CN101127350A - 用于安装电子元件的装置、系统和方法 - Google Patents
用于安装电子元件的装置、系统和方法 Download PDFInfo
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- CN101127350A CN101127350A CNA2007101423107A CN200710142310A CN101127350A CN 101127350 A CN101127350 A CN 101127350A CN A2007101423107 A CNA2007101423107 A CN A2007101423107A CN 200710142310 A CN200710142310 A CN 200710142310A CN 101127350 A CN101127350 A CN 101127350A
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Images
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
- H01L2224/48097—Kinked the kinked part being in proximity to the bonding area outside the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210046248.2A CN102569273B (zh) | 2006-08-16 | 2007-08-16 | 表面安装器件及其制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/465,120 | 2006-08-16 | ||
US11/465,120 US8367945B2 (en) | 2006-08-16 | 2006-08-16 | Apparatus, system and method for use in mounting electronic elements |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210046248.2A Division CN102569273B (zh) | 2006-08-16 | 2007-08-16 | 表面安装器件及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101127350A true CN101127350A (zh) | 2008-02-20 |
CN101127350B CN101127350B (zh) | 2012-05-09 |
Family
ID=39095326
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210046248.2A Active CN102569273B (zh) | 2006-08-16 | 2007-08-16 | 表面安装器件及其制造方法 |
CN2007101423107A Active CN101127350B (zh) | 2006-08-16 | 2007-08-16 | 用于安装电子元件的装置、系统和方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210046248.2A Active CN102569273B (zh) | 2006-08-16 | 2007-08-16 | 表面安装器件及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8367945B2 (zh) |
JP (1) | JP5442189B2 (zh) |
CN (2) | CN102569273B (zh) |
DE (1) | DE102007038320A1 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102130266A (zh) * | 2010-01-20 | 2011-07-20 | 旭丽电子(广州)有限公司 | 封装结构及发光二极管封装结构 |
CN102280424A (zh) * | 2011-06-08 | 2011-12-14 | 无敌科技(西安)有限公司 | 非挥发性内存装置、集成电路装置及集成电路制造方法 |
CN102956628A (zh) * | 2011-08-18 | 2013-03-06 | 乐金显示有限公司 | 发光二极管封装 |
WO2013075309A1 (en) * | 2011-11-24 | 2013-05-30 | Cree Huizhou Solid State Lighting Company Limited | Water resistant led devices and led display including the same |
CN103460416A (zh) * | 2011-02-10 | 2013-12-18 | 日亚化学工业株式会社 | 发光装置、发光装置的制造方法及封装阵列 |
CN104396036A (zh) * | 2012-05-31 | 2015-03-04 | 克利公司 | 光发射器封装、系统、以及方法 |
CN105977246A (zh) * | 2015-03-11 | 2016-09-28 | Lg伊诺特有限公司 | 发光器件 |
CN107431116A (zh) * | 2015-03-18 | 2017-12-01 | Lg伊诺特有限公司 | 发光器件和具有发光器件的相机模块 |
Families Citing this family (31)
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US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US7928462B2 (en) * | 2006-02-16 | 2011-04-19 | Lg Electronics Inc. | Light emitting device having vertical structure, package thereof and method for manufacturing the same |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US7993038B2 (en) * | 2007-03-06 | 2011-08-09 | Toyoda Gosei Co., Ltd. | Light-emitting device |
CN101388161A (zh) * | 2007-09-14 | 2009-03-18 | 科锐香港有限公司 | Led表面安装装置和并入有此装置的led显示器 |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
JP5416975B2 (ja) * | 2008-03-11 | 2014-02-12 | ローム株式会社 | 半導体発光装置 |
WO2010022538A1 (zh) * | 2008-08-26 | 2010-03-04 | Pan Dingguo | 发光二极管多芯片贴片及装有该贴片的灯条 |
US10431567B2 (en) | 2010-11-03 | 2019-10-01 | Cree, Inc. | White ceramic LED package |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
USD661262S1 (en) * | 2009-10-26 | 2012-06-05 | Nichia Corporation | Light emitting diode |
DE102009058421A1 (de) * | 2009-12-16 | 2011-06-22 | OSRAM Opto Semiconductors GmbH, 93055 | Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil |
TWI427745B (zh) * | 2010-01-20 | 2014-02-21 | Lite On Electronics Guangzhou | 封裝結構及發光二極體封裝結構 |
US8901583B2 (en) | 2010-04-12 | 2014-12-02 | Cree Huizhou Opto Limited | Surface mount device thin package |
JP5507330B2 (ja) | 2010-04-27 | 2014-05-28 | ローム株式会社 | Ledモジュール |
KR101705700B1 (ko) * | 2010-07-01 | 2017-02-10 | 엘지이노텍 주식회사 | 발광 소자 |
US9831393B2 (en) | 2010-07-30 | 2017-11-28 | Cree Hong Kong Limited | Water resistant surface mount device package |
US9240395B2 (en) | 2010-11-30 | 2016-01-19 | Cree Huizhou Opto Limited | Waterproof surface mount device package and method |
JP2012238830A (ja) * | 2011-05-09 | 2012-12-06 | Lumirich Co Ltd | 発光ダイオード素子 |
CN103137825B (zh) * | 2011-11-30 | 2016-06-01 | 光宝电子(广州)有限公司 | 发光二极管基板结构、发光二极管单元及其光源模块 |
TW201330332A (zh) * | 2012-01-02 | 2013-07-16 | Lextar Electronics Corp | 固態發光元件及其固態發光封裝體 |
US10504719B2 (en) * | 2012-04-25 | 2019-12-10 | Applied Materials, Inc. | Cooled reflective adapter plate for a deposition chamber |
US9239135B2 (en) * | 2012-07-25 | 2016-01-19 | Tyco Electronics Corporation | LED connector |
US9711489B2 (en) | 2013-05-29 | 2017-07-18 | Cree Huizhou Solid State Lighting Company Limited | Multiple pixel surface mount device package |
US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
DE102014110074A1 (de) * | 2014-07-17 | 2016-01-21 | Osram Opto Semiconductors Gmbh | Elektronisches Bauelement, Leiterrahmen und Verfahren zum Herstellen eines elektronischen Bauelements |
US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
USD740998S1 (en) * | 2014-09-11 | 2015-10-13 | Michael Olen NEVINS | Reflector |
JP6811183B2 (ja) * | 2015-03-06 | 2021-01-13 | ルミレッズ ホールディング ベーフェー | 非対称分布されたledチップを有するledベースの照明装置 |
US10311265B2 (en) * | 2016-03-04 | 2019-06-04 | Assa Abloy Ab | Universal mounting ring |
CN110289341A (zh) * | 2019-06-12 | 2019-09-27 | 浙江英特来光电科技有限公司 | 一种与印刷线路板增加结合力的全彩smd led及其安装方法 |
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CN104396036A (zh) * | 2012-05-31 | 2015-03-04 | 克利公司 | 光发射器封装、系统、以及方法 |
US10439112B2 (en) | 2012-05-31 | 2019-10-08 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
CN105977246A (zh) * | 2015-03-11 | 2016-09-28 | Lg伊诺特有限公司 | 发光器件 |
CN105977246B (zh) * | 2015-03-11 | 2020-04-28 | Lg伊诺特有限公司 | 发光器件 |
CN107431116A (zh) * | 2015-03-18 | 2017-12-01 | Lg伊诺特有限公司 | 发光器件和具有发光器件的相机模块 |
CN107431116B (zh) * | 2015-03-18 | 2020-02-11 | Lg伊诺特有限公司 | 发光器件和具有发光器件的相机模块 |
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CN102569273B (zh) | 2015-09-30 |
US8367945B2 (en) | 2013-02-05 |
US20080041625A1 (en) | 2008-02-21 |
CN102569273A (zh) | 2012-07-11 |
JP5442189B2 (ja) | 2014-03-12 |
JP2008047916A (ja) | 2008-02-28 |
CN101127350B (zh) | 2012-05-09 |
DE102007038320A1 (de) | 2008-04-17 |
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