CN101454911A - 电子组件的安装装置、系统和方法 - Google Patents
电子组件的安装装置、系统和方法 Download PDFInfo
- Publication number
- CN101454911A CN101454911A CNA2007800196439A CN200780019643A CN101454911A CN 101454911 A CN101454911 A CN 101454911A CN A2007800196439 A CNA2007800196439 A CN A2007800196439A CN 200780019643 A CN200780019643 A CN 200780019643A CN 101454911 A CN101454911 A CN 101454911A
- Authority
- CN
- China
- Prior art keywords
- lead wire
- recess
- wire unit
- shell
- extends
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/277,717 | 2006-03-28 | ||
US11/277,717 US7675145B2 (en) | 2006-03-28 | 2006-03-28 | Apparatus, system and method for use in mounting electronic elements |
PCT/IB2007/002432 WO2007141664A2 (en) | 2006-03-28 | 2007-03-27 | Apparatus, system and method for use in mounting electronic elements |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110039138.9A Division CN102137573B (zh) | 2006-03-28 | 2007-03-27 | 表面贴装器件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101454911A true CN101454911A (zh) | 2009-06-10 |
CN101454911B CN101454911B (zh) | 2011-04-20 |
Family
ID=38574337
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110039138.9A Expired - Fee Related CN102137573B (zh) | 2006-03-28 | 2007-03-27 | 表面贴装器件 |
CN2007800196439A Active CN101454911B (zh) | 2006-03-28 | 2007-03-27 | 电子组件的安装装置、系统和方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110039138.9A Expired - Fee Related CN102137573B (zh) | 2006-03-28 | 2007-03-27 | 表面贴装器件 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7675145B2 (zh) |
CN (2) | CN102137573B (zh) |
WO (1) | WO2007141664A2 (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
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US20080246397A1 (en) * | 2007-04-04 | 2008-10-09 | Bily Wang | Manufacturing method of white light led and structure thereof |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
JP4683053B2 (ja) * | 2008-01-28 | 2011-05-11 | 日亜化学工業株式会社 | 射出成形用金型及びこれによって成形される半導体パッケージ並びに半導体パッケージの製造方法 |
JP5464825B2 (ja) * | 2008-07-23 | 2014-04-09 | ローム株式会社 | Ledモジュール |
DE102008048259A1 (de) * | 2008-09-22 | 2010-04-08 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauteil |
US10431567B2 (en) | 2010-11-03 | 2019-10-01 | Cree, Inc. | White ceramic LED package |
US8101955B2 (en) * | 2009-04-17 | 2012-01-24 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | PLCC package with a reflector cup surrounded by an encapsulant |
US8089075B2 (en) * | 2009-04-17 | 2012-01-03 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | LFCC package with a reflector cup surrounded by a single encapsulant |
US20120056793A1 (en) * | 2009-05-22 | 2012-03-08 | Taiki Sato | Reflector and parabolic antenna using the same |
US8101962B2 (en) * | 2009-10-06 | 2012-01-24 | Kuang Hong Precision Co., Ltd. | Carrying structure of semiconductor |
US8178961B2 (en) * | 2010-04-27 | 2012-05-15 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and package process |
US9831393B2 (en) * | 2010-07-30 | 2017-11-28 | Cree Hong Kong Limited | Water resistant surface mount device package |
USD665367S1 (en) * | 2011-08-12 | 2012-08-14 | Silitek Electronic (Guangzhou) Co., Ltd. | Package carrier |
USD665366S1 (en) * | 2011-08-12 | 2012-08-14 | Silitek Electronic (Guangzhou) Co., Ltd. | Package carrier |
JP6102187B2 (ja) * | 2012-10-31 | 2017-03-29 | 日亜化学工業株式会社 | 発光装置用パッケージ及びそれを用いた発光装置 |
JP6107136B2 (ja) | 2012-12-29 | 2017-04-05 | 日亜化学工業株式会社 | 発光装置用パッケージ及びそれを備える発光装置、並びにその発光装置を備える照明装置 |
US9711489B2 (en) | 2013-05-29 | 2017-07-18 | Cree Huizhou Solid State Lighting Company Limited | Multiple pixel surface mount device package |
JP6484396B2 (ja) | 2013-06-28 | 2019-03-13 | 日亜化学工業株式会社 | 発光装置用パッケージ及びそれを用いた発光装置 |
CN103594604A (zh) * | 2013-10-30 | 2014-02-19 | 王定锋 | 电极被全包裹封装的led支架、贴片型led灯及其制造方法 |
DE102013225552A1 (de) * | 2013-12-11 | 2015-06-11 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
JP6374723B2 (ja) | 2014-07-25 | 2018-08-15 | スタンレー電気株式会社 | 半導体発光装置 |
CN106571383B (zh) | 2015-10-08 | 2020-04-28 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
JP1563810S (zh) * | 2016-03-24 | 2016-11-21 | ||
CN108540086A (zh) * | 2018-01-18 | 2018-09-14 | 浙江人和光伏科技有限公司 | 一种太阳能电池接线盒的导电模块 |
TWI713237B (zh) * | 2018-08-01 | 2020-12-11 | 大陸商光寶光電(常州)有限公司 | 發光二極體封裝結構 |
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2006
- 2006-03-28 US US11/277,717 patent/US7675145B2/en active Active
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2007
- 2007-03-27 CN CN201110039138.9A patent/CN102137573B/zh not_active Expired - Fee Related
- 2007-03-27 CN CN2007800196439A patent/CN101454911B/zh active Active
- 2007-03-27 WO PCT/IB2007/002432 patent/WO2007141664A2/en active Application Filing
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US20100133002A1 (en) | 2010-06-03 |
WO2007141664A3 (en) | 2008-03-20 |
US7675145B2 (en) | 2010-03-09 |
WO2007141664A8 (en) | 2008-07-10 |
US9035439B2 (en) | 2015-05-19 |
CN101454911B (zh) | 2011-04-20 |
CN102137573B (zh) | 2015-06-24 |
WO2007141664A2 (en) | 2007-12-13 |
US20070235845A1 (en) | 2007-10-11 |
CN102137573A (zh) | 2011-07-27 |
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