CN102751421A - Light emitting diode packaging structure - Google Patents
Light emitting diode packaging structure Download PDFInfo
- Publication number
- CN102751421A CN102751421A CN2011101726233A CN201110172623A CN102751421A CN 102751421 A CN102751421 A CN 102751421A CN 2011101726233 A CN2011101726233 A CN 2011101726233A CN 201110172623 A CN201110172623 A CN 201110172623A CN 102751421 A CN102751421 A CN 102751421A
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- Prior art keywords
- heat
- package structure
- unit
- conductive
- solder side
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- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 238000000926 separation method Methods 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 69
- 239000007787 solid Substances 0.000 claims description 18
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920006375 polyphtalamide Polymers 0.000 description 3
- 239000004954 Polyphthalamide Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- -1 silver Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The invention provides a light emitting diode packaging structure which comprises an insulating body, a heat conduction unit, two electric conduction units and a light emitting diode. The heat conducting unit and the electric conducting unit are both embedded in the insulating body and can not protrude out of the side face of the insulating body. The heat generated by the light emitting diode is conducted through the heat conducting unit and provides power to the light emitting diode through the electric conducting unit. In summary, the light emitting diode package structure of the present invention adopts a thermoelectric separation design, so as to improve the heat dissipation efficiency of the light emitting diode.
Description
Technical field
The present invention relates to a kind of encapsulating structure, relate in particular to a kind of package structure for LED.
Background technology
Because light-emitting diode has advantages such as low power consuming, the life-span is long, volume is little, has been widely used in the various illumination now.See also Fig. 1 and Fig. 2, Fig. 1 is for having the front view that package structure for LED 1 is arranged at a printed circuit board (PCB) M1 now, and Fig. 2 is the stereogram of existing package structure for LED 1.In figure in package structure for LED 1 via a scolding tin S1 crosswise fixed on a circuit board M1.Package structure for LED 1 comprise an insulating body 10, a conducting subassembly 20, an electrode 30, with a light-emitting diode 40.
Insulating body 10 is provided with a light-emitting area 11.Be arranged with a storage tank 12 on the light-emitting area 11.Conducting subassembly 20 is arranged at insulating body 10 with electrode 30, and is exposed to storage tank 12.Conducting subassembly 20 and electrode 30 can run through behind the side of insulating body 10 and towards circuit board M1 bending, form a weld part 21,31 by this respectively.Because weld part 21,31 protrudes in the side of insulating body 10, therefore must space one segment distance between the two adjacent package structure for LED 1, preventing weld part 21,31 contacts each other, and then cause short circuit.
In addition, as shown in Figure 2, conducting subassembly 20 is exposed to dorsal part 13 fully with electrode 30, so conducting subassembly 20 understands with electrode 30 and contact with air, receives oxidation easily, influences the conduction and the radiating efficiency of package structure for LED 1.
Light-emitting diode 40 is positioned at storage tank, and electrically connects conducting subassembly 20 and electrode 30 respectively.By knowing among the figure, therefore light-emitting diode 40 has influenced the heat dissipation of light-emitting diode 40 simultaneously by conducting subassembly 20 conduction heat and electric.
Prior art
1: package structure for LED
10: insulating body
11: light-emitting area
12: storage tank
13: dorsal part
20: conducting subassembly
21: weld part
30: electrode
31: weld part
40: light-emitting diode
M1: circuit board
S1: scolding tin
The present invention
2,2a: package structure for LED
100: insulating body
101: light-emitting area
102: solder side
103: the side
104: radiating surface
105a, 105b: fixing projection
106a, 106b: bottom surface
110: the reflection lid
111: the first solders side
112: the first sides
113: the first radiating surfaces
114: joint face
1141: connection opening
115: storage tank
116a, 116b: the first fixing projection
120: pedestal
121: the second solders side
1211: the heat conduction opening
1212: the first conduction openings
1213: the second conduction openings
122: the second sides
123: the second radiating surfaces
1231: radiating opening
124: Gu Jinping's face
125a, 125b: the second fixing projection
126: thermal trough
127: the first conductive troughs
128: the second conductive troughs
200: heat-conducting unit
201: the bottom side
210: heat-conducting part
220: the heat conduction weld part
221: the heat conduction end
222: arc convex
223: the bottom surface
230: arc-shaped concave
300,300a: first conductive unit
301: the bottom side
310: the first conductive parts
311: arc convex
320,320a: the first conductive solder portion
321: the bottom surface
330: arc-shaped concave
400,400a: second conductive unit
401: the bottom side
410: the second conductive parts
411: arc convex
420,420a: the second conductive solder portion
421: the bottom surface
422: projection
430: arc-shaped concave
500: light-emitting diode
M1: printed circuit board (PCB)
W1: lead
A1, A2: angle
D1: bearing of trend
D2, D2 ': light emission direction
P1: plane
Summary of the invention
In order to solve the disappearance of above-mentioned prior art; The object of the invention is for providing a kind of package structure for LED, and it takes the thermoelectric design that separates, and can not give prominence to conductive unit in the both sides of insulating body; Cause short circuit to prevent that two adjacent package structure for LED from electrically connecting; In addition, insulating body also coats most heat-conducting unit and conductive unit, to prevent heat-conducting unit and conductive unit oxidation.
In order to reach above-mentioned purpose, the present invention provides a kind of package structure for LED, comprises an insulating body, a heat-conducting unit, two conductive units, a light-emitting diode.Insulating body is provided with a light-emitting area and a solder side, and is arranged with a storage tank by light-emitting area, and the bottom of storage tank also is provided with a solid Jinping face.Heat-conducting unit is embedded in insulating body, and is exposed to solder side and solid Jinping face.Conductive unit is embedded in insulating body and is exposed to solder side and solid Jinping face, and conductive unit and heat-conducting unit are mutual separations.
Light-emitting diode is arranged at heat-conducting unit and is positioned at the bottom of storage tank, and electrically connects two conductive units.Wherein heat-conducting unit conduction heat to the solder side that light-emitting diode produced is outside.Wherein insulating body is provided with two relative sides, and heat-conducting unit and conductive unit can not expose or the rough side that protrudes in.
In sum, package structure for LED of the present invention has been taked the design of thermoelectric separation, can improve the radiating efficiency of light-emitting diode.In addition; Heat-conducting unit and conductive unit can not expose or the rough side that protrudes in, and can shorten the spacing of two adjacent package structure for LED, in addition; Heat-conducting unit and conductive unit major part are imbedded in the insulating body, therefore can prevent the oxidation of heat-conducting unit and conductive unit.
Description of drawings
Fig. 1 is arranged at the front view of a printed circuit board (PCB) for existing package structure for LED;
Fig. 2 is the stereogram of existing package structure for LED;
Fig. 3 is the stereogram of the package structure for LED of the first embodiment of the present invention;
Fig. 4 is the exploded view of the package structure for LED of the first embodiment of the present invention;
Fig. 5 is arranged at the front-view schematic diagram of a printed circuit board (PCB) for package structure for LED of the present invention;
Fig. 6 and Fig. 7 are arranged at the schematic side view of a printed circuit board (PCB) for package structure for LED of the present invention; And
Fig. 8 is the stereogram of the package structure for LED of the second embodiment of the present invention.
Reference numeral:
Embodiment
See also Fig. 3 to Fig. 4, Fig. 3 is the stereogram of the package structure for LED 2 of the first embodiment of the present invention, and Fig. 4 is the exploded view of the package structure for LED 2 of the first embodiment of the present invention.Package structure for LED 2 comprises an insulating body 100, a heat-conducting unit 200, one first conductive unit 300, one second conductive unit 400 and a light-emitting diode 500.Insulating body 100 can be made by plastic material, for example polyphthalamide (Polyphthalamide, PPA) plastics.
Insulating body 100 can extend along a bearing of trend D1; And be provided with the relative side of a light-emitting area 101, a solder side 102, two 103, a radiating surface 104, with two fixedly projection 105a, 105b; Wherein light-emitting area 101 is perpendicular to a light emission direction D2 and adjoining solder side 102, side 103 and radiating surface 104; Solder side 102 and radiating surface 104 are arranged at the two opposite sides of insulating body 100 respectively, and fixedly projection 105a, 105b are arranged on the solder side 102.Insulating body 100 comprises that a reflection covers 110 and one pedestal 120.In another embodiment, the reflection cover 110 and pedestal 120 be formed in one.
Reflection is covered 110 and is provided with aforesaid light-emitting area 101, one first solder side 111,2 first sides 112, one first radiating surface 113, a joint face 114.Adjoining first solder side 111 of light-emitting area 101, first side 112 and first radiating surface 113; Light-emitting area 101 is arranged at reflection respectively with joint face 114 and cover 110 two opposite sides, and first solder side 111 and first radiating surface 113 are arranged at respectively to reflect and cover 110 other two opposite sides.Light-emitting area 101 is concaved with a storage tank 115, in storage tank 115, can fill a package material, and with protection light-emitting diode 500, this package material is a prior art, does not further describe in this.Joint face 114 is provided with a connection opening 1141, and connection opening 1141 is interconnected with storage tank 115.Reflection is covered 110 and is also comprised 2 first fixedly projection 116a, 116b are arranged at aforesaid first solder side 111.
Gu Jinping's face 124 is concaved with a thermal trough 126, one first conductive trough 127 and one second conductive trough 128.Second solder side 121 is provided with a heat conduction opening 1211, one first conduction opening 1212 and one second and conducts electricity opening 1213.Second radiating surface 123 is provided with a radiating opening 1231.Thermal trough 126 is interconnected with heat conduction opening 1211 and radiating opening 1231 respectively, and wherein heat conduction opening 1211 can be oppositely arranged with radiating opening 1231, and heat conduction opening 1211 also can be greater than radiating opening 1231.First conductive trough 127 and the first conduction opening 1212 are interconnected, and second conductive trough 128 and the second conduction opening 1213 are interconnected.
It is made that heat-conducting unit 200 can be metal material; Heat-conducting unit 200 is embedded in insulating body 100; And be exposed to solder side 102 and solid Jinping face 124, but not being exposed to the side 103 of insulating body 100, heat-conducting unit 200 can not protrude in solid Jinping face 124 and protrude in second solder side 121 in present embodiment; In another embodiment, heat-conducting unit 200 can protrude in solid Jinping face 124 and not protrude in second solder side 121.Heat-conducting unit 200 can be a T type structure, and can be placed in the thermal trough 126 of pedestal 120.
Heat-conducting unit 200 comprises a heat-conducting part 210 and a heat conduction weld part 220.Heat-conducting part 210 can protrude in second solder side 121 via heat conduction opening 1211, and heat conduction weld part 220 can protrude in second radiating surface 123 via radiating opening 1231.Heat conduction weld part 220 is connected in heat-conducting part 210, and the width of heat conduction weld part 220 is greater than the width of heat-conducting part 210.Heat-conducting part 210 forms an arc-shaped concave 230 with the sidewall of the junction of heat conduction weld part 220.Heat conduction weld part 220 comprises two relative heat conduction ends 221.Heat conduction end 221 protrudes in heat-conducting part 210, and in being provided with an arc convex 222.In addition, aforesaid heat-conducting part 210 is not exposed to second side 122 with heat conduction weld part 220.
First conductive unit 300 is embedded in insulating body 100; And be exposed to solder side 102 and consolidate Jinping's face 124; First conductive unit 300 can not protrude in solid Jinping face 124 and protrude in second solder side 121 in present embodiment; In another embodiment, first conductive unit 300 can protrude in solid Jinping face 124 and not protrude in second solder side 121.First conductive unit 300 is separated with heat-conducting unit 200 each other.
First conductive unit 300 can be placed in first conductive trough 127, and is provided with one first conductive part 310 and the first conductive solder portion 320.The sidewall of first conductive part 310 be provided with one be matched with arc-shaped concave 230 arc convex 311.The sidewall that the first conductive solder portion 320 is connected in the junction of first conductive part, 310, the first conductive parts 310 and the first conductive solder portion 320 forms an arc-shaped concave 330, and arc-shaped concave 330 is matched with the arc convex 222 of heat conduction end 221.The first conductive solder portion 320 can protrude in second solder side 121 via the first conduction opening 1212.
Second conductive unit 400 is embedded in insulating body 100; And be exposed to solder side 102 and consolidate Jinping's face 124; Second conductive unit 400 can not protrude in solid Jinping face 124 and protrude in second solder side 121 in present embodiment; In another embodiment, second conductive unit 400 can protrude in solid Jinping face 124 and not protrude in second solder side 121.Second conductive unit 400 is separated with heat-conducting unit 200 each other.
Second conductive unit 400 can be placed in second conductive trough 128, and is provided with one second conductive part 410 and the second conductive solder portion 420.The sidewall of second conductive part 410 be provided with one be matched with arc-shaped concave 230 arc convex 411.The sidewall that the second conductive solder portion 420 is connected in the junction of second conductive part, 410, the second conductive parts 410 and the second conductive solder portion 420 forms an arc-shaped concave 430, and arc-shaped concave 430 is matched with the arc convex 222 of heat conduction end 221.The second conductive solder portion 420 can protrude in second solder side 121 via the second conduction opening 1213.
By finding out that the heat-conducting unit 200, first conductive unit 300 and second conductive unit 400 that are exposed to second solder side 121 can be along bearing of trend D1 linear array among the figure.Except heat-conducting unit 200, first conductive unit 300 and second conductive unit 400 expose or the part of the solder side 102 that protrudes in insulating body 100 and radiating surface 104; The bottom side 201,301,401 of heat-conducting unit 200, first conductive unit 300 and second conductive unit 400 is all imbedded insulating body 100 or is insulated 100 of bodies and covers; Therefore can prevent that most bottom side 201,301,401 from contacting with air, and then receive oxidation.
In addition in present embodiment; The surface of heat-conducting unit 200, first conductive unit 300 and second conductive unit 400 can coat a reflector (figure does not show); This reflector can be made up of highly reflective metals such as silver, and the mode that the reflector can be electroplated is arranged on the heat-conducting unit 200.
Light-emitting diode 500 can be arranged at the heat-conducting part 210 of heat-conducting unit 200 and be positioned at storage tank 115, and electrically connects first conductive unit 300 and second conductive unit 400 respectively via lead W1.The light that light-emitting diode 500 is produced can penetrate via light-emitting area 101 along light emission direction D2, also can penetrate via light-emitting area 101 after the surface reflection via the sidewall of storage tank 115 again.
The heat that light-emitting diode 500 is produced conducts to heat conduction weld part 220 via the heat-conducting part 210 of heat-conducting unit 200, and light-emitting diode 500 can provide electric power via first conductive unit 300 and second conductive unit 400.Because it is hot that heat-conducting unit 200 only conduct, first conductive unit 300 and second conductive unit 400 be conduct power only, so the package structure for LED 2 of present embodiment can be an electric heating separated structures, can improve the radiating efficiency of light-emitting diode 500.
Please consult Fig. 5 and Fig. 6 in the lump, Fig. 5 is the front-view schematic diagram that package structure for LED 2 of the present invention is arranged at a printed circuit board (PCB) M1, and Fig. 6 is arranged at the schematic side view of a printed circuit board (PCB) M1 for package structure for LED 2 of the present invention.At this moment, package structure for LED 2 is arranged at the edge of printed circuit board (PCB) M1 along aforesaid bearing of trend D1, and wherein light-emitting area 101 can be perpendicular to printed circuit board (PCB) M1, and light emission direction D2 can and be parallel to printed circuit board (PCB) M1 perpendicular to light-emitting area 101.
By finding out that heat-conducting unit 200, first conductive unit 300 and second conductive unit 400 all are not exposed to the side 103 of insulating body 100 among the figure.When package structure for LED 2 on bearing of trend D1 be arranged in printed circuit board (PCB) M1 the time, two adjacent package structure for LED 2 can be arranged more closely.Therefore, can arrange more package structure for LED 2 in printed circuit board (PCB) M1 in bearing of trend D1.
In Fig. 6, can find out; Insulating body 100 is roughly by the solid Jinping face 124 of pedestal 120; This gradually narrow structure can help the manufacturing process when insulating body 100 takes out from mould (figure does not show); Can cause second solder side 121 to tilt with respect to printed circuit board (PCB) M1, so cause that light-emitting area 101 can't be firm perpendicular to printed circuit board (PCB) M1.
Yet, in present embodiment, be provided with aforesaid fixedly projection 105a between the heat-conducting unit 200 and first conductive unit 300, be provided with aforesaid fixedly projection 105b between the heat-conducting unit 200 and second conductive unit 400.In addition; Like Fig. 5 and shown in Figure 6; Fixedly the bottom surface 321,421 of bottom surface 223, the first conductive solder portion 320 and the second conductive solder portion 420 of the bottom surface 106a of projection 105a, 105b, 106b, heat conduction weld part 220 is positioned on the same plane P 1, and wherein printed circuit board (PCB) M1 can extend along plane P 1.Plane P 1 can be extended along light emission direction D2, and can and second solder side 121 between form an included angle A 1, use making light-emitting area 101 perpendicular to plane P 1 and printed circuit board (PCB) M1.Therefore, present embodiment can make package structure for LED 2 firmly be arranged on the printed circuit board (PCB) M1 and keep light-emitting area 101 perpendicular to printed circuit board (PCB) M1.
In addition in present embodiment, can be by the included angle A 1 that changes between bottom surface 106a, 106b and bottom surface 223,321,421 (just plane P 1) and second solder side 121, and then change light emission direction D2.Please consult Fig. 7 in the lump, wherein by changing the angle of inclination of plane P 1, so that form included angle A 2 between the plane P 1 and second solder side 121 with respect to solder side 121.Therefore, light-emitting area 101 can tilt with respect to plane P 1, and then the light emission direction D2 of change Fig. 6 is the light emission direction D2 ' of Fig. 7.
Please refer to Fig. 8, be the stereogram of the package structure for LED 2a of the second embodiment of the present invention.The main difference part of the present embodiment and first embodiment is; Second 420a of conductive solder portion of first 320a of conductive solder portion of the first conductive unit 300a and the second conductive unit 400a runs through respectively and rough second side 122 that protrudes in, and is respectively equipped with a projection 422 in first 320a of conductive solder portion and second 420a of conductive solder portion of second side 122.
Therefore; The first conductive unit 300a of present embodiment and the second conductive unit 400a also can be as protruding in the side 103 of insulating body 100 as the prior art; But only rough second side 122 that protrudes in of the first conductive unit 300a of present embodiment and the second conductive unit 400a, it can significantly reduce the conducting subassembly of prior art or the outstanding width of electrode.In addition, the first conductive unit 300a of present embodiment and the second conductive unit 400a can be can reach the purpose that protrudes in second side 122 via bending, can compared to the conducting subassembly of prior art or electrode bending structure improve conductance.
In sum, package structure for LED of the present invention has been taked the design of thermoelectric separation, can improve the radiating efficiency of light-emitting diode.In addition; Heat-conducting unit and conductive unit can not expose or the rough side that protrudes in, and can shorten the spacing of two adjacent package structure for LED, in addition; Heat-conducting unit and conductive unit major part are imbedded in the insulating body, therefore can prevent the oxidation of heat-conducting unit and conductive unit.
Though the present invention discloses as above with various embodiment, however its be merely example with reference to but not in order to limiting scope of the present invention, any under the those of ordinary skill of technical field, when can doing a little change and retouching, and do not break away from the spirit and scope of the present invention.
Claims (12)
1. package structure for LED comprises:
One insulating body is provided with a light-emitting area and a solder side, and is arranged with a storage tank by this light-emitting area, and the bottom of this storage tank also is provided with a solid Jinping face;
One heat-conducting unit is embedded in this insulating body, and is exposed to this solder side and is somebody's turn to do solid Jinping face;
Two conductive units are embedded in this insulating body, and are exposed to this solder side and are somebody's turn to do solid Jinping face, and said conductive unit and this heat-conducting unit are mutual separations; And
One light-emitting diode is arranged at this heat-conducting unit and is positioned at the bottom of this storage tank, and electrically connects this two conductive unit;
Wherein this heat-conducting unit conduction heat that this light-emitting diode produced is outside to this solder side.
2. package structure for LED according to claim 1, wherein this insulating body is provided with two relative sides, and this heat-conducting unit and said conductive unit are not exposed to said side.
3. package structure for LED according to claim 2, wherein said side and this solder side are adjoining respectively in this light-emitting area.
4. package structure for LED according to claim 1, wherein this heat-conducting unit of this solder side and said conductive unit are linear array.
5. package structure for LED according to claim 1, wherein this heat-conducting unit and said conductive unit all are exposed to this solid Jinping face and this solder side.
6. package structure for LED according to claim 5, wherein this heat-conducting unit protrudes in this solid Jinping face and this solder side.
7. package structure for LED according to claim 5, wherein said conductive unit protrude in this solid Jinping face and this solder side.
8. package structure for LED according to claim 1 also comprises a fixing projection, is arranged at this solder side.
9. package structure for LED according to claim 8, wherein should be fixedly projection between this heat-conducting unit and said conductive unit.
10. package structure for LED according to claim 8 wherein should fixedly the bottom surface and the solder side of projection have an angle.
11. package structure for LED according to claim 9, wherein fixedly the bottom surface of projection and the bottom surface of this heat-conducting unit are positioned on the same plane.
12. package structure for LED according to claim 1, wherein this heat-conducting unit and said conductive unit coat a reflector.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100113489 | 2011-04-19 | ||
| TW100113489A TWI455379B (en) | 2011-04-19 | 2011-04-19 | Packaging structure of light emitted diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102751421A true CN102751421A (en) | 2012-10-24 |
Family
ID=47031443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101726233A Pending CN102751421A (en) | 2011-04-19 | 2011-06-24 | Light emitting diode packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102751421A (en) |
| TW (1) | TWI455379B (en) |
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| US20090189174A1 (en) * | 2008-01-28 | 2009-07-30 | Alti-Electronics Co., Ltd. | Light emitting diode package |
| JP2009267318A (en) * | 2008-04-28 | 2009-11-12 | Eeshikku Kk | Both-side light-emitting led package |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI456784B (en) * | 2008-07-29 | 2014-10-11 | Nichia Corp | Light emitting device |
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2011
- 2011-04-19 TW TW100113489A patent/TWI455379B/en active
- 2011-06-24 CN CN2011101726233A patent/CN102751421A/en active Pending
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|---|---|---|---|---|
| US20050133939A1 (en) * | 2003-12-17 | 2005-06-23 | Sharp Kabushiki Kaisha | Semiconductor light emitting device |
| CN200959342Y (en) * | 2006-09-11 | 2007-10-10 | 亿光电子工业股份有限公司 | LED device |
| CN101399301A (en) * | 2007-09-25 | 2009-04-01 | 一诠精密工业股份有限公司 | Surface adhesive conducting wire rack |
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| JP2009267318A (en) * | 2008-04-28 | 2009-11-12 | Eeshikku Kk | Both-side light-emitting led package |
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| Publication number | Publication date |
|---|---|
| TWI455379B (en) | 2014-10-01 |
| TW201244189A (en) | 2012-11-01 |
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