CN104362132A - Chip package assembly - Google Patents

Chip package assembly Download PDF

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Publication number
CN104362132A
CN104362132A CN201410505822.5A CN201410505822A CN104362132A CN 104362132 A CN104362132 A CN 104362132A CN 201410505822 A CN201410505822 A CN 201410505822A CN 104362132 A CN104362132 A CN 104362132A
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CN
China
Prior art keywords
chip
packaging sheet
metallic packaging
chip package
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
CN201410505822.5A
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Chinese (zh)
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CN104362132B (en
Inventor
崔永明
张干
王建全
王作义
彭彪
李保霞
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SICHUAN GENERALIZED MICROELECTRONICS Co Ltd
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SICHUAN GENERALIZED MICROELECTRONICS Co Ltd
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Priority to CN201410505822.5A priority Critical patent/CN104362132B/en
Publication of CN104362132A publication Critical patent/CN104362132A/en
Application granted granted Critical
Publication of CN104362132B publication Critical patent/CN104362132B/en
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Abstract

The invention discloses a chip package assembly which comprises a first metal package sheet and a second metal package sheet. The first metal package sheet and the second metal package sheet are provided with two pairs of bent edges which are correspondingly matched with one another, and the bent edges of the first metal package sheet and the second metal package sheet are provided with matched connecting structures; wire lead-out structures are arranged between each pair of bent edges, a metal heat conduction sheet is arranged in the middle of the first metal package sheet, the metal heat conduction sheet and the corresponding bent edges are positioned on the same side of the first metal package sheet, and insulating films are further arranged on the surface of the metal heat conduction sheet; a cavity between the first metal package sheet and the second metal package sheet is filled with insulating solidifying materials. The chip package assembly has the advantages that the two metal package sheets are arranged on the upper surface and the lower surface of a chip, accordingly, the chip package assembly can be used as a chip package protective structure, heat can be simultaneously dissipated from the upper surface and the lower surface of the chip, particularly, heat generated on the upper side of the chip can be directly transmitted and dissipated via the metal heat conduction sheet without being transmitted through a body of the chip, and the heat dissipation efficiency of the chip can be improved.

Description

Chip package
Technical field
The invention belongs to field of semiconductor manufacture, relate to the encapsulation technology of semiconductor chip, particularly relate to a kind of chip package.
Background technology
In field of semiconductor package; packaging part normally installs the shell of semiconductor integrated circuit chip; play a part to lay, fix, seal, protect IC and enhancing electric heating property; but also be the bridge of linking up the chip internal world and external circuit; contact on chip is wired on the pin of package casing, and these pins are connected by the wire in printed board and other devices again.Therefore, encapsulate CPU and other LSI integrated circuits are played an important role.
Along with the progress of semiconductor technology, minimum feature breaks through micron level already, arrive nanometer scale, due to constantly reducing of live width, the power density of semiconductor chip, particularly power device improves constantly, and single semiconductor chip can provide the output current that ampere level is even higher, operating current and the caloric value of chip constantly increase, and the semiconductor chip encapsulated must possess powerful current capacity and heat radiation structure design.
The chip package heat abstractor of prior art is be arranged on chip bottom and the sheet metal be close to, chip pin is positioned at above chip, because the various device in chip and line are positioned at above chip, the heat produced also concentrates on chip top, caloric requirement is through chip body, could arrive the metal fin of bottom, heat-sinking capability is greatly limited.
 
Summary of the invention
For improving the technological deficiency that in existing chip encapsulation technology, radiating effect is not good, the invention discloses a kind of chip package.
Chip package of the present invention, comprise the first metallic packaging sheet and the second metallic packaging sheet, described first metallic packaging sheet and the second metallic packaging sheet have a pair bending edge edge of corresponding matching, and the bending edge of the first metallic packaging sheet and the second metallic packaging sheet is along the syndeton with cooperation;
Have structure for drawing out lead wires between often pair of bending edge edge, have metal conducting strip in the middle part of described first metallic packaging sheet, described metal conducting strip and bending edge are along the homonymy being positioned at the first metallic packaging sheet, and described metal conducting strip surface is also provided with dielectric film; Insulation solidfied material is filled with in cavity between described first metallic packaging sheet and the second metallic packaging sheet.
Chip body 2 is placed on above the second metallic packaging sheet 2, again the first metallic packaging sheet 1 is fastened, the bending edge placement of two metallic packaging sheets is corresponding, size is identical, at bending edge along the syndeton with cooperation, the tooth bar that such as shaped position coordinates and groove, first and second metallic packaging sheet connects along 7 places at bending edge, the accommodating chip body 2 of cavity formed in the middle of first and second metallic packaging sheet, the lead-in wire 4 that chip body connects or pin stretch out from the structure for drawing out lead wires between bending edge edge.
Two metallic packaging sheets are set at chip upper and lower surface; while as chip package operator guards; play the effect of simultaneously dispelling the heat from chip upper and lower surface; particularly above chip, heating need not pass chip body self; directly dispelled the heat by metal conducting strip transmission; improve the radiating efficiency of chip, metallic packaging structure also enhances firmness and the pliability of encapsulation simultaneously.
Preferably, described structure for drawing out lead wires is the insulation and obturation layer between metallic packaging sheet bending edge edge, and described insulation and obturation layer has the groove of position and dimensional fits.
Further, described insulation and obturation layer is rubber layer.
Preferably, described bending edge is along curved, and the central angle of arc is 90 degree.
While joint face is large, add impact resistance and the pliability of encapsulating structure.
Further, the inner side on described bending edge edge has the fan-shaped metal solid part in right angle.
Concrete, described syndeton is tooth bar and the groove of form fit.
Preferably, described metal conducting strip is circular.
Concrete, described dielectric film is alundum (Al2O3).
Concrete, described insulation solidfied material is epoxy resin.
Preferably, described structure for drawing out lead wires is provided with multiple pad, described pad is the metal electrode be connected with chip internal pin.
Further, described pad is connected by gold thread with between metal electrode.
Chip package of the present invention; two metallic packaging sheets are set at chip upper and lower surface; while as chip package operator guards; play the effect of simultaneously dispelling the heat from chip upper and lower surface; particularly above chip, heating need not pass chip body self; directly dispelled the heat by metal conducting strip transmission, improve the radiating efficiency of chip.
Accompanying drawing explanation
Fig. 1 is a kind of embodiment structural representation of chip package of the present invention;
Fig. 2 is a kind of embodiment vertical view of chip package of the present invention;
In figure, Reference numeral name is called: 1-first metallic packaging sheet 2-second metallic packaging sheet 3-chip body 4-lead-in wire 5-structure for drawing out lead wires, 6-metal conducting strip 7-bending edge edge.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
Chip package of the present invention comprises the first metallic packaging sheet 1 and the second metallic packaging sheet 2, described first metallic packaging sheet and the second metallic packaging sheet have a pair bending edge of corresponding matching along 7, and the bending edge of the first metallic packaging sheet and the second metallic packaging sheet is along the syndeton with cooperation;
Have structure for drawing out lead wires between often pair of bending edge edge, have metal conducting strip in the middle part of described first metallic packaging sheet, described metal conducting strip and bending edge are along the homonymy being positioned at the first metallic packaging sheet, and described metal conducting strip surface is also provided with dielectric film; Insulation solidfied material is filled with in cavity between described first metallic packaging sheet and the second metallic packaging sheet.
As shown in Figure 1, during encapsulation, chip body 2 is placed on above the second metallic packaging sheet 2, again the first metallic packaging sheet 1 is fastened, the bending edge placement of two metallic packaging sheets is corresponding, size is identical, at bending edge along the syndeton with cooperation, the tooth bar that such as shaped position coordinates and groove, first and second metallic packaging sheet connects along 7 places at bending edge, the accommodating chip body 2 of cavity formed in the middle of first and second metallic packaging sheet, the lead-in wire 4 that chip body connects or pin stretch out from the structure for drawing out lead wires between bending edge edge.
Metallic packaging sheet can be the material that the thermal conductivity such as aluminium or copper and ductility are good, on bending edge edge, right angle bending shape can be adopted, also curved bend flanging pressure can be adopted, as shown in Figure 1, the bending edge edge of two metallic packaging sheets is arc, the central angle of arc is 90 degree, make two bending edges along being positioned on straight line in direction, junction, joint face is maximum, cambered design adds impact resistance and the pliability of encapsulating structure simultaneously, for strengthening the firmness of upper and lower two sheet metals in junction and heat transfer area, solid metal solid part can be set in curved bend flanging pressure inner side, metal solid part is right angle fan shape.
Preferably, described structure for drawing out lead wires is the insulation and obturation layer between metallic packaging sheet bending edge edge, and described insulation and obturation layer has the groove of position and dimensional fits.Insulation and obturation layer enclose bending edge along between neutral gear, avoid foreign matter to enter encapsulating structure, and further enhancing encapsulating structure intensity, the bending edge of two metallic packaging sheets is along after being combined, and groove fit forms lead-in wire fairlead, and conveniently go between extraction.
Insulating barrier can select rubber, and when being subject to impact extruded, rubber can absorb impulsive force, reduces the direct effect power to inside chip.
Multiple pad can be set at structure for drawing out lead wires, pad is actual is metal electrode, by wire or be connected with chip pin in other forms, preferably be connected between chip pin and the pad on structure for drawing out lead wires by conducting metal filament, filament two ends are welded on pin and pad respectively, filament is preferably gold thread, and gold thread ductility and conductivity are all good, is applicable to being applied to the narrow chip package in inner space.Gold thread should not adopt straight line to connect, and should have certain radian, ensures not easily to be pulled off in encapsulation.
Metal conducting strip 6 below first metallic packaging sheet is connected with above chip body, as shown in Figure 2, the junction of metal conducting strip and chip body 2 is positioned in the middle part of chip, chip edge is each lead pad, lead pad is connected with the pin of encapsulating structure by lead-in wire, metal conducting strip can be set to circle, increasing heat radiation area, metal conducting strip surface is coated with dielectric film, such as alundum (Al2O3), conducting strip is avoided to be electrically connected with above chip body, the thickness of dielectric film should more than 15 microns, metal conducting strip is while curing chip position, play directly from the effect of chip body upper surface heat transfer, by the first metallic packaging sheet, heat is distributed, and need not conduct heat through chip body again, strengthen radiating effect, after two metallic packaging sheets and chip body are packaged together, insulation solidfied material is inserted in cavity between two metallic packaging sheets, such as epoxy resin or other materials etc., make chip body in encapsulating structure, keep fixing.
Realize being bonded and sealed between metal conducting strip and two metallic packaging sheets of composition package casing, form robust structure, during package casing employing metallic packaging, then can adopt melten glass bonded seal between package casing and metal conducting strip.The aluminum that metal conducting strip can adopt thermal conductivity and the good copper of ductility or density low, firm in structure.
Chip package of the present invention; two metallic packaging sheets are set at chip upper and lower surface; while as chip package operator guards; play the effect of simultaneously dispelling the heat from chip upper and lower surface; particularly above chip, heating need not pass chip body self; directly dispelled the heat by metal conducting strip transmission, improve the radiating efficiency of chip, metallic packaging structure also enhances firmness and the pliability of encapsulation simultaneously.
Previously described is each preferred embodiment of the present invention, preferred implementation in each preferred embodiment is if not obviously contradictory or premised on a certain preferred implementation, each preferred implementation can stack combinations use arbitrarily, design parameter in described embodiment and embodiment is only the invention proof procedure in order to clear statement inventor, and be not used to limit scope of patent protection of the present invention, scope of patent protection of the present invention is still as the criterion with its claims, the equivalent structure change that every utilization specification of the present invention and accompanying drawing content are done, in like manner all should be included in protection scope of the present invention.

Claims (10)

1. chip package, it is characterized in that, comprise the first metallic packaging sheet (1) and the second metallic packaging sheet (2), described first metallic packaging sheet and the second metallic packaging sheet have a pair bending edge of corresponding matching along (7), and the bending edge of the first metallic packaging sheet and the second metallic packaging sheet is along the syndeton with cooperation;
Often pair of bending edge has structure for drawing out lead wires (5) between (7), described first metallic packaging sheet (1) middle part has metal conducting strip (6), described metal conducting strip (6) and bending edge are positioned at the homonymy of the first metallic packaging sheet along (7), described metal conducting strip surface is also provided with dielectric film; Insulation solidfied material is filled with in cavity between described first metallic packaging sheet (1) and the second metallic packaging sheet (2).
2. chip package as claimed in claim 1, is characterized in that, described structure for drawing out lead wires is the insulation and obturation layer between metallic packaging sheet bending edge edge, and described insulation and obturation layer has the groove of position and dimensional fits.
3. chip package as claimed in claim 2, it is characterized in that, described insulation and obturation layer is rubber layer.
4. chip package as claimed in claim 1, it is characterized in that, described bending edge is along curved, and the central angle of arc is 90 degree.
5. chip package as claimed in claim 1, it is characterized in that, the inner side on described bending edge edge has the fan-shaped metal solid part in right angle.
6. chip package as claimed in claim 1, it is characterized in that, described syndeton is tooth bar and the groove of form fit.
7. chip package as claimed in claim 1, is characterized in that, described metal conducting strip is circular.
8. chip package as claimed in claim 1, it is characterized in that, described insulation solidfied material is epoxy resin.
9. chip package as claimed in claim 1 or 2, it is characterized in that, described structure for drawing out lead wires is provided with multiple pad, described pad is the metal electrode be electrically connected with chip internal pin.
10. chip package as claimed in claim 9, is characterized in that, described pad is connected by bending gold thread with between metal electrode.
CN201410505822.5A 2014-09-28 2014-09-28 Chip package Active CN104362132B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410505822.5A CN104362132B (en) 2014-09-28 2014-09-28 Chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410505822.5A CN104362132B (en) 2014-09-28 2014-09-28 Chip package

Publications (2)

Publication Number Publication Date
CN104362132A true CN104362132A (en) 2015-02-18
CN104362132B CN104362132B (en) 2015-10-28

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030116769A1 (en) * 2001-12-24 2003-06-26 Samsung Electro-Mechanics Co., Ltd. Light emission diode package
CN202003974U (en) * 2010-12-15 2011-10-05 中国电子科技集团公司第十三研究所 Ultrathin tube shell
CN202103607U (en) * 2011-06-23 2012-01-04 无锡国盛精密模具有限公司 Solar energy photovoltaic assembly conjunction box
CN103456699A (en) * 2013-09-29 2013-12-18 中国兵器工业集团第二一四研究所苏州研发中心 Integrated circuit packaging structure and packaging method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030116769A1 (en) * 2001-12-24 2003-06-26 Samsung Electro-Mechanics Co., Ltd. Light emission diode package
CN202003974U (en) * 2010-12-15 2011-10-05 中国电子科技集团公司第十三研究所 Ultrathin tube shell
CN202103607U (en) * 2011-06-23 2012-01-04 无锡国盛精密模具有限公司 Solar energy photovoltaic assembly conjunction box
CN103456699A (en) * 2013-09-29 2013-12-18 中国兵器工业集团第二一四研究所苏州研发中心 Integrated circuit packaging structure and packaging method thereof

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