DE102015208704A1 - Optoelectronic component - Google Patents

Abstract

The invention relates to an optoelectronic component, comprising: a housing with a carrier, the carrier having a first surface and a second surface opposite the first surface, the carrier comprising an aperture running from the first surface to the second surface wherein - an electrical connection conductor is guided through the opening, wherein the connection conductor has a mounting surface, on which a laser diode is arranged, so that the laser diode is electrically connected to the connection conductor, wherein the support comprises a ceramic.

Description

The publication DE 10 2005 036 266 A1 shows a housing for a laser diode device, a laser diode device and a method for producing a laser diode device.

The object underlying the invention can be seen to provide an optoelectronic component suitable for surface mounting.

This object is achieved by a component having the features of claim 1. Advantageous embodiments of the invention are the subject of the dependent subclaims.

In one aspect, there is provided an optoelectronic device comprising:
a housing with a carrier,
wherein the carrier has a first surface and a second surface opposite the first surface,
wherein the carrier comprises a first aperture formed extending from the first surface to the second surface,
wherein a first electrical connection conductor is guided through the opening,
wherein the first connection conductor has a mounting surface, on which a laser diode is arranged, so that the laser diode is electrically conductively connected to the connection conductor,
wherein the carrier comprises a ceramic.

It is also possible that the carrier is formed of a ceramic. In one embodiment, the ceramic is aluminum nitride or comprises aluminum nitride. For example, the first surface of the carrier and the second surface of the carrier are parallel to each other.

The aperture extends from the first surface of the carrier to the second surface of the carrier and preferably completely penetrates the carrier. Preferably, the first aperture is substantially perpendicular to the first surface and / or the second surface of the carrier.

The fact that the first connection conductor has a mounting surface which simultaneously acts as an electrical contacting of the laser diode for the laser diode causes the technical advantage, for example, that the first connection conductor can be used efficiently. Because it has a dual function: assembly function and electrical connection function. Compared with known components in which these two functions are realized separately, a production or production of the component is advantageously simplified. In addition to the electrical and mechanical contact between the laser diode and the mounting surface thermal thermal contact between the laser diode and mounting surface is usually also realized with advantage. As a result, heat that arises during operation of the laser diode can be dissipated efficiently. According to one embodiment of the component, the first electrical connecting conductor is formed electrically insulated from the carrier.

By way of example, the first connection conductor comprises a metal or is formed from a metal. According to a further embodiment, the electrical connection conductor comprises copper or is formed from copper. The connection conductor can also be coated with gold. At the same time, copper has good electrical and thermal conductivity. Thus, in particular, the technical advantage is achieved that a good electrically conductive connection and a good thermal connection to the laser diode are realized. A waste heat that arises during operation of the laser diode can be dissipated in an advantageous manner quickly. As a result, laser diodes can be used which provide a high laser power. The improved thermal behavior further increases optical output power.

According to a further embodiment, the carrier has a second opening extending from the first surface to the second surface. Preferably, the second aperture is also substantially perpendicular to the first surface and / or the second surface of the carrier. In general, a second electrical connection conductor is guided through the second opening, which is electrically conductively connected to the laser diode, for example by a bonding wire. In this case, the second connection conductor is preferably formed from a metal, particularly preferably from copper. The first connection conductor and the second connection conductor are electrically insulated from one another, so that, for example, by means of the two connection conductors, the laser diode can be subjected to an electrical voltage for operation.

For example, the housing is at least partially formed of a ceramic-copper composite. Thus, the carrier may be formed of a ceramic element, in which the metallic connecting conductors, such as copper, are embedded. Such a composite may be referred to as a DCB composite. DCB stands for "Direct Copper Bonding". Such a DCB composite can be formed from one or more layers. A layer is for example a ceramic layer, another layer is for example a copper layer. By such a DCB composite, the component can be realized, for example, in SMD construction. SMD stands for "Surface Mounting Device". Such an SMD component is a surface-mountable component.

In one embodiment, it is provided that the mounting surface runs flush with the second surface of the carrier. In other words, in this embodiment, the mounting surface and the second surface of the carrier form a plane continuous surface. As a result, for example, the technical advantage is achieved that a seamless transition between the mounting surface and the second surface is realized. The laser diode is thus arranged at the level of the second surface of the carrier. As a result, for example, a component with a lower height can be realized. The component can be built particularly flat in an advantageous manner. Thus, the component can be installed in small installation spaces.

The laser diode is arranged wholly or partially on the mounting surface. In particular, with a flush arrangement of the mounting surface and the second surface of the carrier, it is possible that the laser diode is partially disposed on the mounting surface and partially on the second surface of the carrier.

Alternatively, it is also possible that the mounting surface is formed extending above the second surface. In other words, it is possible that the mounting surface is spaced from the second surface of the carrier in the direction of its normal. For example, in this embodiment, the first connection conductor has a first mounting element which comprises the mounting surface and which projects beyond the second surface of the support.

Because the mounting surface extends above the second surface, the technical advantage, for example, that an emission height for the laser radiation of the laser diode is increased is achieved. As a result, for example, the laser radiation can radiate over a wall of the housing, without this deflecting or scattering the laser radiation. In particular, the laser diode can thereby be brought to an optimum height in order to optimally illuminate an optional deflection element or optional deflection elements, so that the laser radiation can be optimally deflected. As a result, an emission direction of the laser radiation from the component can be realized independently of an installation position of the laser diode. A deflecting element is preferably a mirror, a prism or a reflective housing wall.

According to a further embodiment, a side surface of the mounting element is flush with a side surface of the laser diode.

According to a further embodiment, the first connection conductor comprises an external connection element which extends, for example, along the first surface of the carrier. Preferably, the external connection element is in direct contact with the carrier. The external connection element preferably has an exposed contact surface, which is provided to contact the component from the outside in an electrically conductive manner. The contact surface preferably extends parallel to the second and / or the first surface of the carrier.

For example, the component with the contact surface is applied in an electrically conductive manner to another surface. The component can be mounted by soldering on another surface. The component is thus preferably formed surface mountable. This allows, for example, the external connection element with the contact surface. An SMD component advantageously allows a particularly simple assembly.

In one embodiment, it is provided that the laser diode has a laser beam exit side (laser facet). Through the laser beam exit side, the laser diode emits laser radiation during operation. The laser diode is preferably designed as an edge emitter. When laser radiation is written above and below, it means laser radiation coupled out of the laser diode. Laser radiation also refers to the laser radiation which is coupled out of the laser diode and has been reflected or deflected by one or more elements, for example a deflection element.

In another embodiment, it is provided that the laser diode has a laser beam exit side, which extends substantially perpendicular to the mounting surface. The housing preferably has a housing wall side, which faces the laser beam exit side. The housing wall usually encloses an angle between 0 ° and 90 ° with the mounting surface. The housing wall side is provided, for example, to reflect laser radiation emitted by the laser beam exit side. For example, the housing wall side is formed such that the laterally emerging from an edge emitter laser radiation, which initially runs parallel to the mounting surface and then strikes the housing wall side is deflected by means of the housing wall side to a light exit surface of the component. In this case, the housing wall side with the mounting surface preferably includes an angle of between 30 ° and 50 ° inclusive, more preferably approximately 45 °. The housing wall itself acts with advantage as an optical deflecting element for the laser radiation. The light exit surface of the component runs in this embodiment parallel to the mounting surface, wherein the light of the laser diode initially also runs parallel to the mounting surface and is then deflected by the housing wall side. A design in which the laser radiation is emitted by a light exit surface which runs parallel to the mounting surface is referred to herein as a top-looker.

An additional optical element, which reflects the laser radiation away from the mounting surface, can advantageously be dispensed with if the housing side wall performs this task. This saves costs and assembly time. The laser radiation can thereby be emitted in an embodiment upwards away from the housing.

If the housing sidewall is intended to deflect the laser radiation, for example by reflection, the housing sidewall can be provided with a specularly reflective coating at least in the region in which the laser radiation impinges. The specularly reflective coating is advantageously designed to increase the reflection of the laser radiation.

In a further embodiment, it is provided that the laser diode has a laser beam exit side, which extends substantially perpendicular to the mounting surface, wherein the housing has a side wall opposite the laser beam exit side, which runs substantially parallel to the laser beam exit side, wherein the housing side wall at least partially transmissive for the laser radiation and has in the beam path of the laser radiation disposed window. This design allows the component to emit laser radiation in the same direction as the laser diode through the laser beam exit side. Again, can be dispensed advantageously on a deflection, which saves costs and installation time. In this embodiment, the laser radiation is emitted laterally from the housing. A design in which the laser radiation is emitted from a side surface which is substantially perpendicular to the mounting surface is also called a side-looker in the present case.

In an embodiment, it is provided that an optical deflecting element is arranged in the beam path of the laser radiation of the laser diode. As a result, for example, the technical advantage causes the laser radiation can be deflected from its original direction of emission. A desired emission direction of the component can thus be set independently of a radiation direction of the laser diode. It can also be provided a plurality of optical deflection elements, which are the same or different. An optical deflection element is for example a mirror, a prism or a housing wall, for example a housing side wall. The housing side wall is preferably provided with an optical coating, for example with a specularly reflective coating. It is also possible that the deflecting element is integrated in the housing side wall.

The optical deflecting element can simply be referred to as deflecting element. For example, the deflecting element has a dielectric coating. As a result, a beam quality or a beam quality can advantageously be increased. Optical losses can be minimized or reduced. The deflecting element may have a curvature, in particular a parabolic curvature.

According to a further embodiment, the component has a seating surface on which a cap described below can be placed and positioned. The seating surface is arranged, for example, on at least one outer side wall of the housing. The Aufsitzfläche is in this case formed circumferentially around the housing. Particularly preferably, the seating surface is metallic and preferably has a nickel-containing layer on its surface. Due to the nickel-containing layer, the cap, if it is also provided on the support surfaces with a nickel-containing layer, by means of a welding processes, such as electric welding, mechanically stable and in particular tightly connected to the seating surface. The seating surface may be part of a support element integrated with the housing. The support member protrudes laterally out of the housing, for example, and the parts of the support member which protrude laterally from the housing comprise the Aufsitzfläche. For example, the support member is rod-shaped and is integrated into the housing such that it completely penetrates the housing parallel to a surface of the carrier. Furthermore, it is possible that the support element is integrated in the carrier as part of the housing.

In a further embodiment it is provided that the laser diode is arranged in a cavity of the housing. The cavity can be filled with a solid that is at least partially permeable to the laser radiation, preferably completely permeable. Preferably, the laser diode is completely embedded in the solid. The solid encapsulates the laser diode preferably and protects it from environmental influences. The laser diode is advantageously protected against environmental influences. This advantageously increases a lifetime of the laser diode.

By providing such a solid, for example, to an additional be omitted below cover. This saves material and costs. In particular, if a cover is provided, it does not necessarily take over the hermetic Abkapslung. Such a cover is thus easier to assemble.

According to a preferred embodiment, the component has a cover. The cover encapsulates the laser diode, preferably hermetically. By the term "hermetic encapsulation" is meant that dirt, such as dust and liquids, can reach the LED only to negligible proportions. In particular, hermetic encapsulation prevents the penetration of dirt into the laser facet during operation of the component.

By an encapsulating cover, for example, the technical advantage causes the laser diode is encapsulated by an environment, so that the component can be used, for example, in harsh environments. The laser diode is advantageously protected against environmental influences. This advantageously increases a lifetime of the laser diode.

For a laser diode that emits blue light, good encapsulation is particularly important because high energy portions of the laser radiation from dirt that has penetrated the device can cleave off compounds that can deposit on the laser facet, thus reducing the radiance of the device.

The cover can give the housing, for example, a visually appealing and self-contained form. According to one embodiment, the cover comprises a window through which the laser radiation can exit from the component.

The cover is particularly preferably formed metallic. Particularly preferably, the areas of the covers, which are intended to be mechanically stable connected to the housing, provided with a nickel layer to enable a welding process.

The cover may for example be formed as a cap having a cavity which is intended to receive the laser diode. In particular, a cap is suitable for use with a component having a side view configuration. For this purpose, the cap preferably comprises a window, which is arranged in a side surface of the cap.

Alternatively, it is also possible that the cap is formed as a planar cover, which is placed on the housing. For example, the plane cover comprises a metal frame in which the window is embedded.

According to one embodiment, the cover comprises a conversion element, preferably in the region of its window. It is also possible to provide a plurality of conversion elements in the component.

Preferably, the window and / or the conversion element are arranged in the beam path of the laser radiation.

In one embodiment, it is provided that the laser diode is soldered to the mounting surface. A solder connection is more thermally conductive compared to an adhesive connection, so that an improved thermal connection of the laser diode to the connection conductor can be realized. As a result, an optical output power is advantageously increased.

In a further embodiment, the laser diode is formed as a laser diode chip. According to another embodiment, the laser diode is formed as a laser diode bar.

In a further embodiment, the component comprises a plurality of laser diodes, which, as in the case of designs with only one laser diode, are arranged on corresponding mounting surfaces of connection conductors.

According to another embodiment, it is provided that a region of the housing, which is arranged at least partially permeable to laser radiation of the laser diode and in the beam path of the laser radiation, is provided with a conversion element for a wavelength conversion of the laser radiation. For example, the window is provided with the conversion element. The conversion element usually comprises a phosphor for wavelength conversion. Depending on the phosphor, light can be produced with different colors: for example, blue, red, green, yellow. It is also possible that white light is generated by means of the conversion element.

As a phosphor, for example, one of the following materials is suitable: rare-earth-doped garnets, rare-earth-doped alkaline earth sulfides, rare-earth-doped thiogallates, rare-earth-doped aluminates, rare-earth-doped silicates, rare-earth-doped orthosilicates, rare earth-doped ones Chlorosilicates, rare earth doped alkaline earth silicon nitrides, rare earth doped oxynitrides, rare earth doped aluminum oxynitrides, rare ones Earth doped silicon nitrides, rare earth doped sialons.

If the component comprises a plurality of laser diodes, a separate conversion element can be arranged in the respective beam path of each laser diode. The conversion elements may differ in terms of their conversion properties. For example, the individual conversion elements comprise different phosphors, so that red, green and blue light can be generated. For example, according to one embodiment, an RGBY module may be formed. RGBY stands for "Red, Green, Blue and Yellow", ie "Red, Green, Blue and Yellow". Such a module comprises, for example, the component comprising the housing with a plurality of conversion elements.

The above-described characteristics, features, and advantages of this invention, as well as the manner in which they are achieved, will become clearer and more clearly understood in connection with the following description of the embodiments which will be described in connection with the drawings

1 and 2 each a schematic sectional view of an optoelectronic component according to an embodiment,

3 the component according to 1 and 2 in a schematic plan view,

4 FIG. 2 a schematic sectional view of an optoelectronic component according to a further exemplary embodiment, FIG.

5 the component according to 4 in a schematic plan view,

6 to 9 in each case a schematic sectional illustration of an optoelectronic component according to a respective further exemplary embodiment,

10 and 11 two schematic views of an optoelectronic component according to a further exemplary embodiment,

12 and 13 each a further embodiment of an optoelectronic device in two views,

14 and 15 in each case a schematic sectional representation of an optoelectronic component according to a respective further exemplary embodiment, and

16 to 18 schematic representations of a cover according to one embodiment
demonstrate.

Hereinafter, like reference numerals may be used for like features. For the sake of clarity, it can be provided that not all drawings have all reference numbers.

1 shows an optoelectronic component 101 ,

The component 101 includes a housing 103 comprising a carrier 105 , The carrier 105 has a first surface 107 and a second surface 109 on. The first surface 107 lies opposite the second surface 109 and runs parallel to this.

Furthermore, the wearer points 105 a first breakthrough 111 up, from the first surface 107 to the second surface 109 is formed running. In the first breakthrough 111 is a first electrical connection conductor 115 guided. Here is the first electrical connection conductor 115 electrically isolated from the carrier 105 arranged.

Furthermore, the carrier comprises 105 a second breakthrough 113 also from the first surface 107 to the second surface 109 is formed running. Also in the second breakthrough 113 is a second connection conductor 117 guided. The second electrical connection conductor 117 is also electrically isolated from the carrier 105 ,

The electrical connection conductor 115 has a mounting element with a mounting surface 119 on, parallel to the second surface 109 runs. The mounting surface 119 runs above the second surface 109 , On the mounting surface 119 is a laser diode 121 arranged. Here is the laser diode 121 electrically with the connecting conductor 115 connected.

There are two bonding wires 123 provided that the laser diode 121 with the second electrical connection conductor 117 connect electrically conductive. As a result, an electrical contacting of the laser diode is advantageously 121 causes.

The carrier 105 is formed of or includes a ceramic. The two electrical connection conductors 115 and 117 are preferably formed of copper and in particular of gold-coated copper.

The laser diode 121 is designed as an edge emitter and has a laser exit side 125 on, by which laser radiation 117 exit. That means that the laser diode 121 from their laser exit side 125 laser radiation 127 emitted. The laser exit side 125 runs perpendicular to the mounting surface 119 , The term "vertical" also angle deviations of ± 3 ° are included to include possible manufacturing tolerances with.

The laser radiation 127 meets a housing side wall 129 , because the housing side wall 129 is in the beam path of the laser radiation 127 arranged. The housing side wall 129 is at an angle between 0 ° and 90 ° of the laser exit side 125 arranged opposite. The angle is greater than 0 ° and less than 90 °. As a result, the technical advantage causes the housing side wall in an advantageous manner 129 the laser radiation 127 away from the mounting surface 119 reflected. In particular, the laser radiation is referred to the top of the paper plane of the 1 reflected away. The housing side wall 129 is provided in an embodiment not shown with an optical coating, for example with a dielectric coating. As a result, a reflectance can advantageously be increased and a beam quality can be improved.

The housing side wall 129 arranged opposite is another housing side wall 131 intended. This can, like the 1 also shows at an angle to the laser exit side 125 be arranged. The two side walls of the housing 129 . 131 are integral with the carrier 105 formed and thus also include a ceramic or are formed from such. Alternatively, it is also possible that the housing side walls are covered by a separate reflector element, which is placed on the support.

Through the two side walls of the housing 129 and 131 is a cavity 137 limited, in which the laser diode 121 is arranged.

Furthermore, the housing comprises 103 a cover 133 , which is placed from above on the housing and the cavity 137 hermetically sealed. Thus, a hermetic seal of the laser diode 121 causes an environment. As a result, the laser diode is advantageously 121 protected from external environmental conditions. The cover 133 has a window 135 on, through which the of the housing side wall 129 reflected laser radiation 127 from the cavity 137 So from the case 103 So, so from the component 101 , can escape. This window 135 is here in 1 not shown in detail. In the design according to the 1 it is a top-looker.

2 shows again the component 101 of the 1 with less reference.

3 shows the component 101 of the 1 respectively 2 in a top view. 4 shows a further optoelectronic component 201 in a side view. 5 shows the component 201 according to 4 in a top view.

In contrast to the component according to the embodiment of 1 and 2 indicates the component 201 according to the embodiment of the 4 no housing side wall 129 on that inclined according to the 1 and 2 to the laser exit side 125 is arranged. Rather, the component has 201 a housing sidewall 129 on, which is essentially perpendicular to the mounting surface 119 runs and in the beam path of the laser radiation 127 is arranged. That means that the housing side wall 129 essentially parallel to the laser beam exit side 125 runs. In the housing side wall 129 is a window 135 provided in the beam path of the laser radiation 127 is arranged and is at least partially transparent to the laser radiation. That means that in the component 201 the laser radiation 127 is not radiated up, but to the side. This design is a side-looker. The window 135 is in 4 not shown in detail.

Furthermore, the housing comprises a Aufsitzfläche 205 , which protrudes laterally beyond the housing. On the seating surface 205 a cap can be placed, which is not shown in the figure. Preferably, the cap and the Aufsitzfläche 205 metallically formed with a nickel surface, so that the cap can be welded to the housing.

The seating surface 205 is in the present embodiment part of a support member which is integrated into the housing and this duchdringt completely.

In the plan views of 3 and 5 are the breakthroughs to recognize, for electrical contacting of the laser diode 121 are provided. With the reference number 207 are rear contact surfaces of the electrical connection conductor 115 and 117 characterized. These rear contact surfaces 207 are not really visible in a plan view. Nevertheless, they are shown in the plan views for the sake of clarity.

6 shows a further embodiment of an optoelectronic device 301 ,

The component 301 is essentially analogous to the component 101 of the 1 educated. Again, the housing side walls 129 and 131 at an angle to the laser beam exit side 125 arranged. However, the mounting surface runs 119 not above the second surface 109 but flush with the second surface 109 , Due to its size, the laser diode is 121 through this flush on both the mounting surface 119 as well as in one Area of the second surface 109 arranged. For clarity, in 6 the bonding wires 123 Not shown.

7 shows a further optoelectronic component 401 ,

The component 401 is essentially analogous to the component 301 of the 6 educated. However, the component points 401 no cover 133 on. Rather, the cavity 137 with a solid 403 at least partially filled. This solid 403 is at least partially transparent to the laser radiation, preferably completely permeable, and encapsulates the laser diode 121 hermetically from an environment. The solid 403 is preferably formed of a hermetic substance which generates heat during operation of the laser diode 121 arises, can dissipate.

8th shows another opto-electronic component 501 ,

The component 501 is essentially analogous to the component 401 of the 7 educated. However, as a difference, the housing side wall was 129 removed, for example by removing material. That is, in the corresponding area of the solid 403 was exposed. Accordingly, in this area is now a surface of the solid 403 according to the course of the housing side wall 129 educated. Therefore, the reference number shows 129 with a dashed reference line on this surface of the solid 403 , It is thus an interface transition between the material of the solid 403 and the environment formed. Here, the angle and the respective refractive indices are coordinated so that the laser radiation 127 is totally reflected on this interface, so at the interface transition. Even so, the laser radiation 127 away from the mounting surface 119 reflected.

9 shows an optoelectronic component 601 ,

The component 601 is essentially analogous to the component 201 of the 4 educated. As a difference is analogous to the 6 to 8th the mounting surface 119 flush with the second surface 109 educated. Analogous to the component 201 of the 4 occurs here, too, the laser radiation 127 to the side of the housing 103 out. This becomes analogous to the component 201 of the 4 realized. As a difference to the component 201 of the 4 runs the other housing side wall 131 not parallel to the laser beam exit side 125 but analogous to the 1 . 6 to 8th , at an acute angle.

10 and 11 show an opto-electronic component 701 according to a further embodiment. 10 shows a corresponding plan view. 11 shows a corresponding side view. The component 701 includes two laser diodes 121 at least partially opposite each other in the housing 103 on a common carrier 105 are arranged. The carrier 105 has a housing intermediate wall 705 on, the two angled surfaces 707 having. Left and right of the housing partition wall 705 are the two laser diodes 121 arranged. The laser diodes 121 are formed as edge emitters and emit their laser radiation in the direction of the surfaces 707 the housing intermediate wall. Here are the surfaces 707 analogous to the housing side wall 129 at an acute angle to the laser beam exit side 125 arranged so that the laser radiation 127 away from the mounting surface 119 is reflected. With the reference number 703 is symbolically an exit field of the reflected laser radiation 127 characterized by a light exit surface of the component. The housing intermediate wall 705 is integral with the carrier 105 formed and thus also includes a ceramic or is formed from such. In particular, the housing intermediate wall 705 be formed of a ceramic-copper composite.

For clarity, not all are already in the 1 features shown in the 10 and 11 shown. For example, the electrical connection conductors 115 . 117 Not shown.

12 shows a plan view of another optoelectronic device 801 ,

This shows 12 a plan view of the component 801 with attached cover 133 , The reference numerals 803 . 805 . 807 and 809 respectively denote a conversion element, which can convert laser radiation into electromagnetic radiation with a different wavelength than the laser wavelength. This allows the component 801 emit other wavelengths than the laser wavelengths of the individual laser diodes, which are not shown in detail here.

For example, the conversion element converts 803 the laser radiation in red light. The conversion element 805 For example, it converts the laser radiation into yellow light. The conversion element 807 For example, converts the laser radiation into blue light. The conversion element 809 for example, converts the laser radiation into green light. Here, the laser wavelengths are matched to the individual conversion elements 803 . 805 . 807 and 809 in order to achieve an optimal degree of conversion. These four conversion elements 803 . 805 . 807 and 809 are considered areas in the cover 133 formed in the respective beam path of the laser diodes of the component 801 are arranged. That means that the component 801 has four laser diodes on a common carrier 105 are arranged and due to a reflection on corresponding housing side walls and / or housing intermediate walls laser radiation upwards to the cover 133 and thus to the conversion elements 803 . 805 . 807 and 809 emitted.

13 shows the component 801 without laser diodes 121 ,

By using the conversion elements 803 . 805 . 807 and 809 is advantageously created a so-called RGBY module. That means that the component 801 can emit red, yellow, blue and green light.

14 shows an optoelectronic component 901 which is identical to the component 301 of the 6 is formed, wherein the sake of clarity, no reference numerals are shown.

15 shows a further optoelectronic component 901 ,

The component 901 is analogous to the component 301 of the 6 educated. As a difference, the housing side wall 129 not formed in a straight line. Rather, the housing side wall 129 a curvature, for example a parabolic curvature. This also allows the laser radiation 127 away from the mounting surface 119 be reflected. In particular, with a corresponding arrangement of the curved housing side wall 129 to the laser beam exit side 125 and corresponding radius of curvature, the laser radiation 127 be reflected substantially parallel.

16 to 18 each show a cover 133 according to one embodiment.

The cover 133 according to the embodiment of the 16 is designed as a cap, the more cap surface elements 1001 on, which are arranged to a cube or a cuboid at an angle to each other. One of these cap surface elements 1001 shows the window 135 on. These cap surface elements 1001 thus form housing walls, in particular housing side walls. The cap 133 of the 16 for example, on the seating surfaces 205 of the component 201 mounted and along the Aufsitzfläche 205 mechanically stable and preferably hermetically sealed to the housing by means of a welding process. The welding process can be electrowelding.

The cover 133 according to the embodiment of the 17 is designed as a plane cover. The plane cover includes a metal frame in which a window 135 is embedded. The cover 133 of the 17 for example, as a cover for the component 101 or 301 used. In one of these components, the planar cover is placed on the housing and welded along the frame, so that a mechanically stable connection is formed, which is preferably hermetically sealed.

The cover 133 of the 18 has only two angularly arranged to each other cap surface elements 1001 on, wherein one of the cap surface elements 1001 a window 135 having. This cap element 133 of the 18 for example, as a cover for the component 201 or 601 used. In contrast to the covers according to the embodiments of the 16 and 17 Here, the welding process for the connection between the housing and cover does not take place in a single plane, but along the edges of the cover in two planes.

The invention thus has the following advantages in particular in its corresponding embodiments:
An improved thermal behavior, so that more power loss can be derived or that an optical output power can be increased. In particular, a better thermal behavior is effected, since a smaller thermal contact resistance arises. By means of the closure technique according to the invention by means of the covers, time and costs can be saved in the assembly process, since it is possible to work in the ingot or panel composite. In particular, a beam deflection can be integrated by a mirrored surface in the housing itself, so that the beam deflection must not be supplemented as a separate component. Thus, a desired emission direction can be achieved perpendicular to the mounting surface and it does not necessarily resort to an additional deflection optics. The package form is in particular scalable and can be manufactured and offered, for example, in a 2 by 2 configuration. By integrating different conversion elements or surfaces, it is possible in particular to create a compact RGBY module which has a much higher luminance than known LED variants.

Especially with multiple laser diodes in the housing thermal crosstalk can be prevented. This is achieved in particular by the use of copper, in particular gold-coated copper, for the connection conductor and / or achieved a carrier of a ceramic-copper composite.

While the invention has been further illustrated and described in detail by the preferred embodiments, the invention is not limited by the disclosed examples, and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention.

LIST OF REFERENCE NUMBERS

101, 201, 301, 401, 501, 601, 701, 801, 901

opto-electronic component

103

casing

105

carrier

107

first surface

109

second surface

111

breakthrough

113

another breakthrough

115

electrical connection conductor

117

further electrical connection conductor

119

mounting surface

121

laser diode

123

bonding wire

125

Laser beam exit side

127

laser radiation

129

Housing sidewall

131

additional housing side wall

133

cover

135

window

137

cavity

205

seating surface

207

rear contact surface

403

solid

703

Output field of the laser radiation

705

Housing partition

707

Surfaces of the housing intermediate wall

 803, 805, 807, 809

conversion element

1001

Cap surface element

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102005036266 A1 [0001]

Claims (14)

Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ), comprising: - a housing ( 103 ) with a carrier ( 105 ), - the carrier ( 105 ) a first surface ( 107 ) and one of the first surfaces ( 107 ) opposite second surface ( 109 ), wherein the carrier ( 105 ) a first breakthrough ( 111 ) extending from the first surface ( 107 ) to the second surface ( 109 ) is formed, - whereby by the first breakthrough ( 111 ) a first electrical connection conductor ( 115 ), - wherein the first connection conductor ( 115 ) a mounting surface ( 119 ), on which a laser diode ( 121 ) is arranged so that the laser diode ( 121 ) electrically conductive with the first connection conductor ( 115 ), the carrier ( 105 ) comprises a ceramic. Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ) according to claim 1, wherein the mounting surface ( 119 ) flush with the second surface ( 109 ) is formed running. Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ) according to claim 1, wherein the mounting surface ( 119 ) spaced from the second surface ( 109 ) is arranged. Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ) according to one of the preceding claims, wherein the carrier ( 105 ) a second breakthrough ( 113 ) extending from the first surface ( 107 ) to the second surface ( 109 ) is formed, wherein by the second breakthrough ( 113 ) a second electrical connection conductor ( 117 ), which is connected to the laser diode ( 121 ) is electrically connected. Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ) according to one of the preceding claims, wherein - the laser diode ( 121 ) a laser beam exit side ( 125 ), which is substantially perpendicular to the mounting surface ( 119 ), - a housing wall side of the housing ( 103 ) of the laser beam exit side ( 125 ), and - laser radiation coming from the laser beam exit side ( 125 ) is emitted during operation and parallel to the mounting surface ( 119 ), is deflected by the housing wall side to a light exit surface of the component. Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ) according to one of claims 1 to 4, wherein the laser diode ( 121 ) a laser beam exit side ( 125 ), which is substantially perpendicular to the mounting surface ( 119 ), wherein the housing ( 103 ) one of the laser beam exit side ( 125 ) opposite housing side wall ( 129 ) substantially parallel to the laser beam exit side ( 125 ), wherein the housing side wall ( 129 ) one for the laser radiation ( 127 ) at least partially permeable and in the beam path of the laser radiation ( 127 ) window ( 135 ) having. Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ) according to one of the preceding claims, wherein a portion of the housing ( 103 ), which at least partially transmissive to laser radiation ( 127 ) of the laser diode ( 121 ) and in the beam path of the laser radiation ( 127 ) is arranged, with a conversion element ( 803 . 805 . 807 . 809 ) for a wavelength conversion of the laser radiation ( 127 ) is provided. Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ) according to one of the preceding claims, wherein in the beam path of the laser radiation ( 127 ) of the laser diode ( 121 ) An optical deflecting element is arranged. Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ) according to one of the preceding claims, wherein the laser diode ( 121 ) in a cavity ( 137 ) of the housing ( 103 ) arranged with one for the laser radiation ( 127 ) at least partially permeable and the laser diode ( 121 encapsulating solids ( 403 ) is at least partially filled. Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ) according to one of the preceding claims, wherein the electrical connection conductor ( 115 ) Copper, in particular gold-coated copper. Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ) according to one of the preceding claims, wherein the carrier ( 105 ) is formed of a ceramic-copper composite. Optoelectronic component ( 101 . 201 . 301 . 401 . 501 . 601 . 701 . 801 . 901 ) according to one of the preceding claims, wherein the housing ( 103 ) a the laser diode ( 121 ) encapsulating cover ( 133 ). Optoelectronic component according to the preceding claim, in which the housing ( 103 ) a seating surface ( 205 ) on which the cover ( 133 ), wherein the seating surface ( 205 ) and the cover ( 133 ) are mechanically stable connected. Optoelectronic component according to the preceding claim, in which the seating surface ( 205 ) Is part of a support element that fits into the housing ( 103 ) is integrated and laterally from the housing ( 103 ) protrudes, with the parts of the support element coming out of the housing ( 103 ) protrude, the Aufsitzfläche ( 205 ).

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