US20050230083A1 - Water-cooler radiator module - Google Patents

Water-cooler radiator module Download PDF

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Publication number
US20050230083A1
US20050230083A1 US10/827,232 US82723204A US2005230083A1 US 20050230083 A1 US20050230083 A1 US 20050230083A1 US 82723204 A US82723204 A US 82723204A US 2005230083 A1 US2005230083 A1 US 2005230083A1
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Prior art keywords
shell body
water pipe
cold
hot water
fan
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Granted
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US10/827,232
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US6955212B1 (en
Inventor
Hsin Hsieh
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Adda Corp
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Adda Corp
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Priority to US10/827,232 priority Critical patent/US6955212B1/en
Assigned to ADDA CORPORATION reassignment ADDA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSIEH, HSIN MAO
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0233—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels
    • F28D1/024—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels with an air driving element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
    • F28D1/0477—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being bent in a serpentine or zig-zag
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates generally to a radiator module and, more specifically, a water-cool radiator module that is separated from heavy water tank, cold water pipe and hot water pipe that are independently fixed in a slot for the purpose to reduce the load on the heat-generating electronic components and not occupy the space of the electronic components.
  • FIG. 1 generally comprises a flat pedestal 10 that comprises a plurality of radiating fins 11 and a water conduit (not shown in Fig.) on the other side; the water conduit comprises a water inlet 12 and a water outlet 13 ; the pedestal 10 further comprises a fan 30 .
  • this configuration has the following disadvantages:
  • Fan 30 is located on radiating fins 11 . When fan 30 is activated, heat current will flow slowly through computer and then flow outward through the radiating holes outside the computer. As a result, heat may stay in the computer.
  • a water-cool radiator module that comprises a supporting part that further comprises a shell body; the shell body comprises a fan and a water tank; the water tank is connected to a cold water pipe and a hot water pipe; the extended section of the cold water pipe and hot water pipe connects to a cold waterhead; the shell body further comprises several radiating holes at one end; in practical application, the supporting part is fixed in a slot on the computer case and the shell body is firmly fixed on the slot; cold water on heat-generating electronic component is sent to the shell body via hot the water pipe; blown by the fan, heat is radiated outward via radiating holes; and cool fluid flows from the water tank to the cold waterhead via the cold water pipe.
  • FIG. 1 is a perspective view of the prior art
  • FIG. 2 is a perspective view of the present invention
  • FIG. 3 is an assembly view of the present invention
  • FIG. 4 is another assembly view of the present invention.
  • FIG. 5 is an application view of the present invention.
  • FIG. 2 shows a preferred embodiment of the water-cool radiator module in the present invention wherein the module comprises a supporting part 10 , a supporting part 10 can couple with the interfaces of various types of extended slots such as AGP, PCI and ISA on one side, the supporting part 10 comprises a fixing part 20 on the other side; the fixing part 20 is perpendicular to supporting part 10 and comprises holes 21 .
  • the module comprises a supporting part 10
  • a supporting part 10 can couple with the interfaces of various types of extended slots such as AGP, PCI and ISA on one side
  • the supporting part 10 comprises a fixing part 20 on the other side
  • the fixing part 20 is perpendicular to supporting part 10 and comprises holes 21 .
  • the supporting part 10 comprises a shell body 30 ;
  • the shell body 30 comprises a water tank 310 which connects to a cold water pipe 32 and a hot water pipe 33 on the other side;
  • several radiating fins 34 are aligned orderly on the bending section of the hot water pipe 33 ;
  • a fan 35 is located adjacent to the radiating fins 34 ;
  • an opening 37 is located at a region where the shell body 30 is not braced against the supporting part 10 ; the opening 37 faces the fan 35 ;
  • a pump 31 is located beside the fan 35 and connected to the hot water pipe 33 ;
  • the hot water pipe 33 extends outward from the pump 31 and connects to a cold waterhead 40 ;
  • the cold waterhead 40 is also connected with cold water pipe 32 ;
  • several radiating holes 36 are located on the side where the shell body 30 faces holes 21 .
  • FIG. 2 , FIG. 3 and FIG. 5 users install the cold waterhead 40 on the heat-generating electronic components (a processor in this application), and insert the cold waterhead 40 into the slot on the computer case via the supporting part 10 ; the supporting part 10 is fixed in a slot on the computer case by the fixing of the fixing part 20 on the back of computer case, the shell body 30 is firmly fixed on the slot; such that the heat conducted from electronic components to the cold waterhead 40 will raise the temperature of the fluid in the cold waterhead 40 .
  • the heat-generating electronic component does not bear the weight of the water tank 310 , the radiating fins 34 and the fan 35 .
  • such scheme reduces the possibility of any damage to the heat-generating electronic component and saves space above the heat-generating electronic component.
  • FIG. 4 shows another application of the present invention wherein the radiator module comprises a shell body 30 ; a supporting part 10 is attached on both sides of the shell body 30 ; the supporting part 10 can be inserted into two slots; one side of the supporting part 10 comprises a fixing part 20 that is connected with the supporting part 10 ; the fixing part 20 is perpendicular to the supporting part 10 and comprises holes 21 ; the supporting part 10 further comprises a shell body 30 ; the shell body 30 comprises a water tank 310 which connects to a cold water pipe 32 and a hot water pipe 33 ; the hot water pipe 33 is in continuous bending shape and extends outward via water tank 310 , several radiating fins 34 are aligned orderly on the bending section of the hot water pipe 33 ; a fan 35 is located beside radiating fins 34 ; an opening 37 is located at a region where the shell body 30 is not braced against the supporting part 10 ; the opening 37 faces the fan 35 ; a pump 31 is located beside the fan 35 and connected with the hot water pipe 33
  • the heat-generating electronic component does not bear the weight of the water tank 310 , the radiating fins 34 and the fan 35 . As a result, this reduces the possibility of any damage to the heat-generating electronic component and saves space above the heat-generating electronic component.

Abstract

A water-cool radiator module comes with a supporting part having a shell body; the shell body includes a fan and a water tank; the water tank is connected to a cold water pipe and a hot water pipe; an extended section of the cold water pipe and hot water pipe is connected to a cold waterhead; the shell body includes several radiating holes at one end; such that in an application, the supporting part is inserted into a slot on the computer case and the shell body is mounted onto the slot; the cold water in the cold waterhead of a heat-generating electronic component is circulated to the shell body through the hot water pipe; the fan blows air to radiate heat to the outside through the radiating holes; and the cooled fluid flows from the water tank to the cold waterhead through the cold water pipe.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates generally to a radiator module and, more specifically, a water-cool radiator module that is separated from heavy water tank, cold water pipe and hot water pipe that are independently fixed in a slot for the purpose to reduce the load on the heat-generating electronic components and not occupy the space of the electronic components.
  • 2. Description of the Prior Art
  • Heretofore, it is known that a conventional radiator. As shown in FIG. 1, generally comprises a flat pedestal 10 that comprises a plurality of radiating fins 11 and a water conduit (not shown in Fig.) on the other side; the water conduit comprises a water inlet 12 and a water outlet 13; the pedestal 10 further comprises a fan 30. In practical use, this configuration has the following disadvantages:
  • 1. In addition to radiating fins 11, some water conduit accessories are also located under radiating fins 11. Such mechanism not only increases the height of the radiator structure but also increases the load on the heat-generating electronic components due to increased weight of water in water conduit. As a result, this may cause damage to such electronic component and occupies larger space.
  • 2. Water in the water conduit stays and exchanges heat between radiating fins 11. Therefore, heat stays on radiating fins 11 resulting in very slow radiating speed.
  • 3. Fan 30 is located on radiating fins 11. When fan 30 is activated, heat current will flow slowly through computer and then flow outward through the radiating holes outside the computer. As a result, heat may stay in the computer.
    • SUMMARY OF THE INVENTION
  • It is therefore a primary object of the invention to provide a water-cool radiator module that comprises a supporting part that further comprises a shell body; the shell body comprises a fan and a water tank; the water tank is connected to a cold water pipe and a hot water pipe; the extended section of the cold water pipe and hot water pipe connects to a cold waterhead; the shell body further comprises several radiating holes at one end; in practical application, the supporting part is fixed in a slot on the computer case and the shell body is firmly fixed on the slot; cold water on heat-generating electronic component is sent to the shell body via hot the water pipe; blown by the fan, heat is radiated outward via radiating holes; and cool fluid flows from the water tank to the cold waterhead via the cold water pipe. With repeated circulation, the heat produced by electronic component is taken away quickly. On the other hand, since the water tank, the radiating fins and the fan are all fixed on slot, the heat-generating electronic component does not bear the weight of the water tank, the radiating fins and the fan. As a result, this reduces the possibility of any damage to the heat-generating electronic component and saves space above the heat-generating electronic component.
  • It is still an object for the invention to provide a water-cool radiator module in which a pump is installed inside the shell body to speed up the flow of hot water in the hot water pipe and control the flow direction.
  • It is still another object for the invention to provide a water-cool radiator module in which a fixing part is installed near the radiating holes of the supporting part, several holes are on the fixing part; in practical application, the supporting part is inserted into the slot, the fixing part is fixed firmly on the computer case to have the shell body install more stable onto the slot without swaying.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The accomplishment of the above-mentioned object of the present invention will become apparent from the following description and its accompanying drawings which disclose illustrative an embodiment of the present invention, and are as follows:
  • FIG. 1 is a perspective view of the prior art;
  • FIG. 2 is a perspective view of the present invention;
  • FIG. 3 is an assembly view of the present invention;
  • FIG. 4 is another assembly view of the present invention;
  • FIG. 5 is an application view of the present invention.
    • DESCRIPTION OF THE PREFERRED EMBODIMENT
  • FIG. 2 shows a preferred embodiment of the water-cool radiator module in the present invention wherein the module comprises a supporting part 10, a supporting part 10 can couple with the interfaces of various types of extended slots such as AGP, PCI and ISA on one side, the supporting part 10 comprises a fixing part 20 on the other side; the fixing part 20 is perpendicular to supporting part 10 and comprises holes 21.
  • As shown in FIG. 3, the supporting part 10 comprises a shell body 30; the shell body 30 comprises a water tank 310 which connects to a cold water pipe 32 and a hot water pipe 33 on the other side; several radiating fins 34 are aligned orderly on the bending section of the hot water pipe 33; a fan 35 is located adjacent to the radiating fins 34; an opening 37 is located at a region where the shell body 30 is not braced against the supporting part 10; the opening 37 faces the fan 35; a pump 31 is located beside the fan 35 and connected to the hot water pipe 33; the hot water pipe 33 extends outward from the pump 31 and connects to a cold waterhead 40; the cold waterhead 40 is also connected with cold water pipe 32; several radiating holes 36 are located on the side where the shell body 30 faces holes 21.
  • In practical use, as shown in FIG. 2, FIG. 3 and FIG. 5, users install the cold waterhead 40 on the heat-generating electronic components (a processor in this application), and insert the cold waterhead 40 into the slot on the computer case via the supporting part 10; the supporting part 10 is fixed in a slot on the computer case by the fixing of the fixing part 20 on the back of computer case, the shell body 30 is firmly fixed on the slot; such that the heat conducted from electronic components to the cold waterhead 40 will raise the temperature of the fluid in the cold waterhead 40. By the driving of the pump 31, hot water flows back to the pump 31 via the hot water pipe 33 and flows through the radiating fins 34; the fan 35 draws cold air into the shell body 30 to cool water flowing through the radiating fins 34; after the heat in the water is quickly radiated through the radiating holes 36 and the holes 21, cool water flows from water tank 310 to the cold waterhead 40 via the cold water pipe 32. With repeated circulation, the heat produced by the electronic component is taken away quickly. On the other hand, since the cold waterhead 40 is separated from the water tank 310, the radiating fins 34 and the fan 35, and the water tank 310, the radiating fins 34 and the fan 35 are all fixed on slot, the heat-generating electronic component does not bear the weight of the water tank 310, the radiating fins 34 and the fan 35. As a result, such scheme reduces the possibility of any damage to the heat-generating electronic component and saves space above the heat-generating electronic component.
  • FIG. 4 shows another application of the present invention wherein the radiator module comprises a shell body 30; a supporting part 10 is attached on both sides of the shell body 30; the supporting part 10 can be inserted into two slots; one side of the supporting part 10 comprises a fixing part 20 that is connected with the supporting part 10; the fixing part 20 is perpendicular to the supporting part 10 and comprises holes 21; the supporting part 10 further comprises a shell body 30; the shell body 30 comprises a water tank 310 which connects to a cold water pipe 32 and a hot water pipe 33; the hot water pipe 33 is in continuous bending shape and extends outward via water tank 310, several radiating fins 34 are aligned orderly on the bending section of the hot water pipe 33; a fan 35 is located beside radiating fins 34; an opening 37 is located at a region where the shell body 30 is not braced against the supporting part 10; the opening 37 faces the fan 35; a pump 31 is located beside the fan 35 and connected with the hot water pipe 33; the hot water pipe 33 extends outward via pump 31 and connects to a cold waterhead 40; the cold waterhead 40 is also connected with cold water pipe 32; several radiating holes 36 are located on the side where the shell body 30 faces holes 21.
  • In practical use, as shown in FIG. 3, FIG. 4 and FIG. 5, users install the cold waterhead 40 on the heat-generating electronic component (a processor in this application), and insert the cold waterhead 40 into the slot on the computer case via the supporting part 10, the supporting part 10 is fixed in a slot on the computer case by the fixing of the fixing part 20 on the back of computer case, the shell body 30 is firmly fixed on the slot; such that the heat conducted from electronic component to cold waterhead 40 will raise the temperature of the water in the cold waterhead 40. By the driving of the pump 31, hot water flows back to the pump 31 via the hot water pipe 33 and flows through the radiating fins 34; the fan 35 draws cold air into the shell body 30 to cool water flowing through the radiating fins 34; after the heat in the water is quickly radiated through the radiating holes 36 and the holes 21, cool water flows from the water tank 310 to the cold waterhead 40 via the cold water pipe 32. With repeated circulation, the heat produced by the electronic component is taken away quickly. On the other hand, since the cold waterhead 40 is separated from the water tank 310, the radiating fins 34 and the fan 35, and the water tank 310, the radiating fins 34 and the fan 35 are all fixed on slot, the heat-generating electronic component does not bear the weight of the water tank 310, the radiating fins 34 and the fan 35. As a result, this reduces the possibility of any damage to the heat-generating electronic component and saves space above the heat-generating electronic component.
  • While a preferred embodiment of the invention has been shown and described in detail, it will be readily understood and appreciated that numerous omissions, changes and additions may be made without departing from the spirit and scope of the invention.

Claims (4)

1-5. (canceled)
6. A water-cool radiator module, comprising:
a shell body, having an opening disposed on a surface of said shell body, and a radiating hole disposed on one side of said shell body;
a pump, installed inside said shell body and having a first hot water pipe and a second hot water pipe, and said first hot water pipe is in a continuous bending shape and connected to said pump and having an end interconnected with a water tank, and said first hot water pipe has a plurality of radiating fins aligned orderly on the bending section of said first hot water pipe, and the other end of said second hot water pipe is connected to a cold waterhead;
a water tank, being installed inside said shell body and connected to a cold water pipe and said first hot water pipe;
a fan, installed between said radiating fins and said pump and an opening of said fan faces said shell body;
a cold waterhead, connected to one side of said cold and second hot water pipes that is extended outside of said shell body;
a supporting part, installing said pump, a water tank, and said fan and being attached on said shell body, and one end of said supporting part is inserted into a slot in a computer; and
a fixing part, installed on another end of said supporting part for fixing said supporting part onto the backside of said computer case, and having an opening disposed on said fixing part at a position corresponding to said radiating holes; characterized in that: with the foregoing components, said water-cool radiator module can be fixed by said supporting member being inserted in said slot of said computer, and separate a heat-generating electronic component from said water tank, said radiating fins and said fan on said slot, such that said heat-generating electronic component needs not stand the weight of said water tank, radiating fins and fan and thus reducing the possibility of damaging said electronic component and reducing the space occupied by said heat-generating electronic component.
7. The water-cool radiator module recited in claim 6, wherein said supporting part is attached on both sides of said shell body.
8. The water-cool radiator module recited in claim 6, wherein said fixing part is connected to more than one supporting parts.
US10/827,232 2004-04-20 2004-04-20 Water-cooler radiator module Expired - Fee Related US6955212B1 (en)

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080024978A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Electronic apparatus
US20080024980A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Electronic apparatus including liquid cooling unit
US20080024987A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
US20080024988A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat receiver therefor
US20080023178A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
US20080024981A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Electronic apparatus
US20090321905A1 (en) * 2008-06-27 2009-12-31 Integrated Device Technology, Inc. Multi-Package Ball Grid Array
US8050036B2 (en) 2006-07-25 2011-11-01 Fujitsu Limited Liquid cooling unit and heat receiver therefor
WO2013123899A1 (en) * 2012-02-23 2013-08-29 Zhou Zheming Low-noise computer heat dissipation device
CN103616943A (en) * 2013-12-09 2014-03-05 中山爱科数字科技股份有限公司 Water-cooled server device
CN105739564A (en) * 2016-02-21 2016-07-06 洛阳理工学院 Chassis temperature control system
CN107196583A (en) * 2017-06-27 2017-09-22 上海誉盈光电科技有限公司 A kind of radiating module of electric machine controller
CN107239116A (en) * 2017-06-20 2017-10-10 柳州译海网络科技有限公司 A kind of higher computer host housing of stability
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US20200191042A1 (en) * 2018-12-13 2020-06-18 General Electric Company Liquid driven thermal module and thermal management system
EP3686714A1 (en) * 2019-01-25 2020-07-29 Asetek Danmark A/S Cooling system including a heat exchanging unit
EP3700312A4 (en) * 2017-10-20 2021-07-07 NEC Platforms, Ltd. Module, and server

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
WO2005002307A1 (en) * 2003-06-27 2005-01-06 Nec Corporation Cooler for electronic equipment
US7591302B1 (en) * 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
US7599761B2 (en) * 2005-01-19 2009-10-06 Hewlett-Packard Development Company, L.P. Cooling assist module
FI120128B (en) * 2005-01-20 2009-06-30 Abb Oy Cooling device for an electronic device and method
US20060187638A1 (en) * 2005-02-24 2006-08-24 Vinson Wade D System and method for liquid cooling of an electronic device
US20070047200A1 (en) * 2005-08-23 2007-03-01 Tai-Chi Huang Fan cartridge assembly
WO2007098077A2 (en) * 2006-02-16 2007-08-30 Cooligy, Inc. Liquid cooling loops for server applications
US20070227698A1 (en) * 2006-03-30 2007-10-04 Conway Bruce R Integrated fluid pump and radiator reservoir
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US20070227709A1 (en) * 2006-03-30 2007-10-04 Girish Upadhya Multi device cooling
US20070256815A1 (en) * 2006-05-04 2007-11-08 Cooligy, Inc. Scalable liquid cooling system with modular radiators
US20070256825A1 (en) * 2006-05-04 2007-11-08 Conway Bruce R Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect
CN101715536A (en) * 2007-05-02 2010-05-26 固利吉股份有限公司 Micro-tube/multi-port counter flow radiator design for electronic cooling applications
TW200934352A (en) 2007-08-07 2009-08-01 Cooligy Inc Internal access mechanism for a server rack
US8611083B2 (en) * 2007-11-28 2013-12-17 Hewlett-Packard Development Company, L.P. System and method for cooling a computer
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
CN102171378A (en) 2008-08-05 2011-08-31 固利吉股份有限公司 Bonded metal and ceramic plates for thermal management of optical and electronic devices
US7969733B1 (en) * 2008-12-17 2011-06-28 Nvidia Corporation Heat transfer system, method, and computer program product for use with multiple circuit board environments
CN102573384B (en) * 2010-12-09 2016-05-04 中山市云创知识产权服务有限公司 Liquid cooling heat radiation system
CN102889270B (en) * 2011-07-21 2015-04-22 徐州徐工施维英机械有限公司 Air cooler for pump truck and concrete pump truck
US9095075B2 (en) * 2012-11-27 2015-07-28 Hamilton Sundstrand Corporation Enclosure for electronic components with enhanced cooling
CN104144592B (en) * 2013-05-09 2016-12-07 鸿富锦精密工业（深圳）有限公司 Cooling system and be provided with the Cabinet-type server of this cooling system
TWI598561B (en) * 2013-09-06 2017-09-11 微星科技股份有限公司 Liquid cooling module and electronic device using the same
CN103561554B (en) * 2013-10-29 2015-11-25 徐萍 A kind of square installation component for the treatment of device
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US20230221781A1 (en) * 2022-01-12 2023-07-13 Dell Products L.P. Insert to replace a fan in hybrid liquid cooling of an information handling system
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
US5871396A (en) * 1997-08-12 1999-02-16 Shen; Tsan Jung Convection type heat dissipation device for computers that is adjustable with respect to a heat source
US6084774A (en) * 1999-06-17 2000-07-04 Alpha Processor, Inc. Apparatus and method for mounting a processor circuit board on a system mother board
US6362958B1 (en) * 2000-08-11 2002-03-26 Ming-Chuan Yu Detachable cooling device for computer
US20030169566A1 (en) * 2001-12-21 2003-09-11 Owens Mark J. WDM add/drop multiplexer module
US6754077B2 (en) * 2002-11-13 2004-06-22 Abit Computer Corporation Heat dissipating apparatus for circuit boards
US6763880B1 (en) * 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
US5871396A (en) * 1997-08-12 1999-02-16 Shen; Tsan Jung Convection type heat dissipation device for computers that is adjustable with respect to a heat source
US6084774A (en) * 1999-06-17 2000-07-04 Alpha Processor, Inc. Apparatus and method for mounting a processor circuit board on a system mother board
US6362958B1 (en) * 2000-08-11 2002-03-26 Ming-Chuan Yu Detachable cooling device for computer
US20030169566A1 (en) * 2001-12-21 2003-09-11 Owens Mark J. WDM add/drop multiplexer module
US6754077B2 (en) * 2002-11-13 2004-06-22 Abit Computer Corporation Heat dissipating apparatus for circuit boards
US6763880B1 (en) * 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8050036B2 (en) 2006-07-25 2011-11-01 Fujitsu Limited Liquid cooling unit and heat receiver therefor
US20080024980A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Electronic apparatus including liquid cooling unit
US20080024987A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
US20080024988A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat receiver therefor
US20080023178A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
US20080024981A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Electronic apparatus
EP1884866A1 (en) * 2006-07-25 2008-02-06 Fujitsu Limited Electronic apparatus
US20080024978A1 (en) * 2006-07-25 2008-01-31 Fujitsu Limited Electronic apparatus
US7652884B2 (en) 2006-07-25 2010-01-26 Fujitsu Limited Electronic apparatus including liquid cooling unit
US7672125B2 (en) 2006-07-25 2010-03-02 Fujitsu Limited Electronic apparatus
US7701715B2 (en) 2006-07-25 2010-04-20 Fujitsu Limited Electronic apparatus
US7710722B2 (en) 2006-07-25 2010-05-04 Fujitsu Limited Liquid cooling unit and heat exchanger therefor
US8289701B2 (en) 2006-07-25 2012-10-16 Fujistu Limited Liquid cooling unit and heat receiver therefor
US20090321905A1 (en) * 2008-06-27 2009-12-31 Integrated Device Technology, Inc. Multi-Package Ball Grid Array
US7968989B2 (en) * 2008-06-27 2011-06-28 Integrated Device Technology, Inc Multi-package slot array
WO2013123899A1 (en) * 2012-02-23 2013-08-29 Zhou Zheming Low-noise computer heat dissipation device
CN103616943A (en) * 2013-12-09 2014-03-05 中山爱科数字科技股份有限公司 Water-cooled server device
CN105739564A (en) * 2016-02-21 2016-07-06 洛阳理工学院 Chassis temperature control system
CN107239116A (en) * 2017-06-20 2017-10-10 柳州译海网络科技有限公司 A kind of higher computer host housing of stability
CN107196583A (en) * 2017-06-27 2017-09-22 上海誉盈光电科技有限公司 A kind of radiating module of electric machine controller
US11246242B2 (en) 2017-10-20 2022-02-08 Nec Platforms, Ltd. Module, and server
EP3700312A4 (en) * 2017-10-20 2021-07-07 NEC Platforms, Ltd. Module, and server
US10746084B2 (en) * 2018-12-13 2020-08-18 General Electric Company Liquid driven thermal module and thermal management system
US20200191042A1 (en) * 2018-12-13 2020-06-18 General Electric Company Liquid driven thermal module and thermal management system
CN109683678A (en) * 2018-12-22 2019-04-26 郑州航空工业管理学院 A kind of novel computer host case
WO2020152258A1 (en) * 2019-01-25 2020-07-30 Asetek Danmark A/S Cooling system including a heat exchanging unit
EP3686714A1 (en) * 2019-01-25 2020-07-29 Asetek Danmark A/S Cooling system including a heat exchanging unit
US11880246B2 (en) 2019-01-25 2024-01-23 Asetek Danmark A/S Cooling system including a heat exchanging unit

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