CN104485322A - Routing packaging structure for packaging and re-routing by utilizing frame and manufacturing method of routing packaging structure - Google Patents

Abstract

The invention relates to a routing packaging structure for packaging and re-routing by utilizing a frame and a manufacturing method of the routing packaging structure. The structure comprises a base plate (1), wherein a first solder ball (2) is arranged on the back of the base plate (1); a packaging body (3) is arranged on the front of the base plate (1) through a second solder ball (4); the packaging body (3) comprises a base island (5) and a pin (6); a chip (7) is arranged on the front of the base island (5); the front of the chip (7) is connected with the front of the pin (6) through a metal wire (8); the base island (5), the pin (6) and the chip (7) are encapsulated by a plastic packaging material (9); and the backs of the base island (5) and the pin (6) are level with the back of the plastic packaging material (9). According to the routing packaging structure for packaging and re-routing by utilizing the frame and the manufacturing method of the routing packaging structure, the re-routing of the chip can be realized by utilizing the frame.

Description

The wire bonding and packaging structure and manufacture method thereof that utilize framework to encapsulate to reroute

Technical field

The present invention relates to a kind of wire bonding and packaging structure and manufacture method thereof that utilize framework to encapsulate to reroute, belong to integrated circuit or discrete component encapsulation technology field.

Background technology

1, to be encapsulated in IO number more for conventional routing substrate, and when 2 laminar substrates cannot meet wiring space, common solution uses 4 laminar substrates instead.But compare 2 laminar substrates, 4 laminar substrates have that complex process, cost are high, yield is low, shortcoming that design, manufacturing cycle are long.Or utilize 4 laminar substrates to replace 6 laminar substrates that yield is lower, cost is higher;

2, the chip of some particular design does not mate with common skeleton, cannot realize encapsulation, then need the circuit carrying out chip to reroute.This part technique needs to complete in FAB factory, and common encapsulation factory cannot independently carry out, and cost is very high, and industry production capacity is low.

Summary of the invention

The object of the invention is to overcome above-mentioned deficiency, provide a kind of wire bonding and packaging structure and manufacture method thereof that utilize framework to encapsulate to reroute, it can utilize framework to realize rerouting of chip.

The object of the present invention is achieved like this: a kind of framework that utilizes encapsulates the wire bonding and packaging structure rerouted, it comprises substrate, described substrate back is provided with the first tin ball, described substrate front side is provided with packaging body by the second tin ball, described packaging body comprises Ji Dao and pin, described Ji Dao front is provided with chip, be connected by metal wire between described chip front side with pin front, described Ji Dao, pin and chip circumference are encapsulated with plastic packaging material, and described Ji Dao and the pin back side flush with the plastic packaging material back side.

Utilize framework to encapsulate a manufacture method for the wire bonding and packaging structure rerouted, described method comprises the steps:

Step one, get a metal framework, framework upper strata is line layer, and lower floor is supporting layer;

Step 2, in the enterprising luggage sheet of the framework of step one;

Step 3, on the framework of load, carry out routing;

Step 4, routing product to be encapsulated;

Step 5, packaged products is removed framework lower support layer, expose line layer;

Step 6, thinning for whole piece product is cut into independently unit;

Step 7, the separate unit of cutting is mounted on substrate;

Step 8, carry out planting ball at substrate back;

Step 9, obtain independently encapsulation unit by die-cut for the substrate of planting ball.

The line layer surface portion coating solder mask exposed before described step 3 routing, only reserves and needs windowing of scolding tin.

Compared with prior art, the present invention has following beneficial effect:

1, frame metal circuit is utilized, RDL(Redistribution Layer is provided) layer to be to realize the multilayer winding of substrate or to evade the function of short circuit, save substrate design space, it is made namely to reach the wiring effect of 4 laminar substrates with 2 laminar substrates, not only can simplify substrate manufacture technique, improve the yield of substrate, and save substrate cost;

2, the RDL utilizing framework encapsulation procedure to realize circuit makes, and makes the chip of some particular design utilize common skeleton can also realize encapsulation, can complete the technique that reroutes needing just can provide in specific vendor.

Accompanying drawing explanation

Fig. 1 is a kind of schematic diagram utilizing framework to encapsulate the wire bonding and packaging structure rerouted of the present invention.

Fig. 2 ~ Figure 12 is a kind of each operation schematic diagram utilizing framework to encapsulate the wire bonding and packaging structure manufacture method rerouted of the present invention.

Wherein:

Substrate 1

First tin ball 2

Packaging body 3

Second tin ball 4

Base island 5

Pin 6

Chip 7

Metal wire 8

Plastic packaging material 9.

Embodiment

See Fig. 1, a kind of framework that utilizes of the present invention encapsulates the wire bonding and packaging structure rerouted, it comprises substrate 1, described substrate 1 back side is provided with the first tin ball 2, described substrate 1 front is provided with packaging body 3 by the second tin ball 4, described packaging body 3 comprises base island 5 and pin 6, front, described base island 5 is provided with chip 7, described chip 7 front is connected by metal wire 8 with between pin 6 front, be encapsulated with plastic packaging material 9 around described base island 5, pin 6 and chip 7, described base island 5 and pin 6 back side flush with plastic packaging material 9 back side.

Its manufacture method is as follows:

Step one, see Fig. 2 or Fig. 3, get a metal framework, framework upper strata is line layer, and lower floor is supporting layer, and the line layer on upper strata can provide coiling or short-circuit function,

Step 2, see Fig. 4, in the enterprising luggage sheet of the framework of step one;

Step 3, see Fig. 5, the framework of load carries out routing, if the line terminal of metal framework as shown in Figure 3, line layer surface portion coating solder mask (line layer is covered green paint) then need exposed, only reserve and need windowing (as shown in figure 12) of scolding tin, overflow to prevent tin cream extensions road; If round for shown in Fig. 2 of metal framework line terminal, then do not cover green paint, also can play the effect preventing tin cream extensions road from overflowing;

Step 4, see Fig. 6, routing product to be encapsulated;

Step 5, see Fig. 7, packaged products is removed (etching or additive method) framework lower support layer, expose line layer;

Step 6, see Fig. 8, thinning for whole piece product is cut into independently unit;

Step 7, see Fig. 9, the separate unit of cutting is mounted on substrate;

Step 8, see Figure 10, carry out planting ball at substrate back;

Step 9, see Figure 11, obtain independently encapsulation unit by die-cut for the substrate of planting ball.

Claims (3)

1. one kind utilizes framework to encapsulate the wire bonding and packaging structure rerouted, it is characterized in that: it comprises substrate (1), described substrate (1) back side is provided with the first tin ball (2), described substrate (1) front is provided with packaging body (3) by the second tin ball (4), described packaging body (3) comprises Ji Dao (5) and pin (6), described Ji Dao (5) front is provided with chip (7), be connected by metal wire (8) between described chip (7) front with pin (6) front, described Ji Dao (5), pin (6) and chip (7) are encapsulated with plastic packaging material (9) around, described Ji Dao (5) and pin (6) back side flush with plastic packaging material (9) back side.

2. utilize framework to encapsulate a manufacture method for the wire bonding and packaging structure rerouted, it is characterized in that described method comprises the steps:

Step one, get a metal framework, framework upper strata is line layer, and lower floor is supporting layer;

Step 2, in the enterprising luggage sheet of the framework of step one;

Step 3, on the framework of load, carry out routing;

Step 4, routing product to be encapsulated;

Step 5, packaged products is removed framework lower support layer, expose line layer;

Step 6, thinning for whole piece product is cut into independently unit;

Step 7, the separate unit of cutting is mounted on substrate;

Step 8, carry out planting ball at substrate back;

Step 9, obtain independently encapsulation unit by die-cut for the substrate of planting ball.

3. a kind of manufacture method utilizing framework to encapsulate the wire bonding and packaging structure rerouted according to claim 2, is characterized in that: the line layer surface portion coating solder mask exposed before described step 3 routing, only reserves and need windowing of scolding tin.