DE19848078C2 - Arrangement of boards for the creation of light-emitting diode units - Google Patents
Arrangement of boards for the creation of light-emitting diode unitsInfo
- Publication number
- DE19848078C2 DE19848078C2 DE19848078A DE19848078A DE19848078C2 DE 19848078 C2 DE19848078 C2 DE 19848078C2 DE 19848078 A DE19848078 A DE 19848078A DE 19848078 A DE19848078 A DE 19848078A DE 19848078 C2 DE19848078 C2 DE 19848078C2
- Authority
- DE
- Germany
- Prior art keywords
- arrangement
- boards
- light
- creation
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
Die Erfindung betrifft eine Anordnung nach dem Oberbegriff des Hauptanspruches.The invention relates to an arrangement according to the preamble of the main claim.
Beleuchtungsvorrichtungen, die als Leuchtmittel Leuchtdioden verwenden, sind beispielsweise im Handel auch als LED-Scheinwerfer erhältlich (s. Völkner Hauptkatalog 97/98), Seite 251). Als Basis für einen derartigen Scheinwerfer wird eine entsprechend geformte Platine benötigt, auf der die Leuchtdioden samt zugehöriger Ansteuerungselektronik befestigt sind. Je nach Größe des Scheinwerferdurchmessers muß auch die entsprechende Platine ausgelegt sein.Lighting devices using LEDs as the light source, for example, are commercially available as LED headlamp (s. Völkner main catalog 97/98), page 251). An appropriately shaped circuit board is required as the basis for such a headlight, on which the light-emitting diodes and associated control electronics are fastened. Depending on the size of the headlight diameter, the corresponding circuit board must also be designed.
Dies erfordert gegebenenfalls eine Vielzahl eigens dafür angefertigte Platinen. Das bedeutet auch fertigungstechnisch und ökonomisch einen erheblichen Investitionsaufwand.This may require a large number of specially manufactured boards. The also means a considerable amount in terms of production technology and economics Investment.
Eine gemäß Oberbegriff des Hauptanspruches ausgebildete Platinenanordnung ist durch die EP 0 413 045 A1 bekannt geworden. Diese Platinenanordnung weist zur beliebigen Erstellung von Beleuchtungseinheiten eine Vielzahl von flächig zusammenhängenden Platinen auf, welche viereckig ausgebildet und durch Stege miteinander verbunden sind. Zur Bildung von unterschiedlich großen Beleuchtungseinheiten können sowohl einzelne Platinen, als auch mehrere Platinen aufweisende Platinengruppen aus der Platinenanordnung durch kappen der Stege herausgetrennt werden.A circuit board arrangement designed according to the preamble of the main claim is become known from EP 0 413 045 A1. This board arrangement points to any creation of lighting units a variety of flat contiguous boards, which are square and by webs are interconnected. For the formation of different sizes Lighting units can be single boards as well as multiple boards having circuit board groups from the circuit board arrangement by cutting the webs be separated out.
Der Erfindung liegt die Aufgabe zugrunde, eine Anordnung von Platinen bereitzustellen, die es ermöglicht, daraus für viele Anwendungsfälle mit Leuchtdioden für Beleuchtungszwecke unterschiedlichster Anforderung ein variantenreiches Baukastensystem zur Verfügung zu stellen, wobei jede gewünschte Beleuchtungseinheit über eine eigene Ansteuerungselektronik zur Ein- und Ausschaltung sowie zur Dimmbarkeit dieser Beleuchtungseinheit verfügt. Diese Aufgabe wird gelöst durch eine Anordnung mit den Merkmalen des Hauptanspruches.The invention has for its object an arrangement of boards To provide, which makes it possible for many applications with LEDs for lighting purposes with a wide variety of requirements To provide modular system, any desired Lighting unit via its own control electronics for input and Switching off and dimmability of this lighting unit has. This The problem is solved by an arrangement with the features of Main claim.
Im Folgenden ist die Erfindung beispielhaft beschrieben und anhand der Zeichnungen veranschaulicht. Es zeigt:The invention is described below by way of example and using the Illustrated drawings. It shows:
Fig. 1 eine Anordnung der erfindungsgemäßen Platinen; Fig. 1 shows an arrangement of the blanks according to the invention;
Fig. 2 als Einzelheit X gemäß Fig. 1 stark vergrößert eine Anordnung mit 3 Platinen; FIG. 2 as detail X according to FIG. 1 greatly enlarged an arrangement with 3 boards;
Fig. 3 eine Platine mit Leuchtdioden; Fig. 3 is a circuit board having light emitting diodes;
Fig. 4 eine Platine mit der Ansteuerungselektronik. Fig. 4 shows a circuit board with the control electronics.
Die Anordnung von Platinen 1 gemäß der Fig. 1 bis 4 weisen jeweils einen im wesentlichen vieleckigen Aufbau auf, die an ihren Übergängen jeweils Stege 2 angeordnet haben, womit sie untereinander verbunden sind. Zur Bildung von unterschiedlichen großen Gruppen für entsprechende Beleuchtungseinheiten können aus dieser Platinenanordnung nach Durchtrennen der Stege 2 entsprechende Baugruppen 3 gebildet werden. Die Erfindung bevorzugt im Beispiel Sechseckplatinen, die auf ihrer jeweiligen Seite mit wenigstens einer Leuchtdiode 4 versehen ist, und/oder einer entsprechenden Ansteuerungselektronik 5 versehen ist, womit die Beleuchtungseinheit geschaltet und/oder gedimmt werden kann.The arrangement of boards 1 according to FIGS. 1 to 4 each have an essentially polygonal structure, each of which has webs 2 at their transitions, with which they are connected to one another. To form different large groups for corresponding lighting units, corresponding assemblies 3 can be formed from this circuit board arrangement after severing the webs 2 . In the example, the invention preferably uses hexagon boards which are provided on their respective sides with at least one light-emitting diode 4 and / or with corresponding control electronics 5 , with which the lighting unit can be switched and / or dimmed.
Die Bestückung einer Platinenseite kann je nach Wunsch wahlweise mit Leuchtdioden und zugehöriger Ansteuerungselektronik, oder getrennt, d. h. Leuchtdioden auf einer Seite und Ansteuerungselektronik auf der anderen Seite bestückt sein.The assembly of one side of the board can be optionally with LEDs and associated control electronics, or separately, d. H. LEDs on one side and control electronics on the other be equipped.
Claims (1)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19848078A DE19848078C2 (en) | 1998-10-19 | 1998-10-19 | Arrangement of boards for the creation of light-emitting diode units |
CH01178/99A CH694353A5 (en) | 1998-10-19 | 1999-06-25 | Assembly of printed circuit boards for any production of light-emitting diode lighting units. |
AT0802902U AT5400U3 (en) | 1998-10-19 | 2002-04-08 | ARRANGEMENT OF BOARDS FOR ANY PRODUCTION OF LIGHT-EMITTING DIODE LIGHTING UNITS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19848078A DE19848078C2 (en) | 1998-10-19 | 1998-10-19 | Arrangement of boards for the creation of light-emitting diode units |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19848078A1 DE19848078A1 (en) | 2000-04-20 |
DE19848078C2 true DE19848078C2 (en) | 2003-08-14 |
Family
ID=7884902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19848078A Expired - Fee Related DE19848078C2 (en) | 1998-10-19 | 1998-10-19 | Arrangement of boards for the creation of light-emitting diode units |
Country Status (2)
Country | Link |
---|---|
CH (1) | CH694353A5 (en) |
DE (1) | DE19848078C2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005050254A1 (en) * | 2005-10-20 | 2007-04-26 | Dieter Leber | Multi-arrangement flexible lighting device, has light units each formed as island of unit surface area sufficient for holding electrical connections and cooling devices |
US9076940B2 (en) | 2005-01-10 | 2015-07-07 | Cree, Inc. | Solid state lighting component |
US9335006B2 (en) | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10245932B3 (en) * | 2002-09-30 | 2004-02-05 | Siemens Ag | Light-emitting diode illumination device has spaces provided between side edges of adjacent light-emitting diodes for output of emitted light |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
DE102007003809B4 (en) | 2006-09-27 | 2012-03-08 | Osram Ag | A method of manufacturing a light emitting diode array and light emitting diode array having a plurality of LED modules arranged in a chain |
US9341328B2 (en) | 2006-09-27 | 2016-05-17 | Osram Gesellschaft Mit Beschrankter Haftung | Method of producing a light emitting diode arrangement and light emitting diode arrangement |
ES1063895Y (en) * | 2006-09-28 | 2007-03-16 | Sakma Electronica Ind S A | MODULAR LIGHTING DEVICE |
US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
DE102007043862A1 (en) | 2007-09-14 | 2009-03-19 | Osram Gesellschaft mit beschränkter Haftung | Luminous chain with distributed driver circuit |
US9786811B2 (en) | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
US10842016B2 (en) | 2011-07-06 | 2020-11-17 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0413045A1 (en) * | 1989-08-17 | 1991-02-20 | Georg Schlegel GmbH & Co. | Electrical circuit board |
DE29603557U1 (en) * | 1995-05-16 | 1996-04-18 | Hewlett Packard Co | Formable array frame for an array of light-emitting diodes |
-
1998
- 1998-10-19 DE DE19848078A patent/DE19848078C2/en not_active Expired - Fee Related
-
1999
- 1999-06-25 CH CH01178/99A patent/CH694353A5/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0413045A1 (en) * | 1989-08-17 | 1991-02-20 | Georg Schlegel GmbH & Co. | Electrical circuit board |
DE29603557U1 (en) * | 1995-05-16 | 1996-04-18 | Hewlett Packard Co | Formable array frame for an array of light-emitting diodes |
Non-Patent Citations (1)
Title |
---|
VÖLKNER Hauptlatalog II, Herbst/Winter 97/98, S. 251 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9076940B2 (en) | 2005-01-10 | 2015-07-07 | Cree, Inc. | Solid state lighting component |
DE102005050254A1 (en) * | 2005-10-20 | 2007-04-26 | Dieter Leber | Multi-arrangement flexible lighting device, has light units each formed as island of unit surface area sufficient for holding electrical connections and cooling devices |
DE102005050254B4 (en) * | 2005-10-20 | 2010-02-11 | Dieter Leber | Method for producing a flexible lighting device as a multiple arrangement |
US9335006B2 (en) | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US9484329B2 (en) | 2008-10-24 | 2016-11-01 | Cree, Inc. | Light emitter array layout for color mixing |
Also Published As
Publication number | Publication date |
---|---|
DE19848078A1 (en) | 2000-04-20 |
CH694353A5 (en) | 2004-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8110 | Request for examination paragraph 44 | ||
8127 | New person/name/address of the applicant |
Owner name: INSTA ELEKTRO GMBH, 58511 LUEDENSCHEID, DE |
|
8304 | Grant after examination procedure | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |