DE69530221D1 - Anordnungen von optoelektronischen bauelementen und herstellungsverfahren - Google Patents

Anordnungen von optoelektronischen bauelementen und herstellungsverfahren

Info

Publication number
DE69530221D1
DE69530221D1 DE69530221T DE69530221T DE69530221D1 DE 69530221 D1 DE69530221 D1 DE 69530221D1 DE 69530221 T DE69530221 T DE 69530221T DE 69530221 T DE69530221 T DE 69530221T DE 69530221 D1 DE69530221 D1 DE 69530221D1
Authority
DE
Germany
Prior art keywords
arrangements
manufacturing
optoelectronic components
optoelectronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69530221T
Other languages
English (en)
Other versions
DE69530221T2 (de
Inventor
W Ignatius
S Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quantum Devices Inc
Original Assignee
Quantum Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23382518&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69530221(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Quantum Devices Inc filed Critical Quantum Devices Inc
Publication of DE69530221D1 publication Critical patent/DE69530221D1/de
Application granted granted Critical
Publication of DE69530221T2 publication Critical patent/DE69530221T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/005—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips for several lighting devices in an end-to-end arrangement, i.e. light tracks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding
DE69530221T 1994-12-08 1995-12-07 Anordnungen von optoelektronischen bauelementen und herstellungsverfahren Expired - Fee Related DE69530221T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/351,813 US5660461A (en) 1994-12-08 1994-12-08 Arrays of optoelectronic devices and method of making same
US351813 1994-12-08
PCT/US1995/015894 WO1996018210A1 (en) 1994-12-08 1995-12-07 Arrays of optoelectronic devices and method of making same

Publications (2)

Publication Number Publication Date
DE69530221D1 true DE69530221D1 (de) 2003-05-08
DE69530221T2 DE69530221T2 (de) 2004-02-19

Family

ID=23382518

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69530221T Expired - Fee Related DE69530221T2 (de) 1994-12-08 1995-12-07 Anordnungen von optoelektronischen bauelementen und herstellungsverfahren

Country Status (6)

Country Link
US (1) US5660461A (de)
EP (1) EP0796506B1 (de)
JP (1) JPH10502772A (de)
CA (1) CA2204432C (de)
DE (1) DE69530221T2 (de)
WO (1) WO1996018210A1 (de)

Families Citing this family (373)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969343A (en) * 1995-08-24 1999-10-19 Matsushita Electric Industrial Co., Ltd. Linear illumination device
US6268600B1 (en) 1994-08-01 2001-07-31 Matsushita Electric Industrial Co., Ltd. Linear illumination device
JP3185204B2 (ja) * 1995-05-31 2001-07-09 日本精機株式会社 発光素子アセンブリ
US6600175B1 (en) 1996-03-26 2003-07-29 Advanced Technology Materials, Inc. Solid state white light emitter and display using same
US6177761B1 (en) * 1996-07-17 2001-01-23 Teledyne Lighting And Display Products, Inc. LED with light extractor
US6441943B1 (en) * 1997-04-02 2002-08-27 Gentex Corporation Indicators and illuminators using a semiconductor radiation emitter package
US6031958A (en) * 1997-05-21 2000-02-29 Mcgaffigan; Thomas H. Optical light pipes with laser light appearance
US5951152A (en) * 1997-06-17 1999-09-14 Lumex, Inc. Light source housing apparatus and method of manufacture
DE69832888T2 (de) * 1997-08-25 2006-08-24 Advanced Photodynamic Technologies, Inc., Mendota Heights Einrichtung zur topischen photodynamischen therapie
US5866532A (en) * 1997-08-29 1999-02-02 Amway Corporation Automotive cleaning and protectant composition
GB2329756A (en) 1997-09-25 1999-03-31 Univ Bristol Assemblies of light emitting diodes
GB2330679B (en) * 1997-10-21 2002-04-24 911 Emergency Products Inc Warning signal light
JPH11163412A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置
US5909037A (en) * 1998-01-12 1999-06-01 Hewlett-Packard Company Bi-level injection molded leadframe
US6200134B1 (en) 1998-01-20 2001-03-13 Kerr Corporation Apparatus and method for curing materials with radiation
DE19803936A1 (de) * 1998-01-30 1999-08-05 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Ausdehnungskompensiertes optoelektronisches Halbleiter-Bauelement, insbesondere UV-emittierende Leuchtdiode und Verfahren zu seiner Herstellung
US6106137A (en) * 1998-02-20 2000-08-22 Lorin Industries, Inc. Reflector for automotive exterior lighting
US6170963B1 (en) * 1998-03-30 2001-01-09 Eastman Kodak Company Light source
RU2145247C1 (ru) 1998-04-10 2000-02-10 Жаров Владимир Павлович Фотоматричное терапевтическое устройство для лечения протяженных патологий
US6670207B1 (en) 1999-03-15 2003-12-30 Gentex Corporation Radiation emitter device having an integral micro-groove lens
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US6076950A (en) * 1998-10-05 2000-06-20 Ford Global Technologies, Inc. Integrated lighting assembly
US6087195A (en) * 1998-10-15 2000-07-11 Handy & Harman Method and system for manufacturing lamp tiles
US20060212025A1 (en) * 1998-11-30 2006-09-21 Light Bioscience, Llc Method and apparatus for acne treatment
US6936044B2 (en) * 1998-11-30 2005-08-30 Light Bioscience, Llc Method and apparatus for the stimulation of hair growth
US6887260B1 (en) * 1998-11-30 2005-05-03 Light Bioscience, Llc Method and apparatus for acne treatment
US6283956B1 (en) * 1998-11-30 2001-09-04 David H. McDaniels Reduction, elimination, or stimulation of hair growth
US9192780B2 (en) 1998-11-30 2015-11-24 L'oreal Low intensity light therapy for treatment of retinal, macular, and visual pathway disorders
KR20020010125A (ko) * 1999-03-15 2002-02-02 프레데릭 티. 바우어 반도체 방사선 이미터 꾸러미를 이용하는 지시기들과조명기들
JP3937644B2 (ja) * 1999-03-25 2007-06-27 セイコーエプソン株式会社 光源及び照明装置並びにその照明装置を用いた液晶装置
KR100556475B1 (ko) * 1999-04-01 2006-03-03 엘지전자 주식회사 플라즈마 디스플레이 패널
US6462669B1 (en) 1999-04-06 2002-10-08 E. P . Survivors Llc Replaceable LED modules
JP2001028459A (ja) * 1999-05-13 2001-01-30 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
JP2001042792A (ja) * 1999-05-24 2001-02-16 Sony Corp Ｌｅｄ表示装置
US6705745B1 (en) * 1999-06-08 2004-03-16 911Ep, Inc. Rotational led reflector
US6548832B1 (en) * 1999-06-09 2003-04-15 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
EP1059668A3 (de) * 1999-06-09 2007-07-18 Sanyo Electric Co., Ltd. Integrierte Hybridschaltungsanordnung
TW436856B (en) * 1999-07-16 2001-05-28 Taiwan Oasis Entpr Co Ltd Method for producing LED Christmas lightbulb and structure thereof
US6367949B1 (en) 1999-08-04 2002-04-09 911 Emergency Products, Inc. Par 36 LED utility lamp
US6932600B2 (en) * 1999-09-24 2005-08-23 Cao Group, Inc. Curing light
US6755648B2 (en) 1999-09-24 2004-06-29 Cao Group, Inc. Curing light
US6910886B2 (en) 1999-09-24 2005-06-28 Cao Group, Inc. Curing light
US6974319B2 (en) * 1999-09-24 2005-12-13 Cao Group, Inc. Curing light
US6929472B2 (en) 1999-09-24 2005-08-16 Cao Group, Inc. Curing light
US7077648B2 (en) * 1999-09-24 2006-07-18 Cao Group, Inc. Curing light
US6981867B2 (en) 1999-09-24 2006-01-03 Cao Group, Inc. Curing light
US6824294B2 (en) 1999-09-24 2004-11-30 Cao Group, Inc. Light for use in activating light-activated materials, the light having a plurality of chips mounted in a gross well of a heat sink, and a dome covering the chips
US6331111B1 (en) * 1999-09-24 2001-12-18 Cao Group, Inc. Curing light system useful for curing light activated composite materials
US6719559B2 (en) 1999-09-24 2004-04-13 Densen Cao Curing light
US7066732B2 (en) * 1999-09-24 2006-06-27 Cao Group, Inc. Method for curing light-curable materials
US7294364B2 (en) * 1999-09-24 2007-11-13 Cao Group, Inc. Method for curing composite materials
US6971876B2 (en) 1999-09-24 2005-12-06 Cao Group, Inc. Curing light
US6988890B2 (en) 1999-09-24 2006-01-24 Cao Group, Inc. Curing light
US6780010B2 (en) 1999-09-24 2004-08-24 Cao Group, Inc. Curing light
US6755649B2 (en) 1999-09-24 2004-06-29 Cao Group, Inc. Curing light
US7086858B2 (en) 1999-09-24 2006-08-08 Cao Group, Inc. Semiconductor curing light system useful for curing light activated composite materials
US6783362B2 (en) 1999-09-24 2004-08-31 Cao Group, Inc. Dental curing light using primary and secondary heat sink combination
US6926524B2 (en) * 1999-09-24 2005-08-09 Cao Group, Inc. Curing light
US6719558B2 (en) 1999-09-24 2004-04-13 Densen Cao Curing light
US6988891B2 (en) * 1999-09-24 2006-01-24 Cao Group, Inc. Curing light
US6955537B2 (en) * 1999-09-24 2005-10-18 Cao Group, Inc. Light for use in activating light-activated materials, the light having a plurality of light emitting semiconductor chips emitting light of differing peak wavelengths to provide a wide light spectrum profile
US7094054B2 (en) 1999-09-24 2006-08-22 Cao Group, Inc. Dental curing light
US6979193B2 (en) 1999-09-24 2005-12-27 Cao Group, Inc. Curing light
US6971875B2 (en) * 1999-09-24 2005-12-06 Cao Group, Inc. Dental curing light
US6712486B1 (en) * 1999-10-19 2004-03-30 Permlight Products, Inc. Mounting arrangement for light emitting diodes
GB2357856B (en) 1999-12-29 2001-12-19 Keymed Annular light source in borescopes and endoscopes
US7320593B2 (en) * 2000-03-08 2008-01-22 Tir Systems Ltd. Light emitting diode light source for curing dental composites
DE10012734C1 (de) * 2000-03-16 2001-09-27 Bjb Gmbh & Co Kg Illuminationsbausatz für Beleuchtungs-, Anzeige- oder Hinweiszwecke sowie Steckverbinder für einen solchen Illuminationsbausatz
GB2370992B (en) 2000-03-23 2002-11-20 Photo Therapeutics Ltd Therapeutic light source and method
DE10014804A1 (de) * 2000-03-24 2001-09-27 Swoboda Gmbh Geb Leuchtenmodul
TW421994U (en) * 2000-05-30 2001-02-11 Wei Fang Plant cultivation device using LED as light source
DE10034886A1 (de) * 2000-07-18 2002-02-07 Osram Opto Semiconductors Gmbh Optisches Mehrfachbauteil, insbesondere zur Verwendung mit Leuchtdioden
US6527422B1 (en) * 2000-08-17 2003-03-04 Power Signal Technologies, Inc. Solid state light with solar shielded heatsink
US6602275B1 (en) 2000-09-18 2003-08-05 Jana Sullivan Device and method for therapeutic treatment of living organisms
DE10051159C2 (de) * 2000-10-16 2002-09-19 Osram Opto Semiconductors Gmbh LED-Modul, z.B. Weißlichtquelle
AU2002210396A1 (en) * 2000-10-19 2002-04-29 Reipur Technology A/S A light-emitting assembly
US8188878B2 (en) 2000-11-15 2012-05-29 Federal Law Enforcement Development Services, Inc. LED light communication system
US7439847B2 (en) 2002-08-23 2008-10-21 John C. Pederson Intelligent observation and identification database system
ATE324671T1 (de) * 2000-12-04 2006-05-15 Mu-Chin Yu Licht-emittierende diode mit verbesserter wärmezerstreuung
US6505956B1 (en) * 2000-12-22 2003-01-14 Lektron Industrial Supply, Inc. Reeled L.E.D. assembly
US7230708B2 (en) * 2000-12-28 2007-06-12 Dmitri Olegovich Lapotko Method and device for photothermal examination of microinhomogeneities
DE10065624C2 (de) * 2000-12-29 2002-11-14 Hans Kragl Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler
DE10104579B4 (de) * 2001-02-01 2004-02-19 Ivoclar Vivadent Ag Lichthärtgerät
JP2002246650A (ja) * 2001-02-13 2002-08-30 Agilent Technologies Japan Ltd 発光ダイオード及びその製造方法
US6796994B2 (en) 2001-02-27 2004-09-28 Quantum Devices, Inc. Device for the treatment of mucositis
US6578998B2 (en) * 2001-03-21 2003-06-17 A L Lightech, Inc. Light source arrangement
JP2002299699A (ja) * 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
US6554450B2 (en) * 2001-04-19 2003-04-29 Wei Fang Artificial lighting apparatus for young plants using light emitting diodes as light source
US6798136B2 (en) * 2001-06-19 2004-09-28 Gelcore Llc Phosphor embedded die epoxy and lead frame modifications
US6578986B2 (en) * 2001-06-29 2003-06-17 Permlight Products, Inc. Modular mounting arrangement and method for light emitting diodes
US6799967B2 (en) 2001-07-10 2004-10-05 Cao Group, Inc. Light for use in activating light-activated materials, the light having a plurality of light emitting single chip arrays
US7108504B2 (en) 2001-07-10 2006-09-19 Cao Group, Inc. Light for use in activating light-activated materials, the light having insulators and an air jacket
US6926435B2 (en) * 2001-08-23 2005-08-09 Wavien, Inc. Led illumination engine using a reflector
JP4067802B2 (ja) * 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
US20030058650A1 (en) * 2001-09-25 2003-03-27 Kelvin Shih Light emitting diode with integrated heat dissipater
US6932495B2 (en) * 2001-10-01 2005-08-23 Sloanled, Inc. Channel letter lighting using light emitting diodes
US6692252B2 (en) 2001-12-17 2004-02-17 Ultradent Products, Inc. Heat sink with geometric arrangement of LED surfaces
US7106523B2 (en) 2002-01-11 2006-09-12 Ultradent Products, Inc. Optical lens used to focus led light
US6940659B2 (en) 2002-01-11 2005-09-06 Ultradent Products, Inc. Cone-shaped lens having increased forward light intensity and kits incorporating such lenses
WO2004044877A2 (en) * 2002-11-11 2004-05-27 Cotco International Limited A display device and method for making same
US6702837B2 (en) * 2002-04-23 2004-03-09 Phillip Gutwein Therapeutic light device
TWI229946B (en) 2002-05-08 2005-03-21 Phoseon Technology Inc High efficiency solid-state light source and methods of use and manufacture
USRE47011E1 (en) 2002-05-29 2018-08-28 Optolum, Inc. Light emitting diode light source
US6573536B1 (en) 2002-05-29 2003-06-03 Optolum, Inc. Light emitting diode light source
US7001413B2 (en) * 2002-07-03 2006-02-21 Life Support Technologies, Inc. Methods and apparatus for light therapy
US7201766B2 (en) * 2002-07-03 2007-04-10 Life Support Technologies, Inc. Methods and apparatus for light therapy
JP2004111357A (ja) * 2002-07-09 2004-04-08 Topcon Corp 光源装置
US6971196B2 (en) 2002-07-24 2005-12-06 National Signal, Inc. Message sign
WO2004011848A2 (en) 2002-07-25 2004-02-05 Dahm Jonathan S Method and apparatus for using light emitting diodes for curing
US7182597B2 (en) 2002-08-08 2007-02-27 Kerr Corporation Curing light instrument
US6715901B2 (en) * 2002-08-15 2004-04-06 Shi-Hwa Huang Image projector system having a light source that includes at least four light emitting diode modules
AU2003298561A1 (en) 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US6945672B2 (en) * 2002-08-30 2005-09-20 Gelcore Llc LED planar light source and low-profile headlight constructed therewith
CA2495843A1 (en) * 2002-09-04 2004-03-18 Mark Straubhaar Optoelectronic device for the treatment of muscle or joint pain
DE10242292A1 (de) * 2002-09-12 2004-04-01 Sebastian Matthias Flächenlampe
US20040076003A1 (en) * 2002-10-19 2004-04-22 Collura Joseph S. Apparatus for illuminating through sight devices
AU2003275662A1 (en) * 2002-10-25 2004-05-13 Moriyama Sangyo Kabushiki Kaisha Light-emitting module
CA2410978A1 (en) * 2002-11-04 2004-05-04 John Spencer Solid state illuminator for bi-colour ported water level gauges
US6866678B2 (en) 2002-12-10 2005-03-15 Interbational Technology Center Phototherapeutic treatment methods and apparatus
US6890175B2 (en) * 2002-12-18 2005-05-10 Ultradent Products, Inc. Cooling system for hand-held curing light
US6994546B2 (en) 2002-12-18 2006-02-07 Ultradent Products, Inc. Light curing device with detachable power supply
US20050042390A1 (en) * 2003-01-09 2005-02-24 Siegel Stephen B. Rotary UV curing method and apparatus
US7211299B2 (en) * 2003-01-09 2007-05-01 Con-Trol-Cure, Inc. UV curing method and apparatus
US7671346B2 (en) * 2003-01-09 2010-03-02 Con-Trol-Cure, Inc. Light emitting apparatus and method for curing inks, coatings and adhesives
US7465909B2 (en) * 2003-01-09 2008-12-16 Con-Trol-Cure, Inc. UV LED control loop and controller for causing emitting UV light at a much greater intensity for UV curing
US7399982B2 (en) * 2003-01-09 2008-07-15 Con-Trol-Cure, Inc UV curing system and process with increased light intensity
US7498065B2 (en) * 2003-01-09 2009-03-03 Con-Trol-Cure, Inc. UV printing and curing of CDs, DVDs, Golf Balls And Other Products
US20060121208A1 (en) * 2003-01-09 2006-06-08 Siegel Stephen B Multiple wavelength UV curing
US7137696B2 (en) * 2003-01-09 2006-11-21 Con-Trol-Cure, Inc. Ink jet UV curing
US20060204670A1 (en) * 2003-01-09 2006-09-14 Con-Trol-Cure, Inc. UV curing method and apparatus
US7175712B2 (en) * 2003-01-09 2007-02-13 Con-Trol-Cure, Inc. Light emitting apparatus and method for curing inks, coatings and adhesives
US20040164325A1 (en) * 2003-01-09 2004-08-26 Con-Trol-Cure, Inc. UV curing for ink jet printer
US6902299B2 (en) * 2003-02-27 2005-06-07 Cantronic Systems Inc. Long distance illuminator
US7182480B2 (en) 2003-03-05 2007-02-27 Tir Systems Ltd. System and method for manipulating illumination created by an array of light emitting devices
US20040189555A1 (en) * 2003-03-26 2004-09-30 Capen Larry Stephen Use of track lighting switching power supplies to efficiently drive LED arrays
TW578310B (en) * 2003-04-02 2004-03-01 Au Optronics Corp Low temperature poly silicon thin film transistor and method of forming poly silicon layer of the same
KR20060041161A (ko) 2003-04-10 2006-05-11 라이트 바이오사이언스, 엘엘씨 세포 증식 및 유전자 발현의 조절을 위한 광조절 방법 및광조절 장치
US20070020578A1 (en) * 2005-07-19 2007-01-25 Scott Robert R Dental curing light having a short wavelength LED and a fluorescing lens for converting wavelength light to curing wavelengths and related method
US7633093B2 (en) * 2003-05-05 2009-12-15 Lighting Science Group Corporation Method of making optical light engines with elevated LEDs and resulting product
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
US6921182B2 (en) * 2003-05-13 2005-07-26 Solaroasis Efficient LED lamp for enhancing commercial and home plant growth
US7033060B2 (en) * 2003-05-23 2006-04-25 Gelcore Llc Method and apparatus for irradiation of plants using light emitting diodes
DE10324909B4 (de) * 2003-05-30 2017-09-07 Osram Opto Semiconductors Gmbh Gehäuse für ein strahlungsemittierendes Bauelement, Verfahren zu dessen Herstellung und strahlungsemittierendes Bauelement
WO2004114736A2 (en) * 2003-06-20 2004-12-29 Yazaki Corporation Led illumination device
US8251057B2 (en) 2003-06-30 2012-08-28 Life Support Technologies, Inc. Hyperbaric chamber control and/or monitoring system and methods for using the same
US20050001562A1 (en) * 2003-07-02 2005-01-06 911Ep, Inc. LED compensation circuit
US7080927B2 (en) * 2003-07-09 2006-07-25 Stephen Feuerborn Modular lighting with blocks
EP1648385B1 (de) * 2003-07-31 2016-05-04 Gentlewaves Llc System und verfahren für die photodynamische behandlung von haut
JP2005056653A (ja) * 2003-08-01 2005-03-03 Fuji Photo Film Co Ltd 光源装置
US7192276B2 (en) 2003-08-20 2007-03-20 Ultradent Products, Inc. Dental curing light adapted to emit light at a desired angle
US7047806B2 (en) 2003-09-12 2006-05-23 Clark-Reliance Corporation Liquid level gage and illuminator therefor
US20050056092A1 (en) * 2003-09-12 2005-03-17 Kowalski Kenneth H. Liquid level indicator using lights
US7102172B2 (en) * 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
US6923557B2 (en) * 2003-10-21 2005-08-02 Lightshapes Inc. Modular lighting assembly
US7524085B2 (en) * 2003-10-31 2009-04-28 Phoseon Technology, Inc. Series wiring of highly reliable light sources
US7819550B2 (en) * 2003-10-31 2010-10-26 Phoseon Technology, Inc. Collection optics for led array with offset hemispherical or faceted surfaces
US7281818B2 (en) * 2003-12-11 2007-10-16 Dialight Corporation Light reflector device for light emitting diode (LED) array
US7220018B2 (en) 2003-12-15 2007-05-22 Orbital Technologies, Inc. Marine LED lighting system and method
US7144250B2 (en) 2003-12-17 2006-12-05 Ultradent Products, Inc. Rechargeable dental curing light
JP2005183531A (ja) * 2003-12-17 2005-07-07 Sharp Corp 半導体発光装置
US7195482B2 (en) 2003-12-30 2007-03-27 Ultradent Products, Inc. Dental curing device having a heat sink for dissipating heat
CN2686020Y (zh) * 2004-01-19 2005-03-16 上海三思科技发展有限公司 一种高亮区比例的led点阵显示模块
US7081644B2 (en) * 2004-02-06 2006-07-25 Barnes Group Inc. Overmolded lens on leadframe and method for overmolding lens on lead frame
US7964883B2 (en) * 2004-02-26 2011-06-21 Lighting Science Group Corporation Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
EP1574126A1 (de) * 2004-03-12 2005-09-14 C.R.F. Società Consortile per Azioni Integriertes System zur Bestrahlung von photosyntetischen Organismen, insbesondere Pflanzen, mit mehrfarbigem Licht
EP1754121A4 (de) * 2004-03-15 2014-02-12 Philips Solid State Lighting Verfahren und systeme zur bereitstellung von beleuchtungssystemen
WO2005091392A1 (en) 2004-03-18 2005-09-29 Phoseon Technology, Inc. Micro-reflectors on a substrate for high-density led array
US7235878B2 (en) 2004-03-18 2007-06-26 Phoseon Technology, Inc. Direct cooling of LEDs
JP4754850B2 (ja) * 2004-03-26 2011-08-24 パナソニック株式会社 Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法
EP1743384B1 (de) * 2004-03-30 2015-08-05 Phoseon Technology, Inc. Led-gruppe mit led-detektoren auf gruppenbasis
US7074040B2 (en) 2004-03-30 2006-07-11 Ultradent Products, Inc. Ball lens for use with a dental curing light
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
WO2005101535A2 (en) * 2004-04-12 2005-10-27 Phoseon Technology, Inc. High density led array
US7241031B2 (en) * 2004-04-14 2007-07-10 Sloanled, Inc. Channel letter lighting system using high output white light emitting diodes
DE102004019137A1 (de) * 2004-04-16 2005-11-17 Trilux-Lenze Gmbh + Co Kg Leuchtenfeld
DE102004019049B4 (de) * 2004-04-16 2008-10-09 Universität Duisburg-Essen Verfahren zur Stimulation des Pfanzenwachstums
US8077305B2 (en) * 2004-04-19 2011-12-13 Owen Mark D Imaging semiconductor structures using solid state illumination
US11158768B2 (en) 2004-05-07 2021-10-26 Bruce H. Baretz Vacuum light emitting diode
US8188503B2 (en) * 2004-05-10 2012-05-29 Permlight Products, Inc. Cuttable illuminated panel
JP2005339881A (ja) * 2004-05-25 2005-12-08 Hitachi Displays Ltd 照明装置、照明モジュール及び液晶表示装置
US7761945B2 (en) 2004-05-28 2010-07-27 Life Support Technologies, Inc. Apparatus and methods for preventing pressure ulcers in bedfast patients
DE102004055221A1 (de) * 2004-06-11 2005-12-29 Frank Sprick Leuchte zur Förderung des Wachstums biologischer Systeme
WO2006001928A1 (en) * 2004-06-15 2006-01-05 Henkel Corporation High power led electro-optic assembly
US7186010B2 (en) * 2004-06-16 2007-03-06 Osram Sylvania Inc. LED lamp and lamp/reflector assembly
KR101097486B1 (ko) * 2004-06-28 2011-12-22 엘지디스플레이 주식회사 액정표시장치의 백라이트 유닛
US20060013000A1 (en) * 2004-07-16 2006-01-19 Osram Sylvania Inc. Flat mount for light emitting diode source
US7252408B2 (en) * 2004-07-19 2007-08-07 Lamina Ceramics, Inc. LED array package with internal feedback and control
KR20060015202A (ko) * 2004-08-13 2006-02-16 삼성전자주식회사 평판 표시 장치용 복사 패드와, 이를 갖는 백라이트어셈블리 및 평판 표시 장치
JP4922555B2 (ja) * 2004-09-24 2012-04-25 スタンレー電気株式会社 Ｌｅｄ装置
US7056116B2 (en) 2004-10-26 2006-06-06 Ultradent Products, Inc. Heat sink for dental curing light comprising a plurality of different materials
US7322732B2 (en) * 2004-12-23 2008-01-29 Cree, Inc. Light emitting diode arrays for direct backlighting of liquid crystal displays
JP4800324B2 (ja) 2004-12-30 2011-10-26 フォーセン テクノロジー インク 露光装置
US20060200212A1 (en) * 2005-02-17 2006-09-07 Brawn Peter R Light therapy device for treatment of bone disorders and biostimulation of bone and soft tissue
US20070248930A1 (en) 2005-02-17 2007-10-25 Biolux Research Ltd. Light therapy apparatus and methods
US7977698B2 (en) * 2005-03-18 2011-07-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for surface mountable display
US20060217787A1 (en) * 2005-03-23 2006-09-28 Eastman Kodak Company Light therapy device
US20060241495A1 (en) * 2005-03-23 2006-10-26 Eastman Kodak Company Wound healing monitoring and treatment
US8113830B2 (en) * 2005-05-27 2012-02-14 Kerr Corporation Curing light instrument
KR101096759B1 (ko) * 2005-06-16 2011-12-26 삼성전자주식회사 백라이트 어셈블리 및 이를 이용한 액정표시장치
KR100599013B1 (ko) 2005-06-30 2006-07-12 서울옵토디바이스주식회사 복수개의 발광셀들을 갖는 발광소자 및 그것을 제조하는방법
US20070021807A1 (en) * 2005-07-20 2007-01-25 Eastman Kodak Company Device for optically stimulating collagen formation in tissue
JP4618043B2 (ja) * 2005-08-10 2011-01-26 日亜化学工業株式会社 面発光装置
US20070081328A1 (en) * 2005-08-15 2007-04-12 Chi-Chin Yu Illuminating device for plants
JP3787145B1 (ja) * 2005-08-30 2006-06-21 株式会社未来 照明パネル及び照明装置
CN100405150C (zh) * 2005-09-02 2008-07-23 鸿富锦精密工业（深圳）有限公司 散热模组及采用该散热模组的直下式背光系统
TWI297784B (en) * 2005-09-22 2008-06-11 Lite On Technology Corp Optical module having a lens formed without contacting a reflector and method of manufacturing the same
KR101171186B1 (ko) * 2005-11-10 2012-08-06 삼성전자주식회사 고휘도 발광 다이오드 및 이를 이용한 액정 표시 장치
JP5166278B2 (ja) 2005-11-18 2013-03-21 クリー インコーポレイテッド 固体素子照明タイル
US8465175B2 (en) 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
US20070128577A1 (en) * 2005-12-05 2007-06-07 Ultradent Products, Inc. Dental curing lights including a capacitor power source
US7642527B2 (en) * 2005-12-30 2010-01-05 Phoseon Technology, Inc. Multi-attribute light effects for use in curing and other applications involving photoreactions and processing
KR100659700B1 (ko) 2005-12-30 2006-12-21 서울반도체 주식회사 연결단자가 내장된 발광소자
US7559945B2 (en) 2006-01-13 2009-07-14 Clarimedix Inc. Multi-spectral photon therapy device and methods of use
US20070171635A1 (en) * 2006-01-23 2007-07-26 Kai-Tai Liao Lighting device
KR100675204B1 (ko) * 2006-02-07 2007-01-29 삼성전기주식회사 발광 다이오드 패키지
US20070239232A1 (en) * 2006-03-28 2007-10-11 Eastman Kodak Company Light guide based light therapy device
US20070233208A1 (en) * 2006-03-28 2007-10-04 Eastman Kodak Company Light therapy bandage with imbedded emitters
US20070239233A1 (en) * 2006-04-07 2007-10-11 Life Without Pain L.L.C. Surface mount light emitting diode medical apparatus
WO2007126074A1 (ja) * 2006-04-28 2007-11-08 Shimane Prefectural Government 半導体発光モジュール、装置、およびその製造方法
US8141384B2 (en) * 2006-05-03 2012-03-27 3M Innovative Properties Company Methods of making LED extractor arrays
US7637628B2 (en) * 2006-06-13 2009-12-29 Light-Pod, Inc. LED light pod with modular optics and heat dissipation structure
WO2007147242A1 (en) * 2006-06-19 2007-12-27 Theoreme Innovation Inc. Led luminaire
US20080074583A1 (en) * 2006-07-06 2008-03-27 Intematix Corporation Photo-luminescence color liquid crystal display
US8947619B2 (en) 2006-07-06 2015-02-03 Intematix Corporation Photoluminescence color display comprising quantum dots material and a wavelength selective filter that allows passage of excitation radiation and prevents passage of light generated by photoluminescence materials
WO2008008342A2 (en) * 2006-07-13 2008-01-17 California Institute Of Technology Dual spectrum illuminator for containers
US20080029720A1 (en) 2006-08-03 2008-02-07 Intematix Corporation LED lighting arrangement including light emitting phosphor
US8047686B2 (en) 2006-09-01 2011-11-01 Dahm Jonathan S Multiple light-emitting element heat pipe assembly
ES1063895Y (es) * 2006-09-28 2007-03-16 Sakma Electronica Ind S A Dispositivo modular de iluminacion
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US7952262B2 (en) * 2006-09-30 2011-05-31 Ruud Lighting, Inc. Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules
US20090086491A1 (en) 2007-09-28 2009-04-02 Ruud Lighting, Inc. Aerodynamic LED Floodlight Fixture
US7686469B2 (en) 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
CN1948819A (zh) * 2006-10-26 2007-04-18 诸建平 Led节能灯
US20080158876A1 (en) * 2007-01-02 2008-07-03 Thrailkill John E High intensity solid state lighting apparatus using thermally conductive membrane and method of making thermal membrane component
US20080192458A1 (en) 2007-02-12 2008-08-14 Intematix Corporation Light emitting diode lighting system
DE102007007223B4 (de) * 2007-02-14 2008-11-20 Semikron Elektronik Gmbh & Co. Kg Modular aufgebautes Leistungshalbleitermodul
US7972030B2 (en) 2007-03-05 2011-07-05 Intematix Corporation Light emitting diode (LED) based lighting systems
US20080285294A1 (en) * 2007-03-28 2008-11-20 Kim Michael Y Decorative lighting devices
US8203260B2 (en) * 2007-04-13 2012-06-19 Intematix Corporation Color temperature tunable white light source
US7575341B2 (en) * 2007-04-16 2009-08-18 Yung-Chiang Liao Lamp structure
US7703943B2 (en) * 2007-05-07 2010-04-27 Intematix Corporation Color tunable light source
US20090003832A1 (en) 2007-05-24 2009-01-01 Federal Law Enforcement Development Services, Inc. Led light broad band over power line communication system
US11265082B2 (en) 2007-05-24 2022-03-01 Federal Law Enforcement Development Services, Inc. LED light control assembly and system
US9100124B2 (en) 2007-05-24 2015-08-04 Federal Law Enforcement Development Services, Inc. LED Light Fixture
US9414458B2 (en) 2007-05-24 2016-08-09 Federal Law Enforcement Development Services, Inc. LED light control assembly and system
US9455783B2 (en) 2013-05-06 2016-09-27 Federal Law Enforcement Development Services, Inc. Network security and variable pulse wave form with continuous communication
US9294198B2 (en) 2007-05-24 2016-03-22 Federal Law Enforcement Development Services, Inc. Pulsed light communication key
US9258864B2 (en) 2007-05-24 2016-02-09 Federal Law Enforcement Development Services, Inc. LED light control and management system
WO2008157723A1 (en) * 2007-06-21 2008-12-24 Nila Inc. Modular lighting arrays
IL184218A0 (en) * 2007-06-26 2007-10-31 Zidkiyahu Simenhaus Photo-magnetic radiation device
DE102007033438B4 (de) * 2007-07-18 2012-08-09 Automotive Lighting Reutlingen Gmbh Leuchte für Kraftfahrzeuge
US7922354B2 (en) * 2007-08-13 2011-04-12 Everhart Robert L Solid-state lighting fixtures
US20090050921A1 (en) * 2007-08-23 2009-02-26 Philips Lumileds Lighting Company Llc Light Emitting Diode Array
KR101499950B1 (ko) * 2007-08-31 2015-03-09 엘지이노텍 주식회사 광원 장치
US8783887B2 (en) 2007-10-01 2014-07-22 Intematix Corporation Color tunable light emitting device
JP5157357B2 (ja) * 2007-10-10 2013-03-06 日亜化学工業株式会社 発光装置用パッケージの集合構造体およびその製造方法、ならびに発光装置の製造方法
US7828456B2 (en) 2007-10-17 2010-11-09 Lsi Industries, Inc. Roadway luminaire and methods of use
US7915627B2 (en) 2007-10-17 2011-03-29 Intematix Corporation Light emitting device with phosphor wavelength conversion
US20090105791A1 (en) * 2007-10-23 2009-04-23 Mcginnis William J Light emitting medical garment device, kit and method of using
US20090105708A1 (en) * 2007-10-23 2009-04-23 Mcginnis William J Dual frequency led/electrode surgical device, kit and method
US9135837B2 (en) * 2007-11-16 2015-09-15 Intellectual Discovery Co., Ltd. Illumination assembly having multiple reflective cavities each with a single emitter
US8866410B2 (en) 2007-11-28 2014-10-21 Cree, Inc. Solid state lighting devices and methods of manufacturing the same
KR101395059B1 (ko) * 2007-11-29 2014-05-14 삼성디스플레이 주식회사 백라이트 유닛 및 이를 포함한 액정 표시 장치
EP2071640A1 (de) * 2007-12-14 2009-06-17 Giovanni Luigi Albore Beleuchtungsvorrichtung
CN101498428B (zh) * 2008-01-28 2010-12-08 富士迈半导体精密工业（上海）有限公司 照明装置
JP5351479B2 (ja) * 2008-01-28 2013-11-27 東京エレクトロン株式会社 加熱源の冷却構造
US8740400B2 (en) 2008-03-07 2014-06-03 Intematix Corporation White light illumination system with narrow band green phosphor and multiple-wavelength excitation
US8567973B2 (en) 2008-03-07 2013-10-29 Intematix Corporation Multiple-chip excitation systems for white light emitting diodes (LEDs)
CN101539278B (zh) * 2008-03-19 2010-11-10 富准精密工业(深圳)有限公司 发光二极管组合
AU2008201673B1 (en) * 2008-04-16 2009-10-22 Zhejiang Howell Illuminating Technology Co., Ltd. A method and device for lamp having multiple light illuminating angles
US7868340B2 (en) * 2008-05-30 2011-01-11 Bridgelux, Inc. Method and apparatus for generating white light from solid state light emitting devices
DE102008028611B4 (de) * 2008-06-18 2012-11-08 Phoenix Contact Gmbh & Co. Kg Leuchtelement mit Kunststoffhalterung
US8738160B2 (en) * 2008-07-25 2014-05-27 Jeffery Bucove Apparatus and method for plant metabolism manipulation using spectral output
US20100027293A1 (en) * 2008-07-30 2010-02-04 Intematix Corporation Light Emitting Panel
TW201009250A (en) * 2008-08-21 2010-03-01 yi-zhang Wu Assembly-type LED lamp
US20100079993A1 (en) * 2008-09-29 2010-04-01 Richard Kinderman Decorative light string
US8822954B2 (en) * 2008-10-23 2014-09-02 Intematix Corporation Phosphor based authentication system
TWI411127B (zh) * 2008-11-19 2013-10-01 Sinology Entpr Ltd 模組化之發光二極體光源模組結構
TWM354700U (en) * 2008-12-01 2009-04-11 Honest Prec Ind Co Ltd Illuminating lamp device with LED lighting group
US20100226139A1 (en) * 2008-12-05 2010-09-09 Permlight Products, Inc. Led-based light engine
US20120099305A1 (en) * 2008-12-10 2012-04-26 Jeffery Bucove Rgb led package for optimized emissions of photosynthetically active radiation
US8314408B2 (en) * 2008-12-31 2012-11-20 Draka Comteq, B.V. UVLED apparatus for curing glass-fiber coatings
US8390193B2 (en) * 2008-12-31 2013-03-05 Intematix Corporation Light emitting device with phosphor wavelength conversion
US8890773B1 (en) 2009-04-01 2014-11-18 Federal Law Enforcement Development Services, Inc. Visible light transceiver glasses
US9066777B2 (en) 2009-04-02 2015-06-30 Kerr Corporation Curing light device
US9072572B2 (en) 2009-04-02 2015-07-07 Kerr Corporation Dental light device
US8678612B2 (en) * 2009-04-14 2014-03-25 Phoseon Technology, Inc. Modular light source
KR100926040B1 (ko) * 2009-05-19 2009-11-11 주식회사 케이디파워 Ｌｅｄ 조명등
US8651692B2 (en) * 2009-06-18 2014-02-18 Intematix Corporation LED based lamp and light emitting signage
BE1018825A3 (fr) 2009-07-14 2011-09-06 Daniel Verplaetse Dissipateur thermique pour un composant electronique ou electrique.
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
CN102042494B (zh) * 2009-10-09 2012-09-26 亿光电子工业股份有限公司 光源模组
US20110110095A1 (en) * 2009-10-09 2011-05-12 Intematix Corporation Solid-state lamps with passive cooling
US8794787B2 (en) 2009-11-10 2014-08-05 Lsi Industries, Inc. Modular light reflectors and assemblies for luminaire
US8042968B2 (en) * 2009-11-10 2011-10-25 Lsi Industries, Inc. Modular light reflectors and assemblies for luminaire
CN102062363A (zh) * 2009-11-11 2011-05-18 富士迈半导体精密工业（上海）有限公司 可模组化拼接的灯座
US8308320B2 (en) * 2009-11-12 2012-11-13 Cooper Technologies Company Light emitting diode modules with male/female features for end-to-end coupling
US8779685B2 (en) * 2009-11-19 2014-07-15 Intematix Corporation High CRI white light emitting devices and drive circuitry
US8241044B2 (en) * 2009-12-09 2012-08-14 Tyco Electronics Corporation LED socket assembly
US8845130B2 (en) * 2009-12-09 2014-09-30 Tyco Electronics Corporation LED socket assembly
US8210715B2 (en) * 2009-12-09 2012-07-03 Tyco Electronics Corporation Socket assembly with a thermal management structure
US8878454B2 (en) * 2009-12-09 2014-11-04 Tyco Electronics Corporation Solid state lighting system
US8235549B2 (en) * 2009-12-09 2012-08-07 Tyco Electronics Corporation Solid state lighting assembly
US20110149548A1 (en) * 2009-12-22 2011-06-23 Intematix Corporation Light emitting diode based linear lamps
CN102169878B (zh) * 2010-02-26 2013-02-20 旭丽电子(广州)有限公司 拼接式发光二极管模块
ITAN20100039A1 (it) * 2010-03-24 2011-09-25 Futura Stampi Srl Plafoniera stagna, per illuminazione con led disposti in linea
JP2011249737A (ja) * 2010-04-26 2011-12-08 Panasonic Electric Works Co Ltd リードフレーム、配線板およびそれを用いたｌｅｄユニット
KR101495580B1 (ko) 2010-04-26 2015-02-25 파나소닉 주식회사 리드 프레임, 배선판, 발광 유닛, 조명 장치
WO2011139764A2 (en) 2010-04-27 2011-11-10 Cooper Technologies Company Linkable linear light emitting diode system
WO2011139768A2 (en) 2010-04-28 2011-11-10 Cooper Technologies Company Linear led light module
CN102252214A (zh) * 2010-05-18 2011-11-23 张松岩 一种道路照明的led标准光源
EP2388239B1 (de) 2010-05-20 2017-02-15 Draka Comteq B.V. Härtungsvorrichtung mit in einem Winkel gerichteter UV-LEDs
US8871311B2 (en) 2010-06-03 2014-10-28 Draka Comteq, B.V. Curing method employing UV sources that emit differing ranges of UV radiation
US8807799B2 (en) 2010-06-11 2014-08-19 Intematix Corporation LED-based lamps
US8888318B2 (en) 2010-06-11 2014-11-18 Intematix Corporation LED spotlight
KR101141470B1 (ko) * 2010-07-08 2012-05-04 엘지이노텍 주식회사 발광소자 패키지
US8946998B2 (en) 2010-08-09 2015-02-03 Intematix Corporation LED-based light emitting systems and devices with color compensation
EP2418183B1 (de) 2010-08-10 2018-07-25 Draka Comteq B.V. Verfahren zur Härtung beschichteter Glasfasern mit erhöhter UVLED-Intensität
US8672516B2 (en) * 2010-09-30 2014-03-18 GE Lighting Solutions, LLC Lightweight heat sinks and LED lamps employing same
US8610341B2 (en) 2010-10-05 2013-12-17 Intematix Corporation Wavelength conversion component
US8604678B2 (en) 2010-10-05 2013-12-10 Intematix Corporation Wavelength conversion component with a diffusing layer
US8957585B2 (en) 2010-10-05 2015-02-17 Intermatix Corporation Solid-state light emitting devices with photoluminescence wavelength conversion
CN103155024B (zh) 2010-10-05 2016-09-14 英特曼帝克司公司 具光致发光波长转换的固态发光装置及标牌
US8614539B2 (en) 2010-10-05 2013-12-24 Intematix Corporation Wavelength conversion component with scattering particles
US9546765B2 (en) 2010-10-05 2017-01-17 Intematix Corporation Diffuser component having scattering particles
GB2484711A (en) * 2010-10-21 2012-04-25 Optovate Ltd Illumination Apparatus
GB2484712A (en) * 2010-10-21 2012-04-25 Optovate Ltd Illumination Apparatus
EP2648651B1 (de) 2010-12-08 2016-11-23 Biolux Research Limited Vorrichtungen zur regulation einer knochenneumodellierung oder einer zahnbewegung durch lichttherapie und funktionsanwendung dafür
WO2012097291A1 (en) 2011-01-14 2012-07-19 Federal Law Enforcement Development Services, Inc. Method of providing lumens and tracking of lumen consumption
EP2668442B1 (de) * 2011-01-25 2016-05-25 Koninklijke Philips N.V. Modulare anordnung auf led-basis
EP2691688B1 (de) * 2011-03-29 2015-08-19 CeramTec GmbH Spritzguss-lampenkörper mit keramischen kühlern und leds
US9004705B2 (en) 2011-04-13 2015-04-14 Intematix Corporation LED-based light sources for light emitting devices and lighting arrangements with photoluminescence wavelength conversion
CH704958A1 (de) * 2011-05-16 2012-11-30 Uviterno Ag Beleuchtungsanordnung.
US8998458B2 (en) 2011-05-31 2015-04-07 Sabic Global Technologies B.V. LED plastic heat sink and method for making and using the same
US9423119B2 (en) 2011-09-26 2016-08-23 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface
US9429309B2 (en) 2011-09-26 2016-08-30 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface
US9249955B2 (en) 2011-09-26 2016-02-02 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface
US8992051B2 (en) 2011-10-06 2015-03-31 Intematix Corporation Solid-state lamps with improved radial emission and thermal performance
US20130088848A1 (en) 2011-10-06 2013-04-11 Intematix Corporation Solid-state lamps with improved radial emission and thermal performance
US9115868B2 (en) 2011-10-13 2015-08-25 Intematix Corporation Wavelength conversion component with improved protective characteristics for remote wavelength conversion
US9365766B2 (en) 2011-10-13 2016-06-14 Intematix Corporation Wavelength conversion component having photo-luminescence material embedded into a hermetic material for remote wavelength conversion
US8568001B2 (en) 2012-02-03 2013-10-29 Tyco Electronics Corporation LED socket assembly
TWI464339B (zh) * 2012-03-03 2014-12-11 Lextar Electronics Corp 發光二極體燈條及應用其之發光二極體模組
US9121554B2 (en) * 2012-03-16 2015-09-01 Rohm Co., Ltd. LED lamp and lens unit therefor
EP3240052A1 (de) 2012-04-26 2017-11-01 Intematix Corporation Verfahren und vorrichtung zur implementierung einer farbkonsistenz in einer ferngesteuerten wellenlängeumwandlung
DE102012008637A1 (de) 2012-05-02 2013-11-07 Heraeus Noblelight Gmbh Optisches Modul mit Ausformung zur Montage
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
JP5954657B2 (ja) * 2012-06-21 2016-07-20 パナソニックＩｐマネジメント株式会社 実装基板およびその製造方法、ｌｅｄモジュール
US8994056B2 (en) 2012-07-13 2015-03-31 Intematix Corporation LED-based large area display
CN103574378A (zh) * 2012-07-25 2014-02-12 展晶科技(深圳)有限公司 发光二极管灯条组
US20140185269A1 (en) 2012-12-28 2014-07-03 Intermatix Corporation Solid-state lamps utilizing photoluminescence wavelength conversion components
US9217543B2 (en) 2013-01-28 2015-12-22 Intematix Corporation Solid-state lamps with omnidirectional emission patterns
US9265112B2 (en) 2013-03-13 2016-02-16 Federal Law Enforcement Development Services, Inc. LED light control and management system
TWI627371B (zh) 2013-03-15 2018-06-21 英特曼帝克司公司 光致發光波長轉換組件
US9711489B2 (en) * 2013-05-29 2017-07-18 Cree Huizhou Solid State Lighting Company Limited Multiple pixel surface mount device package
CN104425695B (zh) * 2013-09-04 2017-10-03 展晶科技(深圳)有限公司 发光二极管
TWI599745B (zh) * 2013-09-11 2017-09-21 晶元光電股份有限公司 可撓式發光二極體組件及發光二極體燈泡
WO2015058284A1 (en) 2013-10-22 2015-04-30 Biolux Research Ltd. Intra-oral light-therapy apparatuses and methods for their use
US20150198941A1 (en) 2014-01-15 2015-07-16 John C. Pederson Cyber Life Electronic Networking and Commerce Operating Exchange
US9318670B2 (en) 2014-05-21 2016-04-19 Intematix Corporation Materials for photoluminescence wavelength converted solid-state light emitting devices and arrangements
CN107250906A (zh) 2015-03-23 2017-10-13 英特曼帝克司公司 光致发光彩色显示器
ITUB20152355A1 (it) 2015-07-21 2017-01-21 Osram Spa Dispositivo di illuminazione, ad esempio per l'illuminazione di serre, e corrispondente procedimento di impiego
EP3123976B1 (de) * 2015-07-31 2020-01-08 Ivoclar Vivadent AG Lichthärtgerät
US20170046950A1 (en) 2015-08-11 2017-02-16 Federal Law Enforcement Development Services, Inc. Function disabler device and system
US9512978B1 (en) 2015-08-13 2016-12-06 Randal L Wimberly Vortex light projection system, LED lensless primary optics system, and perfectly random LED color mixing system
WO2018013645A1 (en) * 2016-07-15 2018-01-18 3M Innovative Properties Company Multilayer led substrate
US10823348B2 (en) * 2017-08-07 2020-11-03 Canon Components, Inc. Lighting apparatus, line sensor assembly, reading apparatus, and printing apparatus
US11079075B2 (en) 2017-10-02 2021-08-03 Signify Holding B.V. Configurable and adjustable luminaire
CN108224113A (zh) * 2018-01-26 2018-06-29 深圳市瑞丰光电紫光技术有限公司 可拼接uv led模块、uv led固化组件及固化照射头
US11885474B2 (en) * 2021-09-28 2024-01-30 Lumileds Llc LED module with separate heat sink and referencing part, headlight, and method of manufacture
EP4198376A1 (de) * 2021-12-17 2023-06-21 Valeo Vision Leuchtende vorrichtung für ein kraftfahrzeug

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3711789A (en) * 1970-11-18 1973-01-16 Texas Instruments Inc Diode array assembly for diode pumped lasers
US3778887A (en) * 1970-12-23 1973-12-18 Hitachi Ltd Electronic devices and method for manufacturing the same
US3832480A (en) * 1972-07-07 1974-08-27 Gte Sylvania Inc Intermediate package and method for making
US3764862A (en) * 1972-10-19 1973-10-09 Fairchild Camera Instr Co Lead frame for light-emitting diodes
US4054814A (en) * 1975-10-31 1977-10-18 Western Electric Company, Inc. Electroluminescent display and method of making
US4129682A (en) * 1977-11-16 1978-12-12 Monsanto Company High density led lead frame
US4157486A (en) * 1977-12-19 1979-06-05 Western Electric Company, Inc. Electroluminescent display and circuit protective device and method of making
US4152624A (en) * 1978-03-16 1979-05-01 Monsanto Company Molded LED indicator
US4375606A (en) * 1978-12-04 1983-03-01 Western Electric Co. Microelectronic device
JPS5896785A (ja) * 1981-12-04 1983-06-08 Stanley Electric Co Ltd 発光ダイオ−ドの合成樹脂レンズ成形方法
DE3148843C2 (de) * 1981-12-10 1986-01-02 Telefunken electronic GmbH, 7100 Heilbronn Mehrfach-Leuchtdiodenanordnung
DE3568517D1 (en) * 1984-04-06 1989-04-06 Plessey Overseas Improvements relating to the fabrication of optical devices
JPS6175570A (ja) * 1984-09-18 1986-04-17 Stanley Electric Co Ltd 車両用灯具の光源ユニツトの製造方法
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
FR2574616B1 (fr) * 1984-12-07 1987-01-23 Radiotechnique Compelec Matrice d'element electro-luminescents et son procede de fabrication
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
US4667277A (en) * 1985-09-20 1987-05-19 General Instrument Corporation Indicator lamp assembly
EP0217082A1 (de) * 1985-09-30 1987-04-08 Siemens Aktiengesellschaft Bauelementeträger und Verfahren zur Herstellung eines Bauelements mit einem solchen Bauelementeträger
DE3633203A1 (de) * 1986-09-30 1988-03-31 Siemens Ag Lichtemissionsdioden (led) - anzeigevorrichtung
DE3777785D1 (de) * 1986-12-26 1992-04-30 Idec Izumi Corp Traegerband fuer elektronische bauteile und herstellungsverfahren.
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
US5012609A (en) * 1988-12-12 1991-05-07 Automated Agriculture Associates, Inc. Method and apparatus for irradiation of plants using optoelectronic devices
US5175060A (en) * 1989-07-01 1992-12-29 Ibiden Co., Ltd. Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same
JPH0622111B2 (ja) * 1989-08-29 1994-03-23 スタンレー電気株式会社 基板装着用電球及びその製造方法
JP2890662B2 (ja) * 1990-04-25 1999-05-17 ソニー株式会社 樹脂封止型半導体装置の製造方法とそれに用いるリードフレーム
US5241457A (en) * 1991-01-18 1993-08-31 Nippon Sheet Glass Co., Ltd. Rear window stop lamp for motor vehicles
US5174649B1 (en) * 1991-07-17 1998-04-14 Precision Solar Controls Inc Led lamp including refractive lens element
US5278432A (en) * 1992-08-27 1994-01-11 Quantam Devices, Inc. Apparatus for providing radiant energy
FR2697485B1 (fr) * 1992-11-02 1995-01-20 Valeo Vision Feu de signalisation à éléments lumineux modulaires, pour véhicule automobile.
US5404282A (en) * 1993-09-17 1995-04-04 Hewlett-Packard Company Multiple light emitting diode module

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US5660461A (en) 1997-08-26
CA2204432C (en) 2001-07-03
JPH10502772A (ja) 1998-03-10
CA2204432A1 (en) 1996-06-13
WO1996018210A1 (en) 1996-06-13
DE69530221T2 (de) 2004-02-19
EP0796506B1 (de) 2003-04-02

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