CN101005109A - Low height lead frame for LED device and the manufacturing method thereof - Google Patents
Low height lead frame for LED device and the manufacturing method thereof Download PDFInfo
- Publication number
- CN101005109A CN101005109A CN 200610172361 CN200610172361A CN101005109A CN 101005109 A CN101005109 A CN 101005109A CN 200610172361 CN200610172361 CN 200610172361 CN 200610172361 A CN200610172361 A CN 200610172361A CN 101005109 A CN101005109 A CN 101005109A
- Authority
- CN
- China
- Prior art keywords
- led device
- lead frame
- low height
- resin
- wall section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 239000007769 metal material Substances 0.000 claims abstract description 13
- 238000005452 bending Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 7
- 150000002148 esters Chemical class 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 2
- 230000002159 abnormal effect Effects 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000000994 depressogenic effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Provided is a small size LED apparatus which will not easily cause separation between the lead frame and the resin and resin crack, and has a height lower than 1 mm. In addition, a manufacturing method for the small size LED apparatus is also provided. The small size LED apparatus uses the lead frame to drill the long and abnormal metal material which arranged in order with common part, thin wall part and common part in longer direction with a thickness rate of 2.5:1-3.5:1, forms a chip pad part and an inner wire part on the thin wall part, forms an external wire part on the common part, and jets a formed resin cup shape part, and cuts off the external wire part to form the end part for the external wire part and will not bend the external wire part.
Description
Technical field
The present invention relates to a kind of low height lead frame for LED device that is used to make small size LED (light-emitting diode) device.The manufacture method that also relates to low height lead frame for LED device in addition.
Background technology
Fig. 7 is the orthogonal view of existing LED device.
Make the plate-shape metal material of the length of thickness homogeneous be undertaken passing through emission forming machine after the multistage punch process by multiple position press, on chip pad portion and the 12a of inner lead portion, 12b, carry out ester moulding, form the resin cupule, then outside wire portion 12c, 12d, 12e, 12f are carried out 90 ° of bending machining 2 positions, be configured as " コ " word shape, front end 12d, the 12f of outer lead portion and the bottom surface 10d of resin cupule are connected airtight, be made as root 12c, the 12e of outer lead portion parallel with the side 10c of resin cupule.
Be formed with top 10a, medial surface 10b and the interior top 10f of resin cupule, with interior top 10f adjacency, the 12a of inner lead portion, 12b are electrically insulated mutually and are exposed.Medial surface 10b vertically is inclination, along with the space that forms expansion towards the top.
And medial surface 10b plays a role as reflecting surface.Not shown led chip is sticked on above resin cupule interior, process implementing the wire-bonded that is connected with gold thread with the 12a of inner lead portion, 12b that the electrode pair of led chip is answered.
The height of existing LED device is minimum also 1.4mm, but in recent years the demand height less than the LED device of 1mm.
In existing LED device, in order to reduce height, and the thickness of the part of the resin under the minimizing lead frame, also attempt the root 12c of the corresponding outer lead of shortening portion, the length of 12e simultaneously, be applied to bending stress on the lead frame when excessive, with regard to occur in easily produce between lead frame and the resin peel off or resin on problem such as crack appears.Therefore, the epoxy resin of sealing usefulness leaks into the outside by stripping portion and crack portion easily, becomes the defective of LED device.
Summary of the invention
Therefore, the object of the invention is, provide between a kind of difficult generation lead frame and the resin peel off with the resin crack, the small size LED device of simultaneous altitude below 1mm.The manufacture method of this small size LED device also is provided in addition.
In order to reach above-mentioned purpose, the present inventor person studies intensively with keen determination, with the diverse design of existing LED device, finished LED device lead frame of the present invention.
Above-mentioned purpose is reached by first related low height lead frame for LED device of following the present invention, promptly, to the thickness ratio be 2.5: 1～3.5: 1, on length direction according to common portion and thinner wall section and the irregularly shaped metal material of the tactic length of the portion processing of holing usually, form chip pad portion and inner lead portion in thinner wall section, usually forming outer lead portion in the portion, secondly, injection molding resin cupule, cut off the end that forms outer lead portion afterwards, do not make the bending of outer lead portion.
Described in second of the present invention, in preferred implementation of the present invention, 3 led chips such as R, G, B can be installed.
Described in the 3rd of the present invention, in preferred implementation of the present invention, highly be below the 1mm.
In addition, purpose of the present invention also can be by the 4th of the present invention the manufacture method of low height lead frame for LED device reach, promptly, by multiple position press and emission forming machine, to the thickness ratio of common portion and thinner wall section be 2.5: 1～3.5: 1, on length direction by the irregularly shaped metal material of the tactic length of common portion and thinner wall section and common portion hole processing, cut off processing and ester moulding processing, do not carry out bending machining and make the low height lead frame for LED device of height below 1mm.
Because curved outer wire portion not, bending stress is just inoperative.Therefore, can produce hardly between lead frame and resin and peel off, resin the crack can not occur yet simultaneously.Can also shorten manufacturing process.
Compare with chip pad portion with inner lead portion, the thickness of slab of outer lead portion is thicker, so exothermal effect is big.So, can dispose the bigger LED of output.
Particularly the height of LED device can be made below the 1mm, be compared with the existing LED device of making, the applicant has arrived original about 1/2 with its reduced height.Therefore, further slimming of LCDs.
Description of drawings
Fig. 1 is the vertical view of low height lead frame for LED device.
Fig. 2 is the bottom view of low height lead frame for LED device.
Fig. 3 is a profile of making the irregularly shaped metal material of the used length of low height lead frame for LED device.
Fig. 4 be expression by multiple position press (the multistage punching press group of planes that transmits successively), to the processing of holing of the irregularly shaped metal material of length shown in Figure 3, the profile of the state of formation V-shaped groove.
Fig. 5 is the C-C profile among Fig. 1.
Fig. 6 is the D-D profile among Fig. 1.
Fig. 7 is the front cross-sectional view of existing LED device.
Symbol description
1 thinner wall section
The common portion of 2a
The common portion of 2b
3a inner lead portion
4a inner lead portion
5a inner lead portion
6a inner lead portion
7a inner lead portion
8a inner lead portion
The 1a bore portion
The 5c V-shaped groove
The 8c V-shaped groove
Above the 10a
10b reflecting surface (medial surface)
The 10c side
The 10d bottom surface
10e resin injection portion depressed part
Above in the 10f
12a inner lead portion
12b inner lead portion
12c outer lead portion
12d outer lead portion
12e outer lead portion
12f outer lead portion
Embodiment
Below, be elaborated with reference to the low height lead frame for LED device of accompanying drawing to embodiments of the present invention.
Fig. 3 is the profile of the irregularly shaped metal material of the used length of the low height lead frame for LED device of making embodiments of the present invention, is the profile with the section of length direction orthogonal.
Thickness is that two sides of the thinner wall section 1 of 0.15～0.25mm degree are by thickness is the parallel shape of clamping of the common 2a of portion, 2b of 0.4～0.5mm degree, below smooth, but top thinner wall section 1 section of being recessed to form is poor.Consider conductivity character and price, material can be used copper alloy and stainless steel etc.
Fig. 4 for irregularly shaped metal material that will length shown in Figure 3 by multiple position press (the multistage punching press group of planes that the transmits successively) processing of holing, the profile of the state of formation V-shaped groove.By boring processing bore portion 1a is set, on thinner wall section 1, forms inner lead portion and chip pad portion, forming outer lead portion on the 2a of portion, the 2b usually.
In addition,, in subsequent handling, cut off the common 2a of portion, 2b, on should position as the front end of outer lead portion, from top and below formation V- shaped groove 5c, 8c.
Fig. 5 carries out the profile that insert moulding (insert molding) is processed to form the state of resin cupule for the irregularly shaped metal material with semi-finished length shown in Figure 4 passes through emission forming machine.The part of inner lead portion and chip pad portion are exposed below long irregularly shaped metal material, form around them towards below the main body of outstanding resin cupule.The main body of resin cupule is surrounded by top 10a, side 10c and as the reflecting surface 10b of medial surface.On the other hand, on long irregularly shaped metal material, carry out ester moulding, the bore portion of the depression that forms on filling thin-walled 1, the bore portion 1a of inner lead portion and not shown outer lead portion.10d is the bottom surface, and 10e represents the depressed part of resin injection portion.Outer lead portion is vertically outstanding slightly from the side of resin cupule, forms V-shaped groove 5c, 8c.In addition, on the side of the front and back of resin cupule (length direction), the edge that departs from suspension bracket lead (hanger 1ead) portion of inner lead portion formation a little is embedded in the thinner wall section slightly.
After the insert moulding operation, externally cut off on the position of V-shaped groove 5c, the 8c of wire portion, form the end of outer lead portion.Carry out chip bonding (chip bonding), seal, finish after the LED device, push LED device itself, the suspension bracket wire portion is removed from the side of the front and back of resin cupule pulled down, make single LED device with epoxy resin or silicon.
Fig. 1 is the vertical view of the low height lead frame for LED device in the embodiments of the present invention, and Fig. 2 is its bottom view.Fig. 5 is the C-C profile among Fig. 1, and Fig. 6 is the D-D profile among Fig. 1.
Striding the 3a of inner lead portion, 6a mounting for example R (redness) led chip engage (bonding).Equally, striding the 4a of inner lead portion, 7a mounting for example G (green) led chip engage.And, striding the 5a of inner lead portion equally, 8a mounting B (blueness) led chip engages.By the led chip of 3 kinds of colors of mounting, just can carry out full-color light-emitting.
The top of resin cupule is covered by lens, by sealing with epoxy resin etc., makes small size LED device.Not carrying out bending machining from the side of resin cupule with the outstanding a little outer lead portion in right angle can use.
Claims (4)
1. low height lead frame for LED device, wherein, to on length direction, being the processing of holing of the irregularly shaped metal material of 2.5: 1～3.5: 1 length by tactic, the thickness ratio of common portion, thinner wall section and common portion, form chip pad portion and inner lead portion in thinner wall section, form outer lead portion in common portion, secondly, injection molding resin cupule, cut off the end that forms outer lead portion afterwards, outside wire portion is not carried out bending.
2. low height lead frame for LED device according to claim 1 wherein, can be installed 3 led chips such as R, G, B.
3. low height lead frame for LED device according to claim 1 and 2, wherein, height is below 1mm.
4. the manufacture method of a low height lead frame for LED device, wherein, by multiple position press and emission forming machine, to the thickness ratio of common portion and thinner wall section be 2.5: 1～3.5: 1, on length direction by common portion, thinner wall section and usually the irregularly shaped metal material of the tactic length of portion hole processing, cut off processing, and ester moulding processing, do not carry out bending machining and make the highly low height lead frame for LED device below 1mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006007472A JP2007189150A (en) | 2006-01-16 | 2006-01-16 | Lead frame for low-height led device and method for manufacturing same |
| JP2006007472 | 2006-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101005109A true CN101005109A (en) | 2007-07-25 |
Family
ID=38344087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610172361 Pending CN101005109A (en) | 2006-01-16 | 2006-12-18 | Low height lead frame for LED device and the manufacturing method thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2007189150A (en) |
| KR (1) | KR20070076390A (en) |
| CN (1) | CN101005109A (en) |
| TW (1) | TW200735417A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101344236B (en) * | 2008-09-03 | 2010-06-02 | 湖北匡通电子有限公司 | Short-pitch thin LED lead frame |
| US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
| US8669572B2 (en) | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
| US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
| US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
| US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
| US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
| US9035439B2 (en) | 2006-03-28 | 2015-05-19 | Cree Huizhou Solid State Lighting Company Limited | Apparatus, system and method for use in mounting electronic elements |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100970878B1 (en) | 2008-04-23 | 2010-07-16 | 주식회사 파워라이텍 | Lead frame for led package with plenty of diode chips and the led package thereof |
| JP4531830B2 (en) * | 2008-08-15 | 2010-08-25 | 特新光電科技股▲分▼有限公司 | LED lead frame manufacturing method |
| CN103994359B (en) * | 2014-06-10 | 2016-04-27 | 吴锦星 | A kind of processing method of Modular LED lamp bar |
-
2006
- 2006-01-16 JP JP2006007472A patent/JP2007189150A/en active Pending
- 2006-11-07 KR KR20060109218A patent/KR20070076390A/en not_active Application Discontinuation
- 2006-11-17 TW TW095142650A patent/TW200735417A/en unknown
- 2006-12-18 CN CN 200610172361 patent/CN101005109A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8669572B2 (en) | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
| US9035439B2 (en) | 2006-03-28 | 2015-05-19 | Cree Huizhou Solid State Lighting Company Limited | Apparatus, system and method for use in mounting electronic elements |
| US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
| US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
| US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| US10892383B2 (en) | 2007-10-31 | 2021-01-12 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US11791442B2 (en) | 2007-10-31 | 2023-10-17 | Creeled, Inc. | Light emitting diode package and method for fabricating same |
| CN101344236B (en) * | 2008-09-03 | 2010-06-02 | 湖北匡通电子有限公司 | Short-pitch thin LED lead frame |
| US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
| US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
| US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200735417A (en) | 2007-09-16 |
| KR20070076390A (en) | 2007-07-24 |
| JP2007189150A (en) | 2007-07-26 |
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