode 112 may have a tapered tip portion 412 and stepped base sections 414 , 416 , and 418 of increasing widths.
- electrodes 112 may have a variety of shapes, including continuous width shapes and stepped-pyramidal shapes having more or less than the three different width sections shown in FIG. 4A .
- an electrode's “base section” refers broadly to the end portion of electrode 112 opposite the electrode's tip, without referring to the electrode's shape or width.
- wiring 116 may then be placed over electrodes 112 .
- wiring 116 may have a number of corresponding openings 420 for receipt of electrodes 112 .
- Wiring 116 may slide down over electrodes 112 until, for example, it reaches the bottom base section 418 of each electrode 112 .
- FIG. 4C illustrates wiring 116 in its lowered position.
- FIG. 4D shows an optional step of applying an epoxy coating 430 to electrodes 112 and wiring 116 .
- Epoxy coating 430 may, however, be applied after electrodes 112 are cut as described below with respect to FIG. 4F .
- FIG. 4E shows the epoxy coating 430 lowered until it rests on top of wiring 116 . While FIGS. 4D and 4E show epoxy coating 430 as having a sheet-like form, epoxy 430 may take a variety of forms, such as a more fluid-like form for coating array 110 .
- electrodes 112 may be cut along dashed line 440 shown in FIG. 4F by using a wire EDM technique. After cutting electrodes 112 , their cut ends form square connector pads 442 which may then be soldered or otherwise electrically connected to the electrical contacts of wiring 116 .
- FIG. 4G shows electrode array 110 after electrodes 112 have been cut.
- array 110 may have an improved degree of flexibility over conventional fixed electrode arrays. This improved flexibility may be created by supporting the electrodes 112 removed from base 310 with either-support layer 320 or flexible wiring 116 . In particular, electrodes 112 are essentially supported and held together by their being inserted into the openings of support layer 320 or flexible wiring 116 . Because layer 320 and wiring 116 can each be made flexible, array 110 can also then be flexible. This flexibility is an important feature of the present invention since it allows array 110 to better conform to the contours of the patient's brain and to be more compliant near blood vessels. However, systems and methods consistent with the invention may use electrode arrays 110 with limited flexibility.
- electrode arrays 110 consistent with the present invention may be manufactured by methods other than those discussed above with respect to FIGS. 3A-3D and FIGS. 4A-4G .
- the base section of each individual electrode may be attached directly to a surface of wiring 116 .
- wiring 116 would not need any through-hole (e.g., opening 420 ) for receiving electrodes 112 .
- the end of each electrode 112 may simply be placed on the surface of wiring 116 for attachment (e.g., by a bumping or soldering method).
- FIGS. 5A and 5B illustrate an exemplary embodiment of a wiring 116 consistent with the present invention.
- wiring 116 may include openings 420 for receiving electrodes 112 of array 110 .
- a conductor 510 is connected to each opening 420 for transferring the neural signals received from an electrode 112 inserted into the corresponding opening.
- Conductors 510 may then connect to processing unit 114 using, for example, fine-pitch surface mount connectors.
- wiring 116 may be flexible circuit board or micro-ribbon cable made of polyimide, parylene, or silicone.
- wiring 116 may comprise a single conductive layer of a polyimide-based flexible substrate having, for example, a thickness of up to approximately a 200 ⁇ m, and include conductors 510 having about a 25-50 ⁇ m diameter with a spacing of about 25-150 ⁇ m between adjacent conductors.
- This exemplary embodiment of wiring circuit 116 provides for a wiring connector having small dimensions and flexibility, while also having a good yield during manufacturing.
- Wiring circuits 116 consistent with the invention are not limited to these sizes, however, and those skilled in the art will appreciate that other sizes and types of wiring circuits may be used to connect electrode array 110 to processing unit 114 .
- each opening 420 in wiring 116 may have a diameter sized to securely receive each electrode 112 , while compensating for any positional tolerances from a drilling or laser process when forming the holes.
- wiring 116 may also include slits 520 between conductors 510 at various points along the length of wiring 116 .
- slits 520 may provide circuit 116 with three-dimensional flexibility to help reduce tethering forces described below.
- Slits 520 may be made by using a laser to make cuts on wiring 116 between the parallel conductors 510 .
- Slits 520 may run up to the length of wiring 116 .
- a stiffener may also be added to wiring 116 . For instance, a hardening resin or epoxy may be applied to the area where wiring 116 attaches to electrode array 110 , as also discussed above with respect to FIG. 4D .
- wiring 116 may reduce tethering forces created when the brain moves relative to the skull. If not reduced, these tethering forces may cause the position of electrode array 110 to move relative to the brain. To reduce these forces, an exemplary embodiment of wiring 116 has a horizontally flat shape where its width is much larger than its thickness. Wiring 116 thus has a lower stiffness for up-down brain shifts. Accordingly, by making slits 520 of sufficient lengths, wiring 116 may have minimum stiffness within the maximum expected range of motion. Wiring 116 may then allow electrode array 110 to move with the brain as it shifts relative to the skull.
- brain implant systems of the present invention may sustain relative brain shifts of up to 2 mm, which may result from cardiac and respiratory rhythms or other mechanical perturbations.
- wiring 116 may be coiled along its length or bent into an accordion-style staircase.
- a flip chip mounting method based on stud bumping or other bumping method may be used to connect wiring 116 to electrodes 112 of array 110 .
- FIGS. 6A and 6B illustrate exemplary stud bumping mounting methods for the respective arrays manufactured according to the processing steps of FIGS. 3A to 3 D and the processing steps of FIGS. 4A to 4 G.
- FIGS. 6A and 6B are intended to be exemplary of how known bumping techniques may be used to connect wiring 116 to array 110 .
- attachment methods may also be used to mount wiring 112 to the array 110 , such as by using a conductive epoxy.
- FIG. 6A shows an electrode 112 inserted through an opening of support layer 320 , as described above with respect to FIGS. 3B and 3C .
- electrical contact pads 610 may be formed on wiring 116 near the openings 420 for receiving electrodes 112 .
- Solder bumps 612 may then be disposed on pads 610 .
- solder bumps 612 are deformed and create an electrical connection between pads 610 and platform portions 312 of electrodes 112 .
- FIG. 6A shows contact pads 610 and solder bumps 612 placed on the side of wiring 116 facing support layer 320
- pads 610 and bumps 612 may alternatively be placed on the other side of wiring 116 for connecting wiring 116 to electrodes 112 .
- electrode 112 may be inserted through an opening 420 of wiring 116 until, for example, platform portion 312 of electrode 112 makes contact with electrical contact pads 610 formed on wiring 116 and mates with wiring 116 .
- Solder 612 or other wire bonding methods or materials, may then be added to secure the electrical connection of electrode 112 to pads 610 and hence to wiring 116 .
- a biocompatible polymer layer 620 may then be added on top of wiring 116 and an epoxy 630 may be applied to the space between electrode 112 and the opening 420 in wiring 116 .
- Epoxy 630 may hold electrodes 112 in place for the cutting process described above with respect to FIGS. 4F and 4 G.
- this arrangement may cause any overflow of epoxy 630 from going between wiring 116 and the biocompatible polymer layer 620 . By doing so, this will prevent epoxy 630 from leaking beyond the bottom of wiring circuit 116 and breaking the electrical contact between electrode 112 and the pads 610 .
- array 110 may be used to supply electrical impulse signals to cortex 120 in addition to sensing neural signals.
- array 110 may be used with neural stimulation techniques and tools known to those skilled in the art.
Abstract
A brain implant system consistent with embodiments of the present invention includes an electrode array having a plurality of electrodes for sensing neuron signals. A method for manufacturing the electrode array includes machining a piece of an electrically conductive substance to create a plurality of electrodes extending from a base member. Each electrode also has a corresponding base section. A nonconductive layer is provided around at least a portion of the base section of each electrode to support the plurality of electrodes. The base section of the electrodes are then cut to separate the base member from the plurality of electrodes supported by the nonconductive support layer. The present invention also includes a complete brain implant system using the above electrode array.
Description
- The U.S. Government has certain rights in this invention as provided for by the terms of grant No. NS25074 and contract No. NO1-NS-9-2322 from N.I.N.D.S.
- Recent advances in neurophysiology have allowed researchers to study the activity of groups of neurons with high temporal resolution and in specific locations in the brain. These advances create the possibility for brain-machine interfaces allowing an amputee to control a prosthetic limb in much the same way that person would control a natural limb. Although noninvasive sensors, such as multichannel electroencephalogram (EEG), have shown some promise as simple interfaces to computers, they do not currently offer the spatial resolution needed for prosthetic control. Current research into the electrical activity of small groups of neurons has thus been done primarily with arrays of microelectrodes inserted into the brain.
- Current intra-cortical microelectrode recording systems can record electrical signals from groups of neurons. These systems typically use a microscopic tapered conductive element, insulated except at its tip, to record the neuron signals. Other conductor designs, such as blunt cut wires, may record single neurons, but have sub-optimal recording characteristics. Further, nearly all recording systems rely on arrays of fixed electrodes connected to data acquisition systems through long wiring or cable harnesses. The percutaneous connectors associated with these cables present a potential source of infection that limits the useful life of these systems. The cables themselves also present additional problems in the design of a prosthesis that must continue to function over many years and not interfere with the patient's daily life. For instance, the cables limit the patient's mobility by being tethered to a signal processing device. Relatively long cables may also present a source of electrical interference and may break after repetitive use.
- The current microelectrode systems for recording single neurons can be grouped into two broad classes: those having microdrive mechanisms and those having fixed electrode arrays. Systems with microdrive mechanisms allow one to vertically position the electrodes in the brain tissue. Thus, a user can actively search for neurons of interest and accurately position the electrode tip near the soma of the neuron to improve the signal-to-noise ratio. These systems, however, have their disadvantages. First, even individual microdrive systems are bulky and cannot be fully implanted in a human. Second, microdrive systems typically cannot use more than a few dozen electrodes due to space limitations and the time it takes to independently position each electrode near a neuron.
- Fixed electrode array systems overcome some of these problems, but have their own problems as well. Once placed in the brain, fixed electrode arrays can not be repositioned, so they rely on chance proximity to neurons. The most basic fixed electrode arrays record neural activity using multiple micro-wires or hatpin-like electrodes individually inserted into the brain. Because it can take a relatively significant amount of time to insert each electrode, however, these systems have not been widely used. More recently, wire bundles have been developed which are inserted into the cortex as a unit, but they lack features of ideal recording electrodes, such as tip shape, overall size, and impedance. In particular, the common square tip of such microwires can damage the cortex and can have difficulty penetrating the tough cerebral membranes, as well as brain tissue.
- A major disadvantage of these fixed array systems is that they do not offer the ability to actively hunt for neurons since the electrode tips cannot be easily placed near the soma of the neurons. To help overcome this, large numbers of electrodes are inserted to increase the chance that the electrodes are positioned in close proximity to neurons. The input impedances of the electrodes may also be lowered to enhance their ability to record distant signals. Lowering the input impedance, however, also lowers the signal-to-noise ratio.
- Accordingly, there is a need for a fixed microelectrode array system that may have numerous electrodes providing a high signal-to-noise ratio. Further, there is a need for a fixed array system that has a flexible design and that does not rely upon percutaneous cabling systems to communicate with a data acquisition system.
- According to a first aspect of the invention, a method of manufacturing an electrode array system is disclosed. The method includes machining a work piece of an electrically conductive substance to create a plurality of electrodes extending from a base member. Each electrode has a corresponding base section. A nonconductive layer is provided around at least a portion of the base sections of the plurality of electrodes. The base member is removed from the plurality of electrodes, such that the plurality of electrodes are supported by the nonconductive layer.
- Another aspect of the invention discloses an electrode array. The array includes a flexible nonconductive support layer and an array of electrodes. Each electrode has a base section and a tip section, where the base section of each electrode is inserted into the nonconductive layer, such that the electrodes are held together by the nonconductive layer. An electrical connection located on the base section of each electrode communicates with the respective electrode.
- In yet another aspect of the invention, a brain implant system comprises an electrode configured to be inserted in a brain and for sensing electrical signals generated by brain neurons. A flexible wiring circuit is connected to the electrode and adapted to receive the neuron electrical signals sensed by the electrode. A processing unit receives the neuron electrical signals from the flexible wiring circuit. The processing unit further includes a detection module for detecting the occurrence of a neuron spike in the received neuron electrical signals. The processing unit also includes a transmitter for transmitting data reflecting the occurrence of each detected neuron spike.
- In still another aspect of the invention, a method for operating a brain implant system, comprises: providing an electrode configured to be inserted in a brain and for sensing electrical signals generated by brain neurons; receiving the neuron electrical signals sensed by the electrode over a flexible wiring; receiving the neuron electrical signals from the flexible wiring and detecting the occurrence of a neuron spike in the received neuron electrical signals; and transmitting data reflecting the occurrence of each detected neuron spike.
- Both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the embodiments of the invention as claimed.
- The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various embodiments of the present invention, and, together with the description, serve to explain the principles of the invention. In the drawings:
-
FIG. 1 is a diagram illustrating an exemplary brain implant system consistent with an embodiment of the present invention; -
FIG. 2A is a block diagram of a neuron signal processing system consistent with an embodiment of the present invention; -
FIG. 2B is a block diagram of a power supply system consistent with an embodiment of the present invention; -
FIGS. 3A to 3D illustrate exemplary process for making an electrode array consistent with an embodiment of the present invention; -
FIGS. 4A to 4G illustrate an alternative, exemplary process for making an electrode array consistent with an embodiment of the present invention; -
FIGS. 5A and 5B illustrate an exemplary wiring, consistent with an embodiment of the present invention, for attachment to an electrode array; and -
FIG. 6 illustrates an exemplary method, consistent with an embodiment of the present invention, for connecting an electrode to a wiring. - Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.
-
FIG. 1 generally illustrates a brain implant system consistent with an embodiment of the present invention. As shown inFIG. 1 , the system includes anelectrode array 110 inserted into a patient'scerebral cortex 120 through an opening in theskull 122.Array 110 may include a plurality ofelectrodes 112 for detecting electrical brain signals or impulses. WhileFIG. 1 showsarray 110 inserted intocerebral cortex 120,array 110 may be placed in any location of a patient's brain allowing forarray 110 to detect electrical brain signals or impulses. - Each
electrode 112 may be connected to aprocessing unit 114 viawiring 116.Processing unit 114 may be secured toskull 122 by, for example, the use of an adhesive or screws, and may even be placed inside the skull if desired. Aprotective plate 130 may then be secured toskull 122 underneath the surface of the patient'sskin 124. In one embodiment,plate 130 may be made of titanium and screwed toskull 120 usingscrews 132. However, the invention may use any of a number of known protective plates, such as a biological material, and methods for attaching the same to a patient's skull. Further, processingunit 114 and other surgically implanted components may be placed within a hermetically sealed housing to protect the components from biological materials. -
Electrode array 110 serves as the sensor for the brain implant system. While the various figures in this specification illustrateelectrode array 110 as having sixty-fourelectrodes 112 arranged in an 8×8 matrix,array 110 may include one or more electrodes having a variety of sizes, lengths, shapes, forms, and arrangements. Eachelectrode 112 extends intobrain 120 to detect the electrical neural signals generated from the neurons located in proximity to the electrode's placement within the brain. Neurons may generate such signals when, for example, the brain instructs a particular limb to move in a particular way.Electrode array 110 is described in more detail with respect toFIGS. 3A to 3D andFIGS. 4A to 4G. -
Electrodes 112 transfer the detected neural signals toprocessing unit 114 overwiring 116. As shown inFIG. 1 ,wiring 116 may pass out of the opening inskull 122 beneathprotective plate 130. Wiring 116 may then run underneath the patient'sskin 124 to connect toprocessing unit 114. Persons skilled in the art, however, will appreciate that arrangements other than the one shown inFIG. 1 may be used to connectarray 110 toprocessing unit 114 viawiring 116. Wiring 116 is described in more detail below with respect toFIGS. 5A and 5B . -
Processing unit 114 may preprocess the received neural signals (e.g., impedance matching, noise filtering, or amplifying), digitize them, and further process the neural signals to extract neural information that it may then transmit to an external computing device (not shown). For example, the external device may decode the received neural information into motor control signals for controlling a motorized prosthetic device or analyze the neural information for a variety of other purposes.Processing unit 114 is described in further detail with respect toFIG. 2A . -
FIG. 2A is a block diagram of aprocessing unit 114 consistent with an embodiment of the present invention. As shown inFIG. 2A , processingunit 114 may further include an analog-to-digital (A/D)interface 210, adetection module 220, abuffer 230, acontroller 240, and atransceiver 250. In an exemplary embodiment,interface 210,module 220, and buffer 230 each may be implemented by a common field programmable gate array (FPGA), although other embodiments are possible. For instance, alternative embodiments may include dedicated hardware or software components for implementingsubcomponents - A/
D interface 210 may include a plurality of A/D converters, each of which may receive the analog output from acorresponding electrode 112 or group ofelectrodes 112. Each A/D converter may amplify, digitize, and multiplex the signals received from the corresponding electrode(s) 112. In one exemplary embodiment, an amplification stage of A/D interface 210 may be implemented using a CMOS-based two-stage operational amplifier known to those skilled in the art, and selected to have a bandwidth of approximately 300-10 kHz and a gain of about 5000. However, processing units consistent with the present invention may also process other electrical neural signals, such as those in the 0-100 Hz range, for example. - For the exemplary embodiment of
array 110 comprising an 8×8 matrix of electrodes, A/D interface 210 may include eight 12-bit, 37.5 kHz A/D converters, each of which receives the analog outputs from eight corresponding electrodes. In such a case, each A/D converter may multiplex the electrode channel signals received from a corresponding row or column ofarray 110. A/D interface 210 may, however, multiplex other groupings of the electrode channels using any number of A/D converters. For instance, A/D interface 210 may include one A/D converter that receives the analog outputs from all of the electrode channels to multiplex those signals into one signal. Alternatively, A/D interface 210 may simply convert the electrode channels into digital signals without multiplexing. In either case,interface 210 may then provide the digital signals todetection module 220. -
Detection module 220 detects when a neuron has fired. The signal from a single neuron essentially comprises a series of electrical spikes. The brain encodes information according to the frequency or firing rate of these spikes, which is typically between 0 to 300 Hz. The spike itself may last about 1.5 ms and may have a peak-to-peak voltage of about 100 μV. In systems consistent with an embodiment of this invention,detection module 220 may detect the time a spike occurs since the neural information content is encoded in the timing between the spikes. Alternatively, module may detect the spike count over a predetermined time period or may detect instantaneous neural frequencies. In either event, by removing the inter-spike data and reducing the waveform to a time spike representation,module 220 may optimize the wireless communication bandwidth and minimize the storage requirements of the brain implant system. Buffer 230 may, however, also record information sufficient to determine the shape of the spike. The ability to determine the spike's shape may be needed in certain applications, such as when sorting which spikes come from which neurons. - To detect a spike,
detection module 220 may detect whether the channel signal from A/D interface 210 meets a triggering event. Spike detection may be based on time, amplitude, or other aspects of the shape of the waveform. For example,module 220 may detect when the rising edge of a neural signal detected with aparticular electrode 112 exceeds a predetermined threshold value in amplitude or time, or a combination of the two. Since the spike amplitude may vary among neurons,module 220 may vary the threshold value for eachelectrode 112 based on the particular neuron(s) being detected by that electrode. In an exemplary embodiment,detection module 220 may include a programmable 12-bit threshold for setting the threshold level(s). - Buffer 230 may be implemented by using a pre-trigger and a post-trigger buffer memory. For instance, a small ring buffer may temporarily pre-store the digital data of a channel prior to a triggering event detected by
detection module 220. The pre-trigger buffer memory may thus store those samples corresponding to the spike's shape or other features (e.g., spike slope), prior to the triggering event. Buffer 230 may also include a separate pre-trigger buffer for each channel orelectrode 112, which may store the samples from each channel, according to an exemplary embodiment. Channel data obtained after the triggering event may then be stored directly in the post-trigger buffer memory to record the time each spike occurs and/or the spike shape. In one exemplary embodiment, buffer 230 stores 1.65 ms of recorded data per spike. - Upon triggering, buffer 230 may then output the data of both the pre-trigger and post-trigger buffer memories to
transceiver 250. Ifbuffer 230 outputs neural information faster thantransceiver 250 may transmit that information, then buffer 230 may temporarily store the outputted data in a transmit buffer (not shown). Further,transceiver 250 may also transmit only the time of the triggered event of each detected neuron signal to increase the transmission rate. -
Controller 240 may act as an interface betweentransceiver 250 and A/D interface 210,detection module 220, andbuffer 230.Controller 240 may also perform certain other control functions, such as setting the trigger threshold level ofmodule 220 or setting the size of pre-trigger or post-trigger buffers ofbuffer 230. In addition,controller 240 may be used to select particular electrode channels for processing and outputting bytransmitter 250.Controller 240 may also manage the power resources of the electrode array system 100. To each of these ends,controller 240 may include an I/O interface allowing a user toprogram controller 240 to perform the above or other control functions. A user may thus programcontroller 240 by transmitting control signals from an external control device (not shown) totransceiver 250, which may then forward the control information tocontroller 240. -
Transceiver 250 provides a wireless communication link betweenprocessing unit 114 and an external device (not shown). In particular,transceiver 250 receives the pre-trigger and post-trigger data stored inbuffer 230 for transmission to the external device for further processing and storage.Transceiver 250 may transmit the data using “Bluetooth” technology or according to any other type of wireless communication standard, including, for example, code division multiple access (CDMA), wireless application protocol (WAP), or infrared telemetry.Transceiver 250 may also receive control information using either of the above communication techniques. -
Processing unit 114 may also include a power supply (not shown inFIG. 2A ) for the brain implant system.FIG. 2B is a block diagram of an exemplary power supply system consistent with an embodiment of the present invention. While the power supply system ofFIG. 2B allows the implanted power supply to be recharged, other power supply systems may be used (such as a typical battery source) that need to be replaced when their power is exhausted. As shown inFIG. 2B , a power supply system consistent with the invention may include apower supply 260, anamplifier 262, an outside coil orinductor 264, an inside coil orinductor 266, arectifier circuit 268, abattery recharging circuit 270, and abattery 272.Components components - While each of the components of the power supply system of
FIG. 2B are individually known to those skilled in the art, the particular hardware chosen to implementcomponents components -
Power supply 260 may be any AC power supply, such as a standard 120 volt AC power source.Amplifier 262 receives an AC voltage signal fromsupply 260, amplifies it, and applies the amplified AC voltage signal toinductor 264. Wheninductor 264 is activated and placed in close proximity toinductor 266,inductor 264 will induce a current ininductor 266. The induced current then creates an AC voltage on the output terminals ofinductor 266, which is then applied torectifier circuit 268.Rectifier 268 then converts the induced AC voltage signal to a DC voltage signal in a manner known to those skilled in the art.FIG. 2B further shows anoptional capacitor 269 for filtering the rectified voltage signal. In particular,capacitor 269 may further limit any AC voltage signal levels that may still be present on the rectified output signal and thereby present a cleaner DC voltage signal.Battery recharging circuit 270 then receives the DC voltage signal for chargingbattery 272 located inside the patient. In an exemplary embodiment,battery 272 is a lithium-polymer 3.6 V battery. -
FIGS. 3A to 3G illustrate exemplary manufacturing processing steps for preparing an electrode array consistent with an embodiment of the present invention. In particular,FIG. 3A shows a work piece or block of electricallyconductive material 310 including a plurality ofelectrodes 112. While an exemplary embodiment includes using titanium asmaterial 310, a number of other conductive materials may be used, including, for example, stainless steel, steel, titanium nitride, a titanium-aluminum-vanadium alloy, tungsten carbide, copper, or doped silicon.Electrodes 112 may be formed frommaterial 310 by applying a wire electrical discharge machining (wire EDM) technique known to those skilled in the art. In particular, wire EDM may be used to precisely machine a raw block of electricallyconductive material 310 to formelectrodes 112.Array 110 may be formed by performing a wire EDM cut through one plane, rotatingarray 110 ninety degrees, and then performing a second wire EDM cut through a second plane. Other known manufacturing methods may, however, be used to micro-machineconductive material 310, such as by using a laser or a diamond saw. - Further, a chemical etching process may also be applied to
further machine electrodes 112. For instance, the machined array ofFIG. 3A may be placed in an etching bath to further etch the electrode surfaces. Whenmaterial 310 is titanium, for example, a heated hydrochloric or hydrofluoric acid bath may be used to etch the electrode surfaces. By an etching process,electrodes 112 of finer widths may be obtained. This process also removes the oxide layer from the electrode surfaces and smoothes those surfaces, a desirable step before forming additional coatings onarray 110. -
FIG. 3A showselectrodes 112 as having a tapered shape at their tips. In an exemplary embodiment, eachelectrode 112 may have a width of about 80 μm and taper to a point over the top 50 μm of its length. Further,FIG. 3A also shows that a base section ofelectrodes 112 may have aplatform portion 312.Portions 312 may serve as a platform for securing a support layer, which is described below with respect toFIGS. 3B and 3C . Rather than havingplatforms 312, however,electrodes 112 may include a stepped lower base portion (e.g., as shown inFIG. 3A-1 ) or a rounded lower base portion (e.g., as shown inFIG. 3A-2 ), which may alternatively serve as a platform for supporting the support layer. Moreover,electrodes 112 may have a variety of shapes, such as a continuous width shape (i.e., with no platform or stepped base section), a conical shape, a stepped-pyramidal shape, or a tapered shape different than that shown inFIG. 3A .Electrodes 112 may also have a variety of cross-sectional shapes, such as a rounded cross-section (which may be formed by a chemical etching process) or a rectangular, square, or hexagonal cross-section (which may be formed by the wire EDM technique). Moreover, as used herein, an electrode's “base section” refers broadly to the end portion ofelectrode 112 opposite the electrode's tip, without referring to the electrode's shape or width. -
Electrodes 112 ofarray 110 may also differ in length to sense particular neurons located at different depths incortex 120. For instance,electrodes 112 may increase in length from one side ofarray 110 to the other.Electrodes 112 may also vary in both length and width from other electrodes inarray 110, such that a givenelectrode 112 is either longer or shorter, or wider or narrower, than the electrode adjacent to it. For instance,array 110 may include shorter electrodes between 0.1 mm to 8 mm in length and/or longer electrodes between 0.3 mm to 50 mm in length. Further, forelectrodes 112 to record signals from common neurons, the spacing between electrodes may be less than 50 μm, while the spacing may be more than 400 μm whenelectrodes 112 record signals from different neurons. -
Electrode arrays 110 consistent with the invention may also arrangeelectrodes 112 in a number of ways. For example,electrodes 112 may be arranged in a one-dimensional or two-dimensional matrix, according to a predefined pattern, or in a random order. One exemplary pattern in whichelectrodes 112 may be arranged is a honeycomb-like hexagonal pattern. As described above, however, any type of pattern or arrangement ofelectrodes 112 may be used to formarray 110. - Depending upon the composition of
conductive material 310,electrodes 112 may be coated with a separate conductive layer (not shown). The conductive layer may only be necessary ifconductive material 310 is not biocompatible with the neural tissue and cerebro-spinal fluid or if the electrical characteristics require a coating (e.g., to avoid junction potentials at the electrode tips). An exemplary embodiment may include coatingelectrodes 112 with platinum by an electroplating process or other deposition method. The deposited layer may also improve the sensitivity of the electrode and may also prevent oxidation of the electrode.Electrode arrays 110 consistent with the present invention may also use other conductor materials besides platinum, such as gold or titanium nitride, formed by electroplating or other types of formation processes, such as vapor deposition or electron beam deposition. Further, the entire structure ofFIG. 3A or just the tips ofelectrodes 112 may be coated with the conductive material. - An insulating layer (not shown) may also be applied to
electrodes 112. Except for the electrode tip used to record the neural signals, the insulating layer may cover the whole electrode. The insulating layer may be removed from the electrode tips (e.g., by laser ablation, plasma etching, or chemical etching), or may be prevented from being formed on the tips (e.g., by a masking procedure). In this, way, conduction is allowed only through the tips and single neurons can be better isolated from one another. In the exemplary embodiment, all but the top 50 μm of eachelectrode 112 are insulated with Paralene by a vapor deposition process. Other insulating materials, such as glass, silicon nitride, polyimide, an epoxy, or other plastics or ceramics, may be used instead. - As shown in
FIG. 3B , asupport layer 320 may then be placed overelectrodes 112 to electrically isolateelectrodes 112 and to supportelectrodes 112 during the cutting process described below with respect toFIG. 3C .Layer 320 may have a number of corresponding openings for receipt ofelectrodes 112.Support layer 320 may slide down overelectrodes 112 until, for example, it reaches thebottom platform sections 312 of eachelectrode 112. Each hole or opening inlayer 320 may have a diameter sized to securely receive eachelectrode 112, while compensating for any positional tolerances from a drilling or laser process when forming the holes. In the exemplary embodiment,support layer 320 is a flexible material, such as polyimide, parylene, or silicone.Layer 320 may also be formed using materials having a flexibility that changes over time or under some other condition (e.g., having a flexibility that changes in response to the brain's heat). - An optional step may include applying an epoxy coating (not shown) to
electrodes 112 andsupport layer 320. The epoxy coating may, however, be applied afterelectrodes 112 are cut as described below with respect toFIG. 3C . Aftersupport layer 320 has been placed overelectrodes 112, the bases ofelectrodes 112 may be cut using a wire EDM technique to separateelectrodes 112 fromblock 310.FIG. 3C illustratesarray 110 afterelectrodes 112 have been cut or separated fromblock 310. - After cutting
electrodes 112, wiring 116 may then be placed over the cut ends ofelectrodes 112, as shown inFIG. 3D , to connect electrodes toprocessing unit 114. Likesupport layer 320, wiring 116 may have a number of corresponding openings for receipt ofelectrodes 112. WhileFIG. 3 shows these openings as passing entirely throughwiring 116, the openings may alternatively be formed as depressions inwiring 116, such thatelectrodes 112 may fit within the opening or depression, but not pass entirely throughwiring 116. In either case, each hole or opening may have a diameter sized to securely receive eachelectrode 112, while compensating for any positional tolerances from a drilling or laser process when forming the holes. Wiring 116 may then slide overelectrodes 112 until, for example, it reaches theplatform sections 312 of eachelectrode 112. Wiring 116 may then be electrically connected toelectrodes 112. Further, the cut array assembly may be placed in a holder (not shown) to holdelectrodes 112 in place when aligning and loweringwiring 116 overelectrodes 112. In the exemplary embodiment, wiring 116 may also be formed of a flexible material, such as polyimide, parylene, or silicone. Wiring 116 is described in more detail below with respect toFIGS. 5A and 5B . -
FIGS. 4A to 4G illustrate alternative, exemplary manufacturing processing steps, consistent with an embodiment of the present invention, for making an electrode array. In particular,FIG. 4A shows a block of electricallyconductive material 310 including a plurality ofelectrodes 112. The electrodes ofFIG. 4A may be formed using the processes described above with respect toFIG. 3A . As shown inFIG. 4A , however,electrodes 112 have a stepped-pyramidal shape similar to that shown inFIG. 3A-1 , in which theelectrodes 112 have stepped decreases in width from bottom to top. In an exemplary embodiment, eachelectrode 112 may have a taperedtip portion 412 and steppedbase sections electrodes 112 may have a variety of shapes, including continuous width shapes and stepped-pyramidal shapes having more or less than the three different width sections shown inFIG. 4A . Moreover, as stated above, an electrode's “base section” refers broadly to the end portion ofelectrode 112 opposite the electrode's tip, without referring to the electrode's shape or width. - As shown in
FIG. 4B , wiring 116 may then be placed overelectrodes 112. As shown inFIG. 4B , and as described above with respect toFIG. 3D , wiring 116 may have a number ofcorresponding openings 420 for receipt ofelectrodes 112. Wiring 116 may slide down overelectrodes 112 until, for example, it reaches thebottom base section 418 of eachelectrode 112.FIG. 4C illustrates wiring 116 in its lowered position. -
FIG. 4D shows an optional step of applying anepoxy coating 430 toelectrodes 112 andwiring 116.Epoxy coating 430 may, however, be applied afterelectrodes 112 are cut as described below with respect toFIG. 4F .FIG. 4E shows theepoxy coating 430 lowered until it rests on top ofwiring 116. WhileFIGS. 4D and 4E showepoxy coating 430 as having a sheet-like form,epoxy 430 may take a variety of forms, such as a more fluid-like form forcoating array 110. After wiring 116 andepoxy coating 430 have been placed overelectrodes 112,electrodes 112 may be cut along dashedline 440 shown inFIG. 4F by using a wire EDM technique. After cuttingelectrodes 112, their cut ends formsquare connector pads 442 which may then be soldered or otherwise electrically connected to the electrical contacts ofwiring 116.FIG. 4G showselectrode array 110 afterelectrodes 112 have been cut. - By fabricating
electrode array 110 according to the manufacturing methods discussed above with respect toFIGS. 3A-3D andFIGS. 4A-4G ,array 110 may have an improved degree of flexibility over conventional fixed electrode arrays. This improved flexibility may be created by supporting theelectrodes 112 removed frombase 310 with either-support layer 320 orflexible wiring 116. In particular,electrodes 112 are essentially supported and held together by their being inserted into the openings ofsupport layer 320 orflexible wiring 116. Becauselayer 320 andwiring 116 can each be made flexible,array 110 can also then be flexible. This flexibility is an important feature of the present invention since it allowsarray 110 to better conform to the contours of the patient's brain and to be more compliant near blood vessels. However, systems and methods consistent with the invention may useelectrode arrays 110 with limited flexibility. - Moreover,
electrode arrays 110 consistent with the present invention may be manufactured by methods other than those discussed above with respect toFIGS. 3A-3D andFIGS. 4A-4G . For example, after fabricatingelectrodes 112, the base section of each individual electrode may be attached directly to a surface ofwiring 116. According to this alternative manufacturing method, wiring 116 would not need any through-hole (e.g., opening 420) for receivingelectrodes 112. The end of eachelectrode 112 may simply be placed on the surface ofwiring 116 for attachment (e.g., by a bumping or soldering method). -
FIGS. 5A and 5B illustrate an exemplary embodiment of awiring 116 consistent with the present invention. As shown inFIG. 5A , wiring 116 may includeopenings 420 for receivingelectrodes 112 ofarray 110. Aconductor 510 is connected to eachopening 420 for transferring the neural signals received from anelectrode 112 inserted into the corresponding opening.Conductors 510 may then connect toprocessing unit 114 using, for example, fine-pitch surface mount connectors. - As described above, wiring 116 may be flexible circuit board or micro-ribbon cable made of polyimide, parylene, or silicone. In one exemplary embodiment, wiring 116 may comprise a single conductive layer of a polyimide-based flexible substrate having, for example, a thickness of up to approximately a 200 μm, and include
conductors 510 having about a 25-50 μm diameter with a spacing of about 25-150 μm between adjacent conductors. This exemplary embodiment ofwiring circuit 116 provides for a wiring connector having small dimensions and flexibility, while also having a good yield during manufacturing.Wiring circuits 116 consistent with the invention are not limited to these sizes, however, and those skilled in the art will appreciate that other sizes and types of wiring circuits may be used to connectelectrode array 110 toprocessing unit 114. - A milling or laser machining process may then be used to create corresponding
openings 420 for eachconductor 510. In the exemplary embodiment, each opening 420 inwiring 116 may have a diameter sized to securely receive eachelectrode 112, while compensating for any positional tolerances from a drilling or laser process when forming the holes. - As shown in
FIG. 5B , wiring 116 may also includeslits 520 betweenconductors 510 at various points along the length ofwiring 116. As shown inFIG. 5B , slits 520 may providecircuit 116 with three-dimensional flexibility to help reduce tethering forces described below.Slits 520 may be made by using a laser to make cuts onwiring 116 between theparallel conductors 510.Slits 520 may run up to the length ofwiring 116. To prevent excessive bending ofwiring 116 near its attachment toelectrode array 110, a stiffener may also be added towiring 116. For instance, a hardening resin or epoxy may be applied to the area wherewiring 116 attaches toelectrode array 110, as also discussed above with respect toFIG. 4D . - The flexibility between
electrode array 110 andprocessing unit 114 created by wiring 116 offers several advantages. For instance, wiring 116 may reduce tethering forces created when the brain moves relative to the skull. If not reduced, these tethering forces may cause the position ofelectrode array 110 to move relative to the brain. To reduce these forces, an exemplary embodiment ofwiring 116 has a horizontally flat shape where its width is much larger than its thickness. Wiring 116 thus has a lower stiffness for up-down brain shifts. Accordingly, by makingslits 520 of sufficient lengths, wiring 116 may have minimum stiffness within the maximum expected range of motion. Wiring 116 may then allowelectrode array 110 to move with the brain as it shifts relative to the skull. In this way, brain implant systems of the present invention may sustain relative brain shifts of up to 2 mm, which may result from cardiac and respiratory rhythms or other mechanical perturbations. Further, as an alternative toslits 520, wiring 116 may be coiled along its length or bent into an accordion-style staircase. - In an exemplary embodiment, a flip chip mounting method based on stud bumping or other bumping method may be used to connect
wiring 116 toelectrodes 112 ofarray 110.FIGS. 6A and 6B illustrate exemplary stud bumping mounting methods for the respective arrays manufactured according to the processing steps ofFIGS. 3A to 3D and the processing steps ofFIGS. 4A to 4G. Those skilled in the art will appreciate, however, thatFIGS. 6A and 6B are intended to be exemplary of how known bumping techniques may be used to connectwiring 116 toarray 110. Further, other, attachment methods may also be used to mountwiring 112 to thearray 110, such as by using a conductive epoxy. -
FIG. 6A shows anelectrode 112 inserted through an opening ofsupport layer 320, as described above with respect toFIGS. 3B and 3C . To mountwiring 116,electrical contact pads 610 may be formed onwiring 116 near theopenings 420 for receivingelectrodes 112. Solder bumps 612 may then be disposed onpads 610. When wiring 116 is then placed againstplatform portions 312 ofelectrodes 112, solder bumps 612 are deformed and create an electrical connection betweenpads 610 andplatform portions 312 ofelectrodes 112. WhileFIG. 6A showscontact pads 610 andsolder bumps 612 placed on the side ofwiring 116 facingsupport layer 320,pads 610 andbumps 612 may alternatively be placed on the other side ofwiring 116 for connectingwiring 116 toelectrodes 112. - In the exemplary embodiment of
FIG. 6B ,electrode 112 may be inserted through anopening 420 ofwiring 116 until, for example,platform portion 312 ofelectrode 112 makes contact withelectrical contact pads 610 formed onwiring 116 and mates withwiring 116.Solder 612, or other wire bonding methods or materials, may then be added to secure the electrical connection ofelectrode 112 topads 610 and hence towiring 116. Abiocompatible polymer layer 620 may then be added on top ofwiring 116 and an epoxy 630 may be applied to the space betweenelectrode 112 and theopening 420 inwiring 116.Epoxy 630 may holdelectrodes 112 in place for the cutting process described above with respect toFIGS. 4F and 4G. Further, this arrangement may cause any overflow ofepoxy 630 from going betweenwiring 116 and thebiocompatible polymer layer 620. By doing so, this will prevent epoxy 630 from leaking beyond the bottom ofwiring circuit 116 and breaking the electrical contact betweenelectrode 112 and thepads 610. - Accordingly, wireless brain implant systems and methods for using and manufacturing the same, have been described above. While this invention has been particularly shown and described with references to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention encompassed by the appended claims. For example,
array 110 may be used to supply electrical impulse signals tocortex 120 in addition to sensing neural signals. Thus,array 110 may be used with neural stimulation techniques and tools known to those skilled in the art. - Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
Claims (22)
1-28. (canceled)
29. An electrode array, comprising:
a nonconductive layer;
an array of electrodes, each electrode having a base section and a tip section, wherein the base section of each electrode is inserted into the nonconductive layer, such that the electrodes are held together by the nonconductive layer; and
an electrical connection located on the base section of each electrode to communicate with the respective electrode.
30. The array of claim 29 , wherein the nonconductive layer comprises a wiring layer.
31. The array of claim 30 , wherein the wiring circuit further includes a nonconductive portion and a plurality of conductors supported by the nonconductive portion and for connecting to respective ones of the plurality of electrodes, and wherein the nonconductive portion supports the plurality of electrodes.
32. The array of claim 29 , wherein the nonconductive layer is comprises an epoxy.
33. The array of claim 29 , wherein the nonconductive layer is comprises glass.
34. The array of claim 29 , wherein the nonconductive layer comprises a flexible material.
35. The array of claim 34 , wherein the flexible material comprises at least one of polyimide, parylene, and silicone.
36. The array of claim 29 , wherein the electrodes are arranged in a two-dimensional matrix pattern.
37. The array of claim 29 , wherein the electrodes are arranged in a honeycomb-like hexagonal pattern.
38. The array of claim 29 , wherein the distances between neighboring electrodes varies.
39. The array of claim 29 , wherein the electrodes increase in length from one side of the array to another side of the array.
40. The array of claim 29 , wherein the plurality of electrodes have varying lengths.
41. The array of claim 40 , wherein a first electrode has a length different that than of its immediately neighboring electrodes.
42. The array of claim 40 , wherein the lengths of the plurality of electrodes are random.
43. The array of claim 29 , wherein the plurality of electrodes have varying widths.
44. The array of claim 43 , wherein a first electrode has a width different than that of each of its immediately neighboring electrodes.
45. The array of claim 29 , wherein the electrodes have a platform portion where the width of the electrode is enlarged.
46. The array of claim 45 , wherein the nonconductive layer rests on the platform portion of each electrode after the base section of each electrode is inserted into the nonconductive section.
47. The array of claim 29 , wherein the electrodes may apply an electrical stimulation signal.
48. The array of claim 29 , wherein the electrodes may detect an electrical signal.
49-58. (canceled)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/723,999 US20070169333A1 (en) | 2002-10-24 | 2007-03-23 | Microstructured arrays for cortex interaction and related methods of manufacture and use |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/278,853 US7212851B2 (en) | 2002-10-24 | 2002-10-24 | Microstructured arrays for cortex interaction and related methods of manufacture and use |
US11/723,999 US20070169333A1 (en) | 2002-10-24 | 2007-03-23 | Microstructured arrays for cortex interaction and related methods of manufacture and use |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/278,853 Division US7212851B2 (en) | 2002-10-24 | 2002-10-24 | Microstructured arrays for cortex interaction and related methods of manufacture and use |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070169333A1 true US20070169333A1 (en) | 2007-07-26 |
Family
ID=32106611
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/278,853 Expired - Fee Related US7212851B2 (en) | 2002-10-24 | 2002-10-24 | Microstructured arrays for cortex interaction and related methods of manufacture and use |
US11/723,999 Abandoned US20070169333A1 (en) | 2002-10-24 | 2007-03-23 | Microstructured arrays for cortex interaction and related methods of manufacture and use |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/278,853 Expired - Fee Related US7212851B2 (en) | 2002-10-24 | 2002-10-24 | Microstructured arrays for cortex interaction and related methods of manufacture and use |
Country Status (1)
Country | Link |
---|---|
US (2) | US7212851B2 (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060085056A1 (en) * | 2004-10-19 | 2006-04-20 | Schouenborg Jens O R | Method and means for electrical stimulation of cutaneous sensory receptors |
US20060190058A1 (en) * | 2004-12-03 | 2006-08-24 | Greenberg Robert J | Visual prosthesis for improved circadian rhythms and method of improving the circadian rhythms |
US20080221645A1 (en) * | 2007-03-06 | 2008-09-11 | Neural Signals, Inc. | Neurotrophic Electrode Neural Interface Employing Quantum Dots |
US20090036752A1 (en) * | 2002-10-09 | 2009-02-05 | Deadwyler Sam A | Wireless systems and methods for the detection of neural events using onboard processing |
US20090292336A1 (en) * | 2008-05-22 | 2009-11-26 | Toshikazu Nishida | Neural interface systems and methods |
US20100106047A1 (en) * | 2007-02-01 | 2010-04-29 | Ls Biopath, Inc. | Electrical methods for detection and characterization of abnormal tissue and cells |
US20100179436A1 (en) * | 2007-02-01 | 2010-07-15 | Moshe Sarfaty | Optical system for detection and characterization of abnormal tissue and cells |
US20100274327A1 (en) * | 2004-10-19 | 2010-10-28 | Meagan Medical, Inc. | System and method for stimulating sensory nerves |
US20110178422A1 (en) * | 2008-09-30 | 2011-07-21 | National University Corporation NARA Institute of Science and Technology | Intracerebral information measuring device |
US20120150061A1 (en) * | 2010-11-02 | 2012-06-14 | Industry-Academic Cooperation Foundation, Yonsei University | Sensor for Detecting Cancerous Tissue and Method of Manufacturing the Same |
WO2012158834A1 (en) * | 2011-05-16 | 2012-11-22 | Second Sight Medical Products, Inc. | Cortical interface with an electrode array divided into separate fingers and/or with a wireless transceiver |
US8473072B2 (en) | 2010-06-08 | 2013-06-25 | Axelgaard Manufacturing Company, Ltd. | Customizable medical electrode |
CN103732284A (en) * | 2011-03-17 | 2014-04-16 | 布朗大学 | Implantable wireless neural device |
WO2014150561A1 (en) | 2013-03-15 | 2014-09-25 | Zyvex Labs, Llc | Three-dimensional multi-electrode array |
US9480845B2 (en) | 2006-06-23 | 2016-11-01 | Cyberonics, Inc. | Nerve stimulation device with a wearable loop antenna |
US9962546B2 (en) | 2013-02-21 | 2018-05-08 | Meagan Medical, Inc. | Cutaneous field stimulation with disposable and rechargeable components |
WO2019152648A1 (en) * | 2018-02-02 | 2019-08-08 | Carnegie Mellon University | 3d printed microelectrode arrays |
US10799132B2 (en) | 2014-03-21 | 2020-10-13 | University Of Utah Research Foundation | Multi-site electrode arrays and methods of making the same |
Families Citing this family (115)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9042988B2 (en) | 1998-08-05 | 2015-05-26 | Cyberonics, Inc. | Closed-loop vagus nerve stimulation |
US7209787B2 (en) | 1998-08-05 | 2007-04-24 | Bioneuronics Corporation | Apparatus and method for closed-loop intracranial stimulation for optimal control of neurological disease |
US7747325B2 (en) | 1998-08-05 | 2010-06-29 | Neurovista Corporation | Systems and methods for monitoring a patient's neurological disease state |
US9113801B2 (en) * | 1998-08-05 | 2015-08-25 | Cyberonics, Inc. | Methods and systems for continuous EEG monitoring |
US8762065B2 (en) | 1998-08-05 | 2014-06-24 | Cyberonics, Inc. | Closed-loop feedback-driven neuromodulation |
US9415222B2 (en) * | 1998-08-05 | 2016-08-16 | Cyberonics, Inc. | Monitoring an epilepsy disease state with a supervisory module |
US9375573B2 (en) * | 1998-08-05 | 2016-06-28 | Cyberonics, Inc. | Systems and methods for monitoring a patient's neurological disease state |
US7809432B2 (en) * | 2002-04-12 | 2010-10-05 | Infineon Technologies Ag | Event detection—apparatus and method for measuring the activity of neural networks |
US9854985B2 (en) * | 2002-12-09 | 2018-01-02 | Bio-Signal Group Corp. | Brain signal telemetry and seizure prediction |
US20040111043A1 (en) * | 2002-12-09 | 2004-06-10 | Bio-Signal Group Corp. | Bioelectric telemetering system and method for digital cable eliminator |
US8014878B2 (en) * | 2005-04-28 | 2011-09-06 | Second Sight Medical Products, Inc. | Flexible circuit electrode array |
US7187967B2 (en) * | 2003-09-30 | 2007-03-06 | Neural Signals, Inc. | Apparatus and method for detecting neural signals and using neural signals to drive external functions |
US7187968B2 (en) * | 2003-10-23 | 2007-03-06 | Duke University | Apparatus for acquiring and transmitting neural signals and related methods |
US20050143589A1 (en) * | 2003-11-09 | 2005-06-30 | Donoghue John P. | Calibration systems and methods for neural interface devices |
US7120486B2 (en) * | 2003-12-12 | 2006-10-10 | Washington University | Brain computer interface |
WO2005058135A2 (en) * | 2003-12-12 | 2005-06-30 | Washington University | Electrocorticography telemitter |
US20060009814A1 (en) * | 2004-07-07 | 2006-01-12 | Alfred E. Mann Foundation For Scientific Research | Brian implant device |
US8862235B1 (en) * | 2005-07-01 | 2014-10-14 | Alfred E. Mann Foundation For Scientific Research | Brain implant device |
US8560041B2 (en) | 2004-10-04 | 2013-10-15 | Braingate Co., Llc | Biological interface system |
US20060129056A1 (en) * | 2004-12-10 | 2006-06-15 | Washington University | Electrocorticography telemitter |
US8485979B2 (en) * | 2004-12-17 | 2013-07-16 | Medtronic, Inc. | System and method for monitoring or treating nervous system disorders |
US8095209B2 (en) | 2005-01-06 | 2012-01-10 | Braingate Co., Llc | Biological interface system with gated control signal |
WO2006074029A2 (en) * | 2005-01-06 | 2006-07-13 | Cyberkinetics Neurotechnology Systems, Inc. | Neurally controlled and multi-device patient ambulation systems and related methods |
US20060253166A1 (en) | 2005-01-06 | 2006-11-09 | Flaherty J C | Patient training routine for biological interface system |
US8812096B2 (en) | 2005-01-10 | 2014-08-19 | Braingate Co., Llc | Biological interface system with patient training apparatus |
WO2006078432A2 (en) | 2005-01-18 | 2006-07-27 | Cyberkinetics Neurotechnology Systems, Inc. | Biological interface system with automated configuration |
US20060173261A1 (en) * | 2005-01-31 | 2006-08-03 | Magnus Kall | Biopotential sensor |
US20060293578A1 (en) * | 2005-02-03 | 2006-12-28 | Rennaker Robert L Ii | Brian machine interface device |
US8024022B2 (en) * | 2005-05-25 | 2011-09-20 | Alfred E. Mann Foundation For Scientific Research | Hermetically sealed three-dimensional electrode array |
US7991475B1 (en) * | 2005-06-08 | 2011-08-02 | The Regents Of The University Of California | High density micromachined electrode arrays useable for auditory nerve implants and related methods |
US20060264774A1 (en) * | 2005-08-25 | 2006-11-23 | Outland Research, Llc | Neurologically Controlled Access to an Electronic Information Resource |
US8725243B2 (en) | 2005-12-28 | 2014-05-13 | Cyberonics, Inc. | Methods and systems for recommending an appropriate pharmacological treatment to a patient for managing epilepsy and other neurological disorders |
US8868172B2 (en) | 2005-12-28 | 2014-10-21 | Cyberonics, Inc. | Methods and systems for recommending an appropriate action to a patient for managing epilepsy and other neurological disorders |
US20100168501A1 (en) * | 2006-10-02 | 2010-07-01 | Daniel Rogers Burnett | Method and apparatus for magnetic induction therapy |
US9339641B2 (en) | 2006-01-17 | 2016-05-17 | Emkinetics, Inc. | Method and apparatus for transdermal stimulation over the palmar and plantar surfaces |
US9610459B2 (en) * | 2009-07-24 | 2017-04-04 | Emkinetics, Inc. | Cooling systems and methods for conductive coils |
US20070167990A1 (en) * | 2006-01-17 | 2007-07-19 | Theranova, Llc | Method and apparatus for low frequency induction therapy for the treatment of urinary incontinence and overactive bladder |
DE102006008050A1 (en) * | 2006-02-21 | 2007-08-23 | Imi Intelligent Medical Implants Ag | Device with flexible multi layer system e.g. for contacting or electro stimulation of living tissue cells or nerves, has contact point for electrical contacting and PCB has structure of electrically isolating material layer |
AU2007261384B2 (en) * | 2006-06-19 | 2011-08-04 | Second Sight Medical Products, Inc. | Electrode with increased stability and method of manufacturing the same |
TWI288067B (en) * | 2006-06-22 | 2007-10-11 | Univ Chung Hua | Microarray bioprobe device integrated with a semiconductor amplifier |
US8865288B2 (en) | 2006-07-17 | 2014-10-21 | University Of Utah Research Foundation | Micro-needle arrays having non-planar tips and methods of manufacture thereof |
US20080138581A1 (en) * | 2006-07-17 | 2008-06-12 | Rajmohan Bhandari | Masking high-aspect aspect ratio structures |
US9005102B2 (en) | 2006-10-02 | 2015-04-14 | Emkinetics, Inc. | Method and apparatus for electrical stimulation therapy |
US11224742B2 (en) | 2006-10-02 | 2022-01-18 | Emkinetics, Inc. | Methods and devices for performing electrical stimulation to treat various conditions |
US10786669B2 (en) | 2006-10-02 | 2020-09-29 | Emkinetics, Inc. | Method and apparatus for transdermal stimulation over the palmar and plantar surfaces |
US8295934B2 (en) | 2006-11-14 | 2012-10-23 | Neurovista Corporation | Systems and methods of reducing artifact in neurological stimulation systems |
EP2126785A2 (en) * | 2007-01-25 | 2009-12-02 | NeuroVista Corporation | Systems and methods for identifying a contra-ictal condition in a subject |
US20080183097A1 (en) * | 2007-01-25 | 2008-07-31 | Leyde Kent W | Methods and Systems for Measuring a Subject's Susceptibility to a Seizure |
US8036736B2 (en) * | 2007-03-21 | 2011-10-11 | Neuro Vista Corporation | Implantable systems and methods for identifying a contra-ictal condition in a subject |
EP1985579B1 (en) * | 2007-04-27 | 2018-01-10 | IMEC vzw | Connecting scheme for the orthogonal assembly of microstructures |
US9521955B2 (en) * | 2007-05-03 | 2016-12-20 | Cornell Research Foundtion, Inc. | Subdural electro-optical sensor |
US8007726B2 (en) * | 2007-06-04 | 2011-08-30 | Chung Hua University | Microarray bioprobe device integrated with an amplifier having bottom-gate thin film transistors |
US9788744B2 (en) * | 2007-07-27 | 2017-10-17 | Cyberonics, Inc. | Systems for monitoring brain activity and patient advisory device |
US8165684B2 (en) * | 2007-08-01 | 2012-04-24 | Yale University | Wireless system for epilepsy monitoring and measurement |
US8738139B2 (en) | 2007-08-01 | 2014-05-27 | Bruce Lanning | Wireless system for epilepsy monitoring and measurement |
US20090264789A1 (en) * | 2007-09-26 | 2009-10-22 | Medtronic, Inc. | Therapy program selection |
US8380314B2 (en) | 2007-09-26 | 2013-02-19 | Medtronic, Inc. | Patient directed therapy control |
US8121694B2 (en) * | 2007-10-16 | 2012-02-21 | Medtronic, Inc. | Therapy control based on a patient movement state |
US9259591B2 (en) | 2007-12-28 | 2016-02-16 | Cyberonics, Inc. | Housing for an implantable medical device |
US20090171168A1 (en) | 2007-12-28 | 2009-07-02 | Leyde Kent W | Systems and Method for Recording Clinical Manifestations of a Seizure |
CN101925377A (en) | 2008-01-25 | 2010-12-22 | 麦德托尼克公司 | The detection of Sleep stages |
US8944985B2 (en) * | 2008-04-03 | 2015-02-03 | The General Hospital Corporation | Deep brain stimulation implant with microcoil array |
US20090301994A1 (en) * | 2008-05-12 | 2009-12-10 | Rajmohan Bhandari | Methods for Wafer Scale Processing of Needle Array Devices |
US8886279B2 (en) * | 2008-06-03 | 2014-11-11 | University Of Utah Research Foundation | High aspect ratio microelectrode arrays enabled to have customizable lengths and methods of making the same |
FR2933621B1 (en) * | 2008-07-11 | 2010-09-10 | Commissariat Energie Atomique | IMPLANTABLE PROBE |
EP3536376A1 (en) | 2008-07-30 | 2019-09-11 | Ecole Polytechnique Fédérale de Lausanne | Apparatus for optimized stimulation of a neurological target |
US8335551B2 (en) * | 2008-09-29 | 2012-12-18 | Chong Il Lee | Method and means for connecting a large number of electrodes to a measuring device |
JP5667987B2 (en) | 2008-11-12 | 2015-02-12 | エコーレ ポリテクニーク フェデラーレ デ ローザンヌ (イーピーエフエル) | Micromachined nerve stimulation device |
US8849390B2 (en) | 2008-12-29 | 2014-09-30 | Cyberonics, Inc. | Processing for multi-channel signals |
US8588933B2 (en) | 2009-01-09 | 2013-11-19 | Cyberonics, Inc. | Medical lead termination sleeve for implantable medical devices |
CN101829396B (en) * | 2009-03-27 | 2013-01-30 | 清华大学 | Micro-needle array chip and percutaneous administration patch using same and preparation method thereof |
US8786624B2 (en) | 2009-06-02 | 2014-07-22 | Cyberonics, Inc. | Processing for multi-channel signals |
US9061134B2 (en) * | 2009-09-23 | 2015-06-23 | Ripple Llc | Systems and methods for flexible electrodes |
AU2010313487A1 (en) | 2009-10-26 | 2012-05-24 | Emkinetics, Inc. | Method and apparatus for electromagnetic stimulation of nerve, muscle, and body tissues |
US9770204B2 (en) | 2009-11-11 | 2017-09-26 | Medtronic, Inc. | Deep brain stimulation for sleep and movement disorders |
US8261428B2 (en) * | 2009-11-25 | 2012-09-11 | National Tsing Hua University | Method for assembling a 3-dimensional microelectrode structure |
JP2013512062A (en) | 2009-12-01 | 2013-04-11 | エコーレ ポリテクニーク フェデラーレ デ ローザンヌ | Microfabricated surface nerve stimulation device and methods of making and using the same |
US9643019B2 (en) | 2010-02-12 | 2017-05-09 | Cyberonics, Inc. | Neurological monitoring and alerts |
US9549708B2 (en) | 2010-04-01 | 2017-01-24 | Ecole Polytechnique Federale De Lausanne | Device for interacting with neurological tissue and methods of making and using the same |
US8588884B2 (en) * | 2010-05-28 | 2013-11-19 | Emkinetics, Inc. | Microneedle electrode |
US10448877B2 (en) * | 2010-12-05 | 2019-10-22 | Brown University | Methods for prediction and early detection of neurological events |
US8939774B2 (en) * | 2011-11-11 | 2015-01-27 | Massachusetts Institute Of Technology | Methods and apparatus for three-dimensional microfabricated arrays |
US9095267B2 (en) | 2011-12-22 | 2015-08-04 | Modular Bionics Inc. | Neural interface device and insertion tools |
US9128124B2 (en) * | 2012-02-10 | 2015-09-08 | California Institute Of Technology | Wireless voltage sensing device |
US9849025B2 (en) | 2012-09-07 | 2017-12-26 | Yale University | Brain cooling system |
US11185271B2 (en) * | 2013-09-13 | 2021-11-30 | University Of Utah Research Foundation | Methods of making micro-molded electrodes and arrays |
CN103519808B (en) * | 2013-09-18 | 2015-04-22 | 电子科技大学 | Multi-channel microelectrode array and manufacturing method thereof |
US9636028B2 (en) | 2013-11-08 | 2017-05-02 | Neuronexus Technologies, Inc. | Three-dimensional neural probe microelectrode array and method of manufacture |
US10058263B2 (en) * | 2014-03-24 | 2018-08-28 | University Of Utah Research Foundation | Neural interface |
EP3476430B1 (en) | 2014-05-16 | 2020-07-01 | Aleva Neurotherapeutics SA | Device for interacting with neurological tissue |
US11311718B2 (en) | 2014-05-16 | 2022-04-26 | Aleva Neurotherapeutics Sa | Device for interacting with neurological tissue and methods of making and using the same |
US9474894B2 (en) | 2014-08-27 | 2016-10-25 | Aleva Neurotherapeutics | Deep brain stimulation lead |
US9403011B2 (en) | 2014-08-27 | 2016-08-02 | Aleva Neurotherapeutics | Leadless neurostimulator |
US10674914B1 (en) | 2015-06-24 | 2020-06-09 | Modular Bionics Inc. | Wireless neural interface system |
CN109069824B (en) | 2016-02-02 | 2022-09-16 | 阿莱瓦神经治疗股份有限公司 | Treatment of autoimmune diseases using deep brain stimulation |
CA3014910A1 (en) | 2016-02-22 | 2017-08-31 | The Charles Stark Draper Laboratory, Inc. | Method of manufacturing an implantable neural electrode interface platform |
US10086192B2 (en) | 2016-07-07 | 2018-10-02 | Modular Bionics Inc. | Neural interface insertion and retraction tools |
GB2557612A (en) * | 2016-12-12 | 2018-06-27 | Kokoon Tech Ltd | Electroencephalography sensors |
US11045142B1 (en) * | 2017-04-29 | 2021-06-29 | Biolinq, Inc. | Heterogeneous integration of silicon-fabricated solid microneedle sensors and CMOS circuitry |
WO2019060298A1 (en) | 2017-09-19 | 2019-03-28 | Neuroenhancement Lab, LLC | Method and apparatus for neuroenhancement |
US11717686B2 (en) | 2017-12-04 | 2023-08-08 | Neuroenhancement Lab, LLC | Method and apparatus for neuroenhancement to facilitate learning and performance |
US11065439B1 (en) | 2017-12-11 | 2021-07-20 | Modular Bionics Inc. | Conforming modular neural interface system |
EP3731749A4 (en) | 2017-12-31 | 2022-07-27 | Neuroenhancement Lab, LLC | System and method for neuroenhancement to enhance emotional response |
US10729564B2 (en) | 2018-01-12 | 2020-08-04 | Ripple Llc | Sensor system |
CN111655143A (en) * | 2018-01-31 | 2020-09-11 | 京瓷株式会社 | Ceramic guide, ceramic guide device and ceramic guide module |
US10702692B2 (en) | 2018-03-02 | 2020-07-07 | Aleva Neurotherapeutics | Neurostimulation device |
US11364361B2 (en) | 2018-04-20 | 2022-06-21 | Neuroenhancement Lab, LLC | System and method for inducing sleep by transplanting mental states |
GB2576502A (en) * | 2018-08-17 | 2020-02-26 | 3Brain Ag | Probe arrays |
CN109350046A (en) * | 2018-09-07 | 2019-02-19 | 深圳市太空科技南方研究院 | A kind of flexible electrode and its manufacturing method |
WO2020056418A1 (en) | 2018-09-14 | 2020-03-19 | Neuroenhancement Lab, LLC | System and method of improving sleep |
US11562907B2 (en) | 2018-11-29 | 2023-01-24 | International Business Machines Corporation | Nanostructure featuring nano-topography with optimized electrical and biochemical properties |
US11786694B2 (en) | 2019-05-24 | 2023-10-17 | NeuroLight, Inc. | Device, method, and app for facilitating sleep |
WO2022026764A1 (en) | 2020-07-29 | 2022-02-03 | Biolinq Inc. | Continuous analyte monitoring system with microneedle array |
SE545874C2 (en) | 2021-05-08 | 2024-02-27 | Biolinq Incorporated | Fault detection for microneedle array based continuous analyte monitoring device |
CN114190948A (en) * | 2021-12-14 | 2022-03-18 | 深圳先进技术研究院 | Manufacturing method and using method of multi-brain-area recording electrode array capable of being implanted for long time |
Citations (91)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3837339A (en) * | 1972-02-03 | 1974-09-24 | Whittaker Corp | Blood glucose level monitoring-alarm system and method therefor |
US3850161A (en) * | 1973-04-09 | 1974-11-26 | S Liss | Method and apparatus for monitoring and counteracting excess brain electrical energy to prevent epileptic seizures and the like |
US4055175A (en) * | 1976-05-07 | 1977-10-25 | Miles Laboratories, Inc. | Blood glucose control apparatus |
US4146029A (en) * | 1974-04-23 | 1979-03-27 | Ellinwood Jr Everett H | Self-powered implanted programmable medication system and method |
US4294245A (en) * | 1980-03-24 | 1981-10-13 | Stimtech, Inc. | Perioperative application of electronic pain control in combination with anesthetic agents |
US4360031A (en) * | 1980-09-11 | 1982-11-23 | Medtronic, Inc. | Drug dispensing irrigatable electrode |
US4461304A (en) * | 1979-11-05 | 1984-07-24 | Massachusetts Institute Of Technology | Microelectrode and assembly for parallel recording of neurol groups |
US4633889A (en) * | 1984-12-12 | 1987-01-06 | Andrew Talalla | Stimulation of cauda-equina spinal nerves |
US4690142A (en) * | 1980-12-10 | 1987-09-01 | Ross Sidney A | Method and system for utilizing electro-neuro stimulation in a bio-feedback system |
US4837049A (en) * | 1986-06-17 | 1989-06-06 | Alfred E. Mann Foundation For Scientific Research | Method of making an electrode array |
US4865048A (en) * | 1987-12-31 | 1989-09-12 | Eckerson Harold D | Method and apparatus for drug free neurostimulation |
US4876913A (en) * | 1986-09-09 | 1989-10-31 | Campagnolo S.P.A. | Gear selector for bicycle speed gears |
US4883666A (en) * | 1987-04-29 | 1989-11-28 | Massachusetts Institute Of Technology | Controlled drug delivery system for treatment of neural disorders |
US4969468A (en) * | 1986-06-17 | 1990-11-13 | Alfred E. Mann Foundation For Scientific Research | Electrode array for use in connection with a living body and method of manufacture |
US5037376A (en) * | 1988-07-22 | 1991-08-06 | The United States Of America As Represented By The Department Of Health And Human Services | Apparatus and method for transmitting prosthetic information to the brain |
US5081990A (en) * | 1990-05-11 | 1992-01-21 | New York University | Catheter for spinal epidural injection of drugs and measurement of evoked potentials |
US5119832A (en) * | 1989-07-11 | 1992-06-09 | Ravi Xavier | Epidural catheter with nerve stimulators |
US5156844A (en) * | 1987-11-17 | 1992-10-20 | Brown University Research Foundation | Neurological therapy system |
US5215088A (en) * | 1989-11-07 | 1993-06-01 | The University Of Utah | Three-dimensional electrode device |
US5325865A (en) * | 1990-02-26 | 1994-07-05 | Baxter International, Inc. | Intracranial pressure monitoring system |
US5361760A (en) * | 1989-11-07 | 1994-11-08 | University Of Utah Research Foundation | Impact inserter mechanism for implantation of a biomedical device |
US5388577A (en) * | 1990-06-08 | 1995-02-14 | Boston University | Electrode array microchip |
US5423877A (en) * | 1992-05-04 | 1995-06-13 | David C. Mackey | Method and device for acute pain management by simultaneous spinal cord electrical stimulation and drug infusion |
US5445608A (en) * | 1993-08-16 | 1995-08-29 | James C. Chen | Method and apparatus for providing light-activated therapy |
US5458631A (en) * | 1989-01-06 | 1995-10-17 | Xavier; Ravi | Implantable catheter with electrical pulse nerve stimulators and drug delivery system |
US5474547A (en) * | 1989-06-21 | 1995-12-12 | Brown University Research Foundation | Implanting devices for the focal release of neuroinhibitory compounds |
US5617871A (en) * | 1993-11-02 | 1997-04-08 | Quinton Instrument Company | Spread spectrum telemetry of physiological signals |
US5638826A (en) * | 1995-06-01 | 1997-06-17 | Health Research, Inc. | Communication method and system using brain waves for multidimensional control |
US5687291A (en) * | 1996-06-27 | 1997-11-11 | The United States Of America As Represented By The Secretary Of The Army | Method and apparatus for estimating a cognitive decision made in response to a known stimulus from the corresponding single-event evoked cerebral potential |
US5692517A (en) * | 1993-01-06 | 1997-12-02 | Junker; Andrew | Brain-body actuated system |
US5713923A (en) * | 1996-05-13 | 1998-02-03 | Medtronic, Inc. | Techniques for treating epilepsy by brain stimulation and drug infusion |
US5735885A (en) * | 1994-02-09 | 1998-04-07 | The University Of Iowa Research Foundation | Methods for implanting neural prosthetic for tinnitus |
US5758651A (en) * | 1992-12-22 | 1998-06-02 | Nygard; Tony Mikeal | Telemetry system and apparatus |
US5797898A (en) * | 1996-07-02 | 1998-08-25 | Massachusetts Institute Of Technology | Microchip drug delivery devices |
US5814089A (en) * | 1996-12-18 | 1998-09-29 | Medtronic, Inc. | Leadless multisite implantable stimulus and diagnostic system |
US5855801A (en) * | 1994-06-06 | 1999-01-05 | Lin; Liwei | IC-processed microneedles |
US5873840A (en) * | 1997-08-21 | 1999-02-23 | Neff; Samuel R. | Intracranial pressure monitoring system |
US5928228A (en) * | 1993-03-16 | 1999-07-27 | Ep Technologies, Inc. | Flexible high density multiple electrode circuit assemblies employing ribbon cable |
US5938688A (en) * | 1997-10-22 | 1999-08-17 | Cornell Research Foundation, Inc. | Deep brain stimulation method |
US5938690A (en) * | 1996-06-07 | 1999-08-17 | Advanced Neuromodulation Systems, Inc. | Pain management system and method |
US5938689A (en) * | 1998-05-01 | 1999-08-17 | Neuropace, Inc. | Electrode configuration for a brain neuropacemaker |
US6016449A (en) * | 1997-10-27 | 2000-01-18 | Neuropace, Inc. | System for treatment of neurological disorders |
US6024700A (en) * | 1998-07-16 | 2000-02-15 | Nemirovski; Guerman G. | System and method for detecting a thought and generating a control instruction in response thereto |
US6024702A (en) * | 1997-09-03 | 2000-02-15 | Pmt Corporation | Implantable electrode manufactured with flexible printed circuit |
US6027456A (en) * | 1998-07-10 | 2000-02-22 | Advanced Neuromodulation Systems, Inc. | Apparatus and method for positioning spinal cord stimulation leads |
US6038477A (en) * | 1998-12-23 | 2000-03-14 | Axon Engineering, Inc. | Multiple channel nerve stimulator with channel isolation |
US6086582A (en) * | 1997-03-13 | 2000-07-11 | Altman; Peter A. | Cardiac drug delivery system |
US6091015A (en) * | 1997-05-28 | 2000-07-18 | Universidad Politecnica De Cataluna | Photovoltaic energy supply system with optical fiber for implantable medical devices |
US6092058A (en) * | 1998-01-08 | 2000-07-18 | The United States Of America As Represented By The Secretary Of The Army | Automatic aiding of human cognitive functions with computerized displays |
US6094598A (en) * | 1996-04-25 | 2000-07-25 | Medtronics, Inc. | Method of treating movement disorders by brain stimulation and drug infusion |
US6113553A (en) * | 1996-03-05 | 2000-09-05 | Lifesensors, Inc. | Telemetric intracranial pressure monitoring system |
US6125300A (en) * | 1998-09-11 | 2000-09-26 | Medtronic, Inc. | Implantable device with output circuitry for simultaneous stimulation at multiple sites |
US6154678A (en) * | 1999-03-19 | 2000-11-28 | Advanced Neuromodulation Systems, Inc. | Stimulation lead connector |
US6169981B1 (en) * | 1996-06-04 | 2001-01-02 | Paul J. Werbos | 3-brain architecture for an intelligent decision and control system |
US6171239B1 (en) * | 1998-08-17 | 2001-01-09 | Emory University | Systems, methods, and devices for controlling external devices by signals derived directly from the nervous system |
US6175762B1 (en) * | 1996-04-10 | 2001-01-16 | University Of Technology, Sydney | EEG based activation system |
US6181965B1 (en) * | 1996-02-20 | 2001-01-30 | Advanced Bionics Corporation | Implantable microstimulator system for prevention of disorders |
US6216045B1 (en) * | 1999-04-26 | 2001-04-10 | Advanced Neuromodulation Systems, Inc. | Implantable lead and method of manufacture |
US6224549B1 (en) * | 1999-04-20 | 2001-05-01 | Nicolet Biomedical, Inc. | Medical signal monitoring and display |
US6240315B1 (en) * | 1998-02-25 | 2001-05-29 | Seung Kee Mo | Electrical apparatus for medical treatment using EMG envelope signal |
US6254536B1 (en) * | 1995-08-02 | 2001-07-03 | Ibva Technologies, Inc. | Method and apparatus for measuring and analyzing physiological signals for active or passive control of physical and virtual spaces and the contents therein |
US6263237B1 (en) * | 1997-05-01 | 2001-07-17 | Medtronic, Inc. | Techniques for treating anxiety disorders by brain stimulation and drug infusion |
US6280394B1 (en) * | 1998-03-18 | 2001-08-28 | Sean R. Maloney | Apparatus and methods for detecting and processing EMG signals |
US20010027336A1 (en) * | 1998-01-20 | 2001-10-04 | Medtronic, Inc. | Combined micro-macro brain stimulation system |
US20010029391A1 (en) * | 1999-12-07 | 2001-10-11 | George Mason University | Adaptive electric field modulation of neural systems |
US6309410B1 (en) * | 1998-08-26 | 2001-10-30 | Advanced Bionics Corporation | Cochlear electrode with drug delivery channel and method of making same |
US6313093B1 (en) * | 1989-12-05 | 2001-11-06 | Chiron Corporation | Method for administering insulin to the brain |
US6319241B1 (en) * | 1998-04-30 | 2001-11-20 | Medtronic, Inc. | Techniques for positioning therapy delivery elements within a spinal cord or a brain |
US20020013612A1 (en) * | 2000-06-20 | 2002-01-31 | Whitehurst Todd K. | System and method for treatment of mood and/or anxiety disorders by electrical brain stimulation and/or drug infusion |
US20020016638A1 (en) * | 1999-12-14 | 2002-02-07 | Partha Mitra | Neural prosthetic using temporal structure in the local field potential |
US6353754B1 (en) * | 2000-04-24 | 2002-03-05 | Neuropace, Inc. | System for the creation of patient specific templates for epileptiform activity detection |
US6356784B1 (en) * | 1999-04-30 | 2002-03-12 | Medtronic, Inc. | Method of treating movement disorders by electrical stimulation and/or drug infusion of the pendunulopontine nucleus |
US6354299B1 (en) * | 1997-10-27 | 2002-03-12 | Neuropace, Inc. | Implantable device for patient communication |
US6358202B1 (en) * | 1999-01-25 | 2002-03-19 | Sun Microsystems, Inc. | Network for implanted computer devices |
US6366813B1 (en) * | 1998-08-05 | 2002-04-02 | Dilorenzo Daniel J. | Apparatus and method for closed-loop intracranical stimulation for optimal control of neurological disease |
US20020077620A1 (en) * | 2000-12-18 | 2002-06-20 | Sweeney Robert J. | Drug delivery system for implantable medical device |
US6427086B1 (en) * | 1997-10-27 | 2002-07-30 | Neuropace, Inc. | Means and method for the intracranial placement of a neurostimulator |
US6436708B1 (en) * | 1997-04-17 | 2002-08-20 | Paola Leone | Delivery system for gene therapy to the brain |
US6459936B2 (en) * | 1997-10-27 | 2002-10-01 | Neuropace, Inc. | Methods for responsively treating neurological disorders |
US6466822B1 (en) * | 2000-04-05 | 2002-10-15 | Neuropace, Inc. | Multimodal neurostimulator and process of using it |
US6473639B1 (en) * | 2000-03-02 | 2002-10-29 | Neuropace, Inc. | Neurological event detection procedure using processed display channel based algorithms and devices incorporating these procedures |
US6480743B1 (en) * | 2000-04-05 | 2002-11-12 | Neuropace, Inc. | System and method for adaptive brain stimulation |
US20020169485A1 (en) * | 1995-10-16 | 2002-11-14 | Neuropace, Inc. | Differential neurostimulation therapy driven by physiological context |
US20030004428A1 (en) * | 2001-06-28 | 2003-01-02 | Pless Benjamin D. | Seizure sensing and detection using an implantable device |
US20030083716A1 (en) * | 2001-10-23 | 2003-05-01 | Nicolelis Miguel A.L. | Intelligent brain pacemaker for real-time monitoring and controlling of epileptic seizures |
US20030083724A1 (en) * | 2001-10-31 | 2003-05-01 | Mandar Jog | Multichannel electrode and methods of using same |
US20030082507A1 (en) * | 2001-10-31 | 2003-05-01 | Stypulkowski Paul H. | System and method of treating stuttering by neuromodulation |
US20030093129A1 (en) * | 2001-10-29 | 2003-05-15 | Nicolelis Miguel A.L. | Closed loop brain machine interface |
US6577893B1 (en) * | 1993-09-04 | 2003-06-10 | Motorola, Inc. | Wireless medical diagnosis and monitoring equipment |
US6620415B2 (en) * | 2000-06-14 | 2003-09-16 | Allergan, Inc. | Parkinson's disease treatment |
US20040006264A1 (en) * | 2001-11-20 | 2004-01-08 | Mojarradi Mohammad M. | Neural prosthetic micro system |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4878913A (en) | 1987-09-04 | 1989-11-07 | Pfizer Hospital Products Group, Inc. | Devices for neural signal transmission |
US5843093A (en) | 1994-02-09 | 1998-12-01 | University Of Iowa Research Foundation | Stereotactic electrode assembly |
US5769875A (en) | 1994-09-06 | 1998-06-23 | Case Western Reserve University | Functional neuromusclar stimulation system |
US5697951A (en) * | 1996-04-25 | 1997-12-16 | Medtronic, Inc. | Implantable stimulation and drug infusion techniques |
US5702432A (en) * | 1996-10-03 | 1997-12-30 | Light Sciences Limited Partnership | Intracorporeal light treatment of blood |
US5843142A (en) | 1997-03-27 | 1998-12-01 | Sultan; Hashem | Voice activated loco motor device and method of use for spinal cord injuries |
US6647296B2 (en) | 1997-10-27 | 2003-11-11 | Neuropace, Inc. | Implantable apparatus for treating neurological disorders |
US6006124A (en) | 1998-05-01 | 1999-12-21 | Neuropace, Inc. | Means and method for the placement of brain electrodes |
US6161045A (en) | 1999-06-01 | 2000-12-12 | Neuropace, Inc. | Method for determining stimulation parameters for the treatment of epileptic seizures |
US7460904B2 (en) * | 2002-10-09 | 2008-12-02 | Wake Forest University Health Sciences | Wireless systems and methods for the detection of neural events using onboard processing |
-
2002
- 2002-10-24 US US10/278,853 patent/US7212851B2/en not_active Expired - Fee Related
-
2007
- 2007-03-23 US US11/723,999 patent/US20070169333A1/en not_active Abandoned
Patent Citations (99)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3837339A (en) * | 1972-02-03 | 1974-09-24 | Whittaker Corp | Blood glucose level monitoring-alarm system and method therefor |
US3850161A (en) * | 1973-04-09 | 1974-11-26 | S Liss | Method and apparatus for monitoring and counteracting excess brain electrical energy to prevent epileptic seizures and the like |
US4146029A (en) * | 1974-04-23 | 1979-03-27 | Ellinwood Jr Everett H | Self-powered implanted programmable medication system and method |
US4055175A (en) * | 1976-05-07 | 1977-10-25 | Miles Laboratories, Inc. | Blood glucose control apparatus |
US4461304A (en) * | 1979-11-05 | 1984-07-24 | Massachusetts Institute Of Technology | Microelectrode and assembly for parallel recording of neurol groups |
US4294245A (en) * | 1980-03-24 | 1981-10-13 | Stimtech, Inc. | Perioperative application of electronic pain control in combination with anesthetic agents |
US4360031A (en) * | 1980-09-11 | 1982-11-23 | Medtronic, Inc. | Drug dispensing irrigatable electrode |
US4690142A (en) * | 1980-12-10 | 1987-09-01 | Ross Sidney A | Method and system for utilizing electro-neuro stimulation in a bio-feedback system |
US4633889A (en) * | 1984-12-12 | 1987-01-06 | Andrew Talalla | Stimulation of cauda-equina spinal nerves |
US4837049A (en) * | 1986-06-17 | 1989-06-06 | Alfred E. Mann Foundation For Scientific Research | Method of making an electrode array |
US4969468A (en) * | 1986-06-17 | 1990-11-13 | Alfred E. Mann Foundation For Scientific Research | Electrode array for use in connection with a living body and method of manufacture |
US4876913A (en) * | 1986-09-09 | 1989-10-31 | Campagnolo S.P.A. | Gear selector for bicycle speed gears |
US4883666A (en) * | 1987-04-29 | 1989-11-28 | Massachusetts Institute Of Technology | Controlled drug delivery system for treatment of neural disorders |
US5156844A (en) * | 1987-11-17 | 1992-10-20 | Brown University Research Foundation | Neurological therapy system |
US4865048A (en) * | 1987-12-31 | 1989-09-12 | Eckerson Harold D | Method and apparatus for drug free neurostimulation |
US5037376A (en) * | 1988-07-22 | 1991-08-06 | The United States Of America As Represented By The Department Of Health And Human Services | Apparatus and method for transmitting prosthetic information to the brain |
US5458631A (en) * | 1989-01-06 | 1995-10-17 | Xavier; Ravi | Implantable catheter with electrical pulse nerve stimulators and drug delivery system |
US5474547A (en) * | 1989-06-21 | 1995-12-12 | Brown University Research Foundation | Implanting devices for the focal release of neuroinhibitory compounds |
US5119832A (en) * | 1989-07-11 | 1992-06-09 | Ravi Xavier | Epidural catheter with nerve stimulators |
US5361760A (en) * | 1989-11-07 | 1994-11-08 | University Of Utah Research Foundation | Impact inserter mechanism for implantation of a biomedical device |
US5215088A (en) * | 1989-11-07 | 1993-06-01 | The University Of Utah | Three-dimensional electrode device |
US6313093B1 (en) * | 1989-12-05 | 2001-11-06 | Chiron Corporation | Method for administering insulin to the brain |
US5325865A (en) * | 1990-02-26 | 1994-07-05 | Baxter International, Inc. | Intracranial pressure monitoring system |
US5081990A (en) * | 1990-05-11 | 1992-01-21 | New York University | Catheter for spinal epidural injection of drugs and measurement of evoked potentials |
US5388577A (en) * | 1990-06-08 | 1995-02-14 | Boston University | Electrode array microchip |
US5423877A (en) * | 1992-05-04 | 1995-06-13 | David C. Mackey | Method and device for acute pain management by simultaneous spinal cord electrical stimulation and drug infusion |
US5758651A (en) * | 1992-12-22 | 1998-06-02 | Nygard; Tony Mikeal | Telemetry system and apparatus |
US5692517A (en) * | 1993-01-06 | 1997-12-02 | Junker; Andrew | Brain-body actuated system |
US5928228A (en) * | 1993-03-16 | 1999-07-27 | Ep Technologies, Inc. | Flexible high density multiple electrode circuit assemblies employing ribbon cable |
US5445608A (en) * | 1993-08-16 | 1995-08-29 | James C. Chen | Method and apparatus for providing light-activated therapy |
US6577893B1 (en) * | 1993-09-04 | 2003-06-10 | Motorola, Inc. | Wireless medical diagnosis and monitoring equipment |
US5617871A (en) * | 1993-11-02 | 1997-04-08 | Quinton Instrument Company | Spread spectrum telemetry of physiological signals |
US5735885A (en) * | 1994-02-09 | 1998-04-07 | The University Of Iowa Research Foundation | Methods for implanting neural prosthetic for tinnitus |
US5855801A (en) * | 1994-06-06 | 1999-01-05 | Lin; Liwei | IC-processed microneedles |
US5638826A (en) * | 1995-06-01 | 1997-06-17 | Health Research, Inc. | Communication method and system using brain waves for multidimensional control |
US6254536B1 (en) * | 1995-08-02 | 2001-07-03 | Ibva Technologies, Inc. | Method and apparatus for measuring and analyzing physiological signals for active or passive control of physical and virtual spaces and the contents therein |
US20020169485A1 (en) * | 1995-10-16 | 2002-11-14 | Neuropace, Inc. | Differential neurostimulation therapy driven by physiological context |
US6185455B1 (en) * | 1996-02-20 | 2001-02-06 | Advanced Bionics Corporation | Method of reducing the incidence of medical complications using implantable microstimulators |
US6181965B1 (en) * | 1996-02-20 | 2001-01-30 | Advanced Bionics Corporation | Implantable microstimulator system for prevention of disorders |
US6113553A (en) * | 1996-03-05 | 2000-09-05 | Lifesensors, Inc. | Telemetric intracranial pressure monitoring system |
US6175762B1 (en) * | 1996-04-10 | 2001-01-16 | University Of Technology, Sydney | EEG based activation system |
US6094598A (en) * | 1996-04-25 | 2000-07-25 | Medtronics, Inc. | Method of treating movement disorders by brain stimulation and drug infusion |
US5713923A (en) * | 1996-05-13 | 1998-02-03 | Medtronic, Inc. | Techniques for treating epilepsy by brain stimulation and drug infusion |
US6169981B1 (en) * | 1996-06-04 | 2001-01-02 | Paul J. Werbos | 3-brain architecture for an intelligent decision and control system |
US5938690A (en) * | 1996-06-07 | 1999-08-17 | Advanced Neuromodulation Systems, Inc. | Pain management system and method |
US5687291A (en) * | 1996-06-27 | 1997-11-11 | The United States Of America As Represented By The Secretary Of The Army | Method and apparatus for estimating a cognitive decision made in response to a known stimulus from the corresponding single-event evoked cerebral potential |
US5797898A (en) * | 1996-07-02 | 1998-08-25 | Massachusetts Institute Of Technology | Microchip drug delivery devices |
US5814089A (en) * | 1996-12-18 | 1998-09-29 | Medtronic, Inc. | Leadless multisite implantable stimulus and diagnostic system |
US6086582A (en) * | 1997-03-13 | 2000-07-11 | Altman; Peter A. | Cardiac drug delivery system |
US6436708B1 (en) * | 1997-04-17 | 2002-08-20 | Paola Leone | Delivery system for gene therapy to the brain |
US6263237B1 (en) * | 1997-05-01 | 2001-07-17 | Medtronic, Inc. | Techniques for treating anxiety disorders by brain stimulation and drug infusion |
US6091015A (en) * | 1997-05-28 | 2000-07-18 | Universidad Politecnica De Cataluna | Photovoltaic energy supply system with optical fiber for implantable medical devices |
US5873840A (en) * | 1997-08-21 | 1999-02-23 | Neff; Samuel R. | Intracranial pressure monitoring system |
US6024702A (en) * | 1997-09-03 | 2000-02-15 | Pmt Corporation | Implantable electrode manufactured with flexible printed circuit |
US5938688A (en) * | 1997-10-22 | 1999-08-17 | Cornell Research Foundation, Inc. | Deep brain stimulation method |
US6427086B1 (en) * | 1997-10-27 | 2002-07-30 | Neuropace, Inc. | Means and method for the intracranial placement of a neurostimulator |
US6360122B1 (en) * | 1997-10-27 | 2002-03-19 | Neuropace, Inc. | Data recording methods for an implantable device |
US6134474A (en) * | 1997-10-27 | 2000-10-17 | Neuropace, Inc. | Responsive implantable system for the treatment of neurological disorders |
US6061593A (en) * | 1997-10-27 | 2000-05-09 | Neuropace, Inc. | EEG d-c voltage shift as a means for detecting the onset of a neurological event |
US6459936B2 (en) * | 1997-10-27 | 2002-10-01 | Neuropace, Inc. | Methods for responsively treating neurological disorders |
US6016449A (en) * | 1997-10-27 | 2000-01-18 | Neuropace, Inc. | System for treatment of neurological disorders |
US20020099412A1 (en) * | 1997-10-27 | 2002-07-25 | Neuropace, Inc. | Methods for using an implantable device for patient communication |
US20020002390A1 (en) * | 1997-10-27 | 2002-01-03 | Fischell Robert E. | Implantable neurostimulator having a data communication link |
US6354299B1 (en) * | 1997-10-27 | 2002-03-12 | Neuropace, Inc. | Implantable device for patient communication |
US6128538A (en) * | 1997-10-27 | 2000-10-03 | Neuropace, Inc. | Means and method for the treatment of neurological disorders |
US6092058A (en) * | 1998-01-08 | 2000-07-18 | The United States Of America As Represented By The Secretary Of The Army | Automatic aiding of human cognitive functions with computerized displays |
US20010027336A1 (en) * | 1998-01-20 | 2001-10-04 | Medtronic, Inc. | Combined micro-macro brain stimulation system |
US6240315B1 (en) * | 1998-02-25 | 2001-05-29 | Seung Kee Mo | Electrical apparatus for medical treatment using EMG envelope signal |
US6280394B1 (en) * | 1998-03-18 | 2001-08-28 | Sean R. Maloney | Apparatus and methods for detecting and processing EMG signals |
US6319241B1 (en) * | 1998-04-30 | 2001-11-20 | Medtronic, Inc. | Techniques for positioning therapy delivery elements within a spinal cord or a brain |
US5938689A (en) * | 1998-05-01 | 1999-08-17 | Neuropace, Inc. | Electrode configuration for a brain neuropacemaker |
US6027456A (en) * | 1998-07-10 | 2000-02-22 | Advanced Neuromodulation Systems, Inc. | Apparatus and method for positioning spinal cord stimulation leads |
US6024700A (en) * | 1998-07-16 | 2000-02-15 | Nemirovski; Guerman G. | System and method for detecting a thought and generating a control instruction in response thereto |
US6366813B1 (en) * | 1998-08-05 | 2002-04-02 | Dilorenzo Daniel J. | Apparatus and method for closed-loop intracranical stimulation for optimal control of neurological disease |
US6171239B1 (en) * | 1998-08-17 | 2001-01-09 | Emory University | Systems, methods, and devices for controlling external devices by signals derived directly from the nervous system |
US6309410B1 (en) * | 1998-08-26 | 2001-10-30 | Advanced Bionics Corporation | Cochlear electrode with drug delivery channel and method of making same |
US6125300A (en) * | 1998-09-11 | 2000-09-26 | Medtronic, Inc. | Implantable device with output circuitry for simultaneous stimulation at multiple sites |
US6038477A (en) * | 1998-12-23 | 2000-03-14 | Axon Engineering, Inc. | Multiple channel nerve stimulator with channel isolation |
US6358202B1 (en) * | 1999-01-25 | 2002-03-19 | Sun Microsystems, Inc. | Network for implanted computer devices |
US6154678A (en) * | 1999-03-19 | 2000-11-28 | Advanced Neuromodulation Systems, Inc. | Stimulation lead connector |
US6224549B1 (en) * | 1999-04-20 | 2001-05-01 | Nicolet Biomedical, Inc. | Medical signal monitoring and display |
US6216045B1 (en) * | 1999-04-26 | 2001-04-10 | Advanced Neuromodulation Systems, Inc. | Implantable lead and method of manufacture |
US20010023368A1 (en) * | 1999-04-26 | 2001-09-20 | Advanced Neuromodulation Systems, Inc. | Implantable lead and method of manufacture |
US6356784B1 (en) * | 1999-04-30 | 2002-03-12 | Medtronic, Inc. | Method of treating movement disorders by electrical stimulation and/or drug infusion of the pendunulopontine nucleus |
US20010029391A1 (en) * | 1999-12-07 | 2001-10-11 | George Mason University | Adaptive electric field modulation of neural systems |
US20020016638A1 (en) * | 1999-12-14 | 2002-02-07 | Partha Mitra | Neural prosthetic using temporal structure in the local field potential |
US6473639B1 (en) * | 2000-03-02 | 2002-10-29 | Neuropace, Inc. | Neurological event detection procedure using processed display channel based algorithms and devices incorporating these procedures |
US6466822B1 (en) * | 2000-04-05 | 2002-10-15 | Neuropace, Inc. | Multimodal neurostimulator and process of using it |
US6480743B1 (en) * | 2000-04-05 | 2002-11-12 | Neuropace, Inc. | System and method for adaptive brain stimulation |
US6353754B1 (en) * | 2000-04-24 | 2002-03-05 | Neuropace, Inc. | System for the creation of patient specific templates for epileptiform activity detection |
US6620415B2 (en) * | 2000-06-14 | 2003-09-16 | Allergan, Inc. | Parkinson's disease treatment |
US20020013612A1 (en) * | 2000-06-20 | 2002-01-31 | Whitehurst Todd K. | System and method for treatment of mood and/or anxiety disorders by electrical brain stimulation and/or drug infusion |
US20020077620A1 (en) * | 2000-12-18 | 2002-06-20 | Sweeney Robert J. | Drug delivery system for implantable medical device |
US20030004428A1 (en) * | 2001-06-28 | 2003-01-02 | Pless Benjamin D. | Seizure sensing and detection using an implantable device |
US20030083716A1 (en) * | 2001-10-23 | 2003-05-01 | Nicolelis Miguel A.L. | Intelligent brain pacemaker for real-time monitoring and controlling of epileptic seizures |
US20030093129A1 (en) * | 2001-10-29 | 2003-05-15 | Nicolelis Miguel A.L. | Closed loop brain machine interface |
US20030083724A1 (en) * | 2001-10-31 | 2003-05-01 | Mandar Jog | Multichannel electrode and methods of using same |
US20030082507A1 (en) * | 2001-10-31 | 2003-05-01 | Stypulkowski Paul H. | System and method of treating stuttering by neuromodulation |
US20040006264A1 (en) * | 2001-11-20 | 2004-01-08 | Mojarradi Mohammad M. | Neural prosthetic micro system |
Cited By (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090036752A1 (en) * | 2002-10-09 | 2009-02-05 | Deadwyler Sam A | Wireless systems and methods for the detection of neural events using onboard processing |
US20060085056A1 (en) * | 2004-10-19 | 2006-04-20 | Schouenborg Jens O R | Method and means for electrical stimulation of cutaneous sensory receptors |
US8417352B2 (en) | 2004-10-19 | 2013-04-09 | Meagan Medical, Inc. | System and method for stimulating sensory nerves |
US8386005B2 (en) | 2004-10-19 | 2013-02-26 | Meagan Medical, Inc. | Method for electrical stimulation of cutaneous sensory receptors |
US8086322B2 (en) * | 2004-10-19 | 2011-12-27 | Meagan Medical Inc. | Method and means for electrical stimulation of cutaneous sensory receptors |
US20100274327A1 (en) * | 2004-10-19 | 2010-10-28 | Meagan Medical, Inc. | System and method for stimulating sensory nerves |
US20060190058A1 (en) * | 2004-12-03 | 2006-08-24 | Greenberg Robert J | Visual prosthesis for improved circadian rhythms and method of improving the circadian rhythms |
US8200338B2 (en) * | 2004-12-03 | 2012-06-12 | Second Sight Medical Products, Inc. | Flexible circuit electrode array for improved layer adhesion |
US9480845B2 (en) | 2006-06-23 | 2016-11-01 | Cyberonics, Inc. | Nerve stimulation device with a wearable loop antenna |
US20100179436A1 (en) * | 2007-02-01 | 2010-07-15 | Moshe Sarfaty | Optical system for detection and characterization of abnormal tissue and cells |
US8865076B2 (en) * | 2007-02-01 | 2014-10-21 | Ls Biopath, Inc. | Methods for detection and characterization of abnormal tissue and cells using an electrical system |
US9566030B2 (en) | 2007-02-01 | 2017-02-14 | Ls Biopath, Inc. | Optical system for detection and characterization of abnormal tissue and cells |
US20100106047A1 (en) * | 2007-02-01 | 2010-04-29 | Ls Biopath, Inc. | Electrical methods for detection and characterization of abnormal tissue and cells |
US20100121173A1 (en) * | 2007-02-01 | 2010-05-13 | Moshe Sarfaty | Electrical systems for detection and characterization of abnormal tissue and cells |
US20130230883A1 (en) * | 2007-02-01 | 2013-09-05 | Ls Biopath, Inc. | Methods for detection and characterization of abnormal tissue and cells using an electrical system |
US8437845B2 (en) * | 2007-02-01 | 2013-05-07 | Ls Biopath, Inc. | Electrical methods for detection and characterization of abnormal tissue and cells |
US8417328B2 (en) * | 2007-02-01 | 2013-04-09 | Ls Biopath, Inc. | Electrical systems for detection and characterization of abnormal tissue and cells |
US20080221645A1 (en) * | 2007-03-06 | 2008-09-11 | Neural Signals, Inc. | Neurotrophic Electrode Neural Interface Employing Quantum Dots |
WO2009111618A2 (en) * | 2008-03-05 | 2009-09-11 | Neural Signals, Inc. | Neurotrophic electrode neural interface employing quantum dots |
WO2009111618A3 (en) * | 2008-03-05 | 2009-11-26 | Neural Signals, Inc. | Neurotrophic electrode neural interface employing quantum dots |
US8428732B2 (en) * | 2008-05-22 | 2013-04-23 | University Of Florida Research Foundation, Inc. | Neural interface systems and methods |
US20090292336A1 (en) * | 2008-05-22 | 2009-11-26 | Toshikazu Nishida | Neural interface systems and methods |
US8874201B2 (en) | 2008-09-30 | 2014-10-28 | National University Corporation NARA Institute of Science and Technology | Intracerebral information measuring device |
US20110178422A1 (en) * | 2008-09-30 | 2011-07-21 | National University Corporation NARA Institute of Science and Technology | Intracerebral information measuring device |
US8473072B2 (en) | 2010-06-08 | 2013-06-25 | Axelgaard Manufacturing Company, Ltd. | Customizable medical electrode |
US20120150061A1 (en) * | 2010-11-02 | 2012-06-14 | Industry-Academic Cooperation Foundation, Yonsei University | Sensor for Detecting Cancerous Tissue and Method of Manufacturing the Same |
CN103732284A (en) * | 2011-03-17 | 2014-04-16 | 布朗大学 | Implantable wireless neural device |
US10433754B2 (en) | 2011-03-17 | 2019-10-08 | Brown University | Implantable wireless neural device |
WO2012158834A1 (en) * | 2011-05-16 | 2012-11-22 | Second Sight Medical Products, Inc. | Cortical interface with an electrode array divided into separate fingers and/or with a wireless transceiver |
US10137303B2 (en) | 2011-05-16 | 2018-11-27 | Second Sight Medical Products, Inc. | Cortical interface for motor signal recording and sensory signal stimulation |
US10661083B2 (en) | 2013-02-21 | 2020-05-26 | Meagan Medical, Inc. | Cutaneous field stimulation with disposable and rechargeable components |
US9962546B2 (en) | 2013-02-21 | 2018-05-08 | Meagan Medical, Inc. | Cutaneous field stimulation with disposable and rechargeable components |
WO2014150561A1 (en) | 2013-03-15 | 2014-09-25 | Zyvex Labs, Llc | Three-dimensional multi-electrode array |
US9867979B2 (en) | 2013-03-15 | 2018-01-16 | Zyvex Labs, Llc | Three-dimensional multi-electrode array |
US9386954B2 (en) | 2013-03-15 | 2016-07-12 | Zyvex Labs, Llc | Method of fabricating a multi-electrode array |
CN105163797A (en) * | 2013-03-15 | 2015-12-16 | 塞威实验室有限责任公司 | Three-dimensional multi-electrode array |
US10799132B2 (en) | 2014-03-21 | 2020-10-13 | University Of Utah Research Foundation | Multi-site electrode arrays and methods of making the same |
WO2019152648A1 (en) * | 2018-02-02 | 2019-08-08 | Carnegie Mellon University | 3d printed microelectrode arrays |
Also Published As
Publication number | Publication date |
---|---|
US20040082875A1 (en) | 2004-04-29 |
US7212851B2 (en) | 2007-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7212851B2 (en) | Microstructured arrays for cortex interaction and related methods of manufacture and use | |
US7991475B1 (en) | High density micromachined electrode arrays useable for auditory nerve implants and related methods | |
EP1726329B1 (en) | Hermetically sealed three-dimensional electrode array | |
Akin et al. | A micromachined silicon sieve electrode for nerve regeneration applications | |
Wise et al. | Wireless implantable microsystems: high-density electronic interfaces to the nervous system | |
US8170638B2 (en) | MEMS flexible substrate neural probe and method of fabricating same | |
US9622677B1 (en) | Brain implant device | |
US9949376B2 (en) | Cortical implant system for brain stimulation and recording | |
EP2709716B1 (en) | Cortical interface with an electrode array divided into separate fingers and/or with a wireless transceiver | |
Hoogerwerf et al. | A three-dimensional microelectrode array for chronic neural recording | |
US5897583A (en) | Flexible artificial nerve plates | |
Ahmadi et al. | Towards a distributed, chronically-implantable neural interface | |
US10058263B2 (en) | Neural interface | |
US20130204317A1 (en) | Implantable device of the neural interface type and associated method | |
US20120123289A1 (en) | System and method for wireless transmission of neural data | |
US20110282179A1 (en) | Shielded stimulation and sensing system and method | |
WO2017199052A2 (en) | Implantable neural interface | |
US20180353750A1 (en) | Systems and Methods for Ruggedized Penetrating Medical Electrode Arrays | |
Hetke et al. | Silicon microelectrodes for extracellular recording | |
US8991680B1 (en) | Method of manufacture of an electrode array | |
Patrick et al. | Design and fabrication of a flexible substrate microelectrode array for brain machine interfaces | |
Martel et al. | Development of a wireless brain implant: The telemetric electrode array system (TEAS) project | |
Moxon et al. | Designing a brain-machine interface for neuroprosthetic control | |
US20050177039A1 (en) | Chronically implantable an artifact-free biomedical electrode assemblies | |
Perlin et al. | A compact architecture for three-dimensional neural microelectrode arrays |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
|
AS | Assignment |
Owner name: NATIONAL INSTITUTES OF HEALTH (NIH), U.S. DEPT. OF Free format text: EXECUTIVE ORDER 9424, CONFIRMATORY LICENSE;ASSIGNOR:BROWN UNIVERSITY;REEL/FRAME:022275/0756 Effective date: 20080927 |