CN1417868A - Multiple-chip package structure of LED chip - Google Patents
Multiple-chip package structure of LED chip Download PDFInfo
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- CN1417868A CN1417868A CN01131389A CN01131389A CN1417868A CN 1417868 A CN1417868 A CN 1417868A CN 01131389 A CN01131389 A CN 01131389A CN 01131389 A CN01131389 A CN 01131389A CN 1417868 A CN1417868 A CN 1417868A
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- light
- emitting diode
- flat bottom
- backlight unit
- diode chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The multi-chip package structure is one with several LED chips configured in printed circuit board and glued. The printed circuit board has in one side several flat-bottom notches with conductive layer and one conductor plug penetrating the printed circuit board and in the other side one heat conducting layer connected to the conductor plug. Several LED chips are configured onto the flat bottom of the notch and glued. The said package structure has high integration degree and improved heat dissipation.
Description
Technical field
The invention relates to a kind of encapsulation of light-emitting diode chip for backlight unit, and particularly relevant for a kind of multichip packaging structure that light-emitting diode chip for backlight unit is disposed on the printed circuit board (PCB) with flat bottom surface and concave cups.
Background technology
All active development photoelectric material industry of each advanced country of the world at present, especially the manufacturing technology of the high-level chip in upstream is maked rapid progress especially, and because light-emitting diode has very long useful life and lower power consumption power, therefore the application of light-emitting diode is just tending to generalize, for example the application of the electronic board of large-scale demonstration, traffic lights, directing light of automobile and illumination aspect etc.Present light-emitting diode industry strides forward towards the target of high brightness, low light loss, so that light-emitting diode is enough to replace traditional illumination measures.Yet, to improve at present light-emitting diode brightness, reduce its light loss, except from the architecture advances of light-emitting diode own, the packaged type of light-emitting diode chip for backlight unit influences the key of its luminosity, the luminous uniformity and component life especially.Wherein, the multicore sheet of the light-emitting diode chip for backlight unit encapsulation practice can make brightness, the color of encapsulation back light-emitting diode that more variation be arranged by many light-emitting diode chip for backlight unit.But because the performance on the heat dissipation problem after luminous efficiency, encapsulation integrated level and the encapsulation of the multichip packaging structure of general light-emitting diode still remains to be broken through, so the multichip packaging structure of light-emitting diode chip for backlight unit still can't be popularized in the application aspect the highlight illumination that generally needs.
At first please refer to Fig. 1, be the schematic diagram of the multichip packaging structure of known light-emitting diode chip for backlight unit.Known multichip packaging structure is disposed at a plurality of light-emitting diode chip for backlight unit 102 on the printed circuit board (PCB) 100 on plane and encapsulates.Wherein, have electrode 104a and metal level 104b on the printed circuit board (PCB) 100, and all have an output 106 on each light-emitting diode chip for backlight unit 102 corresponding to each light-emitting diode chip for backlight unit 102.A plurality of light-emitting diode chip for backlight unit 102 directly are disposed on the metal level 104b in a mode of glue coupling, again by output 106 couplings of bonding wire 108 each electrode 104a and each light-emitting diode chip for backlight unit.At last, with colloid 110 a plurality of light-emitting diode chip for backlight unit 102, electrode 104a and metal level 104b are fixed on the printed circuit board (PCB) 100 again, promptly finish the multicore sheet encapsulation of light-emitting diode chip for backlight unit 102.
Have good encapsulation integrated level though a plurality of light-emitting diode chip for backlight unit 102 are disposed at the mode of the printed circuit board (PCB) 100 on plane, the brightness of light-emitting diode chip for backlight unit 102 after encapsulation is bad, the effect of mixed light also relatively poor (structure that does not have optically focused).Therefore, proposition following manner solution multicore sheet is encapsulated in the problem on brightness and the mixed light.
Then please refer to Fig. 2, be the schematic diagram of the multichip packaging structure of known another kind of light-emitting diode chip for backlight unit.Light-emitting diode chip for backlight unit 202 is disposed on the printed circuit board (PCB) 200 with a plurality of cup-shaped bases 212 encapsulates.Have a plurality of electrodes 204 on the printed circuit board (PCB) 200 corresponding to cup-shaped base 212, all have metal level 203 on the surface of each cup-shaped base 212 in order to disposing a light-emitting diode chip for backlight unit 202, and have two output 206a and 206b on the light-emitting diode chip for backlight unit 202.Wherein, be coupled with bonding wire 208 between electrode 204 and the output 206b, and metal level 203 is directly put the glue coupling with output 206a.With colloid 210 a plurality of light-emitting diode chip for backlight unit 202, metal level 203 and electrode 204 are fixed on the printed circuit board (PCB) 200 more at last, promptly finish the encapsulation of light-emitting diode chip for backlight unit 202 multicore sheets.
The multicore sheet encapsulation of above-mentioned light-emitting diode chip for backlight unit, though the profile of the cup-shaped base 212 on the printed circuit board (PCB) 200 and on metal level 203 have optically focused, increase the effect of brightness, but be a curved profile also because of cup-shaped base 212, make a cup-shaped base 212 can't dispose a plurality of light-emitting diode chip for backlight unit 202 simultaneously, must adopt the mode of a light-emitting diode chip for backlight unit 202 corresponding cup-shaped bases 212 to dispose, so just reduce the integrated level of encapsulation.
And when point glue directly is coupled between the output 206a of light-emitting diode chip for backlight unit 202 bottoms and metal level 203, light-emitting diode chip for backlight unit 202 can't be stable the bottom that is positioned over cup-shaped base 212, cause in the follow-up bonding wire process, stress concentrates on the corner of light-emitting diode chip for backlight unit 202, causes light-emitting diode chip for backlight unit 202 fractures (crack) and the qualification rate (yield) of influence encapsulation.In addition, at each light-emitting diode chip for backlight unit after 202 luminous a period of times, because electricresistance effect, each light-emitting diode chip for backlight unit 202 can produce heat energy gradually, and in the output 206a and metal level 203 direct couplings place of each light-emitting diode chip for backlight unit 202 bottoms, the phenomenon of (peeling) can appear peeling off because the heat radiation approach of light-emitting diode chip for backlight unit 202 is bad.
In sum, the encapsulating structure of known employing planar printed circuit board is bad in the performance of brightness and mixed light, problem such as adopt the encapsulating structure of the printed circuit board (PCB) with cup-shaped base then to have the difficult control of qualification rate, the encapsulation integrated level reduces with heat radiation is bad.
Summary of the invention
Therefore, purpose of the present invention can effectively be improved qualification rate, the raising encapsulation integrated level of encapsulation at the multichip packaging structure that proposes a kind of light-emitting diode chip for backlight unit, and can effectively improve the heat dissipation problem after the encapsulation.
For reaching above-mentioned purpose of the present invention, a kind of multichip packaging structure of light-emitting diode chip for backlight unit is proposed, be that a plurality of light-emitting diode chip for backlight unit are disposed in the printed circuit board (PCB), with colloid light-emitting diode chip for backlight unit is fixed on the printed circuit board (PCB) again.Wherein, the one side of printed circuit board (PCB) has a plurality of flat bottom surface and concave cups, the bottom of flat bottom surface and concave cups is a plane, has a conductor layer on the flat bottom surface and concave cups, and below, the bottom of flat bottom surface and concave cups also has a conductor connector and runs through printed circuit board (PCB), and the another side of printed circuit board (PCB) then has a heat-conducting layer and is connected with the conductor connector.A plurality of light-emitting diode chip for backlight unit are disposed on the planar base of a flat bottom surface and concave cups, and a plurality of light-emitting diode chip for backlight unit are fixed in the flat bottom surface and concave cups with colloid.Structure after the encapsulation can effectively improve the integrated level of encapsulation, and can effectively improve the heat dissipation problem after the encapsulation.
Description of drawings
Fig. 1 is the schematic diagram of the multichip packaging structure of known light-emitting diode chip for backlight unit;
Fig. 2 is the schematic diagram of the multichip packaging structure of known light-emitting diode chip for backlight unit;
Fig. 3 is the schematic diagram according to the multichip packaging structure of first embodiment of the invention light-emitting diode chip for backlight unit;
Fig. 4 is for being disposed at light-emitting diode chip for backlight unit according to first embodiment of the invention the encapsulation schematic diagram of the printed circuit board (PCB) with flat bottom surface and concave cups;
Fig. 5 is the schematic diagram according to the multichip packaging structure of second embodiment of the invention light-emitting diode chip for backlight unit; And
Fig. 6 is for being disposed at light-emitting diode chip for backlight unit according to second embodiment of the invention the encapsulation schematic diagram of the printed circuit board (PCB) with flat bottom surface and concave cups.
Description of reference numerals:
100: printed circuit board (PCB) 102: light-emitting diode chip for backlight unit
104a: electrode 104b: metal level
106: output 108: bonding wire
110: colloid 200: printed circuit board (PCB)
202: light-emitting diode chip for backlight unit 203: metal level
204: electrode 206a, 206b: output
208: bonding wire 210: colloid
300: printed circuit board (PCB) 302: light-emitting diode chip for backlight unit
304: flat bottom surface and concave cups 305: planar base
306: conductor layer 308: the conductor connector
310: heat-conducting layer 312: output
314: electrode 316: bonding wire
318: colloid 320: control chip
Embodiment first embodiment
Please refer to Fig. 3, be schematic diagram according to the multichip packaging structure of first embodiment of the invention light-emitting diode chip for backlight unit.Printed circuit board (PCB) 300 fronts for example have a flat bottom surface and concave cups 304 and at least one electrode 314.Wherein, flat bottom surface and concave cups 304 surfaces in printed circuit board (PCB) 300 fronts have a conductor layer 306, and the back side of printed circuit board (PCB) 300 has a heat-conducting layer 310.In addition, flat bottom surface and concave cups 304 bottoms belows has a conductor connector 308 that runs through printed circuit board (PCB) 300, in order to bonding conductor layer 306 and heat-conducting layer 310.
Please refer to Fig. 3 equally, the surface of the flat bottom surface and concave cups 304 on the printed circuit board (PCB) 300 has conductor layer 306, it for example is copper metal layer, arc profile and the conductor layer on it 306 by flat bottom surface and concave cups 304 sides, the light that light-emitting diode chip for backlight unit 302 is radiated penetrates outside the flat bottom surface and concave cups 304 through repeatedly reflecting in flat bottom surface and concave cups 304, make the light that penetrates flat bottom surface and concave cups 304 have same direction, so the curved profile of flat bottom surface and concave cups 304 sides have the function of optically focused.In addition, because known light-emitting diode is positioned on the curved bottom of cup-shaped base, have the shortcoming that in follow-up bonding wire process, causes the light-emitting diode chip for backlight unit fracture, the present invention is a plane with the bottom design of flat bottom surface and concave cups 304, so, light-emitting diode chip for backlight unit 302 does not just have the risk of fracture in follow-up bonding wire process, make element have good reliability (reliability).And among the present invention 304 structure example of the flat bottom surface and concave cups on the printed circuit board (PCB) 300 as making by the mechanical type processing and manufacturing or in the mode of radium-shine boring.And can produce the flat bottom surface and concave cups 304 of different depth, size by the mechanical type processing and manufacturing or the mode of radium-shine boring, and the flat bottom surface and concave cups of making 304 is very consistent dimensionally.The present invention can be by the mechanical type processing and manufacturing or the mode of radium-shine boring, and control forms the degree of depth and size of flat bottom surface and concave cups 304, to adjust the focal length and the luminous flux density of flat bottom surface and concave cups 304.
Please refer to Fig. 3 equally, below the planar base 305 of flat bottom surface and concave cups 304, has a conductor connector 308 that runs through printed circuit board (PCB) 300, this conductor connector 308 has function that thermal conductance is gone out, the mode that conductor connector 308 forms is for example after the mode of mechanical type processing and manufacturing or radium-shine boring forms flat bottom surface and concave cups 304, form a through hole (through hole) that runs through printed circuit board (PCB) 300 in flat bottom surface and concave cups 304 bottom center or appropriate location, again conductor material is inserted and formed conductor connector 308 in the through hole, and the diameter of formation through hole for example is between the 0.05mm to 0.4mm.Because conductor connector 308 runs through printed circuit board (PCB) 300, so conductor connector 308 also has the effect identical with rivet except having function that thermal conductance is gone out.Conductor connector 308 is connected with the conductor layer 306 on flat bottom surface and concave cups 304 surfaces as rivet, makes conductor layer 306 can not be heated and peels off.In addition, has a heat-conducting layer 310 at the back side of printed circuit board (PCB) 300, the material of heat-conducting layer 310 is the material with heat and electric good conductive properties, it for example is the copper metal, and heat-conducting layer 310 have in printed circuit board (PCB) 300 back sides one in order to the heat radiation than large tracts of land, the heat energy that light-emitting diode chip for backlight unit 302 is discharged leaves as soon as possible.
Printed circuit board (PCB) 300 fronts have flat bottom surface and concave cups 304, and the surface of flat bottom surface and concave cups 304 has conductor layer 306, and printed circuit board (PCB) 300 back sides have heat-conducting layer 310, and link to each other with the conductor connector 308 that runs through printed circuit board (PCB) 300 between conductor layer 306 and the heat-conducting layer 310.The structure of above-mentioned printed circuit board (PCB) 300 has good electrical conductivity and heat conduction approach, therefore can improve the qualification rate after light-emitting diode chip for backlight unit 302 encapsulates.
Then please refer to Fig. 4, for a plurality of light-emitting diode chip for backlight unit being disposed at the encapsulation schematic diagram of printed circuit board (PCB) according to first embodiment of the invention with flat bottom surface and concave cups.The multicore sheet encapsulation of the light-emitting diode chip for backlight unit among the present invention, be that a plurality of light-emitting diode chip for backlight unit 302 are positioned on the planar base 305 of a flat bottom surface and concave cups 304, and for example be that elargol is connected light-emitting diode chip for backlight unit 302 with the planar base 305 of flat bottom surface and concave cups 304 by colloid.A plurality of light-emitting diode chip for backlight unit 302 are disposed at after the planar base 305 of flat bottom surface and concave cups 304, by output 312 on bonding wire 316 each light-emitting diode chip for backlight unit 302 of coupling and the electrode 314 on the printed circuit board (PCB) 300, the mode of coupling is for example with wire bonder, be first solder joint, second solder joint with output 312, electrode 314 respectively, the mode that is aided with ultrasonic vibrations with bonding wire 316 pressure weldings on output 312 and electrode 314.Last step of carrying out sealing again is fixed in light-emitting diode chip for backlight unit 302 on the planar base 305 of flat bottom surface and concave cups 304 with colloid 318.
Please refer to Fig. 4 equally, a plurality of light-emitting diode chip for backlight unit 302 for example are a red light emitting diodes chip, a green LED chip and a blue led chips totally three chips, and utilize at heat-conducting layer 310 configurations one control chip 320 with the electric current of control flows, to reach different color demonstrations through three chips.Yet the selection of a plurality of light-emitting diode chip for backlight unit 302 can optionally and to some extent change, and for example is totally four other combinations such as chip of a red light emitting diodes chip, a green LED chip and two blue led chips.A plurality of light-emitting diode chip for backlight unit 302 carry out earlier just penetrating behind the mixed light in flat bottom surface and concave cups 306 and have very good homogeneous, and can dispose the light-emitting diode chip for backlight unit 302 of different numbers or different size on the same flat bottom surface and concave cups 306, for the design of light-emitting diode chip for backlight unit 302 has increased very big elastic space.Second embodiment
Please refer to Fig. 5, be schematic diagram according to the multichip packaging structure of second embodiment of the invention light-emitting diode chip for backlight unit.Printed circuit board (PCB) 300 fronts for example have a flat bottom surface and concave cups 304 and at least one electrode 314, and printed circuit board (PCB) 300 back sides for example have a flat bottom surface and concave cups 304.The flat bottom surface and concave cups 304 in printed circuit board (PCB) 300 fronts is for example in order to disposing a plurality of light-emitting diode chip for backlight unit 302, and the flat bottom surface and concave cups 304 at printed circuit board (PCB) 300 back sides is for example in order to dispose a control chip 320.Wherein, all for example has a conductor layer 306 on flat bottom surface and concave cups 304 surfaces at printed circuit board (PCB) 300 fronts and the back side.In addition, printed circuit board (PCB) 300 fronts for example are connected by a plurality of conductor connectors 308 that run through printed circuit board (PCB) 300 with the flat bottom surface and concave cups 304 at the back side, so that the flat bottom surface and concave cups 304 on printed circuit board (PCB) 300 two sides interconnects.The structure of above-mentioned printed circuit board (PCB) 300 has good electrical conductivity and heat conduction approach, therefore can improve the qualification rate after light-emitting diode chip for backlight unit 302 encapsulates.
Please refer to Fig. 5 equally, the surface of the flat bottom surface and concave cups 304 in printed circuit board (PCB) 300 fronts has conductor layer 306, it for example is copper metal layer, arc profile and the conductor layer on it 306 by flat bottom surface and concave cups 304 sides, the light that light-emitting diode chip for backlight unit 302 is radiated penetrates outside the flat bottom surface and concave cups 304 through repeatedly reflecting in flat bottom surface and concave cups 304, make the light that penetrates flat bottom surface and concave cups 304 have same direction, therefore the curved profile of flat bottom surface and concave cups 304 sides has the function of optically focused, and the surface of the flat bottom surface and concave cups 304 at printed circuit board (PCB) 300 back sides has conductor layer 306 for example for copper metal layer, heat-conducting layer 310 among itself and first embodiment has identical functions, promptly has the function of heat conduction.The flat bottom surface and concave cups 304 in printed circuit board (PCB) 300 fronts can be in order to disposing a plurality of light-emitting diode chip for backlight unit 302 in the present embodiment, and do not have the shortcoming of light-emitting diode chip for backlight unit fracture in the bonding wire process of follow-up each light-emitting diode chip for backlight unit 302.And the flat bottom surface and concave cups 304 at printed circuit board (PCB) 300 back sides for example can hold one even a plurality of control chip 320 in the present embodiment, has further dwindled the volume after light-emitting diode chip for backlight unit 302 overall package.
Same bottom design with flat bottom surface and concave cups 304 is a plane in the present embodiment, and so light-emitting diode chip for backlight unit 302 does not just have the risk of fracture in follow-up bonding wire process, makes element have good reliability (reliability).And among the present invention 304 structure example of the flat bottom surface and concave cups on the printed circuit board (PCB) 300 as making by the mechanical type processing and manufacturing or in the mode of radium-shine boring.And can produce the flat bottom surface and concave cups 304 of different depth, size by the mechanical type processing and manufacturing or the mode of radium-shine boring, and the flat bottom surface and concave cups of making 304 is very consistent dimensionally.The present invention can be by the mechanical type processing and manufacturing or the mode of radium-shine boring, and the degree of depth of the control flat bottom surface and concave cups that forms 304 and size are to adjust the focal length and the luminous flux density of flat bottom surface and concave cups 304.
Please refer to Fig. 5 equally, the planar base 305 that flat bottom surface and concave cups 304 at printed circuit board (PCB) 300 fronts and the back side all have, and for example having a plurality of conductor connectors 308 that run through printed circuit board (PCB) 300 between two planar base 305, a plurality of conductor connectors 308 will have the stronger capacity of heat transmission.And the mode that conductor connector 308 forms is for example after the mode of mechanical type processing and manufacturing or radium-shine boring forms flat bottom surface and concave cups 304, form a plurality of through holes (through hole) that run through printed circuit board (PCB) 300 in appropriate location, flat bottom surface and concave cups 304 bottom, again conductor material is inserted and formed a plurality of conductor connectors 308 in each through hole, and the diameter of formation through hole for example is between the 0.05mm to 0.4mm.Because conductor connector 308 runs through printed circuit board (PCB) 300, so conductor connector 308 also has the effect identical with rivet except having function that thermal conductance is gone out.Conductor connector 308 is connected with the conductor layer 306 on flat bottom surface and concave cups 304 surfaces as rivet, makes conductor layer 306 can not be heated and peels off.In addition, have flat bottom surface and concave cups 304 equally at the back side of printed circuit board (PCB) 300, and the conductor layer 306 on the flat bottom surface and concave cups 304 has the effect of heat conduction, so the heat energy that light-emitting diode chip for backlight unit 302 is discharged leaves as soon as possible.
Then please refer to Fig. 6, for a plurality of light-emitting diode chip for backlight unit being disposed at the encapsulation schematic diagram of printed circuit board (PCB) according to this second embodiment with flat bottom surface and concave cups.The multicore sheet encapsulation of the light-emitting diode chip for backlight unit among the present invention, be that a plurality of light-emitting diode chip for backlight unit 302 are positioned on the planar base 305 of a flat bottom surface and concave cups 304 in printed circuit board (PCB) 300 fronts, and for example be that elargol is connected light-emitting diode chip for backlight unit 302 with the planar base 305 of flat bottom surface and concave cups 304 by colloid.After a plurality of light-emitting diode chip for backlight unit 302 being disposed at the planar base 305 of printed circuit board (PCB) 300 front flat bottom surface and concave cups 304, by output 312 on bonding wire 316 each light-emitting diode chip for backlight unit 302 of coupling and the electrode 314 on the printed circuit board (PCB) 300, the mode of coupling is for example with wire bonder, be first solder joint, second solder joint with output 312, electrode 314 respectively, the mode that is aided with ultrasonic vibrations with bonding wire 316 pressure weldings on output 312 and electrode 314.Last step of carrying out sealing again is fixed in light-emitting diode chip for backlight unit 302 on the planar base 305 of flat bottom surface and concave cups 304 with colloid 318.And the flat bottom surface and concave cups 304 at printed circuit board (PCB) 300 back sides is in order to dispose one or a plurality of control chip 320.
Above-mentioned control chip 320 can be controlled the luminous intensity or the flicker frequency of a plurality of light-emitting diode chip for backlight unit 302, can be by control chip 320 so that the light-emitting diode chip for backlight unit of its control presents various variation, as the flicker frequency of controlling light-emitting diode chip for backlight unit 302 can present different visual effects, and can present different change color by the light-emitting diode chip for backlight unit 302 of control chip 320 control different colours.Luminous intensity, the flicker frequency of being controlled by control chip 320 gone up in the difference collocation of light-emitting diode chip for backlight unit 302 intrinsic colours, makes that presenting of integral body is changeful.In addition, flat bottom surface and concave cups on the printed circuit board (PCB) can be made into the mode of dot matrix arrangement among first embodiment and second embodiment, so that a plurality of point-source of lights after the encapsulation can be formed an area source, since diode chip for backlight unit of the present invention multichip packaging structure presented is very uniform point-source of light, so the application on quite being suitable for throwing light on.
In addition, the present invention is positioned over a plurality of light-emitting diode chip for backlight unit the encapsulation on the planar base of same flat bottom surface and concave cups, make and have higher brightness after a plurality of light-emitting diode chip for backlight unit encapsulation, be about more than 3 times of known brightness, and use component life can increase to about 100,000 hours, and because the good heat radiating approach among the present invention makes the reliability of light-emitting diode increase.
In sum, the multichip packaging structure of light-emitting diode chip for backlight unit of the present invention has following advantage at least:
1. the multichip packaging structure of light-emitting diode chip for backlight unit of the present invention is disposed at a plurality of light-emitting diode chip for backlight unit in the same flat bottom surface and concave cups simultaneously, a plurality of light-emitting diode chip for backlight unit can be in flat bottom surface and concave cups just penetrate behind the first mixed light, and the mixed light effect better and can use aspect illumination.
2. the multichip packaging structure of light-emitting diode chip for backlight unit of the present invention is disposed at a plurality of light-emitting diode chip for backlight unit in the same flat bottom surface and concave cups simultaneously, has to encapsulate integrated level preferably, makes the more miniaturization of multichip packaging structure size.
3. the multichip packaging structure of light-emitting diode chip for backlight unit of the present invention is disposed at a plurality of light-emitting diode chip for backlight unit in the same flat bottom surface and concave cups, because flat bottom surface and concave cups below has connector and heat-conducting layer, so the good heat dissipation path life-span with the increase element can be provided.
4. in the multichip packaging structure of light-emitting diode chip for backlight unit of the present invention, flat bottom surface and concave cups structure on the printed circuit board (PCB) can be by the mechanical type processing and manufacturing, so can make the flat bottom surface and concave cups of different depth, size, with the light-emitting diode chip for backlight unit that disposes different numbers or the light-emitting diode chip for backlight unit of different size.
5. the present invention disposes a plurality of flat bottom surface and concave cups on printed circuit board (PCB), and each flat bottom surface and concave cups all carries a plurality of light-emitting diode chip for backlight unit, the color that presents with control through the electric current of each light-emitting diode chip for backlight unit via a control chip control flows.
6. the positive flat bottom surface and concave cups with the back side of printed circuit board (PCB) can be so that the back side of each chip (comprising light-emitting diode chip for backlight unit and control chip) be attached on its planar base fully among the present invention, in the process of bonding wire, do not have known because of the recessed cup structure of curved surface causes the problem of chip fracture, so increased the qualification rate of encapsulation.
7. the two sides of the printed circuit board (PCB) among the present invention connects and has the flat bottom surface and concave cups structure, and two flat bottom surface and concave cups make that respectively in order to the usefulness of configuration light-emitting diode chip for backlight unit and control chip the thickness after the encapsulation reduces many.In addition, be with one even the connection of a plurality of conductor connector between two flat bottom surface and concave cups, very good heat conduction approach can be provided.
Though the present invention with embodiment explanation as above; right its is not in order to qualification the present invention, any person skilled in the art, without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention is when being as the criterion with claims.
Claims (12)
1. the multichip packaging structure of a light-emitting diode chip for backlight unit is characterized by: comprise at least:
One printed circuit board (PCB), this printed circuit board (PCB) has a flat bottom surface and concave cups, an electrode, a heat-conducting layer and a conductive plunger, wherein this flat bottom surface and concave cups and this electrode are positioned at the one side of this printed circuit board (PCB), and the surface of this flat bottom surface and concave cups has a conductor layer, and this heat-conducting layer is positioned at the another side of this printed circuit board (PCB), this conductor connector run through this printed circuit board (PCB) and be connected in this conductor layer and this heat-conducting layer between;
A plurality of light-emitting diode chip for backlight unit are disposed on the planar base of this flat bottom surface and concave cups, and each those light-emitting diode chip for backlight unit has an output and is connected with this electrode; And
Colloid, this colloid is fixed in those light-emitting diode chip for backlight unit in each those flat bottom surface and concave cups.
2. the multichip packaging structure of light-emitting diode chip for backlight unit as claimed in claim 1 is characterized by: comprise that also a control chip is disposed on this heat-conducting layer, in order to control those light-emitting diode chip for backlight unit.
3. the multichip packaging structure of light-emitting diode chip for backlight unit as claimed in claim 1 is characterized by: this flat bottom surface and concave cups comprises in the mode of mechanical type processing to be made.
4. the multichip packaging structure of light-emitting diode chip for backlight unit as claimed in claim 1, it is characterized by: this flat bottom surface and concave cups comprises in the mode of radium-shine boring to be made.
5. the multichip packaging structure of light-emitting diode chip for backlight unit as claimed in claim 1, it is characterized by: the material of this conductor layer comprises the copper metal.
6. the multichip packaging structure of light-emitting diode chip for backlight unit as claimed in claim 1, it is characterized by: the material of this conductor connector comprises the copper metal.
7. LED source is characterized by: comprise at least:
One printed circuit board (PCB), this printed circuit board (PCB) has a flat bottom surface and concave cups, an electrode, a heat-conducting layer and a conductive plunger, wherein this flat bottom surface and concave cups and this electrode are positioned at the one side of this printed circuit board (PCB), and the surface of this flat bottom surface and concave cups has a conductor layer, and this heat-conducting layer is positioned at the another side of this printed circuit board (PCB), this conductor connector run through this printed circuit board (PCB) and be connected in this conductor layer and this heat-conducting layer between;
One printed circuit board (PCB), this printed circuit board (PCB) has a plurality of flat bottom surface and concave cups, those flat bottom surface and concave cups are corresponding plurality of electrodes, a heat-conducting layer and a conductive plunger respectively, wherein, those flat bottom surface and concave cups and those electrodes are positioned at the one side of this printed circuit board (PCB), and the surface of each those flat bottom surface and concave cups has a conductor layer, and those heat-conducting layers are disposed at the another side of this printed circuit board (PCB), and those conductor connectors run through this printed circuit board (PCB) and be connected in those conductor layers and those heat-conducting layers between;
A plurality of light-emitting diode chip for backlight unit are disposed on the planar base of each those flat bottom surface and concave cups, and each those light-emitting diode chip for backlight unit has an output and is connected with those electrodes; And
Colloid, this colloid is fixed in those light-emitting diode chip for backlight unit in each those flat bottom surface and concave cups.
8. LED source as claimed in claim 7 is characterized by: comprise that also an at least one control chip or a control loop are disposed on those heat-conducting layers, in order to control those light-emitting diode chip for backlight unit.
9. LED source as claimed in claim 7 is characterized by: this flat bottom surface and concave cups comprises in the mode of mechanical type processing to be made.
10. LED source as claimed in claim 7 is characterized by: this flat bottom surface and concave cups comprises in the mode of radium-shine boring to be made.
11. LED source as claimed in claim 7 is characterized by: the material of this conductor layer comprises the copper metal.
12. LED source as claimed in claim 7 is characterized by: the material of this conductor connector comprises the copper metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01131389A CN1417868A (en) | 2001-10-29 | 2001-10-29 | Multiple-chip package structure of LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01131389A CN1417868A (en) | 2001-10-29 | 2001-10-29 | Multiple-chip package structure of LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1417868A true CN1417868A (en) | 2003-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN01131389A Pending CN1417868A (en) | 2001-10-29 | 2001-10-29 | Multiple-chip package structure of LED chip |
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| CN (1) | CN1417868A (en) |
Cited By (19)
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| WO2005029594A1 (en) * | 2003-09-22 | 2005-03-31 | Fujian Joinluck Electronic Enterprise Co., Ltd. | A structure of light emitting diode |
| CN100343984C (en) * | 2004-02-27 | 2007-10-17 | 全懋精密科技股份有限公司 | Constructed configuration of heat sink capable of embedding semiconductor of electronic module |
| CN100352072C (en) * | 2005-03-02 | 2007-11-28 | 友达光电股份有限公司 | Light emitting diode light source module |
| CN100420019C (en) * | 2005-04-20 | 2008-09-17 | 王锐勋 | Packaging method for colony light-emitting diode chips and devices thereof |
| CN101430067A (en) * | 2004-06-29 | 2009-05-13 | 京瓷株式会社 | Liquid crystal display device |
| WO2010081403A1 (en) * | 2009-01-14 | 2010-07-22 | Cree Hong Kong Limited | Aligned multiple emitter package |
| CN102324456A (en) * | 2011-06-22 | 2012-01-18 | 浙江英特来光电科技有限公司 | A kind of high-power LED encapsulation structure |
| US8203669B2 (en) | 2006-07-25 | 2012-06-19 | Kyocera Corporation | Liquid crystal display device |
| CN103107168A (en) * | 2011-11-11 | 2013-05-15 | 东贝光电科技股份有限公司 | Improved structure of white light diode package for improving light mixing effect |
| CN103208582A (en) * | 2006-11-17 | 2013-07-17 | 伦斯勒工业学院 | High-power White Leds And Manufacturing Method Thereof |
| US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
| USD735683S1 (en) | 2013-05-03 | 2015-08-04 | Cree, Inc. | LED package |
| USD758976S1 (en) | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
| US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
| USD777122S1 (en) | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
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| USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2005029594A1 (en) * | 2003-09-22 | 2005-03-31 | Fujian Joinluck Electronic Enterprise Co., Ltd. | A structure of light emitting diode |
| CN100343984C (en) * | 2004-02-27 | 2007-10-17 | 全懋精密科技股份有限公司 | Constructed configuration of heat sink capable of embedding semiconductor of electronic module |
| CN101430068B (en) * | 2004-06-29 | 2011-10-05 | 京瓷株式会社 | Liquid crystal display device |
| CN101430067A (en) * | 2004-06-29 | 2009-05-13 | 京瓷株式会社 | Liquid crystal display device |
| CN100352072C (en) * | 2005-03-02 | 2007-11-28 | 友达光电股份有限公司 | Light emitting diode light source module |
| CN100420019C (en) * | 2005-04-20 | 2008-09-17 | 王锐勋 | Packaging method for colony light-emitting diode chips and devices thereof |
| US8203669B2 (en) | 2006-07-25 | 2012-06-19 | Kyocera Corporation | Liquid crystal display device |
| CN103208582A (en) * | 2006-11-17 | 2013-07-17 | 伦斯勒工业学院 | High-power White Leds And Manufacturing Method Thereof |
| US10305001B2 (en) | 2006-11-17 | 2019-05-28 | Rensselaer Polytechnic Institute | High-power white LEDs |
| WO2010081403A1 (en) * | 2009-01-14 | 2010-07-22 | Cree Hong Kong Limited | Aligned multiple emitter package |
| US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
| US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
| CN102324456A (en) * | 2011-06-22 | 2012-01-18 | 浙江英特来光电科技有限公司 | A kind of high-power LED encapsulation structure |
| CN103107168A (en) * | 2011-11-11 | 2013-05-15 | 东贝光电科技股份有限公司 | Improved structure of white light diode package for improving light mixing effect |
| US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
| USD735683S1 (en) | 2013-05-03 | 2015-08-04 | Cree, Inc. | LED package |
| US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
| USD758976S1 (en) | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
| USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
| USD777122S1 (en) | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
| USD783547S1 (en) | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
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