US20070134901A1 - Growth of GaAs expitaxial layers on Si substrate by using a novel GeSi buffer layer - Google Patents

Growth of GaAs expitaxial layers on Si substrate by using a novel GeSi buffer layer Download PDF

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US20070134901A1
US20070134901A1 US11/652,639 US65263907A US2007134901A1 US 20070134901 A1 US20070134901 A1 US 20070134901A1 US 65263907 A US65263907 A US 65263907A US 2007134901 A1 US2007134901 A1 US 2007134901A1
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layer
gaas
epitaixial
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sige
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Edward Chang
Guangli Luo
Tsung-Hsi Yang
Chun-Yen Chang
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National Chiao Tung University NCTU
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02441—Group 14 semiconducting materials
    • H01L21/0245—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02494—Structure
    • H01L21/02496—Layer structure
    • H01L21/02505—Layer structure consisting of more than two layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/02546—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound

Definitions

  • This invention relates to a process for manufacturing semiconductor structure or devices, more particular for growing a high quality Ge film on Si substrate using a novel GeSi buffer method and additionally growing a high quality Group III-V, such as GaAs epitaixial layer on the grown Ge/SiGe/Si substrate.
  • GaAs or other III-V compound semiconductors on silicon substrate is recognized as a desirable goal for the fabrication of advanced semiconductor devices. Specific advantages of this combinations of materials include the availability of GaAs with high electron mobility and optical activity on a silicon substrate with improved mechanical strength and thermal conductivity over that obtainable with GaAs substrate. In addition, the growth of high quality GaAs on silicon offers the possibility of monolithically integrating GaAs and silicon devices for advanced electronic components.
  • Presently public techniques to overcome the defects produced from the growth of GaAs on Si substrate include varying epitaixial growth conditions for directly growing GaAs epitaxy on Si, applying strained supper lattices buffer to filter threading dislocation and using Ge composition graded SiGe layers as buffer.
  • the technique which uses interlayer as buffer for growing GaAs on Si that is, a structure of GaAs/interlayer/Si, as we know the interlayer can include SeS 2 , ZnSe or STO film.
  • an bonding technique disclosed in “High-quality GaAs on Si substrate by the epitaixial lift-off technique using SeS 2 ” (Applied Physics Letters, Vol. 75, No. 24, 13 Dec. 1999) from M. Umeno et al., which describes that a GaAs wafer is bonded to silicon substrate using SeS 2 as the interlayer and the desirable GaAs layer is acquired by applying the lift-off technique.
  • these arts obviously make some problems, such as high fabricating cost and no large scale of GaAs epitaxy on Si substrate to be obtained.
  • the roughness is over 150 ⁇ ; comparatively, it gains a surface roughness of over 450 ⁇ for growing without degrees.
  • high surface roughness due to thick epitaixial layer and cross hatch pattern will increase the fabrication cost of epitaxy and cause difficulties in device producing.
  • CMP chemical-mechanical polishing
  • a first object of this invention is to solve hereinabove problems, as for growing Ge epitaxy on Si by using a novel method, including how to lower the thickness of Ge epitaixial layers, to flatten the surface roughness induced from high Ge-composition epitaixial layers without help of CMP, and to lower the high defects density due to lattice mismatch.
  • the epitaixial semiconductor structure has been disclosed in relevant patents and references from E. A. Fitzgerald et al., wherein the structure contains a Ge composition graded buffer layer and a Ge-composition uniform layer, however it is with a total epitaixial layer thickness of over 10 ⁇ m.
  • the process disclosed herein is on a silicon substrate, which a first Ge composition graded SiGe epitaixial layer on said substrate is grown by using molecular beam epitaxy (MBE) or ultra-high vacuum chemical vapor deposition, generally at a grading rate of 10% Ge composition per ⁇ m of layers and gradually reaching to 50% of Ge composition, then the surface of said layers is planarized by using chemical-mechanical polishing (CMP).
  • MBE molecular beam epitaxy
  • CMP chemical-mechanical polishing
  • the thickness of the first layer is about 5 ⁇ m.
  • a second layer comprising Ge composition from 50% to 75% is grown and a further planarizing the surface of said second layer by using CMP is performed.
  • the thickness of the second layer is about 2.5 ⁇ m.
  • the product of best mode is a epitaxy layer with no surface cracking, threading dislocation density of about 10 6 /cm 2 , particles density on surface of about 150 /cm 2 , roughness of 24 m and a total epitaixial layer thickness of at least 10 ⁇ m.
  • the conception of the process for this invention is, firstly growing a high Ge-composition epitaixial layer, such as Si 0.1 Ge 0.9 in a thickness of 0.5 ⁇ 0.8 ⁇ m on Si substrate, in which many dislocations are generated and located near the interfaces and in the low of part of this layer due to the large mismatch between this layer and Si substrate. Subsequently growing two or three layers of more high Ge-composition epitaixial layers, such as Si 0.05 Ge 0.95 and /or Si 0.02 Ge 0.98 in a thickness of 0.5 ⁇ 0.8 ⁇ m. The formed strained interfaces between said layers can bend and terminate the propagated upward dislocation from the first layer very effectively. Then, growing a final film of pure Ge on herein epitaixial layer and a total epitaixial thickness is of only several micrometers, such as below 3 micrometer.
  • a high Ge-composition epitaixial layer such as Si 0.1 Ge 0.9 in a thickness of 0.5 ⁇ 0.8
  • the in-situ high temperature annealing for each layers is performed in growing process therein, and carried out under the temperature of from 650 to 800° C., and 15 ⁇ 30 minutes to further promote the quality of single crystalline of the Ge film.
  • the invention applying high Ge content, such as initial Si 0.1 Ge 0.9 layer as the first layer SiGe epitaixial layer and then providing further high Ge-composition layers, such as a layer of Si 0.05 Ge 0.95 and/or an optional Si 0.1 Ge 0.9 layer, is for the purpose of applying the formed strained interfaces between the said layers to bend and terminate the propagated upward dislocation from the first layer.
  • this invention has apparently different conception from prior orts having growing pattern of Ge composition graded at a constant grading rate of 5% or 10% from zero to 100% and that will be at least 10 ⁇ m in thickness of a total SiGe epitaixial layers according to the grading rate herein.
  • this invention it is of high possibility for this invention to have a total thickness of below 3 ⁇ m.
  • FIG. 1 is a schematic diagram of this invention for growing mechanism of Ge epitaxy on Si substrate, which shows the conception that the strained interface blocks the threading dislocation to be generated and locks that dislocation near the interface.
  • FIG. 2 and 3 are cross-sectional (XTEM) and plane-view transmission electronic microscope micrographs of the sample according to this invention, wherein the sample obtained has a total thickness SiGe epitaixial layers of about 2.6 ⁇ m., threading dislocation density of about 3 ⁇ 10 6 /cm 2 on the top Ge layer, and surface roughness of 3.2 nm.
  • FIG. 4 is the analysis of the atomic force microscope micrograph of the surface roughness of the sample according to this invention, which shows the sample having a very smooth surface.
  • This process for the growth of SiGe epitaxy which is based upon ultra-high vacuum chemical vapor deposition and using SiH 4 /Si 2 H 6 ,GeH 4 as growth gases, is carried out at a temperature ranging from 350° C. to 650° C. and a pressure ranging from 20 m-Torr to 100 m-Torr for growth gases herein, and whatever a first, a second and/or an optional third layers grown is under the same conditions except the feeding flow of either SiH 4 /Si 2 H 6 or GeH 4 .
  • the low temperature growing for Ge epitaxy is to prevent island formation and downgrade the quality of Ge epitaxy, and further, the pressure is to control the growing velocity for Ge epitaxy, and both factors including temperature and pressure are preferably kept constant.
  • those prior arts for growth of Ge composition graded epitaixial layers in order to keep the Ge grading rate at a constant, it must be controlled carefully to increase Ge content. For example, to reduce the threading dislocation density of said layers, lower a grading rate for Ge content is selected and more thickly a total epitaxy thickness is formed. In another aspect, if a higher grading rate, such as more than 10% of Ge composition per micrometer of layers is selected, it will fast increase the threading dislocation density.
  • Prior arts further comprise planarization for each epitaixial layer after per growth cycle, said planarization such as chemical-mechanical polishing is to eliminate the surface roughness prior to a next layer on said surface.
  • this invention more particularly allows to provide a surface having more equivalently smooth-faced than that is planarized by using CMP, this invention achieves that by means of different dislocation reducing mechanism as described above.
  • a second object of this invention is to solve the problems in prior arts, which concerns the growth of GaAs epitaixial layers on silicon substrate by using interlayer, more particularly using Si 1-x Ge x as buffer.
  • the invention provides a different solution to grow the epitaixial layers having reduced total thickness, smoother surface and lower defects density.
  • the conception of the process for this invention is, firstly growing a high Ge-composition epitaixial layer, such as Si 0.1 Ge 0.9 in a thickness of 0.5 ⁇ 0.8 ⁇ m on Si substrate, in which many dislocations are generated and located near the interface and in the low of the part of this layer due to large mismatch between this layer and Si substrate. Subsequently growing two or three layers of more high Ge-composition epitaixial layers, such as Si 0.05 Ge 0.95 and/or Si 0.02 Ge 0.98 in a thickness of 0.5 ⁇ 0.8 ⁇ m. The formed strained interfaces of said layers can bend and terminate the propagated upward dislocation from the first layer very effectively.
  • a high Ge-composition epitaixial layer such as Si 0.1 Ge 0.9 in a thickness of 0.5 ⁇ 0.8 ⁇ m on Si substrate, in which many dislocations are generated and located near the interface and in the low of the part of this layer due to large mismatch between this layer and Si substrate.
  • the thickness of a total epitaixial SiGe layer neglecting the additional GaAs layer allows to be, limited below 3 ⁇ m substantially.
  • FIG. 5 is a XRD micrograph of the GaAs/SiGe/Si epitaixial layer sample according to this invention, wherein the sample is obtained with a very high quality for single crystalline.
  • FIG. 6 is a cross-sectional transmission electronic microscope (XTEM) micrograph of the sample according to this invention, and also shows a very good single crystalline quality.
  • XTEM transmission electronic microscope
  • Another object of the invention is to be used in fabrication of high-speed devices and optical devices based on Ge/Si and GaAs/Ge/Si materials, such as Ge MOSFET combined with high-k gate material, Ge photodetector, GaAs HBT, MESFET, HEMET, LED, Laser etc, and future possible integrate of IV and III-V devices on the same Si wafer.
  • Ge MOSFET combined with high-k gate material, Ge photodetector, GaAs HBT, MESFET, HEMET, LED, Laser etc, and future possible integrate of IV and III-V devices on the same Si wafer.
  • pre-cleaning the silicon wafer in a standard cleaning procedure wherein the cleaning treatment comprises steps of boiling the silicon wafer in a solution containing the mixtures of H 2 O 2 :H 2 SO 4 with the ratio 1:4 in about 10 min., then taking and rinsing it with de-ion water in 10 min., furthermore dipping it in a solution of 10% HF in 30 seconds and subsequently further taking and rinsing it into de-ion water loading the wafer into a UHVCVD system immediately after said cleaning and prebaking the wafer at 850° C. in 10 min to remove the native oxided layer and then cooling the temperature of UHVCVD system down to 400° C.
  • the cleaning treatment comprises steps of boiling the silicon wafer in a solution containing the mixtures of H 2 O 2 :H 2 SO 4 with the ratio 1:4 in about 10 min., then taking and rinsing it with de-ion water in 10 min., furthermore dipping it in a solution of 10% HF in 30 seconds and
  • UHVCVD system is a quartz tube furnace equipped with heating sources, and the background is vacuumed by a molecular pump to a pressure of lower than 5 ⁇ 10 ⁇ 8 torr.
  • Growth gases including SiH 4 and GeH 4 , which regulated by mass flow controller (MFC) to adjust the feeding flows of the gases.
  • MFC mass flow controller
  • a second or a third higher Ge-composition SiGe epitaixial layer being in a thickness of, such as at least 0.1 ⁇ m, preferably 0.5 ⁇ 0.8 ⁇ m, most preferably 0.8 ⁇ m on the first layer subsequently growing a film of Ge on said uppermost epitaixial layer in a thickness of, such as 1 ⁇ m.
  • each of epitaixial layers needs in-situ high temperature annealing to further promote the quality of Ge and GaAs epitaxy, i.e., the conditions are a temperature of 650 ⁇ 800° C., preferably 750° C., 0.25 to 1 hour, and at a pressure of 5 to 20 m-Torr using hydrogen as atmosphere of said annealing.
  • the Ge composition of first layer is at least 70%, preferably 70 ⁇ 90%, most preferably 90%
  • the Ge composition of second layer is ranging within 80 ⁇ 98%, preferably 95%.
  • the growth of third layer is optionally carried out depending upon the growth results of epitaxy, wherein the Ge content is decided between which of second and pure Ge.
  • the uppermost lay is pure Ge, which has almost the same lattice constant as GaAs, thus GaAs epitaxy is grown on Ge film therein and is without mismatch at the interface.
  • a first layer Si 0.1 Ge 0.9 having about 0.8 ⁇ m in thickness is obtained in conditions that growth temperature is 400° C., growth gases pressure is 20 m-Torr, and is further in-situ treated by annealing at 750° C.,in 15 min.
  • a second layer Si 0.05 Ge 0.95 having about 0.8 ⁇ m in thickness is formed in conditions that growth temperature is 400° C.,growth gases pressure is 20 m-Torr, and is further in-situ treated by annealing at 750° C., in 15 min.
  • optional third layer which is Si 0.02 Ge 0.98 having about 0.8 ⁇ m in thickness is also obtained in conditions that growth temperature is 400° C.,growth gases pressure is 20 m-Torr, and is treated by annealing at 750° C., in 15 min.
  • uppermost layer which is pure Ge having about 1.0 ⁇ m in thickness is formed in conditions that growth temperature is 400° C.,growth gases pressure is 20 m-Torr, and is also in-situ treated by annealing at 750° C. in 15 min.
  • GaAs epitaxy For the purpose of growing GaAs epitaxy on achieved Ge epitaixial layers, it is carried out at 650° C. by using metal organic chemical vapor deposition equipment.
  • the thickness of epitaixial GaAs depends on the device requirement.

Abstract

This invention provides a process for growing Ge epitaixial layers on Si substrate by using ultra-high vacuum chemical vapor deposition (UHVCVD), and subsequently growing a GaAs layer on Ge film of the surface of said Ge epitaixial layers by using metal organic chemical vapor deposition (MOCVD).
The process comprises steps of, firstly, pre-cleaning a silicon wafer in a standard cleaning procedure, dipping it with HF solution and prebaking to remove its native oxide layer. Then, growing a high Ge-composition epitaixial layer, such as Si0.1Ge0.9 in a thickness of 0.8 μm on said Si substrate by using ultra-high vacuum chemical vapor deposition under certain conditions. Thus, many dislocations are generated and located near the interface and in the low of part of Si0.1Ge0.9 due to the large mismatch between this layer and Si substrate.
Furthermore, a subsequent 0.8 μm Si0.05Ge0.95 layer, and/or optionally a further 0.8 μm Si0.02Ge0.98 layer, are grown. They form strained interfaces of said layers can bend and terminate the propagated upward dislocation very effectively. Therefore, a film of pure Ge is grown on the surface of said epitaixial layers. Finally, a GaAs epitaixial layer is grown on said Ge film by using MOCVD.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • This invention relates to a process for manufacturing semiconductor structure or devices, more particular for growing a high quality Ge film on Si substrate using a novel GeSi buffer method and additionally growing a high quality Group III-V, such as GaAs epitaixial layer on the grown Ge/SiGe/Si substrate.
  • 2. Description of Related Art
  • The growth of high quality GaAs or other III-V compound semiconductors on silicon substrate is recognized as a desirable goal for the fabrication of advanced semiconductor devices. Specific advantages of this combinations of materials include the availability of GaAs with high electron mobility and optical activity on a silicon substrate with improved mechanical strength and thermal conductivity over that obtainable with GaAs substrate. In addition, the growth of high quality GaAs on silicon offers the possibility of monolithically integrating GaAs and silicon devices for advanced electronic components.
  • However, one of the key limitations in the implementation of device structure based on heteroepitaixial GaAs on silicon has a 4.0% difference in lattice constant and additional intrinsic thermal conductivity difference between the two different materials. This lattice mismatch leads to the formation of a network of misfit dislocation at the heterointerface and high density threading dislocation in the epitaixial layers.
  • Presently public techniques to overcome the defects produced from the growth of GaAs on Si substrate include varying epitaixial growth conditions for directly growing GaAs epitaxy on Si, applying strained supper lattices buffer to filter threading dislocation and using Ge composition graded SiGe layers as buffer.
  • For example, the techniques for directly growing GaAs epitaixial layer on Si, for the purpose of lowering the large threading dislocation due to lattice mismatch of GaAs on Si substrate, two steps of annealing methods or strained super-latticed buffer are previously applied to solve those problems. Related disclosures include U.S. Pat. No. 5,959,308, 5,879,962, 5,473,174, 5,308,444, 5,438,951, 5,238,869, 5,183,776 and 5,141,893, furthermore, it is reported in “Subpicosecond carrier dynamics in low-temperature grown GaAs on Si substrates” (Applied Physics Letters, Vol. 75, No. 17, 25 Oct. 1999) from A. C. Gossard et al., and in “Growth of high quality gallium arsenide on HF-etched silicon by chemical beam epitaxy” (Applied Physics Letters, Vol. 62, No. 14. 5 Apr. 1993) from P. J. Goodhew et al., and in “Integration of low-temperature GaAs on Si substrates” (Applied Physics Letters,Vol. 62, No. 3, 18 Jan. 1993) from T. F. Carrathers et al. These prior arts have less effects on lowering the threading dislocation density according to the techniques for production from the directly growing GaAs on Si, wherein the threading dislocation density is generally about 108/cm2, and further reduced to about 107/cm2 with an additional annealing. Furthermore, due to large difference between thermal expansion coefficient of GaAs and that of Si, it is difficult to remove the additional dislocation induced during annealing, thus, these arts obviously are not deemed to be used for fabricating of high performance device.
  • Furthermore, the technique which uses interlayer as buffer for growing GaAs on Si, that is, a structure of GaAs/interlayer/Si, as we know the interlayer can include SeS2, ZnSe or STO film. For example, an bonding technique disclosed in “High-quality GaAs on Si substrate by the epitaixial lift-off technique using SeS2” (Applied Physics Letters, Vol. 75, No. 24, 13 Dec. 1999) from M. Umeno et al., which describes that a GaAs wafer is bonded to silicon substrate using SeS2 as the interlayer and the desirable GaAs layer is acquired by applying the lift-off technique. However, these arts obviously make some problems, such as high fabricating cost and no large scale of GaAs epitaxy on Si substrate to be obtained.
  • And, the reference “Use of ZnSe as an interlayer for GaAs growth on Si” (Applied Physics Letters, Vol. 61, No. 2, 13 Jul. 1992) from J. C. Tramontana et al. is reported that ZnSe is used as the interlayer for growing GaAs epitaxy on Si, i.e., the interlayer has a structure of GaAs/ZnSe/Si. However, it is difficult to grow a high quality ZnSe on Si, and the small thermal conductivity of ZnSe is disadvantageous for fabricating of device, thus, the utilization of this invention is in the presence of some problems to be solved.
  • In addition, it is reported in “New research yield epitaixially grown GaAs on Si” (Solid State Technology, 45, 61 2002) from K. Esenbeiser et al., which discloses the use of STO film as the interlayer for growing GaAs epitaxy on Si, i.e., a structure of GaAs/STO film/Si. However, it is with high fabricating cost and low productivity for growth by applying molecule beam epitaxy (MBE), and additionally it is with small thermal conductivity of STO film, which is disadvantageous for heat diffusion of device, thus, the utilization of this invention totally is in the presence of some problems to be solved, too.
  • As for applying the technique in using Ge composition graded buffer for growing SiGe epitaxy, which is disclosed in “Novel dislocation structure and surface morphology effects in relaxed Ge/SiGe(graded)/Si structures” from E. A. Fitzgerald et al. mentioned above, wherein graded Si1-xGex is applied as interlayer for the growth of GaAs epitaxy on Si due to almost the same lattice constant and thermal expansion coefficient for the two different materials, this technique has comparatively wide field in application, but is also in the presence of some problems to be overcome. That is, applying the concept of gradually increasing Ge content of SiGe epitaxy, since the Ge composition starts from zero to a very high value and herein forms the crosshatch pattern, where the pattern brings a very high surface roughness. As for growing under the condition that the Ge epitaixial layer is 6 degree oriented to silicon substrate, the roughness is over 150 Å; comparatively, it gains a surface roughness of over 450 Å for growing without degrees. Wherein, high surface roughness due to thick epitaixial layer and cross hatch pattern will increase the fabrication cost of epitaxy and cause difficulties in device producing. As for removing cross hatch pattern, chemical-mechanical polishing (CMP) is subjected to solve these problems in above-mentioned references and patents, but it increases additional cost and causes difficulties in processing substantially.
    • SUMMARY OF THE INVENTION
  • A first object of this invention is to solve hereinabove problems, as for growing Ge epitaxy on Si by using a novel method, including how to lower the thickness of Ge epitaixial layers, to flatten the surface roughness induced from high Ge-composition epitaixial layers without help of CMP, and to lower the high defects density due to lattice mismatch.
  • The epitaixial semiconductor structure has been disclosed in relevant patents and references from E. A. Fitzgerald et al., wherein the structure contains a Ge composition graded buffer layer and a Ge-composition uniform layer, however it is with a total epitaixial layer thickness of over 10 μm. The process disclosed herein is on a silicon substrate, which a first Ge composition graded SiGe epitaixial layer on said substrate is grown by using molecular beam epitaxy (MBE) or ultra-high vacuum chemical vapor deposition, generally at a grading rate of 10% Ge composition per μm of layers and gradually reaching to 50% of Ge composition, then the surface of said layers is planarized by using chemical-mechanical polishing (CMP). Herein the thickness of the first layer is about 5 μm. Subsequently, a second layer comprising Ge composition from 50% to 75% is grown and a further planarizing the surface of said second layer by using CMP is performed. Herein the thickness of the second layer is about 2.5 μm. Having grown a high Ge-composition third layer, it needs to vary the epitaixial growth conditions including to lower the growth temperature and partial pressure of growth gases, herein the thickness of said third layer is above 2.5 μm. According to the foregoing process, the product of best mode is a epitaxy layer with no surface cracking, threading dislocation density of about 106/cm2, particles density on surface of about 150/cm2, roughness of 24 m and a total epitaixial layer thickness of at least 10 μm.
  • The conception of the process for this invention is, firstly growing a high Ge-composition epitaixial layer, such as Si0.1Ge0.9 in a thickness of 0.5˜0.8 μm on Si substrate, in which many dislocations are generated and located near the interfaces and in the low of part of this layer due to the large mismatch between this layer and Si substrate. Subsequently growing two or three layers of more high Ge-composition epitaixial layers, such as Si0.05Ge0.95 and /or Si0.02Ge0.98 in a thickness of 0.5˜0.8 μm. The formed strained interfaces between said layers can bend and terminate the propagated upward dislocation from the first layer very effectively. Then, growing a final film of pure Ge on herein epitaixial layer and a total epitaixial thickness is of only several micrometers, such as below 3 micrometer.
  • The in-situ high temperature annealing for each layers is performed in growing process therein, and carried out under the temperature of from 650 to 800° C., and 15˜30 minutes to further promote the quality of single crystalline of the Ge film.
  • Compared to the study of E. A. Fitzgerald et al., the invention applying high Ge content, such as initial Si0.1Ge0.9 layer as the first layer SiGe epitaixial layer and then providing further high Ge-composition layers, such as a layer of Si0.05Ge0.95 and/or an optional Si0.1Ge0.9 layer, is for the purpose of applying the formed strained interfaces between the said layers to bend and terminate the propagated upward dislocation from the first layer. Thus, this invention has apparently different conception from prior orts having growing pattern of Ge composition graded at a constant grading rate of 5% or 10% from zero to 100% and that will be at least 10 μm in thickness of a total SiGe epitaixial layers according to the grading rate herein. However, it is of high possibility for this invention to have a total thickness of below 3 μm.
    • BRIEF DESCRIPTION OF THE INVENTION
  • FIG. 1 is a schematic diagram of this invention for growing mechanism of Ge epitaxy on Si substrate, which shows the conception that the strained interface blocks the threading dislocation to be generated and locks that dislocation near the interface.
  • FIG. 2 and 3 are cross-sectional (XTEM) and plane-view transmission electronic microscope micrographs of the sample according to this invention, wherein the sample obtained has a total thickness SiGe epitaixial layers of about 2.6 μm., threading dislocation density of about 3×106/cm2 on the top Ge layer, and surface roughness of 3.2 nm.
  • FIG. 4 is the analysis of the atomic force microscope micrograph of the surface roughness of the sample according to this invention, which shows the sample having a very smooth surface.
  • This process for the growth of SiGe epitaxy, which is based upon ultra-high vacuum chemical vapor deposition and using SiH4/Si2H6,GeH4 as growth gases, is carried out at a temperature ranging from 350° C. to 650° C. and a pressure ranging from 20 m-Torr to 100 m-Torr for growth gases herein, and whatever a first, a second and/or an optional third layers grown is under the same conditions except the feeding flow of either SiH4/Si2H6 or GeH4. The low temperature growing for Ge epitaxy is to prevent island formation and downgrade the quality of Ge epitaxy, and further, the pressure is to control the growing velocity for Ge epitaxy, and both factors including temperature and pressure are preferably kept constant. However, those prior arts for growth of Ge composition graded epitaixial layers, in order to keep the Ge grading rate at a constant, it must be controlled carefully to increase Ge content. For example, to reduce the threading dislocation density of said layers, lower a grading rate for Ge content is selected and more thickly a total epitaxy thickness is formed. In another aspect, if a higher grading rate, such as more than 10% of Ge composition per micrometer of layers is selected, it will fast increase the threading dislocation density.
  • Prior arts further comprise planarization for each epitaixial layer after per growth cycle, said planarization such as chemical-mechanical polishing is to eliminate the surface roughness prior to a next layer on said surface. However, without very complicated work sequence like that, this invention more particularly allows to provide a surface having more equivalently smooth-faced than that is planarized by using CMP, this invention achieves that by means of different dislocation reducing mechanism as described above.
  • A second object of this invention is to solve the problems in prior arts, which concerns the growth of GaAs epitaixial layers on silicon substrate by using interlayer, more particularly using Si1-xGex as buffer.
  • With respect to the techniques for GaAs grown on Si using Si1-xGex as buffer, it is reported in “Impact of GaAs buffer thickness on electronic quality of GaAs grown on graded Ge/SiGe/Si substrate” (Applied Physic Letters, Vol. 76, No. 14, 3 Apr. 2000) from E. A. Fitzgerald et al., they use Ge composition graded buffer layers to grow SiGe epitaxy on silicon wafer, and apply molecule beam epitaxy (MBE) to grow an GaAs epitaixial layer on uppermost Ge film of said SiGe epitaxy, wherein the techniques for Si1-xGex grown on Si has been disclosed in U.S. Pat. No. 6,291,321, 6,107,653 from E. A. Fitzgerald et al., and besides, the techniques for growing a GaAs epitaixial layer on Ge applying MBE has been disclosed in U.S. Pat. No. 5,308,444 from Jeng-Ming Kuo et al. Therein is a semiconductor structure comprising a SiGe epitaixial layer which has a Ge composition grading from zero to 100% and having low dislocation density in said layers, it is of a total epitaixial layer thickness of above 10 μm. The final step of the process is to grow a thickness of about 2.5 μm of GaAs on latest Ge film by using MBE.
  • For overcoming the problems resulted from the growth of GaAs on Si by using Ge graded Si1-xGex as buffer, the invention provides a different solution to grow the epitaixial layers having reduced total thickness, smoother surface and lower defects density.
  • The conception of the process for this invention is, firstly growing a high Ge-composition epitaixial layer, such as Si0.1Ge0.9 in a thickness of 0.5˜0.8 μm on Si substrate, in which many dislocations are generated and located near the interface and in the low of the part of this layer due to large mismatch between this layer and Si substrate. Subsequently growing two or three layers of more high Ge-composition epitaixial layers, such as Si0.05Ge0.95 and/or Si0.02Ge0.98 in a thickness of 0.5˜0.8 μm. The formed strained interfaces of said layers can bend and terminate the propagated upward dislocation from the first layer very effectively. Then, growing a film of pure Ge on herein epitaixial layer, and a total epitaixial thickness being of only several micrometers, such as below 3 micrometer. Finally, growing a GaAs epitaixial layer in a certain thickness on said Ge film by using metal organic chemical vapor deposition (MOCVD), wherein the thickness of epitaixial GaAs depending upon the properties required for the fabrication of devices may be 1 to 3 μm in thickness. Therefore, according to the invention, the thickness of a total epitaixial SiGe layer neglecting the additional GaAs layer, allows to be, limited below 3 μm substantially.
  • FIG.5 is a XRD micrograph of the GaAs/SiGe/Si epitaixial layer sample according to this invention, wherein the sample is obtained with a very high quality for single crystalline.
  • FIG.6 is a cross-sectional transmission electronic microscope (XTEM) micrograph of the sample according to this invention, and also shows a very good single crystalline quality.
  • Another object of the invention is to be used in fabrication of high-speed devices and optical devices based on Ge/Si and GaAs/Ge/Si materials, such as Ge MOSFET combined with high-k gate material, Ge photodetector, GaAs HBT, MESFET, HEMET, LED, Laser etc, and future possible integrate of IV and III-V devices on the same Si wafer.
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODYMENT
  • The invention will be now illustrated in the following example but not be limited to.
  • Firstly, pre-cleaning the silicon wafer in a standard cleaning procedure, wherein the cleaning treatment comprises steps of boiling the silicon wafer in a solution containing the mixtures of H2O2:H2SO4 with the ratio 1:4 in about 10 min., then taking and rinsing it with de-ion water in 10 min., furthermore dipping it in a solution of 10% HF in 30 seconds and subsequently further taking and rinsing it into de-ion water loading the wafer into a UHVCVD system immediately after said cleaning and prebaking the wafer at 850° C. in 10 min to remove the native oxided layer and then cooling the temperature of UHVCVD system down to 400° C. While temperature of system present stable and is capable of growing a high Ge-composition SiGe epitaixial layer. Wherein UHVCVD system is a quartz tube furnace equipped with heating sources, and the background is vacuumed by a molecular pump to a pressure of lower than 5×10−8 torr. Growth gases including SiH4 and GeH4, which regulated by mass flow controller (MFC) to adjust the feeding flows of the gases. Wherein the flows supply of SiH4 is fixed and that of GeH4 is adjusted only.
  • Growth is in condition of:
    • (1) growth temperature range: 350˜650° C.,preferably 400° C.
    • (2) growth gases pressure range: 20˜100 m-Torr, preferably 20 m-Torr
    • (3) species of growth gases: high purity of SiH4 and GeH4.
  • In addition, further growing a second or a third higher Ge-composition SiGe epitaixial layer being in a thickness of, such as at least 0.1 μm, preferably 0.5˜0.8 μm, most preferably 0.8 μm on the first layer subsequently growing a film of Ge on said uppermost epitaixial layer in a thickness of, such as 1 μm. At last, growing a GaAs epitaixial layer by using MOCVD in a thickness of 1˜3 μm on said Ge film at 650° C.
  • During above-mentioned growth cycle, each of epitaixial layers needs in-situ high temperature annealing to further promote the quality of Ge and GaAs epitaxy, i.e., the conditions are a temperature of 650˜800° C., preferably 750° C., 0.25 to 1 hour, and at a pressure of 5 to 20 m-Torr using hydrogen as atmosphere of said annealing.
  • With respect to the growth cycle for Ge epitaxy on Si, the Ge composition of first layer is at least 70%, preferably 70˜90%, most preferably 90%, the Ge composition of second layer is ranging within 80˜98%, preferably 95%. The growth of third layer is optionally carried out depending upon the growth results of epitaxy, wherein the Ge content is decided between which of second and pure Ge. Of course the uppermost lay is pure Ge, which has almost the same lattice constant as GaAs, thus GaAs epitaxy is grown on Ge film therein and is without mismatch at the interface.
  • As for best mode of GaAs grown on Ge epitaxy according to the invention, a first layer Si0.1Ge0.9 having about 0.8 μm in thickness is obtained in conditions that growth temperature is 400° C., growth gases pressure is 20 m-Torr, and is further in-situ treated by annealing at 750° C.,in 15 min. After that, a second layer Si0.05Ge0.95 having about 0.8 μm in thickness is formed in conditions that growth temperature is 400° C.,growth gases pressure is 20 m-Torr, and is further in-situ treated by annealing at 750° C., in 15 min. In the case of optional third layer which is Si0.02Ge0.98 having about 0.8 μm in thickness is also obtained in conditions that growth temperature is 400° C.,growth gases pressure is 20 m-Torr, and is treated by annealing at 750° C., in 15 min. At last, uppermost layer which is pure Ge having about 1.0 μm in thickness is formed in conditions that growth temperature is 400° C.,growth gases pressure is 20 m-Torr, and is also in-situ treated by annealing at 750° C. in 15 min.
  • For the purpose of growing GaAs epitaxy on achieved Ge epitaixial layers, it is carried out at 650° C. by using metal organic chemical vapor deposition equipment. The thickness of epitaixial GaAs depends on the device requirement.

Claims (10)

1-13. (canceled)
14. The semiconductor structure of SiGe epitaxy, comprising a silicon substrate, a first SiGe epitaxial layer having Ge content at least 70 wt. %, a second SiGe epitaxial layer having Ge content more than that of the first layer, an optional third SiGe epitaxial layer having Ge content more than that of the second layer, a pure Ge film, and a GaAs epitaxial layer as the topmost layer, characterized in that the first SiGe epitaxial layer can accommodate large dislocations which are generated and located near in the low part of the first layer and the interface due to the large lattice mismatch, and the second and/or the third optional layers can form strained interfaces of said layers to bend and terminate the propagated upward dislocation very effectively.
15. A semiconductor structure of SiGe eptiaxy, comprising a silicon substrate, a first SiGe epitaxial layer having Ge content at least 70 wt. %, a second SiGe epitaxial layer having Ge content more than that of the first layer, an optional third SiGe epitaxial layer having Ge content more than that of the second layer, a pure Ge film, and a GaAs epitaxial layer as the topmost layer, characterized in that the thickness of epitaxial layers totally is controlled in not exceed to 3.0 μm, and the surface of said layers is very smooth and without planarization using CMP.
16. A semiconductor structure of SiGe eptiaxy, comprising a silicon substrate, a first SiGe epitaxial layer having Ge content at least 70 wt. %, a second SiGe epitaxial layer having Ge content more than that of the first layer, an optional third SiGe epitaxial layer having Ge content more than that of the second layer, a pure Ge film, and a GaAs epitaxial layer as the topmost layer, characterized in that the threading density is not controlled in not exceed to 106/cm2.
17. The semiconductor structure according to claim 14 is suitable as high-speed devices and optical devices.
18. The semiconductor structure according to claim 14 is further suitable as a wafer of Group III-IV material and an integrating wafer which is used to integrate Group III-IV material and Group IV material.
19. The semiconductor structure according to claim 15 is suitable as high-speed devices and optical devices.
20. The semiconductor structure according to claim 16 is suitable as high-speed devices and optical devices.
21. The semiconductor structure according to claim 15 is further suitable as a wafer of Group III-IV material and an integrating wafer which is used to integrate Group III-IV material and Group IV material.
22. The semiconductor structure according to claim 16 is further suitable as a wafer of Group III-IV material and an integrating wafer which is used to integrate Group III-IV material and Group IV material.
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