EP2940376A1 - Thermally conductive optics - Google Patents

Thermally conductive optics Download PDF

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Publication number
EP2940376A1
EP2940376A1 EP15166275.6A EP15166275A EP2940376A1 EP 2940376 A1 EP2940376 A1 EP 2940376A1 EP 15166275 A EP15166275 A EP 15166275A EP 2940376 A1 EP2940376 A1 EP 2940376A1
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EP
European Patent Office
Prior art keywords
light module
circuit board
module according
led
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15166275.6A
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German (de)
French (fr)
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EP2940376B1 (en
Inventor
Frank Drees
Alexander Drölle
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ITZ Innovations und Technologiezentrum GmbH
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ITZ Innovations und Technologiezentrum GmbH
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Publication of EP2940376A1 publication Critical patent/EP2940376A1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/504—Cooling arrangements characterised by the adaptation for cooling of specific components of refractors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a light module for installation in a luminaire, comprising a printed circuit board having at least one conductor track, at least one connected to the conductor LED to generate a luminous flux, an optic with a light guide unit for directing the light flux and a holding unit for attaching the optics to the conductive Surface.
  • the conductor tracks are formed on printed circuit boards.
  • Printed circuit boards are made of electrically insulating material with conductive tracks (connections) arranged thereon.
  • the printed conductors are usually etched from a top-side, thin copper layer. Individual LEDs are then soldered to pads or pads so that they are simultaneously mechanically held and electrically connected.
  • As an insulating material is preferably fiber reinforced plastic, z. B. CEM or FR4 used, which are rather poor heat conducting materials and thus the majority of the heat generated during operation over the upper side copper surfaces and the surfaces of the tracks to the lamp or the environment submitted.
  • the light-generating LED or the plurality preferably in a grid arranged LEDs together with the necessary for your operation equipment, such as an electronic ballast (ECG), driver, sensor or the like, an LED module, which is often referred to as a light engine.
  • ECG electronic ballast
  • sensor sensor
  • an LED module which is often referred to as a light engine.
  • the optics usually sits on the top side of the printed circuit board and thus forms the top of the light module, which covers the electrically conductive surface or the circuit board more or less over the entire surface, so that a heat exchange between the conductive surface or the circuit board and the environment through the covering optics is prevented.
  • heat build-up develops underneath the optics, which is usually designed as a transparent plastic injection-molded part, which adversely affect the service life of the LEDs of the LED module.
  • the invention is based on a light module of the type mentioned initially with the object of at least partially avoiding the aforementioned disadvantages and, in particular, of providing a light module which avoids as much as possible heat buildup.
  • this object is essentially already achieved in that the holding region is formed-at least partially-as a cooling surface or comprises a cooling surface.
  • the invention is based on the recognition that the circuit board or the conductive surface of the light module in installation position covering and thus causing the heat accumulation holding areas of the optics used as a cooling element, namely by the optics with its primary light-guiding unit is reduced to its optical function and the On the optics otherwise provided holding areas is not only used for the fixation of the optics, but now also for the cooling.
  • Measure is the appearance of a component that causes heat build-up and thus negative for the life of the LEDs, transformed into a component that acts as a heat sink and thus increases the life of the LEDs and thus the light module.
  • the invention is used in conjunction with printed circuit boards which are made of electrically insulating material having thereon conductive traces (interconnects) and constitute a component which is incorporated into larger assemblies, e.g. in a luminaire housing a lamp or the like.
  • the electrically conductive surface may also be formed as a conductive surface applied to a nonconducting support (plastic, ceramic) by surface metallization.
  • a three-dimensional array of LEDs has been realized by means of the laser direct structuring (LDS) of 3D circuit carriers (3D-MID).
  • LDS laser direct structuring
  • 3D-MID 3D circuit carriers
  • the one component e.g. the luminaire housing or the luminaire cover, electronic functions.
  • the LDS components thus reduce space requirements and weight, can be quickly adapted to new requirements and also save on separate components.
  • This support surface can either be on a separate component or the surface of a component itself, e.g. a light housing made of plastic, ceramic, metal or combinations thereof.
  • the optics is combined with a thermally conductive Be executed element, which either the use of thermally conductive plastics, ie with thermally conductive fillers, eg. As aluminum oxide, graphite, boron nitride, enriched carrier plastics, such as PC, PC, PBT, whereby the thermal conductivity of these carrier plastics is increased by at least 3 times.
  • thermally conductive plastics ie with thermally conductive fillers
  • thermally conductive fillers eg. As aluminum oxide, graphite, boron nitride, enriched carrier plastics, such as PC, PC, PBT, whereby the thermal conductivity of these carrier plastics is increased by at least 3 times.
  • the composite can also be realized with a heat-conducting metal, in particular copper.
  • metal used for increased heat absorption or delivery on an enlarged surface for example in the form of a sawtooth, ribs or wave structure.
  • the optics comprise raster-like or mutually spaced webs, in which a plurality of heat sinks facet-like for attachment to the optics can be used or fastened with this.
  • an optic also includes a holding or fastening area, which may be e.g. as arranged laterally next to the optics retaining strip may be formed which rests in the installed position usually flat on the circuit board of the light module.
  • a metal surface can be applied to the holding region, which acts as a cooling surface and is preferably formed with a wave or a sawtooth profile for enlarging the surface area.
  • the preferred embodiment provides to provide a plurality of surfaces of a bar with such cooling surfaces;
  • a particularly high cooling capacity is realized if, in addition to the upper and lower side horizontal surface, the lateral vertical surface also comprises a cooling metal surface or such a metal element, ie the retaining strip is enclosed by the cooling surfaces. This can also be done by one on the retaining strip be pushed laterally and in installation position enclosing this cover or coat, which encloses the retaining strip on the outside.
  • the holding portion of the optics, webs, z. B several rod-shaped webs to form a kind of grid.
  • the holding area z. Example, a grid structure with a longitudinally extending longitudinal web and at certain intervals along this longitudinal web transversely extending transverse webs, which thus define a check grid.
  • Insert elements functioning as cooling surfaces can be inserted into the grid thus produced, wherein these insert elements thus formed preferably comprise metal or consist of metal so as to form, in the installed position, a sort of tile structure consisting of the insert elements, which are enclosed by the webs of the holding unit.
  • These insert elements can also consist of thermally conductive plastics.
  • the inserts are made of metal, at least the resting on the underlying tracks metal areas with a heat-conducting insulation with a material thickness preferably between 0.02 and 0.2mm are provided.
  • Epoxy resin is preferably used, ie typical thermoplastics (PC, PBT, PA etc.), preferably provided with electrically non-conductive fillers to increase the thermal conductivity.
  • FIG. 1 shows a perspective view of the light module itself, so expanded from a light.
  • This light module essentially consists of a plate-shaped LED module 2, which is formed from a plate-shaped printed circuit board 2A and along the central longitudinal axis collinear at uniform intervals extending toward each other mounted LEDs 2B.
  • this LED module 2 extends formed as a one-piece injection molded plastic part of transparent plastic optics 4, which includes a dome-like over the LEDs 2B arching middle section, which simultaneously forms the actual optics for focusing the emitted light from the LEDs 2B, and each side to this central portion 4A integrally molded sidebars 4B, 4C comprises, which lie flat with their lower mounting surfaces on the top of the circuit board 2A and is fixed in position by means of fastening screws 6 to an underlying element.
  • the side strips 4B, 4C are bordered on the top, bottom and side surfaces with a circumferentially comprehensive metal shell, the contact surfaces of the side strips 4B, 4C are designed smooth and their faces facing away from the contact surface outer surfaces to increase the effective surface and the cooling capacity are provided with a sawtooth.
  • the inventive design, the side strips 4B, 4C act along the entire surface as a heat sink and thus improve the efficiency of the LED module or the light module, but prevent in any case for the life of the LEDs 2B detrimental heat accumulation between the circuit board 2A and the Optics 4.
  • FIG. 4 shows an alternative embodiment of a light module in a perspective view, in which adjoin the central portion 4A of the optics 4 no sidebars, but in certain, equidistant distances from each other transverse webs 4D to 4F are formed, which extend transversely to the longitudinal axis of the optic 4 and a kind Define grid structure, in which made of copper heatsink 8 are inserted laterally so that they rest in the installed position on the circuit board 2A.
  • a variant of this second embodiment provides for injecting a thermally conductive plastic in the 2-component process into the spaces between the transverse webs 4D-4F.
  • optical plastics PC, PMMA and SAN are particularly preferably used, and as thermally conductive plastics with heat-conductive fillers, such as aluminum oxide, graphite, boron nitride, filled carrier plastics, eg PC, PC, PBT and other suitable plastics.
  • thermally conductive plastics with heat-conductive fillers such as aluminum oxide, graphite, boron nitride, filled carrier plastics, eg PC, PC, PBT and other suitable plastics.
  • FIG. 5 shows an enlarged, perspective detail view of a third embodiment of a light module 10 according to the invention, in which the cooling of a printed circuit board 10A takes place primarily via convection.
  • a printed circuit board 10A On the surface of the circuit board 10A are spaced apart in a grid a plurality of LEDs 10B - 10E attached.
  • a heat-conducting carrier 10G Via a lateral edge 10F extending transversely to the plane of the printed circuit board, a heat-conducting carrier 10G is applied to the printed circuit board 10A enclosing.
  • edge 10F Since the edge 10F is provided only at the edge of the carrier 10G, there exists between the circuit board 10A and the carrier 10G a cavity acting as a cooling space through which heat radiated from the circuit board 10A can rise and be cooled by the heat-conductive material of the carrier 10G. The resulting heat thus rises from the circuit board 10A upwards, cools on the carrier 10G designed as a heat sink and flows down to cool the circuit board 10A. Thus, the air circulates in the space formed between the top of the circuit board 10A and the bottom of the carrier 10G, and the metal-made carrier 10G 10G functions as a heat sink.
  • the carrier 10G has, corresponding to the arrangement of the LEDs 10B-10E spaced from each other on a plurality of circular openings, on the underside of the LEDs 10B - 10E associated lenses 10H are provided, which have on the inside a cylindrical recess and on the outer surface approximately the shape of a rotation parabola have, so symmetrical rotation body are formed.
  • FIG. 1 shows a further enlarged, detailed perspective view of a light module according to the invention, which is fundamentally of a similar construction to the embodiment according to FIG. 5 , but with the difference that in the cooling space between the underside of the carrier 12G and the top of the circuit board 12A, a body made of a heat-transmitting plastic is used.
  • this heat transferring plastic which is the heat transfer here by means of heat conduction and not by convection as in the embodiment according to FIG. 5 realized, provided with a hole structure having openings for enclosing the LEDs 12B - 12E, and those at the bottom of the carrier 12G arranged to accommodate lenses 12H.
  • this arrangement is not necessarily and represents only a preferred embodiment.
  • the fundamental solution of the invention is therefore to make the holding areas for attaching the optics to a printed circuit board as cooling surfaces by either have these enclosures made of metal or bordered by metal.

Abstract

Die Erfindung betrifft ein Lichtmodul zum Einbau in eine Leuchte. Dieses umfasst eine auf einer leitenden Oberfläche, z.B. einer Leiterplatte (2A) oder einer metallisierten Oberfläche eines LED-Moduls angeordnete LED (2B), eine Optik (4) mit einer Lichtlenkungseinheit zur Lichtlenkung des von der LED (2B) erzeugten Lichtstroms und einen Haltebereich zur Befestigung an der Leiterplatte (2A) bzw. an dem Lichtmodul. Um Stauwärme zu vermeiden und somit die Lebensdauer eines Lichtmoduls zu erhöhen wird vorgeschlagen, die Halteeinheit - zumindest teilweise - als Kühlfläche auszubilden.The invention relates to a light module for installation in a luminaire. This includes one on a conductive surface, e.g. a printed circuit board (2A) or a metallized surface of an LED module arranged LED (2B), an optical system (4) with a light guide unit for directing the light generated by the LED (2B) luminous flux and a holding area for attachment to the circuit board (2A) or at the light module. To avoid congestion heat and thus increase the life of a light module is proposed to form the holding unit - at least partially - as a cooling surface.

Description

Die Erfindung betrifft ein Lichtmodul zum Einbau in eine Leuchte, umfassend eine Leiterplatte mit mindestens einer Leiterbahn, mindestens eine mit der Leiterbahn verbundene LED zur Erzeugung eines Lichtstroms, einer Optik mit einer Lichtlenkungseinheit zur Lichtlenkung des Lichtstroms und eine Halteeinheit zur Befestigung der Optik an der leitenden Oberfläche.The invention relates to a light module for installation in a luminaire, comprising a printed circuit board having at least one conductor track, at least one connected to the conductor LED to generate a luminous flux, an optic with a light guide unit for directing the light flux and a holding unit for attaching the optics to the conductive Surface.

Üblicherweise sind die Leiterbahnen ausgebildet auf Leiterplatten. Leiterplatten bestehen aus elektrisch isolierendem Material mit darauf angeordneten, leitenden Leiterbahnen (Verbindungen). Die Leiterbahnen werden zumeist aus einer oberseitigen, dünnen Kupferschicht geätzt. Einzelne LEDs werden sodann auf Lötflächen (Pads) oder in Lötaugen gelötet, so dass diese gleichzeitig mechanisch gehalten werden und elektrisch verbunden sind. Als isolierendes Material wird vorzugsweise faserverstärkter Kunststoff, z. B. CEM oder FR4 eingesetzt, welche eher schlecht wärmeleitende Materialien darstellen und somit den Großteil der beim Betrieb entstehenden Wärme über die oberseitige Kupferflächen bzw. die Flächen der Leiterbahnen an die Leuchte bzw. die Umgebung abgegeben.Usually, the conductor tracks are formed on printed circuit boards. Printed circuit boards are made of electrically insulating material with conductive tracks (connections) arranged thereon. The printed conductors are usually etched from a top-side, thin copper layer. Individual LEDs are then soldered to pads or pads so that they are simultaneously mechanically held and electrically connected. As an insulating material is preferably fiber reinforced plastic, z. B. CEM or FR4 used, which are rather poor heat conducting materials and thus the majority of the heat generated during operation over the upper side copper surfaces and the surfaces of the tracks to the lamp or the environment submitted.

Die lichterzeugende LED bzw. die mehreren, vorzugsweise in einem Raster angeordneten LEDs bilden zusammen mit den für Ihren Betrieb notwendigen Betriebsgeräten, z.B. einem elektronischen Vorschaltgerät (EVG), Treiber, Sensor oder dergleichen ein LED-Modul, welches häufig auch als Light Engine bezeichnet wird.The light-generating LED or the plurality, preferably in a grid arranged LEDs together with the necessary for your operation equipment, such as an electronic ballast (ECG), driver, sensor or the like, an LED module, which is often referred to as a light engine.

Die Optik sitzt üblicherweise oberseitig auf der Leiterplatte auf und bildet somit die Oberseite des Lichtmoduls, welche also die elektrisch leitende Oberfläche bzw. die Leiterplatte mehr oder weniger vollflächig abdeckt, so dass ein Wärmeaustausch zwischen der leitenden Oberfläche bzw. der Leiterplatte und der Umgebung durch die abdeckende Optik unterbunden wird. Durch diese Ausbildung entsteht unterhalb der Optik, welche üblicherweise als durchsichtiges Kunststoffspritzgussteil ausgebildet ist, Stauwärme, welche die Lebensdauer der LEDs des LED-Moduls negativ beeinflusst.The optics usually sits on the top side of the printed circuit board and thus forms the top of the light module, which covers the electrically conductive surface or the circuit board more or less over the entire surface, so that a heat exchange between the conductive surface or the circuit board and the environment through the covering optics is prevented. As a result of this design, heat build-up develops underneath the optics, which is usually designed as a transparent plastic injection-molded part, which adversely affect the service life of the LEDs of the LED module.

Allgemein befasst sich die Erfindung ausgehend von einem Lichtmodul der eingangs genannten Art mit der Aufgabe, die zuvor genannten Nachteile zumindest teilweise zu vermeiden und insbesondere ein Lichtmodul vorzusehen, welches benannte Stauwärme möglichst weitgehend vermeidet.In general, the invention is based on a light module of the type mentioned initially with the object of at least partially avoiding the aforementioned disadvantages and, in particular, of providing a light module which avoids as much as possible heat buildup.

Erfindungsgemäß wird diese Aufgabe bei einem Lichtmodul der eingangs genannten Art im Wesentlichen bereits dadurch gelöst, dass der Haltebereich - zumindest teilweise - als Kühlfläche ausgebildet ist bzw. eine Kühlfläche umfasst. Die Erfindung beruht insofern auf der Erkenntnis, den die Leiterplatte bzw. die leitende Oberfläche des Lichtmoduls in Einbaulage abdeckenden und somit den Hitzestau verursachenden Haltebereiche der Optik als Kühlelement einzusetzen, und zwar indem die Optik mit ihrer primären Lichtlenkungseinheit auf ihre optische Funktion reduziert wird und die an der Optik ansonsten vorgesehenen Haltebereiche nicht nur für die Fixierung der Optik verwendet wird, sondern nunmehr auch für die Kühlung. Durch die erfindungsgemäße Maßnahme wird die Optik von einem Bauteil, welches einen Wärmestau verursacht und somit negativ für die Lebensdauer der LEDs ist, in ein Bauteil verwandelt, welches als Kühlkörper fungiert und somit die Lebensdauer der LEDs und somit des Lichtmoduls erhöht.According to the invention, in a light module of the type mentioned at the outset, this object is essentially already achieved in that the holding region is formed-at least partially-as a cooling surface or comprises a cooling surface. The invention is based on the recognition that the circuit board or the conductive surface of the light module in installation position covering and thus causing the heat accumulation holding areas of the optics used as a cooling element, namely by the optics with its primary light-guiding unit is reduced to its optical function and the On the optics otherwise provided holding areas is not only used for the fixation of the optics, but now also for the cooling. By the invention Measure is the appearance of a component that causes heat build-up and thus negative for the life of the LEDs, transformed into a component that acts as a heat sink and thus increases the life of the LEDs and thus the light module.

Vorzugsweise wird die Erfindung eingesetzt in Verbindung mit Leiterplatten, welche aus elektrisch isolierendem Material mit darauf angeordneten, leitenden Leiterbahnen (Verbindungen) bestehen und ein Bauteil darstellen, welches in größere Baugruppen eingebaut wird, z.B. in ein Leuchtengehäuse einer Leuchte oder dergleichen. Die elektrisch leitende Oberfläche kann aber auch als eine auf einem nichtleitenden Träger (Kunststoff, Keramik) durch Aufmetallisieren aufgebrachte leitende Oberfläche ausgebildet sein. So kann z.B. eine dreidimensionale Anordnung von LEDs mit Hilfe der Laser-Direktstrukturierung (LDS) von 3D-Schaltungsträgern (3D-MID) realisiert worden. Mit LDS können somit dreidimensionale, komplexe Kunststoffkörper mit Leiterbahnen versehen werden. Damit übernimmt das eine Bauteil, z.B. das Leuchtengehäuse oder die Leuchtenabdeckung, elektronische Funktionen. Die LDS-Komponenten reduzieren somit den Platzbedarf und das Gewicht, lassen sich schnell an neue Anforderungen anpassen und sparen auch noch separate Komponenten ein.Preferably, the invention is used in conjunction with printed circuit boards which are made of electrically insulating material having thereon conductive traces (interconnects) and constitute a component which is incorporated into larger assemblies, e.g. in a luminaire housing a lamp or the like. However, the electrically conductive surface may also be formed as a conductive surface applied to a nonconducting support (plastic, ceramic) by surface metallization. Thus, e.g. a three-dimensional array of LEDs has been realized by means of the laser direct structuring (LDS) of 3D circuit carriers (3D-MID). With LDS, three-dimensional, complex plastic bodies can be provided with conductor tracks. Thus, the one component, e.g. the luminaire housing or the luminaire cover, electronic functions. The LDS components thus reduce space requirements and weight, can be quickly adapted to new requirements and also save on separate components.

Es liegt dabei auch im Rahmen der Erfindung, die LEDs direkt auf einer aufmetallisierten und somit als Leiterbahn fungierenden Oberfläche anzuordnen, die ihrerseits auf einer zumindest in diesem Bereich nicht leitenden Trägerfläche angeordnet ist. Diese Trägerfläche kann entweder auf einem getrennten Bauteil sein oder die Oberfläche eines Bauteils selbst sein, z.B. eines Leuchtengehäuses aus Kunststoff, Keramik, Metall oder Kombinationen derselben.It is also within the scope of the invention to arrange the LEDs directly on a aufmetallisierten and thus acting as a conductor surface, which in turn is arranged on a non-conductive at least in this area support surface. This support surface can either be on a separate component or the surface of a component itself, e.g. a light housing made of plastic, ceramic, metal or combinations thereof.

Zu diesem Zweck ist die Optik im Verbund mit einem wärmeleitenden Element ausgeführt sein, was entweder den Einsatz von wärmeleitenden Kunststoffen, also mit wärmeleitenden Füllstoffen, z. B. Aluminium-Oxid, Graphit, Bornitrid, angereicherte Trägerkunststoffe, wie PC,PC,PBT, womit die Wärmeleitfähigkeit dieser Trägerkunststoffe um mindestens das 3-fache erhöht wird. Der Verbund kann aber auch mit einem wärmleitenden Metall realisiert sein, insbesondere Kupfer. Vorzugsweise weist eingesetztes Metall zur erhöhten Wärmeaufnahme oder -abgabe eine vergrößerte Oberfläche auf, z.B. in Form einer Sägezahn-, Rippen oder Wellenstruktur.For this purpose, the optics is combined with a thermally conductive Be executed element, which either the use of thermally conductive plastics, ie with thermally conductive fillers, eg. As aluminum oxide, graphite, boron nitride, enriched carrier plastics, such as PC, PC, PBT, whereby the thermal conductivity of these carrier plastics is increased by at least 3 times. The composite can also be realized with a heat-conducting metal, in particular copper. Preferably, metal used for increased heat absorption or delivery on an enlarged surface, for example in the form of a sawtooth, ribs or wave structure.

Dieses kann auch durch mindestens einen in die Optik integrierten Kühlkörper erfolgen, z.B. in Form mindestens einer einsetzbaren Metallplatte, z.B. aus Kupfer. Vorzugsweise umfasst die Optik rasterartig aufgebaute bzw. zueinander beabstandete Stege, in welche mehrere Kühlkörper facettenartig zur Befestigung an der Optik einsetzbar bzw. mit dieser befestigbar sind.This may also be done by at least one optic integrated heat sink, e.g. in the form of at least one insertable metal plate, e.g. made of copper. Preferably, the optics comprise raster-like or mutually spaced webs, in which a plurality of heat sinks facet-like for attachment to the optics can be used or fastened with this.

Eine Optik umfasst neben der eigentlichen Optik- bzw. Lichtlenkungseinheit auch einen Halte- bzw. Befestigungsbereich, welcher z.B. als seitlich neben der Optik angeordnete Halteleiste ausgebildet sein kann, welche in Einbaulage üblicherweise flächig auf der Leiterplatte des Lichtmoduls aufliegt. Erfindungsgemäß kann auf dem Haltebereich eine Metallfläche aufgebracht sein, welche als Kühlfläche fungiert und vorzugsweise mit einem Wellen- bzw. einem Sägezahnprofil zur Vergrößerung der Oberflächef ausgebildet ist.In addition to the actual optical or light-directing unit, an optic also includes a holding or fastening area, which may be e.g. as arranged laterally next to the optics retaining strip may be formed which rests in the installed position usually flat on the circuit board of the light module. According to the invention, a metal surface can be applied to the holding region, which acts as a cooling surface and is preferably formed with a wave or a sawtooth profile for enlarging the surface area.

Die bevorzugte Ausführungsform sieht vor, mehrere Flächen einer Leiste mit derartigen Kühlflächen zu versehen; eine besonders hohe Kühlleistung wird realisiert, wenn neben der ober- und unterseitigen Horizontalfläche auch die seitliche Vertikalfläche eine kühlende Metallfläche bzw. ein derartiges Metallelement umfasst, die Halteleiste also von den Kühlflächen eingefasst ist. Dieses kann auch durch einen auf die Halteleiste seitlich aufgeschobenen und in Einbaulage diese umschließenden Überzug bzw. Mantel erfolgen, welcher die Halteleiste außenseitig umschließt.The preferred embodiment provides to provide a plurality of surfaces of a bar with such cooling surfaces; A particularly high cooling capacity is realized if, in addition to the upper and lower side horizontal surface, the lateral vertical surface also comprises a cooling metal surface or such a metal element, ie the retaining strip is enclosed by the cooling surfaces. This can also be done by one on the retaining strip be pushed laterally and in installation position enclosing this cover or coat, which encloses the retaining strip on the outside.

Bei einer anderen Ausführungsform umfasst der Haltebereich der Optik , Stege, z. B. mehrere stabförmige Stege zur Bildung einer Art von Gitter. So kann der Haltebereich z. B. eine Gitterstruktur mit einem sich in Längsrichtung erstreckenden Längssteg und in bestimmten Abständen entlang dieses Längsstegs quer erstreckenden Querstegen umfassen, welche somit ein Karo-Gitter definieren. In das so erzeugte Gitter können als Kühlflächen fungierende Einsatzelemente eingesetzt werden, wobei diese so gebildeten Einsatzelemente vorzugsweise Metall umfassen oder aus Metall bestehen, um dann in Einbaulage quasi eine Art Fliesenstruktur bestehend aus den Einsatzelementen zu bilden, welche von den Stegen der Halteeinheit eingefasst sind. Diese Einsatzelemente können aber auch aus wärmeleitfähigen Kunststoffen bestehen. Sofern die Einsätze aus Metall bestehen, sind zumindest die auf den darunterliegenden Leiterbahnen aufliegenden Metallbereiche mit einer wärmeleitenden Isolierung mit einer Materialstärke vorzugsweise zwischen 0,02 und 0,2mm versehen. Vorzugsweise kommt dabei Epoxid-Harz zum Einsatz, also typische Thermoplaste (PC, PBT, PA usw.), vorzugsweise mit elektrisch nichtleitenden Füllstoffen zur Steigerung der Wärmeleitfähigkeit versehen.In another embodiment, the holding portion of the optics, webs, z. B. several rod-shaped webs to form a kind of grid. Thus, the holding area z. Example, a grid structure with a longitudinally extending longitudinal web and at certain intervals along this longitudinal web transversely extending transverse webs, which thus define a check grid. Insert elements functioning as cooling surfaces can be inserted into the grid thus produced, wherein these insert elements thus formed preferably comprise metal or consist of metal so as to form, in the installed position, a sort of tile structure consisting of the insert elements, which are enclosed by the webs of the holding unit. These insert elements can also consist of thermally conductive plastics. If the inserts are made of metal, at least the resting on the underlying tracks metal areas with a heat-conducting insulation with a material thickness preferably between 0.02 and 0.2mm are provided. Epoxy resin is preferably used, ie typical thermoplastics (PC, PBT, PA etc.), preferably provided with electrically non-conductive fillers to increase the thermal conductivity.

Weitere Einzelheiten, Vorteile und Merkmale der Erfindung lassen sich dem nachfolgenden Teil der Beschreibung entnehmen, in dem ein Ausführungsbeispiel des erfindungsgemäßen Lichtmoduls an Hand der Zeichnungen näher erläutert wird. Es zeigen:

Figur 1
eine perspektivische Frontansicht einer ersten Ausführungsform des Lichtmoduls;
Figur 2
eine vergrößerte Stirnansicht des Lichtmoduls gemäß Figur 1;
Figur 3
eine Vergrößerung des Abschnitts III gemäß Figur 2;
Figur 4
eine perspektivische Ansicht einer alternativen Ausführungsform des Lichtmoduls;
Figur 5
eine vergrößerte perspektivische Detailansicht einer dritten Ausführungsform eines Lichtmoduls; und
Figur 6
eine vergrößerte perspektivische Detailansicht einer vierten Ausführungsform eines Lichtmoduls.
Further details, advantages and features of the invention can be taken from the following part of the description, in which an embodiment of the light module according to the invention will be explained in more detail with reference to the drawings. Show it:
FIG. 1
a front perspective view of a first embodiment of the light module;
FIG. 2
an enlarged end view of the light module according to FIG. 1 ;
FIG. 3
an enlargement of Section III according to FIG. 2 ;
FIG. 4
a perspective view of an alternative embodiment of the light module;
FIG. 5
an enlarged perspective detail view of a third embodiment of a light module; and
FIG. 6
an enlarged perspective detail view of a fourth embodiment of a light module.

Figur 1 zeigt eine perspektivische Ansicht des Lichtmoduls an sich, also ausgebaut aus einer Leuchte. Dieses Lichtmodul besteht im Wesentlichen aus einem plattenförmigen LED-Modul 2, welches gebildet wird aus einer plattenförmigen Leiterplatte 2A und sich entlang der mittleren Längsachse kollinear in gleichmäßigen Abständen zueinander erstreckend darauf befestigte LEDs 2B. Über dieses LED-Modul 2 erstreckt sich eine als einstückiges Kunststoffspritzgussteil aus durchsichtigem Kunststoff gebildete Optik 4, welche einen domartig sich über die LEDs 2B wölbenden Mittelabschnitt umfasst, welcher gleichzeitig die eigentliche Optik zur Fokussierung des von den LEDs 2B ausgestrahlten Lichtes bildet, sowie jeweils seitlich an diesen Mittelabschnitt 4A einstückig angeformte Seitenleisten 4B, 4C umfasst, welche mit ihren unteren Montageflächen flächig auf der Oberseite der Leiterplatte 2A aufliegen und mittels Befestigungsschrauben 6 an einem darunter angeordneten Element lagefixiert ist. FIG. 1 shows a perspective view of the light module itself, so expanded from a light. This light module essentially consists of a plate-shaped LED module 2, which is formed from a plate-shaped printed circuit board 2A and along the central longitudinal axis collinear at uniform intervals extending toward each other mounted LEDs 2B. About this LED module 2 extends formed as a one-piece injection molded plastic part of transparent plastic optics 4, which includes a dome-like over the LEDs 2B arching middle section, which simultaneously forms the actual optics for focusing the emitted light from the LEDs 2B, and each side to this central portion 4A integrally molded sidebars 4B, 4C comprises, which lie flat with their lower mounting surfaces on the top of the circuit board 2A and is fixed in position by means of fastening screws 6 to an underlying element.

Bei der ersten, in den Figuren 1 bis 3 dargestellten Ausführungsform sind die Seitenleisten 4B, 4C an den Ober-, Unter- und den Seitenflächen mit einem umfänglich umfassenden Metallmantel eingefasst, deren Anlageflächen an die Seitenleisten 4B, 4C glatt ausgestaltet sind und deren von der Anlagefläche abgewandten Außenflächen zur Erhöhung der wirksamen Oberfläche und der Kühlleistung mit einem Sägezahnprofil versehen sind. Durch die erfindungsgemäße Ausgestaltung fungieren die Seitenleisten 4B, 4C entlang der gesamten Fläche als Kühlkörper und verbessern somit den Wirkungsgrad des LED-Moduls bzw. des Lichtmoduls, verhindern aber in jedem Fall die für die Lebensdauer der LEDs 2B schädliche Stauwärme zwischen der Leiterplatte 2A und der Optik 4.At the first, in the FIGS. 1 to 3 illustrated embodiment, the side strips 4B, 4C are bordered on the top, bottom and side surfaces with a circumferentially comprehensive metal shell, the contact surfaces of the side strips 4B, 4C are designed smooth and their faces facing away from the contact surface outer surfaces to increase the effective surface and the cooling capacity are provided with a sawtooth. The inventive design, the side strips 4B, 4C act along the entire surface as a heat sink and thus improve the efficiency of the LED module or the light module, but prevent in any case for the life of the LEDs 2B detrimental heat accumulation between the circuit board 2A and the Optics 4.

Figur 4 zeigt eine alternative Ausgestaltung eines Lichtmoduls in perspektivischer Ansicht, bei welcher sich an den Mittelabschnitt 4A der Optik 4 keine Seitenleisten anschließen, sondern in bestimmten, äquidistanten Abständen zueinander Querstege 4D bis 4F angeformt sind, welche sich quer zur Längsachse der Optik 4 erstrecken und eine Art Gitterstruktur definieren, in welche aus Kupfer gebildete Kühlkörper 8 seitlich einschiebbar sind, so dass diese in Einbaulage auf der Leiterplatte 2A aufliegen. Eine Variante dieser zweiten Ausführungsform sieht vor, einen wärmeleitenden Kunststoff im 2-K-Verfahren in die Zwischenräume zwischen den Querstegen 4D - 4F einzuspritzen. Als optische Kunststoffe werden besonders bevorzugt PC, PMMA und SAN verwendet, und als wärmeleitfähige Kunststoffe die mit wärmeleitenden Füllstoffen, z.B. Aluminium-Oxid, Graphit, Bornitrid, gefüllten Trägerkunststoffe, z.B. PC,PC,PBT und andere geeignete Kunststoffe. FIG. 4 shows an alternative embodiment of a light module in a perspective view, in which adjoin the central portion 4A of the optics 4 no sidebars, but in certain, equidistant distances from each other transverse webs 4D to 4F are formed, which extend transversely to the longitudinal axis of the optic 4 and a kind Define grid structure, in which made of copper heatsink 8 are inserted laterally so that they rest in the installed position on the circuit board 2A. A variant of this second embodiment provides for injecting a thermally conductive plastic in the 2-component process into the spaces between the transverse webs 4D-4F. As optical plastics PC, PMMA and SAN are particularly preferably used, and as thermally conductive plastics with heat-conductive fillers, such as aluminum oxide, graphite, boron nitride, filled carrier plastics, eg PC, PC, PBT and other suitable plastics.

Figur 5 zeigt eine vergrößerte, perspektivische Detailansicht einer dritten Ausführungsform eines erfindungsgemäßen Lichtmoduls 10, bei dem die Kühlung einer Leiterplatte 10A primär über Konvektion erfolgt. Auf der Oberfläche der Leiterplatte 10A sind beabstandet zueinander in einem Raster mehrere LEDs 10B - 10E befestigt. Über einen seitlichen, sich quer zur Ebene der Leiterplatte erstreckenden Rand 10F ist ein wärmeleitender Träger 10G auf die Leiterplatte 10A aufgebracht bzw. diese umschließend aufgesetzt. Da der Rand 10F nur am Rand des Trägers 10G vorgesehen ist, existiert zwischen Leiterplatte 10A und dem Träger 10G ein als Kühlraum fungierender Hohlraum, über den von der Leiterplatte 10A abgestrahlte Wärme aufsteigen und über das wärmeleitende Material der Trägers 10G abgekühlt werden kann. Die entstehende Wärme steigt demnach von der Leiterplatte 10A nach oben, kühlt sich an dem als Kühlkörper ausgebildeten Träger 10G ab und strömt nach unten zur Kühlung der Leiterplatte 10A. Die Luft zirkuliert also in dem zwischen der Oberseite der Leiterplatte 10A und Unterseite des Trägers 10G gebildeten Zwischenraum, wobei der aus Metall ausgebildete Träger 10G 10G als Kühlkörper fungiert. Der Träger 10G weist korrespondierend zur Anordnung der LEDs 10B - 10E beabstandet zueinander mehrere kreisrunde Öffnungen auf, an deren Unterseiten den LEDs 10B - 10E zugeordnete Linsen 10H vorgesehen sind, welche an der Innenseite eine zylindrische Ausnehmung aufweisen und an der Außenfläche etwa die Gestalt einer Rotationsparabel aufweisen, also symmetrische Rotationskörper ausgebildet sind. Durch bedarfsgerecht angepasste Linsen 10H können somit gewünschte Lichtverteilungskurven zur Verwirklichung gewünschter Beleuchtungsaufgaben im Zusammenspiel mit den LEDs realisiert werden. FIG. 5 shows an enlarged, perspective detail view of a third embodiment of a light module 10 according to the invention, in which the cooling of a printed circuit board 10A takes place primarily via convection. On the surface of the circuit board 10A are spaced apart in a grid a plurality of LEDs 10B - 10E attached. Via a lateral edge 10F extending transversely to the plane of the printed circuit board, a heat-conducting carrier 10G is applied to the printed circuit board 10A enclosing. Since the edge 10F is provided only at the edge of the carrier 10G, there exists between the circuit board 10A and the carrier 10G a cavity acting as a cooling space through which heat radiated from the circuit board 10A can rise and be cooled by the heat-conductive material of the carrier 10G. The resulting heat thus rises from the circuit board 10A upwards, cools on the carrier 10G designed as a heat sink and flows down to cool the circuit board 10A. Thus, the air circulates in the space formed between the top of the circuit board 10A and the bottom of the carrier 10G, and the metal-made carrier 10G 10G functions as a heat sink. The carrier 10G has, corresponding to the arrangement of the LEDs 10B-10E spaced from each other on a plurality of circular openings, on the underside of the LEDs 10B - 10E associated lenses 10H are provided, which have on the inside a cylindrical recess and on the outer surface approximately the shape of a rotation parabola have, so symmetrical rotation body are formed. By appropriately adapted lenses 10H thus desired light distribution curves for realizing desired lighting tasks can be realized in interaction with the LEDs.

Figur 6 zeigt schließlich zeigt eine weitere vergrößerte perspektivische Detailansicht eines erfindungsgemäßen Lichtmoduls, welches grundsätzlich ähnlich aufgebaut ist wie die Ausführungsform gemäß Figur 5, allerdings mit dem Unterschied, dass in dem Kühlraum zwischen der Unterseite des Trägers 12G und der Oberseite der Leiterplatte 12A ein Körper aus einem wärmeübertragenden Kunststoff eingesetzt ist. In der vorliegenden Ausführungsform ist dieser wärmeübertragende Kunststoff, welcher den Wärmeübertrag hier mittels Wärmeleitung und nicht mittels Konvektion wie bei der Ausführungsform gemäß Figur 5 realisiert, mit einer Lochstruktur versehen, welche Öffnungen zum Umschließen der LEDs 12B - 12E aufweist, sowie die an der Unterseite des Trägers 12G angeordneten Linsen 12H umschließend aufnehmen. Diese Anordnung ist aber nicht zwangsläufig und stellt lediglich eine bevorzugte Ausführungsform dar. FIG. 6 Finally, FIG. 1 shows a further enlarged, detailed perspective view of a light module according to the invention, which is fundamentally of a similar construction to the embodiment according to FIG FIG. 5 , but with the difference that in the cooling space between the underside of the carrier 12G and the top of the circuit board 12A, a body made of a heat-transmitting plastic is used. In the present embodiment, this heat transferring plastic, which is the heat transfer here by means of heat conduction and not by convection as in the embodiment according to FIG. 5 realized, provided with a hole structure having openings for enclosing the LEDs 12B - 12E, and those at the bottom of the carrier 12G arranged to accommodate lenses 12H. However, this arrangement is not necessarily and represents only a preferred embodiment.

Die grundsätzliche Lösung der Erfindung besteht demnach darin, die Haltebereiche zur Befestigung der Optik an einer Leiterplatte als Kühlflächen zu gestalten, indem diese entweder Einfassungen aus Metall aufweisen oder von Metall eingefasst sind.The fundamental solution of the invention is therefore to make the holding areas for attaching the optics to a printed circuit board as cooling surfaces by either have these enclosures made of metal or bordered by metal.

Der Gegenstand der vorliegenden Erfindung ergibt sich nicht nur aus dem Gegenstand der einzelnen Patentansprüche, sondern aus der Kombination der einzelnen Patentansprüche untereinander. Alle in den Unterlagen - einschließlich der Zusammenfassung - offenbarten Angaben und Merkmale, insbesondere die in den Zeichnungen dargestellte räumliche Ausbildung werden als erfindungswesentlich beansprucht, soweit sie einzeln oder in Kombination gegenüber dem Stand der Technik neu sind.The subject matter of the present invention results not only from the subject matter of the individual claims, but also from the combination of the individual claims with one another. All information and features disclosed in the documents - including the abstract - in particular the spatial design shown in the drawings are claimed as essential to the invention, as far as they are new individually or in combination with respect to the prior art.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

22
LED-ModulLED module
2A2A
Leiterplattecircuit board
2B2 B
LEDLED
44
Optikoptics
4A4A
Mittelabschnittmidsection
4B4B
Seitenleistesidebar
4C4C
Seitenleistesidebar
4D4D
Querstegcrosspiece
4E4E
Querstegcrosspiece
4F4F
Querstegcrosspiece
66
Befestigungsschraubefixing screw
88th
Kühlkachelcool tile
1010
Lichtmodullight module
10A10A
Leiterplattecircuit board
10B10B
LEDLED
10C10C
LEDLED
10D10D
LEDLED
10E10E
LEDLED
10F10F
Randedge
10G10G
Trägercarrier
10H10H
Linselens
1212
Lichtmodullight module
12A12A
Leiterplattecircuit board
12B12B
LEDLED
12C12C
LEDLED
12D12D
LEDLED
12E12E
LEDLED
12F12F
Randedge
12G12G
Trägercarrier
12H12H
Linselens

Claims (10)

Lichtmodul zum Einbau in eine Leuchte, umfassend eine auf einer elektrisch leitenden Oberfläche angeordnete LED (2B), einer Optik (4) mit einer Lichtlenkungseinheit zur Lichtlenkung des von der LED (2B) erzeugten Lichtstroms, DADURCH GEKENNZEICHNET, dass die Optik zumindest teilweise wärmeleitend ausgebildet ist.Light module for installation in a luminaire, comprising an LED (2B) arranged on an electrically conductive surface, an optic (4) with a light- directing unit for directing the luminous flux generated by the LED (2B) , characterized in that the optics are at least partially thermally conductive is. Lichtmodul nach Anspruch 1, DADURCH GEKENNZEICHNET, DASS die leitende Oberfläche als Leiterplatte (2A) ausgebildet ist.Light module according to claim 1, characterized in that the conductive surface is formed as a printed circuit board (2A). Lichtmodul nach Anspruch 1, DADURCH GEKENNZEICHNET, DASS die leitende Oberfläche eine auf einen Träger aufmetallisierte Leiterstruktur umfasst.Light module according to claim 1, characterized in that the conductive surface comprises a conductor-metallized on a support conductor structure. Lichtmodul nach einem der vorhergehenden Ansprüche, wobei die Optik mindestens eine Leiste (4B, 4C) umfasst, DADURCH GEKENNZEICHNET, DASS die Leiste (4B, 4C) mindestens eine als Kühlfläche fungierende Metallfläche aufweist.Light module according to one of the preceding claims, wherein the optical system comprises at least one strip (4B, 4C), characterized in that the strip (4B, 4C) has at least one metal surface functioning as a cooling surface. Lichtmodul nach Anspruch 4, DADURCH GEKENNZEICHNET, DASS auf der Leiste (4B, 4C) mehrere als Kühlflächen ausgebildete Metallflächen angeordnet sind.Light module according to claim 4, characterized That on the bar (4B, 4C) are arranged a plurality of cooling surfaces formed metal surfaces. Lichtmodul nach Anspruch 5, DADURCH GEKENNZEICHNET, DASS die Leiste (4B, 4C) von Metallflächen eingefasst ist.Light module according to claim 5, characterized in that the strip (4B, 4C) is enclosed by metal surfaces. Lichtmodul nach einem der Ansprüche 1 bis 3, DADURCH GEKENNZEICHNET, DASS die Optik Stege (4D, 4E, 4F) aufweist, und dass die Stege zur Aufnahme mindestens eines Kühleinsatzes ausgebildet sind.Light module according to one of claims 1 to 3, characterized in that the optic webs (4D, 4E, 4F), and that the webs are adapted to receive at least one cooling insert. Lichtmodul (10) nach einem der Ansprüche 1 bis 3, DADURCH GEKENNZEICHNET, DASS die Optik einen wärmeleitenden Träger (10G; 12G) umfasst, der beabstandet von der Leiterplatte (10A; 12A) zur Bildung eines Kühlraums angeordnet ist.The light module (10) according to any one of claims 1 to 3, characterized in that the optic comprises a thermally conductive support (10G; 12G) spaced from the circuit board (10A; 12A) to form a cooling space. Lichtmodul nach Anspruch 8, DADURCH GEKENNZEICHNET, DASS in dem Kühlraum ein wärmeleitender Stoff angeordnet ist.Light module according to claim 8, characterized in that a heat-conducting material is arranged in the cooling space . Lichtmodul nach Anspruch 8, DADURCH GEKENNZEICHNET, DASS der Kühlraum als Hohlraum ausgebildet ist.Light module according to claim 8, characterized in that the cooling space is formed as a cavity.
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