US20070144768A1 - Composite circuit board and method for manufacturing the same - Google Patents

Composite circuit board and method for manufacturing the same Download PDF

Info

Publication number
US20070144768A1
US20070144768A1 US11/319,998 US31999805A US2007144768A1 US 20070144768 A1 US20070144768 A1 US 20070144768A1 US 31999805 A US31999805 A US 31999805A US 2007144768 A1 US2007144768 A1 US 2007144768A1
Authority
US
United States
Prior art keywords
soft
rigid panel
canceled
composite circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US11/319,998
Other versions
US7234230B1 (en
Inventor
Ting-Hao Lin
Chung-yuan Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gold Circuit Electronics Ltd
Original Assignee
Gold Circuit Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gold Circuit Electronics Ltd filed Critical Gold Circuit Electronics Ltd
Priority to US11/319,998 priority Critical patent/US7234230B1/en
Assigned to GOLD CIRCUIT ELECTRONICS LTD. reassignment GOLD CIRCUIT ELECTRONICS LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHUNG-YUAN, LIN, TING-HAO
Application granted granted Critical
Publication of US7234230B1 publication Critical patent/US7234230B1/en
Publication of US20070144768A1 publication Critical patent/US20070144768A1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Definitions

  • the present invention relates to a composite circuit board and a method, and more particularly to a composite circuit board that comprises multiple soft panels on a single rigid panel and a method for manufacturing the same.
  • a conventional composite circuit board comprises a soft panel with circuitry and a rigid panel on which the soft panel is mounted.
  • the advantage of the composite circuit board over a conventional printed circuit board is superior thinness and lightness.
  • the composite circuit board is widely used in electronic products and in military applications.
  • a conventional composite circuit board has a soft panel ( 30 ) and a rigid panel ( 40 ), on which the soft panel ( 30 ) is mounted.
  • the soft panel ( 30 ) is the same size as that of the rigid panel ( 40 ).
  • Electronic circuitry is provided on the soft panel ( 30 ) and multiple holes ( 31 ) are defined near the edges of the soft panel ( 30 ).
  • the rigid panel ( 40 ) has multiple through holes (not numbered) near the edges corresponding to the respective holes ( 31 ) in the soft panel ( 30 ). Multiple locating pins ( 41 ) are inserted respectively through the multiple through holes in the rigid panel ( 40 ).
  • the multiple holes ( 31 ) and corresponding multiple locating pins ( 41 ) are configured such that the soft panel ( 30 ) will be in proper alignment when mounted on the rigid panel ( 40 ).
  • the soft panel ( 30 ) and the rigid panel ( 40 ) are bonded together under heat and pressure to form a composite circuit board.
  • the soft panel ( 30 ) and the rigid panel ( 40 ) are made of different material and have different expansion and contraction rates when heated or cooled. Hence, it is difficult for the soft panel ( 30 ) to remain in proper alignment on the rigid panel ( 40 ) and the further processing of the composite circuit board, such as exposure or drilling, is made difficult. Furthermore, as panel size increases, the degree of the alignment problem is multiplied. Hence, the panel sizes for composite circuit boards are limited to between 250 mm to 500 mm.
  • the invention provides a composite circuit board to mitigate or obviate the aforementioned problems.
  • the main objective of the present invention is to provide a composite circuit board, on which multiple soft panels are mounted on a rigid panel accurately and remain in proper alignment after bonding.
  • FIG. 1 is a top view of a soft panel of a composite circuit board in accordance with the present invention
  • FIG. 2 is a perspective view of two soft panels of the composite circuit board in accordance with the present invention.
  • FIG. 3 is a perspective view of a rigid panel combined with multiple soft panels of the composite circuit board in accordance with the present invention.
  • FIG. 4 is an exploded perspective view of a conventional composite circuit board.
  • a large soft panel ( 10 ) has multiple circuit groups ( 11 ) mounted thereon and in alignment with each other. Multiple circuit units ( 12 ) are formed in rows in the circuit groups ( 11 ). Multiple holes ( 14 ) are defined in the periphery of each circuit group ( 11 ).
  • the large soft panel ( 10 ) is then divided into the multiple smaller soft panels ( 13 ) and the multiple holes ( 14 ) are now defined in the corners of the smaller soft panels ( 13 ).
  • a preferred embodiment of a composite circuit board comprises multiple soft panels ( 13 ) and a rigid panel ( 20 ).
  • the rigid panel ( 20 ) formed as a single-level panel or combined with multi-levels panels, has a connection surface ( 21 ) formed on a top surface.
  • Multiple zones ( 22 ) are defined on the rigid panel ( 20 ) and are in alignment with each other.
  • Each zone ( 22 ) has circuitry provided thereon and multiple openings ( 23 ) are defined in the comers of each zone ( 22 ) to correspond to the holes ( 14 ) in the soft panels ( 13 ).
  • Multiple locating pins ( 24 ) are mounted in the openings ( 23 ) in the rigid panel ( 20 ).
  • the soft panels ( 13 ) are mounted on the connecting surface ( 21 ) and aligned in the respective zones ( 22 ) by the locating pins ( 24 ) on the rigid panel ( 20 ) and the corresponding holes ( 14 ) in the soft panels ( 13 ).
  • the soft panels ( 13 ) are then molecularly bonded to the rigid panel ( 20 ) under heat and pressure.
  • a method for manufacturing a composite circuit board in accordance with the present invention comprises acts of:
  • the soft panels ( 13 ) is secured to the rigid panel ( 20 ) with a pre-securing process before being molecularly bonded to the rigid panel ( 20 ) via fasteners, ultrasonic weld, or heat weld.
  • the soft panels are bonded on the rigid panel via heat welding, the degree of expansion and contraction is smaller relative to the smaller size of the soft panels. Therefore, the soft panels can be mounted on the rigid panel accurately and remain in proper alignment.
  • Soft panels of different sizes or with different circuitry can be mounted on a single rigid panel so that composite circuit board of different sizes or types can be easily produced and would help lower manufacturing costs.

Abstract

A composite circuit board comprises multiple soft panels evenly mounted on a rigid panel. The soft panels are positioned on the rigid panel in proper alignment via locating pins on the rigid panel and corresponding holes in the soft panels. The soft panels are securely bonded to the rigid panel to form the composite circuit boards. The smaller size of the soft panels minimizes the alignment problems caused by the different heat expansion rates of the soft panel and the rigid panel.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a composite circuit board and a method, and more particularly to a composite circuit board that comprises multiple soft panels on a single rigid panel and a method for manufacturing the same.
  • 2. Description of the Related Art
  • A conventional composite circuit board comprises a soft panel with circuitry and a rigid panel on which the soft panel is mounted. The advantage of the composite circuit board over a conventional printed circuit board is superior thinness and lightness. The composite circuit board is widely used in electronic products and in military applications.
  • With reference to FIG. 4, a conventional composite circuit board has a soft panel (30) and a rigid panel (40), on which the soft panel (30) is mounted. The soft panel (30) is the same size as that of the rigid panel (40). Electronic circuitry is provided on the soft panel (30) and multiple holes (31) are defined near the edges of the soft panel (30). The rigid panel (40) has multiple through holes (not numbered) near the edges corresponding to the respective holes (31) in the soft panel (30). Multiple locating pins (41) are inserted respectively through the multiple through holes in the rigid panel (40). The multiple holes (31) and corresponding multiple locating pins (41) are configured such that the soft panel (30) will be in proper alignment when mounted on the rigid panel (40). The soft panel (30) and the rigid panel (40) are bonded together under heat and pressure to form a composite circuit board.
  • However, the soft panel (30) and the rigid panel (40) are made of different material and have different expansion and contraction rates when heated or cooled. Hence, it is difficult for the soft panel (30) to remain in proper alignment on the rigid panel (40) and the further processing of the composite circuit board, such as exposure or drilling, is made difficult. Furthermore, as panel size increases, the degree of the alignment problem is multiplied. Hence, the panel sizes for composite circuit boards are limited to between 250 mm to 500 mm.
  • Therefore, the invention provides a composite circuit board to mitigate or obviate the aforementioned problems.
    • SUMMARY OF THE INVENTION
  • The main objective of the present invention is to provide a composite circuit board, on which multiple soft panels are mounted on a rigid panel accurately and remain in proper alignment after bonding.
  • Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a top view of a soft panel of a composite circuit board in accordance with the present invention;
  • FIG. 2 is a perspective view of two soft panels of the composite circuit board in accordance with the present invention;
  • FIG. 3 is a perspective view of a rigid panel combined with multiple soft panels of the composite circuit board in accordance with the present invention; and
  • FIG. 4 is an exploded perspective view of a conventional composite circuit board.
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • With reference to FIG. 1, a large soft panel (10) has multiple circuit groups (11) mounted thereon and in alignment with each other. Multiple circuit units (12) are formed in rows in the circuit groups (11). Multiple holes (14) are defined in the periphery of each circuit group (11).
  • With reference to FIG. 2, the large soft panel (10) is then divided into the multiple smaller soft panels (13) and the multiple holes (14) are now defined in the corners of the smaller soft panels (13).
  • With reference to FIG. 3, a preferred embodiment of a composite circuit board comprises multiple soft panels (13) and a rigid panel (20). The rigid panel (20), formed as a single-level panel or combined with multi-levels panels, has a connection surface (21) formed on a top surface. Multiple zones (22) are defined on the rigid panel (20) and are in alignment with each other. Each zone (22) has circuitry provided thereon and multiple openings (23) are defined in the comers of each zone (22) to correspond to the holes (14) in the soft panels (13). Multiple locating pins (24) are mounted in the openings (23) in the rigid panel (20).
  • During assembly, the soft panels (13) are mounted on the connecting surface (21) and aligned in the respective zones (22) by the locating pins (24) on the rigid panel (20) and the corresponding holes (14) in the soft panels (13). The soft panels (13) are then molecularly bonded to the rigid panel (20) under heat and pressure.
  • A method for manufacturing a composite circuit board in accordance with the present invention comprises acts of:
  • (a) providing multiple soft panels (13);
  • (b) providing a rigid panel (20) larger than each soft panel (13)
  • (c) putting the soft panels (13) on the connecting surface (21) and aligned in the respective zones (22), by the locating pins (24) mounted in the rigid panel (20) and the corresponding holes (14) in the soft panels (13);
  • (d) molecularly bonding the soft panels (13) bonded to the rigid panel (20) under heat and pressure; and
  • (e) dividing the rigid panel (20) into multiple pieces according to the soft panels (13) for form multiple composite circuit boards.
  • In other preferred embodiments of the composite circuit board, the soft panels (13) is secured to the rigid panel (20) with a pre-securing process before being molecularly bonded to the rigid panel (20) via fasteners, ultrasonic weld, or heat weld.
  • The advantages of the composite circuit board in accordance with the present invention are described as follows:
  • 1. When the soft panels are bonded on the rigid panel via heat welding, the degree of expansion and contraction is smaller relative to the smaller size of the soft panels. Therefore, the soft panels can be mounted on the rigid panel accurately and remain in proper alignment.
  • 2. Soft panels of different sizes or with different circuitry can be mounted on a single rigid panel so that composite circuit board of different sizes or types can be easily produced and would help lower manufacturing costs.
  • It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only. Changes may be made in the details, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (15)

1. (canceled)
2. (canceled)
3. (canceled)
4. (canceled)
5. (canceled)
6. (canceled)
7. (canceled)
8. (canceled)
9. (canceled)
10. (canceled)
11. A method for manufacturing a composite circuit board comprising acts of:
providing multiple soft panels having circuit groups in alignment and multiple holes defined in a periphery of each circuit group;
providing a rigid panel larger than each soft panel and having
a connecting surface formed on a top surface thereof,
multiple zones in alignment defined on the connecting surface and having
circuits and,
multiple openings defined in corners in which
multiple locating pins are mounted, respectively;
putting the soft panels on the connecting surface and aligned in the respective zones, by the locating pins mounted in the rigid panel and the corresponding holes in the soft panels;
molecularly bonding the soft panels bonded to the rigid panel under heat and pressure; and
dividing the rigid panel into multiple pieces according to the soft panels to form multiple composite circuit boards.
12. The method for manufacturing a composite circuit board as claimed in claim 11 further comprising a pre-securing process of securing the soft panels to the rigid panel before the soft panels being molecularly bonded to the rigid panel.
13. The method for manufacturing a composite circuit board as claimed in claim 12, wherein the pre-securing process is securing the soft panels to the rigid panel via fasteners.
14. The method for manufacturing a composite circuit board as claimed in claim 12, wherein the pre-securing process is securing the soft panels to the rigid panel via ultrasonic weld.
15. The method for manufacturing a composite circuit board as claimed in claim 12, wherein the pre-securing process is securing the soft panels to the rigid panel via heat weld.
US11/319,998 2005-12-27 2005-12-27 Composite circuit board and method for manufacturing the same Expired - Fee Related US7234230B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/319,998 US7234230B1 (en) 2005-12-27 2005-12-27 Composite circuit board and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/319,998 US7234230B1 (en) 2005-12-27 2005-12-27 Composite circuit board and method for manufacturing the same

Publications (2)

Publication Number Publication Date
US7234230B1 US7234230B1 (en) 2007-06-26
US20070144768A1 true US20070144768A1 (en) 2007-06-28

Family

ID=38178644

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/319,998 Expired - Fee Related US7234230B1 (en) 2005-12-27 2005-12-27 Composite circuit board and method for manufacturing the same

Country Status (1)

Country Link
US (1) US7234230B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2919781A1 (en) * 2007-07-31 2009-02-06 Beauce Realisations Et Etudes METHOD OF MANUFACTURING A SEMI-FLEXIBLE PRINTED CIRCUIT, PLATE USED FOR SUCH A METHOD, PRINTED CIRCUIT AND ELECTRONIC DEVICE THEREFOR

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761795A (en) * 1994-10-05 1998-06-09 Enplas Corporation Pressing apparatus for connecting terminals of flexible circuit board
US5899757A (en) * 1997-11-03 1999-05-04 Intercon Systems, Inc. Compression connector
US6036502A (en) * 1997-11-03 2000-03-14 Intercon Systems, Inc. Flexible circuit compression connector system and method of manufacture
US6258627B1 (en) * 1999-01-19 2001-07-10 International Business Machines Corporation Underfill preform interposer for joining chip to substrate
US20020129894A1 (en) * 2001-01-08 2002-09-19 Kuo-Chuan Liu Method for joining and an ultra-high density interconnect

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761795A (en) * 1994-10-05 1998-06-09 Enplas Corporation Pressing apparatus for connecting terminals of flexible circuit board
US5899757A (en) * 1997-11-03 1999-05-04 Intercon Systems, Inc. Compression connector
US6036502A (en) * 1997-11-03 2000-03-14 Intercon Systems, Inc. Flexible circuit compression connector system and method of manufacture
US6258627B1 (en) * 1999-01-19 2001-07-10 International Business Machines Corporation Underfill preform interposer for joining chip to substrate
US20020129894A1 (en) * 2001-01-08 2002-09-19 Kuo-Chuan Liu Method for joining and an ultra-high density interconnect

Also Published As

Publication number Publication date
US7234230B1 (en) 2007-06-26

Similar Documents

Publication Publication Date Title
CN103247233B (en) Flexible base, board, display device and attach the method for electron device on flexible substrates
JP3202426U (en) Ceramic embedded circuit board
US20080044689A1 (en) Pallet-type membrane electrode assembly layer structure
US7234230B1 (en) Composite circuit board and method for manufacturing the same
TW200720753A (en) Anisotropic conductive film and flat panel display using the same, and method for manufacturing the same
US9560746B1 (en) Stress relief for rigid components on flexible circuits
CN207589281U (en) A kind of wiring board and camera module
CN203276737U (en) Flexible substrate and display device
CN105357864A (en) Multilayer circuit board and manufacturing method
KR20110058183A (en) Method for manufacturing ic card
US20140110152A1 (en) Printed circuit board and method for manufacturing same
EP1965614A4 (en) Circuit board connecting structure, circuit board connecting section, and electronic apparatus
CN109275282A (en) Assembly method, circuit board and the electronic equipment of circuit board
US20060164818A1 (en) Electronic assembly having a substrate laminated within a backplate cavity
CN106358387A (en) Combining method of PCB inner-layer boards
JP2000340895A (en) Wiring board and manufacture thereof
JPH0531838B2 (en)
JP2003283094A (en) Method for manufacturing flexible printed wiring board with reinforcing sheet
CN220235050U (en) Inner layer board
US20050064222A1 (en) Component and method for manufacturing printed circuit boards
CN108811370B (en) Method for manufacturing high-frequency multilayer circuit board
JPS61224497A (en) Manufacture of multilayer board
US11252824B2 (en) Method for fabricating printed circuit board and printed circuit board fabricated thereby
US20120318562A1 (en) Working panel and working panel set comprising array board patterns
JP2015509284A (en) Method and apparatus for bonding a plurality of substrates

Legal Events

Date Code Title Description
AS Assignment

Owner name: GOLD CIRCUIT ELECTRONICS LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, TING-HAO;CHEN, CHUNG-YUAN;REEL/FRAME:017423/0952

Effective date: 20051222

FPAY Fee payment

Year of fee payment: 4

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20150626