DE3463317D1 - Method of manufacturing a semiconductor device and semiconductor device manufactured by means of the method - Google Patents
Method of manufacturing a semiconductor device and semiconductor device manufactured by means of the methodInfo
- Publication number
- DE3463317D1 DE3463317D1 DE8484201019T DE3463317T DE3463317D1 DE 3463317 D1 DE3463317 D1 DE 3463317D1 DE 8484201019 T DE8484201019 T DE 8484201019T DE 3463317 T DE3463317 T DE 3463317T DE 3463317 D1 DE3463317 D1 DE 3463317D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- manufacturing
- device manufactured
- manufactured
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66946—Charge transfer devices
- H01L29/66954—Charge transfer devices with an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/911—Differential oxidation and etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/981—Utilizing varying dielectric thickness
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8302541A NL8302541A (nl) | 1983-07-15 | 1983-07-15 | Werkwijze ter vervaardiging van een halfgeleiderinrichting, en halfgeleiderinrichting vervaardigd volgens de werkwijze. |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3463317D1 true DE3463317D1 (en) | 1987-05-27 |
Family
ID=19842167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484201019T Expired DE3463317D1 (en) | 1983-07-15 | 1984-07-11 | Method of manufacturing a semiconductor device and semiconductor device manufactured by means of the method |
Country Status (7)
Country | Link |
---|---|
US (2) | US4659428A (de) |
EP (1) | EP0132009B1 (de) |
JP (1) | JPS6038874A (de) |
CA (1) | CA1216969A (de) |
DE (1) | DE3463317D1 (de) |
IE (1) | IE55653B1 (de) |
NL (1) | NL8302541A (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8302541A (nl) * | 1983-07-15 | 1985-02-01 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting, en halfgeleiderinrichting vervaardigd volgens de werkwijze. |
NL8400224A (nl) * | 1984-01-25 | 1985-08-16 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting en inrichting vervaardigd door toepassing daarvan. |
NL8402223A (nl) * | 1984-07-13 | 1986-02-03 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting en inrichting, vervaardigd door toepassing daarvan. |
FR2573919B1 (fr) * | 1984-11-06 | 1987-07-17 | Thomson Csf | Procede de fabrication de grilles pour circuit integre |
FR2610140B1 (fr) * | 1987-01-26 | 1990-04-20 | Commissariat Energie Atomique | Circuit integre cmos et procede de fabrication de ses zones d'isolation electrique |
US5067002A (en) * | 1987-01-30 | 1991-11-19 | Motorola, Inc. | Integrated circuit structures having polycrystalline electrode contacts |
US4837176A (en) * | 1987-01-30 | 1989-06-06 | Motorola Inc. | Integrated circuit structures having polycrystalline electrode contacts and process |
US5026663A (en) * | 1989-07-21 | 1991-06-25 | Motorola, Inc. | Method of fabricating a structure having self-aligned diffused junctions |
JP2726502B2 (ja) * | 1989-08-10 | 1998-03-11 | 株式会社東芝 | 半導体装置の製造方法 |
US5092957A (en) * | 1989-11-24 | 1992-03-03 | The United States Of America As Represented By The United States Department Of Energy | Carrier-lifetime-controlled selective etching process for semiconductors using photochemical etching |
US5120675A (en) * | 1990-06-01 | 1992-06-09 | Texas Instruments Incorporated | Method for forming a trench within a semiconductor layer of material |
US5240512A (en) * | 1990-06-01 | 1993-08-31 | Texas Instruments Incorporated | Method and structure for forming a trench within a semiconductor layer of material |
JPH04212472A (ja) * | 1990-07-13 | 1992-08-04 | Toshiba Corp | 不揮発性半導体記憶装置の製造方法 |
US5026665A (en) * | 1990-12-24 | 1991-06-25 | Motorola Inc. | Semiconductor device electrode method |
US5305519A (en) * | 1991-10-24 | 1994-04-26 | Kawasaki Steel Corporation | Multilevel interconnect structure and method of manufacturing the same |
US5292680A (en) * | 1993-05-07 | 1994-03-08 | United Microelectronics Corporation | Method of forming a convex charge coupled device |
US5968058A (en) * | 1996-03-27 | 1999-10-19 | Optonol Ltd. | Device for and method of implanting an intraocular implant |
US6203513B1 (en) * | 1997-11-20 | 2001-03-20 | Optonol Ltd. | Flow regulating implant, method of manufacture, and delivery device |
US8313454B2 (en) * | 1997-11-20 | 2012-11-20 | Optonol Ltd. | Fluid drainage device, delivery device, and associated methods of use and manufacture |
US6558342B1 (en) | 1999-06-02 | 2003-05-06 | Optonol Ltd. | Flow control device, introducer and method of implanting |
US6770904B2 (en) * | 2002-01-11 | 2004-08-03 | Xerox Corporation | Polythiophenes and electronic devices generated therefrom |
JP4347009B2 (ja) * | 2003-09-26 | 2009-10-21 | キヤノン株式会社 | 近接場光の発生方法、近接場露光用マスク、近接場露光方法、近接場露光装置、近接場光ヘッド |
US7862531B2 (en) * | 2004-06-25 | 2011-01-04 | Optonol Ltd. | Flow regulating implants |
US8109896B2 (en) * | 2008-02-11 | 2012-02-07 | Optonol Ltd. | Devices and methods for opening fluid passageways |
JP6667410B2 (ja) * | 2016-09-29 | 2020-03-18 | 東京エレクトロン株式会社 | ハードマスクおよびその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3767492A (en) * | 1971-10-12 | 1973-10-23 | Bell Telephone Labor Inc | Semiconductor masking |
US4053349A (en) * | 1976-02-02 | 1977-10-11 | Intel Corporation | Method for forming a narrow gap |
EP0051534B1 (de) * | 1980-10-29 | 1986-05-14 | FAIRCHILD CAMERA & INSTRUMENT CORPORATION | Selbstjustierendes Verfahren zur Herstellung integrierter Stromkreisstrukturen unter Verwendung unterschiedlicher Oxydationsraten |
NL8105559A (nl) * | 1981-12-10 | 1983-07-01 | Philips Nv | Werkwijze voor het aanbrengen van een smalle groef in een substraatgebied, in het bijzonder een halfgeleidersubstraatgebied. |
NL8202686A (nl) * | 1982-07-05 | 1984-02-01 | Philips Nv | Werkwijze ter vervaardiging van een veldeffektinrichting met geisoleerde stuurelektrode, en inrichting vervaardigd volgens de werkwijze. |
NL8302541A (nl) * | 1983-07-15 | 1985-02-01 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting, en halfgeleiderinrichting vervaardigd volgens de werkwijze. |
-
1983
- 1983-07-15 NL NL8302541A patent/NL8302541A/nl not_active Application Discontinuation
-
1984
- 1984-07-11 EP EP84201019A patent/EP0132009B1/de not_active Expired
- 1984-07-11 DE DE8484201019T patent/DE3463317D1/de not_active Expired
- 1984-07-11 CA CA000458637A patent/CA1216969A/en not_active Expired
- 1984-07-12 JP JP59143407A patent/JPS6038874A/ja active Pending
- 1984-07-12 IE IE1792/84A patent/IE55653B1/en unknown
-
1986
- 1986-03-17 US US06/840,164 patent/US4659428A/en not_active Expired - Fee Related
-
1987
- 1987-01-27 US US07/007,152 patent/US4750971A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0132009B1 (de) | 1987-04-22 |
IE841792L (en) | 1985-01-15 |
US4750971A (en) | 1988-06-14 |
IE55653B1 (en) | 1990-12-05 |
EP0132009A3 (en) | 1985-03-13 |
US4659428A (en) | 1987-04-21 |
NL8302541A (nl) | 1985-02-01 |
JPS6038874A (ja) | 1985-02-28 |
EP0132009A2 (de) | 1985-01-23 |
CA1216969A (en) | 1987-01-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |