US20020112847A1 - Cooling device for heat source - Google Patents
Cooling device for heat source Download PDFInfo
- Publication number
- US20020112847A1 US20020112847A1 US10/067,992 US6799202A US2002112847A1 US 20020112847 A1 US20020112847 A1 US 20020112847A1 US 6799202 A US6799202 A US 6799202A US 2002112847 A1 US2002112847 A1 US 2002112847A1
- Authority
- US
- United States
- Prior art keywords
- holes
- heat source
- heat sink
- cooling device
- header
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a cooling device for a heat source that cools a heat source such as a semiconductor element.
- FIG. 1 shows cross-sectional views of a prior art cooling device for a heat source, FIG. 1A being a c cross-section, FIG. 1B being an a cross-section and FIG. 1C being a b cross-section.
- 1 are heat sources such as semiconductor elements
- 2 is a heat sink
- 3 are holes
- 4 are headers
- 5 is an inlet port
- 6 is an outlet port
- 7 a is an inlet-side flow path
- 7 b is an outlet-side flow path
- cooling medium hereinbelow “fluid”
- the heat that is generated in the heat source is transmitted to heat sink 2 by thermal conduction and is transmitted to the fluid flowing out from holes 3 by thermal conduction.
- the cooling performance is raised by the fact that the rate of heat conduction (so-called, heat condition rate) is increased since the fluid, rather than merely flowing, collides with the heat sink as a spray from holes 3 .
- a further problem is that, although the pressure loss is less than in the case of the channel type, the pressure loss may still not necessarily be capable of being described as small; this inevitably lowers the flow rate, due to limitations on the cooling liquid circulation pump and so lowers the cooling performance.
- one object of the present invention is to provide a novel cooling device for a heat source wherein the above problems are solved and a practically uniform cooling performance can be achieved with little loss of pressure.
- a cooling device for a heat source is constructed as follows.
- a cooling device for a heat source comprises:
- a heat sink with a heat source arranged on its outer surface and a plurality of holes provided at its back surface;
- a cooling device for a heat source comprises:
- FIG. 1 shows cross-sectional views of a prior art cooling device for a heat source
- FIG. 2 shows cross-sectional views of a cooling device for a heat source according to a first embodiment of the present invention
- FIG. 3 shows cross-sectional views of a cooling device for a heat source according to a second embodiment of the present invention
- FIG. 4 shows cross-sectional views of a cooling device for a heat source according to a third embodiment of the present invention
- FIG. 5 shows cross-sectional views of a cooling device for a heat source according to a fourth embodiment of the present invention
- FIG. 6 shows cross-sectional views of a cooling device for a heat source according to a fifth embodiment of the present invention
- FIG. 7 shows cross-sectional views of a cooling device for a heat source according to a sixth embodiment of the present invention.
- FIG. 8 shows cross-sectional views of a cooling device for a heat source according to a seventh embodiment of the present invention
- FIG. 9 shows cross-sectional views of a cooling device for a heat source according to an eighth embodiment of the present invention.
- FIG. 10 shows cross-sectional views of a cooling device for a heat source according to a ninth embodiment of the present invention.
- FIG. 11 shows cross-sectional views of a cooling device for a heat source according to a tenth embodiment of the present invention
- FIG. 12 shows cross-sectional views of a cooling device for a heat source according to an eleventh embodiment of the present invention
- FIG. 13 shows cross-sectional views of a cooling device for a heat source according to a twelfth embodiment of the present invention
- FIG. 14 shows cross-sectional views of a cooling device for a heat source according to a thirteenth embodiment of the present invention.
- FIG. 15 shows cross-sectional views of a cooling device for a heat source according to a fourteenth embodiment of the present invention.
- FIG. 16 shows a cross-sectional view of a cooling device for a heat source according to a fifteenth embodiment of the present invention
- FIG. 17 shows cross-sectional views of a cooling device for a heat source according to a sixteenth embodiment of the present invention.
- FIG. 18 shows a cross-sectional view of a cooling device for a heat source according to a seventeenth embodiment of the present invention.
- FIG. 2 shows cross-sectional views of a cooling device for a heat source according to a first embodiment of the present invention, FIG. 2A being a c cross-section, FIG. 2B being an a cross-section and FIG. 2C being a b cross-section.
- 1 are heat sources such as semiconductor elements
- 2 is a heat sink (more precisely, a first heat sink member constituting a heat sink)
- 3 are holes (more precisely, these holes are provided in a second heat sink member constituting the heat sink)
- 4 is a header
- 5 is an inlet port
- 6 is an outlet port
- 7 b is an outlet-side flow path
- header 4 is arranged on the downstream side of inlet port 5 i.e.
- heat sources 1 are arranged on the surface 2 a of heat sink 2 and a plurality of holes 3 are provided that spray fluid towards the rear face 2 b of heat sink 2 ; and there is provided an outlet port 6 (in this embodiment, a single one on the opposite side to that of inlet port 5 ) of number fewer than the number of holes 3 .
- the cross sectional area S 4 of header 4 is made considerably larger than the cross-sectional area S 5 of inlet port 5 (S 4 >>S 5 ).
- the header cross-sectional area Sz in the hole inlet direction is made considerably larger than the cross-sectional area Sh of a single hole (Sz>>Sh).
- FIG. 3 shows cross-sectional views of a cooling device for a heat source according to a second embodiment, FIG. 3A being a c cross-section, FIG. 3B being an a cross-section and FIG. 3C being a b cross-section.
- the difference with respect to the first embodiment illustrated in FIG. 2 lies in the provision of upright plates 8 on the downstream side of the holes 3 of header 4 .
- FIG. 4 shows cross-sectional views of a cooling device for a heat source according to a third embodiment, FIG. 4A being a c cross-section, FIG. 4B being an a cross-section, and FIG. 4C being a b cross-section; the difference from the second embodiment shown in FIG. 3 lies in that upright plates arranged on the downstream side of holes 3 of header 4 are constituted as arcuate upright plates 8 a so as to surround holes 3 .
- FIG. 5 shows cross-sectional views of a cooling device for a heat source according to a fourth embodiment, FIG. 5A being a c cross-section, FIG. 5B being an a cross-section, and FIG. 5C being a b cross-section; the difference from the second embodiment shown in FIG. 3 lies in that upright plates arranged on the downstream side of holes 3 of header 4 are provided offset from the centers of holes 3 .
- FIG. 6 shows cross-sectional views of a cooling device for a heat source according to a fifth embodiment, FIG. 6A being a c cross-section, FIG. 6B being an a cross-section, and FIG. 6C being a b cross-section; the difference from the fourth embodiment shown in FIG. 5 lies in that the upright plates which are provided on the downstream side are offset from the centers of holes 3 of header 4 are formed as upright plates 8 b of arcuate shape such as to surround holes 3 .
- FIG. 7 shows cross-sectional views of a cooling device for a heat source according to a sixth embodiment, FIG. 7A being a c cross-section, FIG. 7B being an a cross-section, and FIG. 7C being a b cross-section; the difference from the second embodiment shown in FIG. 3 lies in that upright plates 8 c arranged on the downstream side of holes 3 of header 4 are arranged so as to contact without a gap side wall face 2 c of header 4 on the opposite side to the holes.
- FIG. 8 shows cross-sectional views of a cooling device for a heat source according to a seventh embodiment, FIG. 8A being a c cross-section, FIG. 8B being an a cross-section, and FIG. 8C being a b cross-section; the difference from the first embodiment shown in FIG. 2 lies in that baffle plates 10 are provided on the upstream side of holes 3 of outlet-side flow path 7 b.
- the thickness of the boundary layer at sidewall 2 b of the jet stream becomes less than in the case of the first embodiment, raising the rate of heat conduction and so making it possible to improve the heat sink cooling performance.
- FIG. 9 shows cross-sectional views of a cooling device for a heat source according to an eighth embodiment, FIG. 9A being a c cross-section, FIG. 9B being an a cross-section, and FIG. 9C being a b cross-section; the difference from the seventh embodiment shown in FIG. 8 lies in that the baffle plates that are provided on the upstream side of holes 3 of outlet-side flow path 7 b are constituted as upright plates 10 a of arcuate shape surrounding holes 3 .
- the thickness of the boundary layer at sidewall 2 b of the jet stream becomes less than in the case of the seventh embodiment, raising the rate of heat conduction and so making it possible to improve the heat sink cooling performance.
- FIG. 10 shows cross-sectional views of a cooling device for a heat source according to a ninth embodiment, FIG. 10A being a c cross-section, FIG. 10B being an a cross-section, and FIG. 10C being a b cross-section; the difference from the seventh embodiment shown in FIG. 8 lies in that the baffle plates 10 b that are provided on the upstream side of holes 3 of outlet-side flow path 7 b are arranged to contact without a gap the side wall face 2 b of outlet-side flow path 7 b opposite the holes.
- the thickness of the boundary layer at sidewall 2 b of the jet stream becomes less than in the case of the seventh embodiment, raising the rate of heat conduction and so making it possible to improve the heat sink cooling performance.
- FIG. 11 shows cross-sectional views of a cooling device for a heat source according to a tenth embodiment, FIG. 11A being a c cross-section, FIG. 11B being an a cross-section, and FIG. 11C being a b cross-section; the difference from the ninth embodiment shown in FIG. 10 lies in that, just as in the case of the sixth embodiment, upright plates 8 c are arranged so as to contact without a gap side wall face 2 c of header 4 on the opposite side to the holes arranged on the downstream side of holes 3 of header 4 .
- this pressure can be raised, thereby decreasing the contact thermal resistance of the heat sources 1 and heat sink 2 , so raising the rate of passage of heat and making it possible to improve the cooling performance of the heat sink.
- FIG. 12 shows cross-sectional views of a cooling device for a heat source according to an eleventh embodiment, FIG. 12A being a c cross-section, FIG. 12B being an a cross-section, and FIG. 12C being a b cross-section; the difference from the tenth embodiment shown in FIG. 11 lies in that the upright plates and baffle plates are made of arcuate shape surrounding respective holes.
- this pressure can be raised, thereby decreasing the contact thermal resistance of the heat sources 1 and heat sink 2 , so raising the rate of passage of heat and making it possible to improve the cooling performance of the heat sink.
- FIG. 13 shows cross-sectional views of a cooling device for a heat source according to a twelfth embodiment, FIG. 13A being a c cross-section, FIG. 13B being an a cross-section, and FIG. 13C being a b cross-section; the difference from the first embodiment shown in FIG. 2 lies in that a porous fluid resistance 18 is arranged between inlet port 5 and the header 4 provided on the opposite side of holes 3 to that of the heat sources.
- porous fluid resistance 18 between header 4 and inlet port 5 , the flow issuing on the downstream side of porous fluid resistance 18 becomes uniform and the tendency for differences to arise in the flow rate flowing into holes 3 is reduced, so flow rate differences between holes can be made smaller and, just as in the case of the first embodiment, the heat conduction rate of the plurality of parts with which the flow collides becomes practically equal, so the cooling performance of the heat sink, with which the flow collides, at the back of the heat sources becomes practically uniform.
- FIG. 14 shows cross-sectional views of a cooling device for a heat source according to a twelfth embodiment, FIG. 14A being a c cross-section, FIG. 14B being an a cross-section, and FIG. 14C being a b cross-section; the difference from the first embodiment shown in FIG. 2 lies in that a porous fluid resistance 19 is provided on the upstream side of holes 3 .
- porous fluid resistance 19 on the upstream side of holes 3 By providing porous fluid resistance 19 on the upstream side of holes 3 , the differences in pressure loss from inlet port 5 to porous fluid resistance 19 on the upstream side of the holes among the plurality of holes 3 becomes small and the outflow flow rate from holes 3 becomes practically uniform, making it possible to reduce flow rate differences between holes; just as in the case of the first embodiment, the heat conduction rate of the plurality of parts with which the flow collides becomes practically equal, so the cooling performance of the heat sink, with which the flow collides, at the back of the heat source becomes practically uniform.
- FIG. 15 shows cross-sectional views of a cooling device for a heat source according to a fourteenth embodiment, FIG. 15A being a c cross-section, FIG. 15B being an a cross-section, and FIG. 15C being a b cross-section; the difference from the first embodiment shown in FIG. 2 lies in that a plurality of headers 4 a are arranged on the side of holes 3 opposite to that of the heat source.
- the plurality of headers 4 a are partitioned by partitions 9 , flow from inlet port 5 to headers 4 a being guided by inlet-side flow path 7 a.
- FIG. 16 shows a cross-sectional view of a cooling device for a heat source according to a fifteenth embodiment; the difference from the fourteenth embodiment shown in FIG. 15 lies in that it is arranged that the fluid issuing from holes 3 passes through flow path 16 from outlet side flow path 7 b, to be returned to another header 4 b.
- the number of holes per header is reduced and the difference of fluid resistance from the header inlet to the respective holes within a header thus becomes small, making it possible to reduce the differences of flow rate between the respective holes.
- the heat conduction rate of the plurality of parts with which the flow collides thus becomes practically equal, so the cooling performance of the heat sink, with which the flow collides, at the back of the heat sources becomes practically uniform.
- FIG. 17 shows cross-sectional views of a cooling device for a heat source according to a sixteenth embodiment, FIG. 17A being a c cross-section, FIG. 17B being an a cross-section, and FIG. 17C being a b cross-section; the difference from the first embodiment shown in FIG. 2 lies in that, whereas the cooling device for a heat source of the first embodiment was integrally formed, in this embodiment, the part 21 where heat sources 1 are arranged, the part 22 where holes 3 are arranged and the part 23 where header 4 is arranged are divided.
- FIG. 18 is a cross-sectional view of a cooling device for a heat source according to a seventeenth embodiment.
- 1 are heat sources such as semiconductor elements
- 12 is a heat sink
- 13 are holes
- 14 is a header
- 15 is an inlet port
- header 14 being constituted in the middle of heat sink 12 and respectively a single one or a plurality of holes 13 being provided in sidewalls 17 on both sides of the header.
Abstract
In a cooling device for a heat source according to the present invention, header is arranged on the downstream side of an inlet port i.e. on the side of holes opposite to that of the heat source, a heat source is arranged on the outside face of a heat sink and holes are provided that spray fluid towards the back face of the heat sink, outlet ports being provided fewer than the number of holes. Thanks to the arrangement of header on the side of holes opposite to that of the heat source, no large differences are generated in the flow rate of the holes; thus, the heat conduction rate when the flow from holes collides with the back face of the heat sink is practically uniform and the cooling performance of the heat sink, with which the flow collides, at the back of the heat source is practically uniform.
Description
- This application claims benefit of priority to Japanese application number JP 2001-33916 filed Feb. 9, 2001, the entire content of which is incorporated by reference herein.
- 1. Field of the Invention
- The present invention relates to a cooling device for a heat source that cools a heat source such as a semiconductor element.
- 2. Description of the Related Art
- FIG. 1 shows cross-sectional views of a prior art cooling device for a heat source, FIG. 1A being a c cross-section, FIG. 1B being an a cross-section and FIG. 1C being a b cross-section.
- In FIG. 1A to C,1 are heat sources such as semiconductor elements, 2 is a heat sink, 3 are holes, 4 are headers, 5 is an inlet port, 6 is an outlet port, 7 a is an inlet-side flow path, and 7 b is an outlet-side flow path; cooling medium (hereinbelow “fluid”) entering from
inlet port 5 passes through outlet-side flow path 7 a and collides with the wall face ofheat sink 2 where the heat sources are arranged fromheaders 4 fromholes 3 and then flows through outlet-side flow path 7 b and is discharged fromoutlet port 6. The arrows indicate the flow of the fluid. - The heat that is generated in the heat source is transmitted to
heat sink 2 by thermal conduction and is transmitted to the fluid flowing out fromholes 3 by thermal conduction. In this process, the cooling performance is raised by the fact that the rate of heat conduction (so-called, heat condition rate) is increased since the fluid, rather than merely flowing, collides with the heat sink as a spray fromholes 3. - Also, although, in the case of a channel-type heat sink, there is considerable pressure loss since the fluid passes through narrow channels, with the spray system using holes, pressure loss is smaller than in the case of channels, so the cooling performance is higher.
- However, with the conventional cooling device for a heat source, although the fluid is guided from the inlet port to the respective holes by inlet-
side flow path 7 a, there are considerable differences in the liquid frictional resistance between the respective flow paths, with the result that the flow rate from the holes is uneven, producing local differences in cooling performance. - A further problem is that, although the pressure loss is less than in the case of the channel type, the pressure loss may still not necessarily be capable of being described as small; this inevitably lowers the flow rate, due to limitations on the cooling liquid circulation pump and so lowers the cooling performance.
- Accordingly one object of the present invention is to provide a novel cooling device for a heat source wherein the above problems are solved and a practically uniform cooling performance can be achieved with little loss of pressure.
- In order to achieve this object, a cooling device for a heat source according to the present invention is constructed as follows.
- Specifically, a cooling device for a heat source comprises:
- a heat sink with a heat source arranged on its outer surface and a plurality of holes provided at its back surface;
- a header arranged on the side of the holes arranged in this heat sink opposite to that of the heat source;
- an inlet port at which coolant flows into said header; and
- an outlet port at which coolant in the heat sink flows out.
- Thus, by arranging a header at the side of the holes opposite the heat source, pressure loss becomes smaller than in the case of the prior art in which fluid was fed to the holes by a flow path from an inlet port and practically uniform flow can be achieved without generating large differences in the flow rate of the plurality of holes.
- Also, the following construction is provided. Specifically, a cooling device for a heat source comprises:
- (1) a heat sink incorporating coolant, this heat sink comprising:
- (a) a first heat sink member with a heat source arranged at its outer surface; and
- (b) a second heat sink member provided with holes, the coolant that cools the heat source being made to pass through these holes;
- (2) a header arranged on the opposite side to that of the first heat sink member about the second heat sink member as axis;
- (3) an inlet port whereby the coolant is made to flow into a space surrounded by the header and the second heat sink member; and
- (4) an outlet port whereby coolant in the space surrounded by said first heat sink member and second heat sink member is made to flow out.
- A more complete appreciation of the present invention and many of the attendant advantage thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:
- FIG. 1 shows cross-sectional views of a prior art cooling device for a heat source;
- FIG. 2 shows cross-sectional views of a cooling device for a heat source according to a first embodiment of the present invention;
- FIG. 3 shows cross-sectional views of a cooling device for a heat source according to a second embodiment of the present invention;
- FIG. 4 shows cross-sectional views of a cooling device for a heat source according to a third embodiment of the present invention;
- FIG. 5 shows cross-sectional views of a cooling device for a heat source according to a fourth embodiment of the present invention;
- FIG. 6 shows cross-sectional views of a cooling device for a heat source according to a fifth embodiment of the present invention;
- FIG. 7 shows cross-sectional views of a cooling device for a heat source according to a sixth embodiment of the present invention;
- FIG. 8 shows cross-sectional views of a cooling device for a heat source according to a seventh embodiment of the present invention;
- FIG. 9 shows cross-sectional views of a cooling device for a heat source according to an eighth embodiment of the present invention;
- FIG. 10 shows cross-sectional views of a cooling device for a heat source according to a ninth embodiment of the present invention;
- FIG. 11 shows cross-sectional views of a cooling device for a heat source according to a tenth embodiment of the present invention;
- FIG. 12 shows cross-sectional views of a cooling device for a heat source according to an eleventh embodiment of the present invention;
- FIG. 13 shows cross-sectional views of a cooling device for a heat source according to a twelfth embodiment of the present invention;
- FIG. 14 shows cross-sectional views of a cooling device for a heat source according to a thirteenth embodiment of the present invention;
- FIG. 15 shows cross-sectional views of a cooling device for a heat source according to a fourteenth embodiment of the present invention;
- FIG. 16 shows a cross-sectional view of a cooling device for a heat source according to a fifteenth embodiment of the present invention;
- FIG. 17 shows cross-sectional views of a cooling device for a heat source according to a sixteenth embodiment of the present invention; and
- FIG. 18 shows a cross-sectional view of a cooling device for a heat source according to a seventeenth embodiment of the present invention.
- Referring now to the drawings, wherein like reference numerals designate identical or corresponding parts throughout the several views, and more particularly to FIG. 2 thereof, one embodiment of the present invention will be described.
- FIG. 2 shows cross-sectional views of a cooling device for a heat source according to a first embodiment of the present invention, FIG. 2A being a c cross-section, FIG. 2B being an a cross-section and FIG. 2C being a b cross-section.
- In FIG. 2A to C,1 are heat sources such as semiconductor elements, 2 is a heat sink (more precisely, a first heat sink member constituting a heat sink), 3 are holes (more precisely, these holes are provided in a second heat sink member constituting the heat sink), 4 is a header, 5 is an inlet port, 6 is an outlet port, and 7 b is an outlet-side flow path;
header 4 is arranged on the downstream side ofinlet port 5 i.e. on the opposite side ofholes 3 to that of the heat sources (on the opposite side toheat sources 2 a, regarding the body ofheat sink 2 as the center);heat sources 1 are arranged on thesurface 2 a ofheat sink 2 and a plurality ofholes 3 are provided that spray fluid towards therear face 2 b ofheat sink 2; and there is provided an outlet port 6 (in this embodiment, a single one on the opposite side to that of inlet port 5) of number fewer than the number ofholes 3. - Furthermore, the cross sectional area S4 of
header 4 is made considerably larger than the cross-sectional area S5 of inlet port 5 (S4>>S5). - Also, the header cross-sectional area Sz in the hole inlet direction is made considerably larger than the cross-sectional area Sh of a single hole (Sz>>Sh).
- In this way, by arranging the headers on the opposite side of
holes 3 to that of the heat sources, a practically uniform flow is obtained without generating large differences in the flow rate of the plurality ofholes 3, and the pressure loss is smaller than that in the conventional arrangement, in which the fluid was fed in a flow path from the inlet port. In this way, the rate of heat conduction when the flow fromholes 3 collides with theback surface 2 b of the heat sink becomes practically uniform (flow rate of the coolant colliding therewith is uniform), so the cooling performance of the heat sink, with which the flow collides, at the back of the heat sources becomes practically uniform. - Thus, the fluid resistance from
inlet port 5 to therespective holes 3 can be reduced by the provision ofheader 4. - Next, a second embodiment of the present invention will be described with reference to FIG. 3. Description of parts which are identical with those of the first embodiment is omitted; only the parts which are different are described.
- FIG. 3 shows cross-sectional views of a cooling device for a heat source according to a second embodiment, FIG. 3A being a c cross-section, FIG. 3B being an a cross-section and FIG. 3C being a b cross-section. The difference with respect to the first embodiment illustrated in FIG. 2 lies in the provision of
upright plates 8 on the downstream side of theholes 3 ofheader 4. - If there are no
upright plates 8, the flow is branched into downstream side flow and flow towards the holes, so branching loss is produced and the flow rate to the holes becomes somewhat smaller than the mean flow rate obtained by dividing the total flow rate by the number of holes. - Thanks to the provision of
upright plates 8 surroundingholes 3, theflow entering holes 3 fromheader 4 cannot be affected by branching loss produced by flow towards the further downstream side of the holes, so the pressure on the upstream side of the holes is raised and the flow rate toholes 3 becomes practically uniform; thus, in the same way as in the first embodiment, the heat conduction rate of the plurality of parts with which the flow collides becomes practically uniform, with the result that the cooling performance of the heat sink, with which the flow collides, at the back of the heat sources becomes practically uniform. - Next, a third embodiment of the present invention is described with reference to FIG. 4. Description of parts which are the same as in the case of the second embodiment is omitted and only parts which are different are described.
- FIG. 4 shows cross-sectional views of a cooling device for a heat source according to a third embodiment, FIG. 4A being a c cross-section, FIG. 4B being an a cross-section, and FIG. 4C being a b cross-section; the difference from the second embodiment shown in FIG. 3 lies in that upright plates arranged on the downstream side of
holes 3 ofheader 4 are constituted asarcuate upright plates 8 a so as to surroundholes 3. - In this way, the pressure on the upstream side of
upright plates 8 a i.e. in the vicinity ofholes 3 becomes higher than in the case of the second embodiment so the flow enters even more smoothly intoholes 3 with the result that the flow rate into the holes becomes practically equal to the mean flow rate; thus, in the same way as in the second embodiment, the heat conduction rates of the plurality of parts with which the flow collides become practically equal, so the cooling performance of the heat sink, with which the flow collides, at the back of the heat sources becomes practically uniform. - Next, a fourth embodiment of the present invention will be described with reference to FIG. 5. Description of parts which are the same as in the case of the second embodiment is omitted and only parts which are different are described.
- FIG. 5 shows cross-sectional views of a cooling device for a heat source according to a fourth embodiment, FIG. 5A being a c cross-section, FIG. 5B being an a cross-section, and FIG. 5C being a b cross-section; the difference from the second embodiment shown in FIG. 3 lies in that upright plates arranged on the downstream side of
holes 3 ofheader 4 are provided offset from the centers ofholes 3. - In this way, since the slipstream zone of a
hole 3 is offset from ahole 3 b on the downstream side thereof, it becomes easier for fluid to flow into such ahole 3 b on the downstream side; this makes it possible to reduce the difference of inflow for each hole; thus, in the same way as in the second embodiment, the heat conduction rates of the plurality of parts with which the flow collides become practically equal, so the cooling performance of the heat sink, with which the flow collides, at the back of the heat-generating becomes practically uniform. - FIG. 6 shows cross-sectional views of a cooling device for a heat source according to a fifth embodiment, FIG. 6A being a c cross-section, FIG. 6B being an a cross-section, and FIG. 6C being a b cross-section; the difference from the fourth embodiment shown in FIG. 5 lies in that the upright plates which are provided on the downstream side are offset from the centers of
holes 3 ofheader 4 are formed asupright plates 8 b of arcuate shape such as to surroundholes 3. - In this way, the flow from the upstream side flows along the downstream-side side faces of arcuate
upright plates 8 b, resulting in a reduction in the size of the slipstream zone; since the slipstream zone is offset from the holes on the downstream side, it becomes easier for fluid to flow into holes on the downstream side so the flow rate into the holes becomes a practically uniform flow rate; thus, in the same way as in the fourth embodiment, the heat conduction rates of the plurality of parts with which the flow collides become practically equal, so the cooling performance of the heat sink, with which the flow collides, at the back of the heat sources becomes practically uniform. - Next, a sixth embodiment of the present invention will be described with reference to FIG. 7. Description of parts which are the same as in the case of the second embodiment is omitted and only parts which are different are described.
- FIG. 7 shows cross-sectional views of a cooling device for a heat source according to a sixth embodiment, FIG. 7A being a c cross-section, FIG. 7B being an a cross-section, and FIG. 7C being a b cross-section; the difference from the second embodiment shown in FIG. 3 lies in that
upright plates 8 c arranged on the downstream side ofholes 3 ofheader 4 are arranged so as to contact without a gapside wall face 2 c ofheader 4 on the opposite side to the holes. - In this way, the pressure on the upstream side of
upright plates 8 c i.e. in the vicinity ofholes 3 becomes higher than in the case of the second embodiment so the flow enters even more smoothly intoholes 3 with the result that the flow rate difference for each hole can be reduced so that just as in the case of the second embodiment, the heat conduction rates of the plurality of parts with which the flow collides become practically equal, so the cooling performance of the heat sink, with which the flow collides, at the back of the heat sources becomes practically uniform. - Next, a seventh embodiment of the present invention is described with reference to FIG. 8. Description of parts which are the same as in the case of the first embodiment is omitted and only parts which are different are described.
- FIG. 8 shows cross-sectional views of a cooling device for a heat source according to a seventh embodiment, FIG. 8A being a c cross-section, FIG. 8B being an a cross-section, and FIG. 8C being a b cross-section; the difference from the first embodiment shown in FIG. 2 lies in that
baffle plates 10 are provided on the upstream side ofholes 3 of outlet-side flow path 7 b. - In this way, flow from the upstream side of outlet-
side flow path 7 b is divided onto both sides bybaffle plates 10 and so interference with the flow flowing out fromholes 3 is eliminated. - As a result, the thickness of the boundary layer at
sidewall 2 b of the jet stream becomes less than in the case of the first embodiment, raising the rate of heat conduction and so making it possible to improve the heat sink cooling performance. - Next, an eighth embodiment of the present invention is described with reference to FIG. 9. Description of parts which are the same as in the case of the seventh embodiment is omitted and only parts which are different are described.
- FIG. 9 shows cross-sectional views of a cooling device for a heat source according to an eighth embodiment, FIG. 9A being a c cross-section, FIG. 9B being an a cross-section, and FIG. 9C being a b cross-section; the difference from the seventh embodiment shown in FIG. 8 lies in that the baffle plates that are provided on the upstream side of
holes 3 of outlet-side flow path 7 b are constituted asupright plates 10 a of arcuateshape surrounding holes 3. - As a result, the flow from the upstream side of outlet-
side flow path 7 b is divided onto both sides by thearcuate baffle plates 10 a, so interference with respect of the flow flowing out fromholes 3 is eliminated more effectively than in the case of the seventh embodiment, so that the flow becomes smoother on the downstream side. - As a result, the thickness of the boundary layer at
sidewall 2 b of the jet stream becomes less than in the case of the seventh embodiment, raising the rate of heat conduction and so making it possible to improve the heat sink cooling performance. - Next, a ninth embodiment of the present invention is described with reference to FIG. 10. Description of parts which are the same as in the case of the seventh embodiment is omitted and only parts which are different are described.
- FIG. 10 shows cross-sectional views of a cooling device for a heat source according to a ninth embodiment, FIG. 10A being a c cross-section, FIG. 10B being an a cross-section, and FIG. 10C being a b cross-section; the difference from the seventh embodiment shown in FIG. 8 lies in that the
baffle plates 10 b that are provided on the upstream side ofholes 3 of outlet-side flow path 7 b are arranged to contact without a gap theside wall face 2 b of outlet-side flow path 7 b opposite the holes. - As a result, the flow from the upstream side of outlet-
side flow path 7 b is divided onto both sides by thebaffle plates 10 b, so interference with respect of the flow flowing out fromholes 3 is eliminated more effectively than in the case of the seventh embodiment, so that the flow becomes smoother on the downstream side. - As a result, the thickness of the boundary layer at
sidewall 2 b of the jet stream becomes less than in the case of the seventh embodiment, raising the rate of heat conduction and so making it possible to improve the heat sink cooling performance. - Next, a tenth embodiment of the present invention is described with reference to FIG. 11. Description of parts which are the same as in the case of the ninth embodiment is omitted and only parts which are different are described.
- FIG. 11 shows cross-sectional views of a cooling device for a heat source according to a tenth embodiment, FIG. 11A being a c cross-section, FIG. 11B being an a cross-section, and FIG. 11C being a b cross-section; the difference from the ninth embodiment shown in FIG. 10 lies in that, just as in the case of the sixth embodiment,
upright plates 8 c are arranged so as to contact without a gapside wall face 2 c ofheader 4 on the opposite side to the holes arranged on the downstream side ofholes 3 ofheader 4. - In this way, in the same way as in the case of the sixth embodiment, the pressure on the upstream side of
upright plates 8 c i.e. in the vicinity ofholes 3 becomes higher, with the result that the flow enters even more smoothly intoholes 3 and it becomes possible to reduce the difference of flow rates between respective holes; also, just as in the case of the ninth embodiment, the flow from the upstream side of outlet-side flow path 7 b is divided onto both sides bybaffle plates 10 b so that interference with the flow issuing fromholes 3 is eliminated and the flow can flow out smoothly on the downstream side. In addition to this, rigidity in the thickness direction ofheat sink 2 is improved, making it possible to reduce the amount of deformation of the heat sink that is produced by the heat sources pressing thereon. - As a result, this pressure can be raised, thereby decreasing the contact thermal resistance of the
heat sources 1 andheat sink 2, so raising the rate of passage of heat and making it possible to improve the cooling performance of the heat sink. - Next, an eleventh embodiment of the present invention will be described with reference to FIG. 12. Description of parts which are the same as in the case of the tenth embodiment is omitted and only parts which are different are described.
- FIG. 12 shows cross-sectional views of a cooling device for a heat source according to an eleventh embodiment, FIG. 12A being a c cross-section, FIG. 12B being an a cross-section, and FIG. 12C being a b cross-section; the difference from the tenth embodiment shown in FIG. 11 lies in that the upright plates and baffle plates are made of arcuate shape surrounding respective holes.
- In this way, in the same way as in the case of the sixth embodiment, the pressure on the upstream side of
upright plates 8 c i.e. in the vicinity ofholes 3 becomes higher, with the result that the flow enters even more smoothly intoholes 3 and it becomes possible to reduce the difference of flow rates between respective holes; also, just as in the case of the ninth embodiment, the flow from the upstream side of outlet-side flow path 7 b is divided onto both sides bybaffle plates 10 b so that interference with the flow issuing fromholes 3 is eliminated and the flow can flow out smoothly on the downstream side. In addition to this, rigidity in the thickness direction ofheat sink 2 is improved compared with that in the tenth embodiment, making it possible to reduce the amount of deformation of theheat sink 2 that is produced by the heat sources pressing thereon. - As a result, this pressure can be raised, thereby decreasing the contact thermal resistance of the
heat sources 1 andheat sink 2, so raising the rate of passage of heat and making it possible to improve the cooling performance of the heat sink. - Next, a twelfth embodiment of the present invention will be described with reference to FIG. 13. Description of parts which are the same as in the case of the first embodiment is omitted and only parts which are different are described.
- FIG. 13 shows cross-sectional views of a cooling device for a heat source according to a twelfth embodiment, FIG. 13A being a c cross-section, FIG. 13B being an a cross-section, and FIG. 13C being a b cross-section; the difference from the first embodiment shown in FIG. 2 lies in that a
porous fluid resistance 18 is arranged betweeninlet port 5 and theheader 4 provided on the opposite side ofholes 3 to that of the heat sources. - By providing
porous fluid resistance 18 betweenheader 4 andinlet port 5, the flow issuing on the downstream side ofporous fluid resistance 18 becomes uniform and the tendency for differences to arise in the flow rate flowing intoholes 3 is reduced, so flow rate differences between holes can be made smaller and, just as in the case of the first embodiment, the heat conduction rate of the plurality of parts with which the flow collides becomes practically equal, so the cooling performance of the heat sink, with which the flow collides, at the back of the heat sources becomes practically uniform. - Next, a thirteenth embodiment of the present invention will be described with reference to FIG. 14. Description of parts which are the same as in the case of the first embodiment is omitted and only parts which are different are described.
- FIG. 14 shows cross-sectional views of a cooling device for a heat source according to a twelfth embodiment, FIG. 14A being a c cross-section, FIG. 14B being an a cross-section, and FIG. 14C being a b cross-section; the difference from the first embodiment shown in FIG. 2 lies in that a
porous fluid resistance 19 is provided on the upstream side ofholes 3. - By providing
porous fluid resistance 19 on the upstream side ofholes 3, the differences in pressure loss frominlet port 5 toporous fluid resistance 19 on the upstream side of the holes among the plurality ofholes 3 becomes small and the outflow flow rate fromholes 3 becomes practically uniform, making it possible to reduce flow rate differences between holes; just as in the case of the first embodiment, the heat conduction rate of the plurality of parts with which the flow collides becomes practically equal, so the cooling performance of the heat sink, with which the flow collides, at the back of the heat source becomes practically uniform. - Next, a fourteenth embodiment of the present invention will be described with reference to FIG. 15. Description of parts which are the same as in the case of the first embodiment is omitted and only parts which are different are described.
- FIG. 15 shows cross-sectional views of a cooling device for a heat source according to a fourteenth embodiment, FIG. 15A being a c cross-section, FIG. 15B being an a cross-section, and FIG. 15C being a b cross-section; the difference from the first embodiment shown in FIG. 2 lies in that a plurality of
headers 4 a are arranged on the side ofholes 3 opposite to that of the heat source. - The plurality of
headers 4 a are partitioned by partitions 9, flow frominlet port 5 toheaders 4 a being guided by inlet-side flow path 7 a. - In this way, the fluid resistance of inlet-
side flow path 7 a to the respective headers is equalized, thereby reducing the difference of total flow rate of the respective headers. In this way, compared with the case where there is only a single header, the number of holes per header becomes fewer, so the differences of fluid resistance to the respective holes in a header becomes small, making it possible to reduce the flow rate differences between each hole; thus, just as in the case of the first embodiment, the heat conduction rate of the plurality of parts with which the flow collides becomes practically equal so the cooling performance of the heat sink, with which the flow collides, at the back of the heat sources becomes practically uniform. - Next, a fifteenth embodiment of the present invention will be described with reference to FIG. 16. Description of parts which are the same as in the case of the fourteenth embodiment is omitted and only parts which are different are described.
- FIG. 16 shows a cross-sectional view of a cooling device for a heat source according to a fifteenth embodiment; the difference from the fourteenth embodiment shown in FIG. 15 lies in that it is arranged that the fluid issuing from
holes 3 passes throughflow path 16 from outletside flow path 7 b, to be returned to anotherheader 4 b. - In this way, the number of holes per header is reduced and the difference of fluid resistance from the header inlet to the respective holes within a header thus becomes small, making it possible to reduce the differences of flow rate between the respective holes. In the same way as in the fourth embodiment, the heat conduction rate of the plurality of parts with which the flow collides thus becomes practically equal, so the cooling performance of the heat sink, with which the flow collides, at the back of the heat sources becomes practically uniform.
- Next, a sixteenth embodiment of the present invention will be described with reference to FIG. 17. Description of parts which are the same as in the case of the first embodiment is omitted and only parts which are different are described.
- FIG. 17 shows cross-sectional views of a cooling device for a heat source according to a sixteenth embodiment, FIG. 17A being a c cross-section, FIG. 17B being an a cross-section, and FIG. 17C being a b cross-section; the difference from the first embodiment shown in FIG. 2 lies in that, whereas the cooling device for a heat source of the first embodiment was integrally formed, in this embodiment, the
part 21 whereheat sources 1 are arranged, thepart 22 whereholes 3 are arranged and thepart 23 whereheader 4 is arranged are divided. - Thanks to such division, it becomes possible to easily change the position and hole diameter of
holes 3 in accordance with the position of the heat sources and the size of the heat sources and the flow fromholes 3 can thus be directed to the middle of the heat sources. - Since the heat conduction rate of the heat conduction of the colliding flow decreases as the distance from the jet stream is increased, by arranging
holes 3 therebelow in accordance with the position of the heat sources, a high heat conduction rate at the locations of heat generation can be obtained and, just as in the case of the first embodiment, the heat conduction rate of the plurality of parts with which the flow collides thus becomes practically equal, so the cooling performance of the heat sink, with which the flow A collides, at the back of the heat sources becomes practically uniform. - FIG. 18 is a cross-sectional view of a cooling device for a heat source according to a seventeenth embodiment.
- In FIG. 18, 1 are heat sources such as semiconductor elements,12 is a heat sink, 13 are holes, 14 is a header and 15 is an inlet port,
header 14 being constituted in the middle ofheat sink 12 and respectively a single one or a plurality ofholes 13 being provided insidewalls 17 on both sides of the header. - The fluid flowing in from
inlet port 15 passes throughheader 14 and passes out throughholes 13 provided inwalls 17 on both sides of the header. Thus the jet stream fromholes 13 towardsheat sources 1 arranged on the outer surfaces on both sides of theoutside walls 12 b of the heat sink collides therewith. The heat conduction rate of wall faces 12 b is thereby increased, improving the cooling performance. - For example, if
heat sources 1 of the same number are arranged with the same pitch in the direction of the fluid flow, by such an arrangement ofheat sources 1 on both sides, the distance from theinflow port 15 toholes 13 can be shortened compared with the case where they are arranged on one side only; pressure loss can therefore be reduced. - As described in detail above, with the present invention, fluid resistance is reduced and pressure loss is reduced. Also, a cooling device for a heat source can be obtained wherein the heat conduction rate of the plurality of parts with which the flow collides is practically equal, so the cooling performance of the heat sink, with which the flow collides, at the back of the heat sources becomes practically uniform.
- Obviously, numerous additional modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the present invention they be practiced otherwise than as specially described herein.
Claims (17)
1. A cooling device for a heat source, comprising:
a heat sink with a heat source arranged on an outer surface of said heat sink and a plurality of holes provided at a back surface of said heat sink;
a header arranged on a side of said holes arranged in said heat sink opposite to said heat source;
an inlet port at which a coolant flows into said header; and
an outlet port at which said coolant in said heat sink flows out.
2. A cooling device for a heat source, comprising:
(1) a heat sink including a coolant, said heat sink comprising:
(a) a first heat sink member with a heat source arranged at an outer surface of said heat sink; and
(b) a second heat sink member provided with a plurality of holes, said coolant that cools said heat source being made to pass through said holes;
(2) a header configured to an opposite side to said first heat sink member about said second heat sink member as axis;
(3) an inlet port whereby said coolant is made to flow into a first space surrounded by said header and said second heat sink member; and
(4) an outlet port whereby said coolant in a second space surrounded by said first heat sink member and second heat sink member is made to flow out.
3. The cooling device for a heat source according to claim 1 ,
wherein an upright plate is provided on a downstream side of said header.
4. The cooling device for a heat source according to claim 2 ,
wherein an upright plate provided on a downstream side of said header is made of arcuate shape such as to surround a hole.
5. The cooling device for a heat source according to claim 2 or claim 3 ,
wherein said upright plate provided on a downstream side of said header is provided offset from a center of said hole.
6. The cooling device for a heat source according to any of claim 1 to claim 4 ,
wherein a gap between said upright plate provided on a downstream side of said header and a wall face on a side of said header opposite said holes is eliminated.
7. The cooling device for a heat source according to claim 1 ,
wherein a baffle plate is provided on an upstream side of said holes within said heat sink.
8. The cooling device for a heat source according to claim 6 ,
wherein the baffle plate provided on an upstream side of said holes within said heat sink is made of arcuate shape such as to surround a hole.
9. The cooling device for a heat source according to claim 6 or claim 7 ,
wherein a gap between said baffle plate provided on an upstream side of said holes within said heat sink and said wall face on a side of said heat sink opposite said holes is eliminated.
10. The cooling device for a heat source according to claim 1 ,
wherein an upright plate on a downstream side of said holes of said header and a baffle plate on an upstream side of said holes within said heat sink are provided.
11. The cooling device for a heat source according to claim 9 ,
wherein said upright plate and said baffle plate respectively are made of arcuate shape such as to surround a hole.
12. The cooling device for a heat source according to claim 1 ,
wherein a porous fluid resistance is arranged between an upstream end of said header and said holes.
13. The cooling device for a heat source according to claim 1 ,
wherein a porous fluid resistance is arranged on an upstream side of said holes.
14. The cooling device for a heat source according to claim 1 ,
wherein a plurality of headers are arranged on a side of holes arranged in said heat sink opposite that of said heat source.
15. The cooling device for a heat source according to claim 13 ,
wherein a flow path is provided whereby said coolant flowing out from said holes is returned to another header from within said heat sink.
16. The cooling device for a heat source according to claim 1 , wherein said cooling device is constructed divided into a part where said heat source is arranged, a part where said holes are arranged and a header part.
17. A cooling device for a heat source comprising:
a header wherein one or a plurality of holes are respectively provided in a wall faces on both sides;
a heat sink outside wall where a heat source is arranged on an outer surface with gaps being provided on both sides of said header;
an inlet port whereby an coolant flows into said header; and
an outlet port whereby said coolant within said heat sink flows out.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/260,273 US7568519B2 (en) | 2001-02-09 | 2005-10-28 | Cooling device for heat source |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-033916 | 2001-02-09 | ||
JP2001033916A JP3857060B2 (en) | 2001-02-09 | 2001-02-09 | Heating element cooling device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/260,273 Division US7568519B2 (en) | 2001-02-09 | 2005-10-28 | Cooling device for heat source |
Publications (1)
Publication Number | Publication Date |
---|---|
US20020112847A1 true US20020112847A1 (en) | 2002-08-22 |
Family
ID=18897600
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/067,992 Abandoned US20020112847A1 (en) | 2001-02-09 | 2002-02-08 | Cooling device for heat source |
US11/260,273 Expired - Fee Related US7568519B2 (en) | 2001-02-09 | 2005-10-28 | Cooling device for heat source |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/260,273 Expired - Fee Related US7568519B2 (en) | 2001-02-09 | 2005-10-28 | Cooling device for heat source |
Country Status (2)
Country | Link |
---|---|
US (2) | US20020112847A1 (en) |
JP (1) | JP3857060B2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103928414A (en) * | 2014-04-15 | 2014-07-16 | 合肥工业大学 | Liquid cooling radiating system of electronic component |
CN105208837A (en) * | 2015-10-29 | 2015-12-30 | 中国电子科技集团公司第二十研究所 | Staggered micro-channel heat sinking device based on sealed micro jet |
CN107148201A (en) * | 2017-07-14 | 2017-09-08 | 四川大学 | A kind of cooling device of utilization miniaturization boiling high efficient heat exchanging technology |
CN107275298A (en) * | 2017-06-14 | 2017-10-20 | 国电南瑞科技股份有限公司 | A kind of suppression electromagnetic interference and the water-filled radiator for optimizing heat dispersion |
CN109764706A (en) * | 2019-03-12 | 2019-05-17 | 山东省科学院能源研究所 | A kind of micro-channel heat exchanger structure and working method with jet pipe |
US10306802B1 (en) * | 2015-08-28 | 2019-05-28 | Lockheed Martin Corporation | Micro jet impingement heat sink |
US20190212067A1 (en) * | 2018-01-11 | 2019-07-11 | Asia Vital Components Co., Ltd. | Multi-outlet-inlet multilayered liquid-cooling heat dissipation structure |
EP3836204A1 (en) * | 2019-12-13 | 2021-06-16 | Valeo Siemens eAutomotive Germany GmbH | Cooling device for semiconductor switching elements, power inverter device and arrangement with a power inverter device and an electric machine |
WO2022139830A1 (en) * | 2020-12-23 | 2022-06-30 | Abaco Systems, Inc. | Impingement cooling providing enhanced localized cooling of a heatsink |
US11723173B1 (en) * | 2022-03-23 | 2023-08-08 | Rolls-Royce Corporation | Stacked cold plate with flow guiding vanes and method of manufacturing |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4699253B2 (en) * | 2006-03-23 | 2011-06-08 | トヨタ自動車株式会社 | Cooler |
JP4675283B2 (en) * | 2006-06-14 | 2011-04-20 | トヨタ自動車株式会社 | Heat sink and cooler |
JP4855227B2 (en) * | 2006-11-30 | 2012-01-18 | 三菱電機株式会社 | Choke coil unit and power device using the same |
US20090205809A1 (en) * | 2008-02-19 | 2009-08-20 | Man Zai Industrial Co., Ltd. | Liquid cooling device |
JP2009266885A (en) * | 2008-04-22 | 2009-11-12 | Fuji Electric Systems Co Ltd | Cooling device for electronic device with wiring board |
US8077460B1 (en) * | 2010-07-19 | 2011-12-13 | Toyota Motor Engineering & Manufacturing North America, Inc. | Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same |
EP2426409B1 (en) * | 2010-09-01 | 2014-03-05 | Goodrich Lighting Systems GmbH | Device for generating a cold air flow in a preferred flow direction for cooling electrical components |
JP5740119B2 (en) * | 2010-09-13 | 2015-06-24 | 昭和電工株式会社 | Cooling system |
JP2014135396A (en) * | 2013-01-10 | 2014-07-24 | Fujitsu Ltd | Cooling head and electronic apparatus |
US9247679B2 (en) * | 2013-05-24 | 2016-01-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement coolers and power electronics modules comprising the same |
JP6440822B2 (en) * | 2015-03-25 | 2018-12-19 | 三菱電機株式会社 | Cooler, power conversion device and cooling system |
US9622380B1 (en) | 2015-09-30 | 2017-04-11 | Toyota Motor Engineering & Manufacturing North America, Inc. | Two-phase jet impingement cooling devices and electronic device assemblies incorporating the same |
Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4202551A (en) * | 1978-05-11 | 1980-05-13 | Darnall Tom A Jr | Acoustic dampening assembly for record player turntable |
US4225142A (en) * | 1979-02-28 | 1980-09-30 | Zolt David M | Turntable system with low aggregate resonance |
US4425813A (en) * | 1981-06-04 | 1984-01-17 | Wadensten Theodore S | Vibration dampening apparatus for motor actuated eccentric forces |
US4683520A (en) * | 1986-07-14 | 1987-07-28 | Laser Magnetic Storage International Company | Mechanical shock mount system for electrical apparatus |
US4705527A (en) * | 1986-05-14 | 1987-11-10 | Burlington Industries, Inc. | Process for the printing of shaped articles derived from aramid fibers |
US4812932A (en) * | 1986-07-09 | 1989-03-14 | Hitachi, Ltd. | Vibration proof supporting structure for disk-type information memory unit |
US4896777A (en) * | 1988-04-06 | 1990-01-30 | Digital Equipment Corporation | Lock and shock mounted device for computer disk drive |
US4937806A (en) * | 1988-02-12 | 1990-06-26 | Mdb Systems, Inc. | Shock-isolated portable mass data storage device |
US4964017A (en) * | 1989-04-26 | 1990-10-16 | Intelligent Instrumentation, Inc. | Adaptable housing for embedding of computer-controlled products |
US5131619A (en) * | 1988-03-09 | 1992-07-21 | Digital Equipment Corporation | Vibration isolating mount |
US5239443A (en) * | 1992-04-23 | 1993-08-24 | International Business Machines Corporation | Blind hole cold plate cooling system |
US5347503A (en) * | 1989-08-04 | 1994-09-13 | Canon Kabushiki Kaisha | Optical information processing apparatus for correcting linearity of a photosensor output with respect to power of an emitted light beam |
US5402308A (en) * | 1992-05-12 | 1995-03-28 | International Business Machines Corporation | Portable disk storage apparatus using flexible cable for shock absorption |
US5440172A (en) * | 1993-06-28 | 1995-08-08 | Sundstrand Corporation | Integral heat sink interface |
US5737304A (en) * | 1994-04-25 | 1998-04-07 | Sony Corporation | CD/CD-ROM apparatus |
US5839100A (en) * | 1996-04-22 | 1998-11-17 | Wegener; Albert William | Lossless and loss-limited compression of sampled data signals |
US5860726A (en) * | 1997-05-05 | 1999-01-19 | Star Headlight And Lantern Co. Inc. | Rotator mounting system |
US5875067A (en) * | 1991-03-22 | 1999-02-23 | Seagate Technology, Inc. | Acoustic isolator for a disc drive assembly |
US5943208A (en) * | 1996-11-13 | 1999-08-24 | Fujitsu Limited | Terminal device and memory device-fastening mechanism |
US5956314A (en) * | 1992-06-05 | 1999-09-21 | Sony Corporation | Shock absorbing device and recording/playback apparatus for disc-shaped recording medium employing the shock absorbing device |
US6021041A (en) * | 1997-06-09 | 2000-02-01 | Dell U.S.A., L.P | Tuned shock absorbing system for portable computer hard disc drives |
US6041302A (en) * | 1996-11-11 | 2000-03-21 | U.S. Philips Corporation | Data compression/expansion using a rice encoder/decoder |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3361195A (en) * | 1966-09-23 | 1968-01-02 | Westinghouse Electric Corp | Heat sink member for a semiconductor device |
EP0341950B1 (en) * | 1988-05-09 | 1994-09-14 | Nec Corporation | Flat cooling structure of integrated circuit |
US5016090A (en) * | 1990-03-21 | 1991-05-14 | International Business Machines Corporation | Cross-hatch flow distribution and applications thereof |
JP2995590B2 (en) * | 1991-06-26 | 1999-12-27 | 株式会社日立製作所 | Semiconductor cooling device |
US5263536A (en) * | 1991-07-19 | 1993-11-23 | Thermo Electron Technologies Corp. | Miniature heat exchanger |
CA2088821C (en) * | 1992-02-05 | 1999-09-07 | Hironobu Ikeda | Cooling structure for integrated circuit |
US5316075A (en) * | 1992-12-22 | 1994-05-31 | Hughes Aircraft Company | Liquid jet cold plate for impingement cooling |
JP3415663B2 (en) * | 1992-12-28 | 2003-06-09 | アルストム | Equipment for cooling the cooling surface in an impact manner |
JP2834996B2 (en) | 1994-03-17 | 1998-12-14 | 富士通株式会社 | heatsink |
US5631676A (en) * | 1994-11-30 | 1997-05-20 | Xerox Corporation | Parallel flow water cooling system for printbars |
US5604665A (en) * | 1995-06-30 | 1997-02-18 | International Business Machines Corporation | Multiple parallel impingement flow cooling with tuning |
JP3203475B2 (en) | 1996-06-28 | 2001-08-27 | 株式会社日立製作所 | Semiconductor device |
US5841634A (en) * | 1997-03-12 | 1998-11-24 | Delco Electronics Corporation | Liquid-cooled baffle series/parallel heat sink |
DE19751299C2 (en) * | 1997-11-19 | 1999-09-09 | Siemens Ag | Combustion chamber and method for steam cooling a combustion chamber |
US6397936B1 (en) * | 1999-05-14 | 2002-06-04 | Creare Inc. | Freeze-tolerant condenser for a closed-loop heat-transfer system |
-
2001
- 2001-02-09 JP JP2001033916A patent/JP3857060B2/en not_active Expired - Fee Related
-
2002
- 2002-02-08 US US10/067,992 patent/US20020112847A1/en not_active Abandoned
-
2005
- 2005-10-28 US US11/260,273 patent/US7568519B2/en not_active Expired - Fee Related
Patent Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4202551A (en) * | 1978-05-11 | 1980-05-13 | Darnall Tom A Jr | Acoustic dampening assembly for record player turntable |
US4225142A (en) * | 1979-02-28 | 1980-09-30 | Zolt David M | Turntable system with low aggregate resonance |
US4425813A (en) * | 1981-06-04 | 1984-01-17 | Wadensten Theodore S | Vibration dampening apparatus for motor actuated eccentric forces |
US4705527A (en) * | 1986-05-14 | 1987-11-10 | Burlington Industries, Inc. | Process for the printing of shaped articles derived from aramid fibers |
US4812932A (en) * | 1986-07-09 | 1989-03-14 | Hitachi, Ltd. | Vibration proof supporting structure for disk-type information memory unit |
US4683520A (en) * | 1986-07-14 | 1987-07-28 | Laser Magnetic Storage International Company | Mechanical shock mount system for electrical apparatus |
US4937806A (en) * | 1988-02-12 | 1990-06-26 | Mdb Systems, Inc. | Shock-isolated portable mass data storage device |
US5131619A (en) * | 1988-03-09 | 1992-07-21 | Digital Equipment Corporation | Vibration isolating mount |
US4896777A (en) * | 1988-04-06 | 1990-01-30 | Digital Equipment Corporation | Lock and shock mounted device for computer disk drive |
US4964017A (en) * | 1989-04-26 | 1990-10-16 | Intelligent Instrumentation, Inc. | Adaptable housing for embedding of computer-controlled products |
US5347503A (en) * | 1989-08-04 | 1994-09-13 | Canon Kabushiki Kaisha | Optical information processing apparatus for correcting linearity of a photosensor output with respect to power of an emitted light beam |
US5875067A (en) * | 1991-03-22 | 1999-02-23 | Seagate Technology, Inc. | Acoustic isolator for a disc drive assembly |
US5239443A (en) * | 1992-04-23 | 1993-08-24 | International Business Machines Corporation | Blind hole cold plate cooling system |
US5402308A (en) * | 1992-05-12 | 1995-03-28 | International Business Machines Corporation | Portable disk storage apparatus using flexible cable for shock absorption |
US5956314A (en) * | 1992-06-05 | 1999-09-21 | Sony Corporation | Shock absorbing device and recording/playback apparatus for disc-shaped recording medium employing the shock absorbing device |
US5440172A (en) * | 1993-06-28 | 1995-08-08 | Sundstrand Corporation | Integral heat sink interface |
US5737304A (en) * | 1994-04-25 | 1998-04-07 | Sony Corporation | CD/CD-ROM apparatus |
US5839100A (en) * | 1996-04-22 | 1998-11-17 | Wegener; Albert William | Lossless and loss-limited compression of sampled data signals |
US6041302A (en) * | 1996-11-11 | 2000-03-21 | U.S. Philips Corporation | Data compression/expansion using a rice encoder/decoder |
US5943208A (en) * | 1996-11-13 | 1999-08-24 | Fujitsu Limited | Terminal device and memory device-fastening mechanism |
US5860726A (en) * | 1997-05-05 | 1999-01-19 | Star Headlight And Lantern Co. Inc. | Rotator mounting system |
US6021041A (en) * | 1997-06-09 | 2000-02-01 | Dell U.S.A., L.P | Tuned shock absorbing system for portable computer hard disc drives |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103928414A (en) * | 2014-04-15 | 2014-07-16 | 合肥工业大学 | Liquid cooling radiating system of electronic component |
US10306802B1 (en) * | 2015-08-28 | 2019-05-28 | Lockheed Martin Corporation | Micro jet impingement heat sink |
CN105208837A (en) * | 2015-10-29 | 2015-12-30 | 中国电子科技集团公司第二十研究所 | Staggered micro-channel heat sinking device based on sealed micro jet |
CN107275298A (en) * | 2017-06-14 | 2017-10-20 | 国电南瑞科技股份有限公司 | A kind of suppression electromagnetic interference and the water-filled radiator for optimizing heat dispersion |
CN107148201A (en) * | 2017-07-14 | 2017-09-08 | 四川大学 | A kind of cooling device of utilization miniaturization boiling high efficient heat exchanging technology |
US20190212067A1 (en) * | 2018-01-11 | 2019-07-11 | Asia Vital Components Co., Ltd. | Multi-outlet-inlet multilayered liquid-cooling heat dissipation structure |
CN109764706A (en) * | 2019-03-12 | 2019-05-17 | 山东省科学院能源研究所 | A kind of micro-channel heat exchanger structure and working method with jet pipe |
WO2020181605A1 (en) * | 2019-03-12 | 2020-09-17 | 山东省科学院能源研究所 | Microchannel heat exchanger structure having nozzle and working method |
US20210247142A1 (en) * | 2019-03-12 | 2021-08-12 | Energy Research Institute Of Shandong Academy Of Sciences | Microchannel heat exchanger structure with nozzle and working method thereof |
US11549758B2 (en) * | 2019-03-12 | 2023-01-10 | Energy Research Institute Of Shandong Academy Of Sciences | Microchannel heat exchanger structure with nozzle and working method thereof |
EP3836204A1 (en) * | 2019-12-13 | 2021-06-16 | Valeo Siemens eAutomotive Germany GmbH | Cooling device for semiconductor switching elements, power inverter device and arrangement with a power inverter device and an electric machine |
WO2021115897A1 (en) * | 2019-12-13 | 2021-06-17 | Valeo Siemens Eautomotive Germany Gmbh | Cooling device for semiconductor switching elements, power inverter device and arrangement with a power inverter device and an electric machine |
US20230050543A1 (en) * | 2019-12-13 | 2023-02-16 | Valeo Siemens Eautomotive Germany Gmbh | Cooling device for semiconductor switching elements, power inverter device and arrangement with a power inverter device and an electric machine |
WO2022139830A1 (en) * | 2020-12-23 | 2022-06-30 | Abaco Systems, Inc. | Impingement cooling providing enhanced localized cooling of a heatsink |
US11723173B1 (en) * | 2022-03-23 | 2023-08-08 | Rolls-Royce Corporation | Stacked cold plate with flow guiding vanes and method of manufacturing |
Also Published As
Publication number | Publication date |
---|---|
US7568519B2 (en) | 2009-08-04 |
JP2002237691A (en) | 2002-08-23 |
US20060048918A1 (en) | 2006-03-09 |
JP3857060B2 (en) | 2006-12-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7568519B2 (en) | Cooling device for heat source | |
US7114550B2 (en) | Cooling device for heat-generating elements | |
US6337794B1 (en) | Isothermal heat sink with tiered cooling channels | |
US6253835B1 (en) | Isothermal heat sink with converging, diverging channels | |
US6301109B1 (en) | Isothermal heat sink with cross-flow openings between channels | |
KR100619076B1 (en) | Heat sink apparatus for radiating of the electronic device | |
WO2019043801A1 (en) | Heat sink | |
US11502023B2 (en) | Semiconductor device with partition for refrigerant cooling | |
US20050082035A1 (en) | Heat dissipating apparatus | |
EP2559063B1 (en) | A flow distributor | |
JP6109265B2 (en) | Electric equipment with refrigerant flow path | |
JP2014135396A (en) | Cooling head and electronic apparatus | |
JP2020145245A (en) | Heat sink and semiconductor module with the same | |
JP4041131B2 (en) | Semiconductor module cooling system | |
EP3770958B1 (en) | Liquid-cooled cooler | |
JP2021173748A (en) | Position measuring device | |
US20240110753A1 (en) | Multi-channel liquid cooling radiator | |
JP4522725B2 (en) | heatsink | |
US10168112B2 (en) | Heat exchanging apparatus and method for transferring heat | |
US20230204305A1 (en) | Heat dissipation member and cooling device | |
US20220210946A1 (en) | Cold plate with uniform plenum flow | |
CN116847628A (en) | Jet flow micro-channel heat sink | |
JP2982396B2 (en) | Internal combustion engine cooling system | |
JPH05343576A (en) | Heat transfer cooler | |
CN115579556A (en) | Liquid cooling plate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: KABUSHIKI KAISHA TOSHIBA, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:NAKAHAMA, TAKAFUMI;REEL/FRAME:012850/0865 Effective date: 20020409 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |