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Patent

  1. Avancerad patentsökning
PublikationsnummerCN104362132 A
Typ av kungörelseAnsökan
AnsökningsnummerCN 201410505822
Publiceringsdatum18 feb 2015
Registreringsdatum28 sep 2014
Prioritetsdatum28 sep 2014
Även publicerat somCN104362132B
Publikationsnummer201410505822.5, CN 104362132 A, CN 104362132A, CN 201410505822, CN-A-104362132, CN104362132 A, CN104362132A, CN201410505822, CN201410505822.5
Uppfinnare崔永明, 张干, 王建全, 王作义, 彭彪, 李保霞
Sökande四川广义微电子股份有限公司
Exportera citatBiBTeX, EndNote, RefMan
Externa länkar:  SIPO, Espacenet
Chip package assembly
CN 104362132 A
Sammanfattning
The invention discloses a chip package assembly which comprises a first metal package sheet and a second metal package sheet. The first metal package sheet and the second metal package sheet are provided with two pairs of bent edges which are correspondingly matched with one another, and the bent edges of the first metal package sheet and the second metal package sheet are provided with matched connecting structures; wire lead-out structures are arranged between each pair of bent edges, a metal heat conduction sheet is arranged in the middle of the first metal package sheet, the metal heat conduction sheet and the corresponding bent edges are positioned on the same side of the first metal package sheet, and insulating films are further arranged on the surface of the metal heat conduction sheet; a cavity between the first metal package sheet and the second metal package sheet is filled with insulating solidifying materials. The chip package assembly has the advantages that the two metal package sheets are arranged on the upper surface and the lower surface of a chip, accordingly, the chip package assembly can be used as a chip package protective structure, heat can be simultaneously dissipated from the upper surface and the lower surface of the chip, particularly, heat generated on the upper side of the chip can be directly transmitted and dissipated via the metal heat conduction sheet without being transmitted through a body of the chip, and the heat dissipation efficiency of the chip can be improved.
Anspråk(10)  översatt från kinesiska
1.芯片封装件,其特征在于,包括第一金属封装片(I)和第二金属封装片(2),所述第一金属封装片和第二金属封装片具有对应配合的一对弯折边沿(7),第一金属封装片和第二金属封装片的弯折边沿具有配合的连接结构; 每对弯折边沿(7)之间具有引线引出结构(5),所述第一金属封装片(I)中部具有金属导热片(6),所述金属导热片(6)与弯折边沿(7)位于第一金属封装片的同侧,所述金属导热片表面还设置有绝缘膜;所述第一金属封装片(I)和第二金属封装片(2)之间的空腔内填充有绝缘固化物。 1. The chip package, wherein the package comprises a first metal sheet (I) and a second sheet metal package (2), said first and second sheet metal encapsulation sheet metal package having a corresponding mating pair of bent edge (7), bending sheet metal package edge first and the second sheet metal package with a connector mating structure; having a lead terminal structure (5) (7) between each pair of bent edge, the first metal packaging sheet (I) having a central metal heat-conducting sheet (6), said thermally conductive metal sheet (6) and the folding edge (7) located at the same side of the first sheet metal package, the surface of the metal sheet is also provided with a thermally conductive insulating film; encapsulating said first metal sheet (I) and a second cavity between the metal sheet package (2) filled with an insulating cured product.
2.如权利要求1所述的芯片封装件,其特征在于,所述引线引出结构为位于金属封装片弯折边沿之间的绝缘封闭层,所述绝缘封闭层具有位置和尺寸配合的凹槽。 2. The chip package according to claim 1, characterized in that said lead terminal structure of the package sheet located metal bent edge insulating layer between the closure, the insulating layer having a closed position and dimensions of the mating groove .
3.如权利要求2所述的芯片封装件,其特征在于,所述绝缘封闭层为橡胶层。 Chip package as claimed in claim 2, characterized in that said insulating layer is a rubber layer closure.
4.如权利要求1所述的芯片封装件,其特征在于,所述弯折边沿呈弧形,弧形的圆心角为90度。 The chip package according to claim 1, characterized in that said curved folding edges, curved central angle of 90 degrees.
5.如权利要求1所述的芯片封装件,其特征在于,所述弯折边沿的内侧具有直角扇形的金属实心部。 5. The chip package according to claim 1, characterized in that the solid metal portion folded inside edge having a right-angle fan-shaped.
6.如权利要求1所述的芯片封装件,其特征在于,所述连接结构为形状配合的齿条和沟槽。 6. The chip package according to claim 1, wherein said connecting structure is a rack-and-groove fit shape.
7.如权利要求1所述的芯片封装件,其特征在于,所述金属导热片为圆形。 7. The chip package according to claim 1, characterized in that said circular metallic thermally conductive sheet.
8.如权利要求1所述的芯片封装件,其特征在于,所述绝缘固化物为环氧树脂。 8. The chip package according to claim 1, wherein said insulating material is an epoxy resin cured.
9.如权利要求1或2所述的芯片封装件,其特征在于,所述引线引出结构上设置有多个焊盘,所述焊盘为与芯片内部引脚电连接的金属电极。 9. A chip package according to claim 1 or claim 2, wherein said lead terminal structure provided on a plurality of pads, the pad is a metal electrode and electrically connected to the chip pins.
10.如权利要求9所述的芯片封装件,其特征在于,所述焊盘与金属电极之间通过弯曲金线连接。 10. The chip package according to claim 9, characterized in that the connection between the pad and the gold wire by bending a metal electrode.
Beskrivning  översatt från kinesiska
芯片封装件 Chip package

技术领域 Technical Field

[0001] 本发明属于半导体制造领域,涉及半导体芯片的封装技术,特别是涉及一种芯片封装件。 [0001] The present invention belongs to the field of semiconductor fabrication, a semiconductor chip packaging technology, particularly, to a chip package.

背景技术 Background technique

[0002] 在半导体封装领域,封装件通常是安装半导体集成电路芯片用的外壳,起着安放、固定、密封、保护芯片和增强电热性能的作用,而且还是沟通芯片内部世界与外部电路的桥梁,芯片上的接点用导线连接到封装外壳的引脚上,这些引脚又通过印制板上的导线与其他器件建立连接。 [0002] In the field of semiconductor packaging, the package is usually installed with a semiconductor integrated circuit chip housing plays placed, fixed and sealed to protect the chip and enhance the role of electric performance, but also to communicate with the outside world chip circuit bridge contacts on the chip with a wire attached to the package housing the pins, which in turn connect with other devices on the printed circuit board through a wire. 因此,封装对CPU和其他LSI集成电路都起着重要的作用。 Thus, the package of CPU and other LSI integrated circuits play an important role.

[0003] 随着半导体工艺的进步,最小线宽早已突破微米级别,到达纳米量级,由于线宽的不断缩小,半导体芯片,特别是功率器件的功率密度不断提高,单一的半导体芯片已经能够提供安培级甚至更高的输出电流,芯片的工作电流和发热量不断增大,封装完成的半导体芯片必须具备强大的电流导通能力和散热结构设计。 [0003] As advances in semiconductor technology, has already exceeded the minimum line width micron level, to Dana Mi magnitude, due to the width of shrinking, semiconductor chips, especially the power density power devices continue to improve, a single semiconductor chip has been able to provide amps even higher output current, the chip operating current and heat increasing, finished semiconductor chip package must have a strong current conducting capability and thermal design.

[0004] 现有技术的芯片封装散热装置为设置在芯片底部并紧贴的金属片,芯片引脚位于芯片上方,由于芯片中的各种器件及连线位于芯片上方,产生的热量也集中在芯片上部,热量需要穿过芯片本体,才能到达底部的金属散热片,散热能力受到很大局限。 [0004] calorie chip package cooling device of the prior art is provided at the bottom of the chip and close the metal sheet, the chip lead at the top of the chip, because the chip in a variety of devices and connections at the top of the chip, produced also concentrated in the upper portion of the chip, the heat through the chip body needs to get to the bottom of the metal heat sink, cooling capacity has been greatly limitations.

[0005] [0005]

发明内容 DISCLOSURE

[0006]为改善现有芯片封装技术中散热效果不佳的技术缺陷,本发明公开了一种芯片封装件。 [0006] In order to improve the prior art chip packaging technology poor cooling effect of the defect, the present invention discloses a chip package.

[0007] 本发明所述芯片封装件,包括第一金属封装片和第二金属封装片,所述第一金属封装片和第二金属封装片具有对应配合的一对弯折边沿,第一金属封装片和第二金属封装片的弯折边沿具有配合的连接结构; [0007] The chip package of the present invention, a metal package comprising a first sheet and a second sheet metal package, the first package sheet metal and a second metal having a pair of bent packaging sheet with the corresponding edge of the first metal bent edge encapsulation sheet and the second sheet metal package with a connector mating structure;

每对弯折边沿之间具有引线引出结构,所述第一金属封装片中部具有金属导热片,所述金属导热片与弯折边沿位于第一金属封装片的同侧,所述金属导热片表面还设置有绝缘膜;所述第一金属封装片和第二金属封装片之间的空腔内填充有绝缘固化物。 Having a lead edge between each pair of leads is bent structure, said first metal having a central metal sheet package thermally conductive sheet, the thermally conductive sheet metal and is bent at the first edge of the same side of sheet metal package, the thermally conductive sheet metal surface There is also provided an insulating film; the first cavity and the second sheet metal package sheet between a metal package filled with an insulating cured product.

[0008] 芯片本体2放置在第二金属封装片2上方,再将第一金属封装片I扣合,两个金属封装片的弯折边沿位置对应,大小相同,在弯折边沿具有配合的连接结构,例如形状位置配合的齿条和沟槽,第一与第二金属封装片在弯折边沿7处连接,第一与第二金属封装片中间形成的空腔容置芯片本体2,芯片本体上连接的引线4或引脚从弯折边沿之间的引线引出结构伸出。 [0008] The chip body 2 is placed over the second sheet metal package 2, then the first sheet metal package I snap, bent sheet metal package edge position corresponding to the two the same size, the bent edge having mating connector structure, such as the shape and position of the rack with the grooves of the first and second metal packaging sheet 7 is connected to the bent edge intermediate the first and second cavities formed sheet metal package receiving chip body 2, chip body 4-wire connecting leads or pins extending from the wire bending structure between the edges.

[0009] 设置两个金属封装片在芯片上下两面,在作为芯片封装保护结构的同时,起到从芯片上下两面同时散热的作用,特别是芯片上方发热无须穿过芯片本体自身,直接通过金属导热片传递散热,提高了芯片的散热效率,同时金属封装结构也增强了封装的牢固程度和柔韧性。 [0009] The sheet metal package set two upper and lower surfaces of the chip, a chip package in a protective structure at the same time, play from the chip at the same time the upper and lower sides of the cooling effect, especially above the chip through the chip body's own heat without direct heat conduction through the metal heat transfer sheet, improve thermal efficiency of the chip, while metal packaging structure also enhance the package as strong and flexible.

[0010] 优选的,所述引线引出结构为位于金属封装片弯折边沿之间的绝缘封闭层,所述绝缘封闭层具有位置和尺寸配合的凹槽。 [0010] Preferably, the lead terminal structure of bent sheet metal package is located in the insulating layer is enclosed between the edges, the insulating layer having a closed position and dimensions of the mating groove.

[0011] 进一步的,所述绝缘封闭层为橡胶层。 [0011] Further, the insulating layer is a rubber layer closure.

[0012] 优选的,所述弯折边沿呈弧形,弧形的圆心角为90度。 [0012] Preferably, the bent edge curved, curved central angle of 90 degrees.

[0013] 连接面大的同时,增加了封装结构的抗冲击性和柔韧性。 [0013] Connection is large, while increasing the impact resistance and flexibility of the package structure.

[0014] 进一步的,所述弯折边沿的内侧具有直角扇形的金属实心部。 [0014] Further, the inner side of the bent edge portion having a rectangular solid metal fan.

[0015] 具体的,所述连接结构为形状配合的齿条和沟槽。 [0015] Specifically, the shape of the connecting structure with the rack and grooves.

[0016] 优选的,所述金属导热片为圆形。 [0016] Preferably, the thermally conductive sheet metal circular.

[0017] 具体的,所述绝缘膜为三氧化二铝。 [0017] Specifically, the insulating film is aluminum oxide.

[0018] 具体的,所述绝缘固化物为环氧树脂。 [0018] Specifically, the insulator is an epoxy resin cured product.

[0019] 优选的,所述引线引出结构上设置有多个焊盘,所述焊盘为与芯片内部引脚连接的金属电极。 [0019] Preferably, the lead-wire structure is provided with a plurality of pads, the pad for the metal electrode and the chip pin connections.

[0020] 进一步的,所述焊盘与金属电极之间通过金线连接。 [0020] Further, the gold wire connection between the pad and the metal electrode.

[0021] 本发明所述的芯片封装件,设置两个金属封装片在芯片上下两面,在作为芯片封装保护结构的同时,起到从芯片上下两面同时散热的作用,特别是芯片上方发热无须穿过芯片本体自身,直接通过金属导热片传递散热,提高了芯片的散热效率。 [0021] The chip package of the present invention, set up two metal packaging sheet in the upper and lower sides of the chip, a chip package in a protective structure at the same time, play from the chip at the same time the upper and lower sides of the cooling effect, especially above the chip fever without wear over the chip body itself, direct heat transfer through the metal thermally conductive sheet, improve thermal efficiency of the chip.

附图说明 Brief Description

[0022]图1为本发明所述芯片封装件的一种具体实施方式结构示意图; [0022] Figure 1 a specific embodiment of the present invention a schematic structural view of the chip package;

图2为本发明所述芯片封装件的一种具体实施方式俯视图; Figure 2 is a specific embodiment of the invention, the chip package in a plan view;

图中附图标记名称为:1_第一金属封装片2-第二金属封装片3-芯片本体4-引线5-引线引出结构,6-金属导热片7-弯折边沿。 Figure reference numeral name: 1_ first encapsulation sheet metal sheet metal package 2- second chip body 4- 3- 5- lead wire leads structure, 6- 7- thermally conductive sheet metal bent edges.

具体实施方式 DETAILED DESCRIPTION

[0023] 下面结合附图,对本发明的具体实施方式作进一步的详细说明。 [0023] below with the drawings, embodiments of the present invention will be described in further detail.

[0024] 本发明所述芯片封装件包括第一金属封装片I和第二金属封装片2,所述第一金属封装片和第二金属封装片具有对应配合的一对弯折边沿7,第一金属封装片和第二金属封装片的弯折边沿具有配合的连接结构; [0024] The chip package of the present invention includes a first metal and a second metal encapsulation sheet I package sheet 2, the first metal and a second metal sheet package having a pair of bent packaging sheet corresponding to the mating edge 7, folded edge of a sheet metal package and the second package sheet metal structure with a connector mating;

每对弯折边沿之间具有引线引出结构,所述第一金属封装片中部具有金属导热片,所述金属导热片与弯折边沿位于第一金属封装片的同侧,所述金属导热片表面还设置有绝缘膜;所述第一金属封装片和第二金属封装片之间的空腔内填充有绝缘固化物。 Having a lead edge between each pair of leads is bent structure, said first metal having a central metal sheet package thermally conductive sheet, the thermally conductive sheet metal and is bent at the first edge of the same side of sheet metal package, the thermally conductive sheet metal surface There is also provided an insulating film; the first cavity and the second sheet metal package sheet between a metal package filled with an insulating cured product.

[0025] 如图1所示,封装时,芯片本体2放置在第二金属封装片2上方,再将第一金属封装片I扣合,两个金属封装片的弯折边沿位置对应,大小相同,在弯折边沿具有配合的连接结构,例如形状位置配合的齿条和沟槽,第一与第二金属封装片在弯折边沿7处连接,第一与第二金属封装片中间形成的空腔容置芯片本体2,芯片本体上连接的引线4或引脚从弯折边沿之间的引线引出结构伸出。 [0025] Figure 1, when the package, chip body 2 is placed over the second sheet metal package 2, and then folding the edge position I of the first metal sheet engaging encapsulation, encapsulation sheet metal corresponding to the two, the same size , connecting the bent edge with mating structure, such as the shape and position of the rack with the grooves of the first and second metal packaging sheet 7 is connected to the bent edge intermediate the first and second metal sheet forming the package blank chip accommodating chamber body 2, the leads connected to the chip body 4 or pin terminal structure from wire bending edge extending between.

[0026] 金属封装片可以是铝或铜等导热性和延展性好的材料,在弯折边沿,可以采用直角弯折形状,也可以采用弧形弯折边压,如图1所示,两个金属封装片的弯折边沿为弧形,弧形的圆心角为90度,使两个弯折边沿在连接处方向位于一条直线上,连接面最大,弧形设计同时增加了封装结构的抗冲击性和柔韧性,为增强上下两个金属片在连接处的牢固度和传热面积,可以在弧形弯折边压内侧设置实心的金属实心部,金属实心部为直角扇形形状。 [0026] metal packaging sheet may be aluminum or copper and other materials with good thermal conductivity and ductility, the bent edge, bent rectangular shapes can also be used folded arcuate pressure side, shown in Figure 1, two Edge bending sheet metal package of the arc, the arc of a central angle of 90 degrees, so that the two folded edge is located at the junction of the direction of a straight line connecting the largest surface, curved design while increasing anti-packaging structure impact resistance and flexibility, to enhance both the upper and lower metal sheet fastness and heat transfer area connection, you can set the pressure inside of the solid metal portion of the arcuate curvature is solid, metal rectangular solid portion of the fan shape.

[0027] 优选的,所述引线引出结构为位于金属封装片弯折边沿之间的绝缘封闭层,所述绝缘封闭层具有位置和尺寸配合的凹槽。 [0027] Preferably, the lead terminal structure of bent sheet metal package is located in the insulating layer is enclosed between the edges, the insulating layer having a closed position and dimensions of the mating groove. 绝缘封闭层封闭了弯折边沿之间的空档,避免异物进入封装结构,并且进一步增强了封装结构强度,两个金属封装片的弯折边沿合在一起后,凹槽配合形成引线引出孔,方便引线引出。 Insulating sealing layer closed the gap between the bent edge, to avoid foreign body into the package structure, and further enhances the structural strength of the package, the package after bending the edge of the two pieces of metal together, the grooves are formed with wire leads hole, convenient wire leads.

[0028] 绝缘层可以选择橡胶,在受到冲击挤压时,橡胶可以吸收冲击力,减少对内部芯片的直接作用力。 [0028] The rubber insulating layer can be selected in the impact extrusion, rubber can absorb impact, reduce the direct force of the internal chip.

[0029] 可以在引线引出结构设置多个焊盘,焊盘实际为金属电极,通过导线或以其它形式与芯片引脚连接,优选的将芯片引脚与引线引出结构上的焊盘之间通过导电金属细丝连接,金属细丝两端分别焊接在引脚和焊盘上,金属细丝优选为金线,金线延展性和导电性俱佳,适合应用于内部空间狭窄的芯片封装。 [0029] In the wiring structure can lead to a plurality of pads, the actual metal electrode pads by wire or by other forms of chip connection pins, preferably the lead between the chip and the lead pin on the pad structure conductive metal filaments connected to a metal filament ends were welded to the pins and pads, metal filaments preferably a gold wire, gold wire ductility and conductivity superb, suitable for narrow space inside the chip package. 金线不应采用直线连接,而应具有一定弧度,保证封装中不易被拉断。 Gold wire connections should not be used straight, but should have a certain arc, guarantee package easily pulled off.

[0030] 第一金属封装片下方的金属导热片6与芯片本体上方连接,如图2所示,金属导热片与芯片本体2的连接处位于芯片中部,芯片边沿为各个引线焊盘,引线焊盘通过引线与封装结构的引脚连接,金属导热片可以设置为圆形,增大散热面积,金属导热片表面镀有绝缘膜,例如三氧化二铝,避免导热片与芯片本体上方电连接,绝缘膜的厚度不应超过15微米,金属导热片在固化芯片位置的同时,起到直接从芯片本体上表面传热的作用,通过第一金属封装片将热量散发,而无须再经过芯片本体传热,加强了散热效果,将两个金属封装片与芯片本体封装在一起后,在两个金属封装片之间的空腔内填入绝缘固化物,例如环氧树脂或其他材料等,使芯片本体在封装结构内保持固定。 [0030] The first metal heat-conducting sheet metal packaging sheet 6 above and below the chip body connection, shown in Figure 2, the thermally conductive sheet metal chip body 2 is connected at the middle of the chip, the chip edge for each lead pad, wire bonding the disc package pin connection lead structure, thermally conductive metal sheet can be set to circular, increase heat dissipation area, heat conductive metal sheet coated with an insulating film, e.g., alumina, to avoid thermally conductive sheet body and electrically connected to the top of the chip, The thickness of the insulating film should not exceed 15 microns, sheet metal thermal curing chip position at the same time, play the role of direct heat transfer from the surface of the chip body, by the first sheet metal package heat dissipation, instead of having to pass through the chip body heat, enhance the cooling effect, after the two sheet metal package together with the chip body package, the package sheet between two metal cavity filled with solidified insulating material, e.g., epoxy or other materials, so that the chip body remains fixed in the package structure.

[0031] 金属导热片与组成封装外壳的两个金属封装片之间实现粘结密封,形成稳固结构,封装外壳采用金属封装时,则封装外壳与金属导热片之间可采用熔融玻璃键合密封。 [0031] The thermally conductive sheet metal between two metal composition encapsulation shell encapsulation sheet and achieve bonding and sealing, to form a solid structure, when the encapsulation shell metal package, the package may be molten glass bond between the shell and the heat-conductive sheet metal fastener seal . 金属导热片可以采用导热性和延展性好的铜或密度低、结构坚固的铝材料。 Thermally conductive sheet metal can and ductility good heat conductivity of copper or low density, rugged aluminum materials.

[0032] 本发明所述的芯片封装件,设置两个金属封装片在芯片上下两面,在作为芯片封装保护结构的同时,起到从芯片上下两面同时散热的作用,特别是芯片上方发热无须穿过芯片本体自身,直接通过金属导热片传递散热,提高了芯片的散热效率,同时金属封装结构也增强了封装的牢固程度和柔韧性。 [0032] The chip package of the present invention, set up two metal packaging sheet in the upper and lower sides of the chip, a chip package in a protective structure at the same time, play from the chip at the same time the upper and lower sides of the cooling effect, especially above the chip fever without wear over the chip body itself is passed directly through sheet metal thermal cooling, improve the cooling efficiency of the chip, while metal packaging structure also enhance the package as strong and flexible.

[0033] 前文所述的为本发明的各个优选实施例,各个优选实施例中的优选实施方式如果不是明显自相矛盾或以某一优选实施方式为前提,各个优选实施方式都可以任意叠加组合使用,所述实施例以及实施例中的具体参数仅是为了清楚表述发明人的发明验证过程,并非用以限制本发明的专利保护范围,本发明的专利保护范围仍然以其权利要求书为准,凡是运用本发明的说明书及附图内容所作的等同结构变化,同理均应包含在本发明的保护范围内。 [0033] Preferably each of the previously described embodiment of the present invention, various preferred embodiments of the preferred embodiments, or if it is not obvious contradiction to a preferred embodiment as a precondition, the various preferred embodiments can be any combination of superimposed Use the embodiments and examples of the implementation of the specific parameters for clarity of presentation only the inventor of the verification process invention and are not intended to limit the scope of the present invention patent, patent protection of the invention is still in its claims prevail , who use the description and drawings made by the present invention is equivalent structural change, empathy should be included within the scope of the present invention.

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18 feb 2015C06Publication
25 mar 2015C10Entry into substantive examination
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