DE60331243D1 - Herstellungsverfahren eines sockels zur testdurchführung integrierten schaltungen und ein solcher sockel - Google Patents

Herstellungsverfahren eines sockels zur testdurchführung integrierten schaltungen und ein solcher sockel

Info

Publication number
DE60331243D1
DE60331243D1 DE60331243T DE60331243T DE60331243D1 DE 60331243 D1 DE60331243 D1 DE 60331243D1 DE 60331243 T DE60331243 T DE 60331243T DE 60331243 T DE60331243 T DE 60331243T DE 60331243 D1 DE60331243 D1 DE 60331243D1
Authority
DE
Germany
Prior art keywords
base
manufacturing
integrated circuits
test implementation
implementation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60331243T
Other languages
English (en)
Inventor
Igor K Khandros
Gaetan L Mathieu
Carl V Reynolds
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Application granted granted Critical
Publication of DE60331243D1 publication Critical patent/DE60331243D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001Core members of the bump connector
    • H01L2224/13099Material
    • H01L2224/131Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01046Palladium [Pd]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01055Cesium [Cs]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • Y10T29/49149Assembling terminal to base by metal fusion bonding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49174Assembling terminal to elongated conductor
    • Y10T29/49179Assembling terminal to elongated conductor by metal fusion bonding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49194Assembling elongated conductors, e.g., splicing, etc.
    • Y10T29/49195Assembling elongated conductors, e.g., splicing, etc. with end-to-end orienting
    • Y10T29/49197Assembling elongated conductors, e.g., splicing, etc. with end-to-end orienting including fluid evacuating or pressurizing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921Contact or terminal manufacturing by assembling plural parts with bonding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49224Contact or terminal manufacturing with coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/532Conductor
    • Y10T29/53209Terminal or connector
    • Y10T29/53213Assembled to wire-type conductor
    • Y10T29/53217Means to simultaneously assemble multiple, independent conductors to terminal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53265Means to assemble electrical device with work-holder for assembly
DE60331243T 2002-12-06 2003-12-02 Herstellungsverfahren eines sockels zur testdurchführung integrierten schaltungen und ein solcher sockel Expired - Lifetime DE60331243D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/310,791 US6920689B2 (en) 2002-12-06 2002-12-06 Method for making a socket to perform testing on integrated circuits
PCT/US2003/038463 WO2004053976A2 (en) 2002-12-06 2003-12-02 Method of making a socket to perform testing on integrated circuits and such a socket

Publications (1)

Publication Number Publication Date
DE60331243D1 true DE60331243D1 (de) 2010-03-25

Family

ID=32468118

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60331243T Expired - Lifetime DE60331243D1 (de) 2002-12-06 2003-12-02 Herstellungsverfahren eines sockels zur testdurchführung integrierten schaltungen und ein solcher sockel

Country Status (9)

Country Link
US (3) US6920689B2 (de)
EP (1) EP1570277B1 (de)
JP (1) JP2006509215A (de)
KR (1) KR20050085387A (de)
CN (1) CN100538369C (de)
AU (1) AU2003298856A1 (de)
DE (1) DE60331243D1 (de)
TW (1) TWI362711B (de)
WO (1) WO2004053976A2 (de)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020004320A1 (en) * 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US6887723B1 (en) * 1998-12-04 2005-05-03 Formfactor, Inc. Method for processing an integrated circuit including placing dice into a carrier and testing
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
JP2001174482A (ja) * 1999-12-21 2001-06-29 Toshiba Corp 電気的特性評価用接触針、プローブ構造体、プローブカード、および電気的特性評価用接触針の製造方法
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7694246B2 (en) * 2002-06-19 2010-04-06 Formfactor, Inc. Test method for yielding a known good die
US6920689B2 (en) * 2002-12-06 2005-07-26 Formfactor, Inc. Method for making a socket to perform testing on integrated circuits
KR100443999B1 (ko) * 2003-02-28 2004-08-21 주식회사 파이컴 인쇄회로기판용 상호 접속체, 이의 제조방법 및 이를구비한 상호 접속 조립체
US7114961B2 (en) 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US8584353B2 (en) 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US7758351B2 (en) 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
US20050227510A1 (en) * 2004-04-09 2005-10-13 Brown Dirk D Small array contact with precision working range
TWI309094B (en) 2004-03-19 2009-04-21 Neoconix Inc Electrical connector in a flexible host and method for fabricating the same
US7347698B2 (en) * 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
US20060038576A1 (en) * 2004-08-19 2006-02-23 Pooya Tadayon Sort interface unit having probe capacitors
US7172431B2 (en) * 2004-08-27 2007-02-06 International Business Machines Corporation Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof
KR100963499B1 (ko) * 2005-08-09 2010-06-17 가부시키가이샤 니혼 마이크로닉스 통전 테스트용 프로브
US7172450B1 (en) * 2006-01-11 2007-02-06 Qualitau, Inc. High temperature open ended zero insertion force (ZIF) test socket
US7982290B2 (en) * 2006-01-12 2011-07-19 Palo Alto Research Center, Inc. Contact spring application to semiconductor devices
US7528618B2 (en) * 2006-05-02 2009-05-05 Formfactor, Inc. Extended probe tips
KR100817054B1 (ko) 2006-07-13 2008-03-26 삼성전자주식회사 패키지 테스트용 소켓, 테스트 소켓용 러버 및 테스트소켓용 가이드
US7731503B2 (en) * 2006-08-21 2010-06-08 Formfactor, Inc. Carbon nanotube contact structures
KR100703043B1 (ko) * 2006-09-21 2007-04-09 (주)에이펙스 검사용 프로브 기판 및 그 제조 방법
KR100816843B1 (ko) * 2006-10-31 2008-03-26 삼성전기주식회사 인쇄회로기판
US8149007B2 (en) * 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components
CN101316014B (zh) * 2007-10-17 2012-02-01 番禺得意精密电子工业有限公司 电连接装置及其组装方法
KR101004911B1 (ko) * 2008-08-12 2010-12-28 삼성전기주식회사 마이크로 전자기계적 부품 제조방법
CN101750525B (zh) * 2008-12-22 2012-07-04 京元电子股份有限公司 测试插座的制作方法及其所使用的弹性测试探针
US8272124B2 (en) * 2009-04-03 2012-09-25 Formfactor, Inc. Anchoring carbon nanotube columns
US20100252317A1 (en) * 2009-04-03 2010-10-07 Formfactor, Inc. Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
JP5333029B2 (ja) * 2009-08-10 2013-11-06 Jsr株式会社 電気接続部材および電気接続部材の製造方法
US8476538B2 (en) * 2010-03-08 2013-07-02 Formfactor, Inc. Wiring substrate with customization layers
US8215966B2 (en) * 2010-04-20 2012-07-10 Tyco Electronics Corporation Interposer connector assembly
US8274798B2 (en) * 2010-07-28 2012-09-25 Unimicron Technology Corp. Carrier substrate and method for making the same
DE102010054782A1 (de) * 2010-12-16 2012-06-21 Epcos Ag Gehäustes elektrisches Bauelement
CN102175946A (zh) * 2011-03-07 2011-09-07 世盟科信(北京)国际科技发展有限公司 用于生产测试的治具
JP5809509B2 (ja) 2011-09-29 2015-11-11 新光電気工業株式会社 スプリング端子付配線基板及びその実装構造とソケット
US8491315B1 (en) * 2011-11-29 2013-07-23 Plastronics Socket Partners, Ltd. Micro via adapter socket
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
US10788531B2 (en) * 2014-10-29 2020-09-29 Modus Test, Llc Reduced cost package device simulator, manufacturing method and method of use
DE102017107142A1 (de) * 2017-04-03 2018-10-04 Tkr Spezialwerkzeuge Gmbh Kontaktbuchse
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
US11821918B1 (en) 2020-04-24 2023-11-21 Microfabrica Inc. Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions
US11828775B1 (en) 2020-05-13 2023-11-28 Microfabrica Inc. Vertical probe arrays and improved methods for making using temporary or permanent alignment structures for setting or maintaining probe-to-probe relationships

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5974662A (en) * 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US5806181A (en) * 1993-11-16 1998-09-15 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US6085978A (en) * 1994-08-17 2000-07-11 Metrologic Instruments, Inc. Holographic laser scanners of modular construction and method and apparatus for designing and manufacturing the same
KR100394205B1 (ko) 1994-11-15 2003-08-06 폼팩터, 인크. 시험된 반도체 장치 및 시험된 반도체 장치의 제조방법
US5949246A (en) * 1997-01-28 1999-09-07 International Business Machines Test head for applying signals in a burn-in test of an integrated circuit
US6292003B1 (en) 1998-07-01 2001-09-18 Xilinx, Inc. Apparatus and method for testing chip scale package integrated circuits
US6256882B1 (en) * 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
JP4513145B2 (ja) * 1999-09-07 2010-07-28 ソニー株式会社 半導体装置の製造方法および研磨方法
US6489788B2 (en) 2000-01-20 2002-12-03 Earl Sausen Contactor assembly for common grid array devices
JP4590032B2 (ja) 2000-01-24 2010-12-01 東京エレクトロン株式会社 プローブの製造方法
DE10102649B4 (de) * 2000-03-30 2006-05-24 International Business Machines Corp. System und Verfahren für die Realisierung von Transaktionen mit Unterstützung durch ein Verzeichniszugriffs-LDAP-Protokoll
US6462575B1 (en) * 2000-08-28 2002-10-08 Micron Technology, Inc. Method and system for wafer level testing and burning-in semiconductor components
US6920689B2 (en) 2002-12-06 2005-07-26 Formfactor, Inc. Method for making a socket to perform testing on integrated circuits

Also Published As

Publication number Publication date
TW200423277A (en) 2004-11-01
WO2004053976A2 (en) 2004-06-24
US20080132095A1 (en) 2008-06-05
US6920689B2 (en) 2005-07-26
KR20050085387A (ko) 2005-08-29
AU2003298856A1 (en) 2004-06-30
CN1745307A (zh) 2006-03-08
US20050167816A1 (en) 2005-08-04
US20040107568A1 (en) 2004-06-10
AU2003298856A8 (en) 2004-06-30
JP2006509215A (ja) 2006-03-16
CN100538369C (zh) 2009-09-09
US7330039B2 (en) 2008-02-12
WO2004053976A3 (en) 2004-08-05
EP1570277A2 (de) 2005-09-07
TWI362711B (en) 2012-04-21
EP1570277B1 (de) 2010-02-10

Similar Documents

Publication Publication Date Title
DE60331243D1 (de) Herstellungsverfahren eines sockels zur testdurchführung integrierten schaltungen und ein solcher sockel
DE60121064D1 (de) Anordnung und verfahren zur zeitkalibrierung eines halbleiterscheibenprüfgeräts für integrierte schaltungen
DE602005020391D1 (de) Hochfrequenz IC Etikette und Verfahren zu deren Herstellung
DE60324376D1 (de) Halbleiterbauelement und Verfahren zu dessen Herstellung
DE60303066D1 (de) Prüfspitze für integrierte Schaltungen
DE60236470D1 (de) Halbleitersubstratvorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung
DE60200992D1 (de) "Timing"-Kalibrierung und -Verifikation von Testern für elektronische Schaltungen
DE60308993D1 (de) Sondengehäuse und verfahren zur herstellung
DE102006032925B8 (de) Elektronische Baugruppe und Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen
DE502004008318D1 (de) Speicher-schaltungsanordnung und verfahren zur herstellung
DE60238598D1 (de) Verfahren zur herstellung eines grundöls und eines gasöls
GB2394780B (en) A method of and apparatus for testing for integrated circuit contact defects
SE0302467L (sv) A method and a device for manufacturing of electrical components
DE60304780D1 (de) Substratstruktur für eine elektronische Anordnung und elektronische Anordnung
DE60238885D1 (de) Glassubstrat für Photomasken und Verfahren zur Herstellung
DE502005005273D1 (de) Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern
DE60318069D1 (de) Schaltung und verfahren zum prüfen eingebetteter dram-schaltungen durch direktzugriffsmodus
DE50309469D1 (de) Verfahren und messgerät zur ortung eingeschlossener objekte
DE60214333D1 (de) Verfahren und Schaltungsanordnung zur Kalibrierung eines Analog-Digital Wandlers
DE50114463D1 (de) Integrierte Schaltung mit Testbetriebsart und Verfahren zum Testen einer Vielzahl solcher integrierter Schaltungen
DE60323804D1 (de) Herstellungsverfahren eines Präzisions-Kondensators für eine integrierte Schaltung
DE50304589D1 (de) Testvorrichtung für bauteile integrierter schaltungen
DE602004008186D1 (de) Kontaktloses Prüfen integrierter Schaltungen
DE60303976D1 (de) Eingebettete Testschaltung für Phasenregelschleife sowie dazugehörige Verfahren und Rechnerprogramm
DE60318795D1 (de) Prüfung von integrierten Schaltungen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition