CN100521181C - Method of electrically connecting connection points of elements to related connection points of circuit - Google Patents

Abstract

A contact of a component is electrically connected to an associated contact of an electrical circuit, typically formed on a substrate, by depositing material between the contacts, the material forming or being processed to form an electrical connection between the contacts. The invention also provides apparatus for this purpose and a resulting circuit.

Description

The contact of element is electrically connected to method on the circuit associated contacts

Invention field

The present invention relates to interelement electrical connection, for example microchip or other electronic components are connected on the circuit on the substrate of printed circuit board (PCB) form, relate to simultaneously with the electric contact of element be connected to electric contact on the circuit method, implement the equipment and the thus obtained circuit of the method.

Background of invention

Known have all technology be used for element for example microchip (chip) be connected on the circuit on the printed circuit board (PCB) (substrate).

Wire-bonded is the most ancient conventional method.In this method, element accurately is positioned (≤± 30 μ m) on the substrate, make contact and each associated contacts on the upper surface of base plate on the element upper surface (away from substrate) contiguous.These contacts on the element are the lead-in wire form, long 200 μ m, and from then on element extends upward, and this element is fixed to appropriate location on the substrate by chips welding by adhesive.Wire bonding machine is generally the gold or the aluminum lead of 25 μ m diameters with one section lead-in wire, extend in a pair of have coila (one on the element and another on the substrate) between.Two ends with this lead-in wire are welded on the corresponding contact simultaneously, for example with ultrasonic bond or hot weld.Pigtail splice in this stage is a becket fragile, that expose, and they usually are on-insulated from substrate surface upper process and this metal lead wire.So, generally this pigtail splice is sealed, for example with silicone material sealing, make it injury-free and insulated, prevent to come in contact between pigtail splice and possible short circuit.

Because lead contact is from this surface upper process, this kind method is unfavorable for flat product such as smart card or RFID (rfid device).Although this method can be full-automatic, it is expensive, and for the processor with a plurality of tie points, each chip can spend about 10 cents simultaneously.PR expectation low, with typical automatic machinery output be about 10000 elements/hour.In addition, the piece-ups made of the complexity of above-mentioned output and element or draw up are relevant; So complicated more element is produced also slowly more.

Another kind method is a tab engages.In this method, in substrate, be provided with and be slightly larger than the hole that element takes up an area of the zone, contact then suitably is positioned on the adjacent upper surface of base plate in hole therewith.The contact form of this element is the lead-in wire or the branch line of the horizontal alignment of extension.This element is to insert in this hole with a part, allows relevant contact contact on branch line and the substrate of projection.These associated contacts to (contact on the element and another on substrate) weld then or bend to together, finish required circuit.This method requires the substrate of specialized designs and manufacturing, and possess suitable hole and contact, thereby can be expensive, and main only for application at high price.

In the method for comparatively recently a kind of being referred to as " flip-chip ", this element is promptly to place on the substrate with the contiguous state of the contact on the element lower surface and substrate with rollover states.Contact on element or the substrate rises or " protuberance ", so that the electric connection point of projection to be provided between element and substrate circuit.This protrusion is known several diverse ways in order to form, and comprises palladium (Pd) protuberance, nickel gold (NiAu) protuberance, polymer bumps, solder flux protuberance, and may the time adopt metallization (UBM) under the protrusion.

In another approach, element is accurately to be installed in advance on the supporting slice or supporting strap that is referred to as interpolater, and the latter has the suitable contact in location to be electrically connected with said elements.The interpolater that element will be installed then places on the substrate and by the contact panel on interpolater and the substrate and be electrically connected with substrate.This contact panel is bigger, and area is generally some square millimeters, so interpolater does not need big precision when being placed on the substrate.These contacts usually are to press or be crimped onto together finishing between interpolater and substrate, thereby being electrically connected between element and substrate.The shortcoming of this method is to have used additional parts, and promptly interpolater also just needs other treatment step.

Summary of the invention

The present invention provides the method that associated contacts in the contact of element and the circuit or that be used for circuit is electrically connected aspect one, the method is included in deposition materials between these contacts, and this material forms or be processed to form electrical connector between these contacts.

With the connector of component contacts can be the associated contacts of circuit, the associated contacts of another element or another contact of original element.The part of this electrical connector itself can constitute another element or its part.

Element need be connected with circuit at a more than place usually, thus on request method iterates up between contact, having formed whole required connections.

Said elements can be selected from broad range, comprising: microchip (analog or digital), comprising have one deck non-conducting material on the circuit that exposes in case harmful passive chip that electrically contacts takes place; Microprocessor; Storage chip; Timing chip; Capacitor; Transistor; Resistor; Inductor; Diode; Switch; Relay; Solenoid; Microphone; Loud speaker; Amplifier; Piezoelectric device or crystal; Ariel or antenna; Battery; Fuel cell; Barrier-layer cell; Solar cell; Light-emitting diode (LED); Light emitting polymer (LEP); LCD (LCD); Charge-coupled device (CCD); Semiconductor imaging device, or be used for above any bearing, connector, terminal or socket.

Described circuit generally is formed on the substrate.Described material generally is with welding impossible mode deposit and being attached on the substrate.This substrate can be the material of broad range, comprises plastics, paper, pottery etc.This substrate is generally got the form of rigidity or flexible sheet stock, for example is plastic sheet etc.Substrate generally has the conduction drawing lines, comprises for example by photoetching process contact formed thereon.The common form of this substrate is a printed circuit board (PCB).

Electrical connector is generally the form (being that length is greater than width) of drawing lines form, particularly elongated drawing lines.The width of drawing lines can suitably select (and variation) to become the mode that can not realize with prior art to meet the demands with length.These a plurality of connectors also do not require identical but the size of determining can be arranged respectively.

The width of this drawing lines and/or length in a planned way over dimensioning produce to improve conductivity and/or to allow to reduce the drawing lines of deposit precision.

Described electrical connector generally is to be arranged between the contact selectively.This electrical connector selectively forms has required limited field (drawing lines that normally has Len req and width).Another kind method is to form the bigger conductive material layer of more required scope, then, for example uses mask, removes or handles this material selectively and only stay electrical connector on desired zone.In this another kind of method, described material can unnecessaryly have positioning accuracy required in the first method to carry out deposit.

This method generally includes element is provided with respect to the circuit location that it connected.

This element can adopt serial of methods with respect to the circuit location when being provided with, and comprises artificial location and mechanical positioning.Mechanical positioning is thought of as preferably from speed and precision, and preferably by computer control, can adopt the known suitable installation aiding device of one skilled in the art, comprises picking up-put the formula manipulator.Pick up-put the formula manipulator because very firm and quite be fit to this purposes, common disposal ability can reach 60000/hour, and can have been widely used by adopting suitable software.Adopt one or more this manipulator can simultaneously or lay a plurality of elements continuously.

Said method preferably includes such step, promptly adopts sniffer (need not manually import with automated manner) to come the position of the contact of detecting element with respect to the circuit associated contacts, simultaneously with deposition of materials between the position of detecting these contacts.

The connecting point position of described element can directly be surveyed by measuring connecting point position, maybe can infer according to the data of element upper contact position by the position of measuring element and measures indirectly.

The contact of element with respect to the position of associated contacts on the circuit in several ways (directly or indirectly) measure, this is that the one skilled in the art is known.Preferably adopt digital imaging apparatus such as CCD at this.Other possible methods comprise uses photodiode sensor (color according to for example contact is carried out position finding), or uses transducer (detection according to the docking point metal is measured).This position measuring device can comprise data processing equipment, and for example image processing apparatus is to handle data of being measured by imaging device and the position of determining one or more contact.

The most handy printing process deposit of previous materials.Preferably a kind of contactless processing of this printing treatment preferably digital processing simultaneously, because so just can adjust and control the exact position of deposition materials apace, do not make printing equipment do actual motion and be not required to be to position by adopting suitable software.In addition, adopt the digital printed connection that this method can be used for form, do not need accurate location this moment owing to can promptly make suitable compensation with respect to relevant circuit to a plurality of elements.Inkjet printing is particularly suitable for such use.Typical industrial inkjet printhead has the nozzle that some separate about 140 μ m, so by selecting one or more suitable nozzle, deposition materials and do not require printhead is carried out mechanical reorientating with respect to parts and circuit accurately just.By interleaved printhead, can reduce injector spacing, for example use 4 staggered printheads can be with this hypotelorism to 35 μ m.Other possible figure punch technology comprise laser printing, adopt powder toner.Other available simulate press technology comprise inking roller printing, silk screen printing, lithographic printing, intaglio etc.

When adopting digital imagery to combine, must adjusting can be undertaken for any of compensating element, location of mistake, and needn't go to the position of regulating element and/or circuit by the position and/or the shape of adjusting deposition materials with figure punch.In addition, can handle a plurality of elements and form a plurality of connectors with one operating procedure by digital printer.

Intend the material of deposit and get liquid form usually, may have suspension or dispersed solids particle, be convenient to use.

The method that the invention provides a kind of open (and unleaded) forms electrical connector.Welding needs more accurately with the element location, because just form a some connection or a solder joint connection.In addition, welding method is not suitable for the gap between the cross-over connection contact.

The material that is used for deposit can be from forming, form or can choosing through the material that processing goes to form the wide scope of conducting connecting part between the contact.For example this deposition materials can comprise metal nanoparticle (being deposited in the suitable liquid-carrier).By for example heat treatment of suitable processing, chemical treatment and with ultraviolet irradiation etc., these pellet clinkerings are to together, or form the connector with good electrical conductive properties through annealing.In addition, also can adopt conducting polymer such as PEDOT (gathering-3, the 4-Ethylenedioxy Thiophene), it is produced by one or more reagent reacting in the scene.Pigment, ink or the pasting of conduction, for example graphitiferous or argentiferous also can be used to deposit and become conducting connecting part.The material of institute's deposit also can comprise metal carrier body.A kind of possibility is arranged again, and this conducting connecting part can pass through the metallization reaction form at the scene, for example is disclosed among inventor's etc. the PCT/GB2004/000358 (WO 2004/068389).This specification discloses the method that forms conductive metal region on substrate, be included in deposit on the substrate (for example by inkjet printing, spraying and impregnating, and with inkjet printing the best) metal ion solution, deposit on substrate simultaneously is (for example by inkjet printing, spraying and dipping, and with inkjet printing the best) reductant solution, make metal ion and reducing agent one arise from the solution reaction and on substrate, form conductive metal region.This method can be between contact the high connector of production conductivity.

Method of the present invention preferably includes such initial step, be about to activator for example catalyst or catalyst Precursors be deposited on the substrate, form the district to activate an electric conducting material.This deposit is preferably undertaken by figure punch method such as inkjet printing.It can be disclosed among for example above-mentioned WO 2004/068389 that this kind electric conducting material forms reaction, the reaction between metal ion and reducing agent, or also can adopt the known electroless plating technology of one skilled in the art.In this processing, used dipping, and preferably adopted passive chip (on the circuit that exposes, being provided with the electrically non-conductive material layer), so they are suitable for being immersed in case electrically contact, for example, during the metallization of not having an electricity is bathed.When handling, preferably catalytic amount is done low-keyed use with the autocatalysis method.Above-mentioned activator should provide continuous connector between the contact that intend to connect, but needn't and in fact had better not cover contact [be at least when contact be by will support (catalysis) this electric conducting material and form the metal that reacts and form the time] fully; Do there is no need like this, and understand waste material, may reduce the conductivity of the connector of final formation in addition.So this activator can be with the provided in very thin tape form deposit of for example extending between contact.Activated by the activator of metallic contact and deposit, electric conducting material afterwards forms that reaction makes this electric conducting material growth and the activator district that covers and connect this metallic contact and deposit.

Another kind of possibility method is, activator can be deposited to than on the bigger zone of the scope of required electrical connector, removes selectively then or handles, and makes it inefficacy before electric conducting material forms reaction.Under one situation of back, untreated activator must be nonconducting.

Can adopt electroless plating or electro deposition technology selectively in conjunction with said method, improve conductivity on electric conducting material, to form metal level.

In general element is fixed in adhesive in known mode is suitable on the substrate.The adhesive that is suitable for is that the one skilled in the art knows, and comprises adhesive and epobond epoxyn that UV is curable, comprises inkjet printing as suitable operating technology.This adhesive can be but must not be heat conduction, but preferably non-conductive i.e. insulation.Described ink also should be selected with respect to the subsequent treatment that should carry out, for example is to catalyst stable ink and metallization, in order to prevent that element breaks away from substrate in follow-up processing.

Be preferably in and before deposition of materials is between contact moistening controlling agent coated the surface of element, substrate and/or adhesive when existing (if).This moistening controlling agent plays by regulating surface energy and controls wetting effect, also plays the liquid film cloth effect of scattering stably that for example kept follow-up coating before solidifying, in case dehumidification or nettedization.The moistening controlling agent that is fit to comprises polymer such as polyvinylpyrrolidone (PVP).Polyacrylic acid, polyvinyl acetate, polymine, poly(ethylene oxide), polyethylene glycol, gelatin and polymer thereof.Moistening controlling agent can for example be coated with by inkjet printing by any mode easily.This moistening controlling agent can suitably be coated with into form of film, and common thickness is less than 1 micron, and for example about 100nm is thick.

Moistening controlling agent plays on different surfaces, for example produces the more effect of uniform outer surface energy on the surface of substrate, adhesive, element, and the material that can make deposit can form all drawing lines uniformly of width and thickness when not adopting this controlling agent.

The drawing lines width of deposition materials also is subjected to for example influence of the quantity of material of adhesive, institute's deposit and deposition materials composition etc. of the surface of its deposit, lip-deep any coating.The expert can promptly try to achieve the appropriate combination form of this class variable and provide the drawing lines of the deposition materials of required width.

Significantly outstanding and present the situation of profile with the level from substrate at element, the special round part that has the right angle when this step, when the chip that is installed on the printed circuit board (PCB) is for example arranged, just be difficult to material (particularly liquid form) is deposited to (vertically) side of element and element on the right angle crimp between this (vertically) side and (level) end face.Particularly, may be difficult on the side of element, form continuous liquid level, especially be difficult to the sharp edge at wetting element top, thereby also just be not easy to produce the connection of conduction in this boundaries on either side.In order to overcome this difficulty the whole bag of tricks has been proposed.

1) improves for example design of chip of element, the inclined-plane, chamfered edge, that be cut into fillet or that curved edge bends by the right angle with replacement top arris is set to element.Another kind of feasible method is that for example chip manufacturing must be than the thin shoulder height that therefore reduce with element.

2) improve for example design of chip of element, make to comprise that a contact (dish), the latter extend to (or approaching as far as possible) top margin always, and extend through the side of top margin (also), or be formed at the side of element down to element.The benefit of doing like this is because usually used liquid (for example ink) the generally whole surface of moistening contact and the surface of moistening element relatively poorly well, especially in the situation of passive chip.The result usually just forms the thin liquid film of one deck on the surface of element, make liquid easily guide contact into, and it is discontinuous to cause liquid to become, so that can not produce continuous electrical connector.

3) material of deposit volume forms a slope or inclined-plane on the substrate of above-mentioned step, reduces the size of step thus or eliminates step fully.Can easily realize above-mentioned purpose with inkjet printing, promptly, make it, when arriving the top, reduce the quantity of material of deposit then along with the quantity of material that increases its deposit near the vertical side edge of element to the printer programming.It is particularly useful when this metal drawing lines on circuit board (or other substrates) is connected on the pin that is positioned on such microchip or other contacts, the orientation of this microchip then makes not subtend circuit board of this pin or other contacts, thereby the electrical connector of institute's deposit must extend to the side of chip.

But there is some shortcoming in said method and is subjected to some restrictions.

For some (non-passive) microchip, might be by chip edge and circuit contacts, thereby any liquid (ink) that can contact with chip edge or adhesive must be nonconducting.This method will consume more ink (this is expensive), and difficulty realizes with printing with curing, exists the risk that circuit (when existing) the formation conduction that exposes is connected simultaneously.In addition, too thick if the catalyst ink water layer becomes, the stress of just might predisposition sending out makes metallization peel off from substrate.Thereby also can encourage deflection dispersion when printing too much ink makes the drawing lines of printing widen along with its thickening.In order to form above-mentioned slope most effectively, preferably print one deck ink earlier, print another layer after the curing again, curing and duplicate printing reach desired thickness, do not solidify then and plan to print a thick-layer with once-through operation.Preferably adopt following adhesive ramp method of construction for this reason.

4) on the side of element, form adhesive ramp, from substrate surface director element top, by remove in the element side or this vertical step of equating so that the deposit of material.This method can remain in suitable place on the substrate with element by enough adhesives, makes adhesive play double action.Above-mentioned slope can have the falcate of forward (protruding) or negative sense (recessed).Best a kind of slope is to remove 90 ° angle from the corner of element, that is to carry out the transition to adhesive from element be smooth, is bent to substrate then downwards low.For high-frequency circuit, preferably also make the zone between this adhesive ramp covering top margin and contact.To increase conduction drawing lines and interelement distance like this, thereby reduce any capacitive coupling that might take place.

Above-mentioned adhesive can be coated with before or after element is in place.In preceding a kind of situation, adhesive can (not cover contact fully in being located on the substrate on the appropriate location, for example by carefully laying adhesive or adopting the adhesive of non-humidity not remove to cover metallic contact), and then element is put on the adhesive appropriate location.This adhesive will be moved, and be tending towards forming the slope with forward falcate from substrate surface to the element side.Perhaps, element directly can be placed on the substrate, applying adhesive forms from the slope of substrate surface up to the element side then, has the negative sense meniscus under this situation probably.Under these two kinds of situations, all be afterwards deposition of materials to be arrived between the contact to be connected, above adhesive ramp.

For method 3 and 4, importantly, the material that is formed at element side upslope should contact the side of (wetting) element and can not stay remaining gap in slope and interelement.In order to help to realize this purpose, element can be as mentioned above with moistening controlling agent (for example PVP) preliminary treatment, and moistening to control by the adjusting surface energy, the while kept liquid film spreading (preventing to dry or textured) stably before solidifying.When circuit that existence exposes, importantly make adhesive form good sealing combination with respect to the side of element, prevent that electric conducting material is seeped between element and the adhesive ramp.

This method can be included in components set before on the substrate, with the step of one layer or more deposition of materials on substrate.For example electronic component place deposit conductive metal layer can be provided with.This conductive metal layer plays the radiator effect.This is particularly advantageous for the electronic component that needs radiator for example is separated from substrate by one or more contact location microchip.Generally, contact pin that needs the microchip of radiator to have to extend along a direction and in the opposite direction the face that is connected with radiator.But by deposit radiator on substrate surface, this microchip or other electronic components can be thermally connected to easily on the surface of substrate and then be electrically connected with circuit on one or more other faces.Heat Conduction Material can be deposited on the conducting metal laminar surface and improve thermal conductivity between electronic component and the radiator.

The method also is included on whole base plate system and one or more element and forms protective coating (for example encapsulation or jacket layer) by printing.

Adopt above-mentioned the whole bag of tricks can carry out all selective additional printing step.

This method can be used for batch process, but preferably on the basis of working continuously, for example carries out on production line/conveyer.Be provided with in the step in the location, can be in different the processing stage, on different elements, carry out the position sensing of (one or more material) and deposit simultaneously to boost productivity.

The present invention is applied to produce the RFID mark especially.Method of the present invention can be used to the RFID chip is connected on the RFID antenna.The method also can be used to the RFID antenna is directly printed on the contact of RFID chip, forms antenna with the material of deposit and to the connector of chip with a step, and needn't form connector between chip and antenna by independent step.In this case, this connector partly constitutes antenna.

The application deposition technology forms between contact and is electrically connected is a kind of method simply, conveniently and flexibly.

In addition, in relating to the preferred forms of detection steps, method of the present invention and prior art different be in, with element with respect to circuit that it connected (be at least approximate accurately) location after, promptly with respect to the position of the associated contacts detecting element contact of this circuit.Form electrical connector by deposition materials then between the connecting point position that detects, this generally is to form or form after treatment the connector that has connected these contacts by this material.Thereby this element just needn't be located with respect to circuit with absolute precision, and this forms material by deposit connector in correct position and can regulate dislocation because of arriving as subsequent probe.In the method for the invention the requirement of element positioning accuracy is compared and can be reduced significantly with existing technology.The result is placing element more quickly just, and can boost productivity and reduce cost of equipment.In addition, compare with current element laying method, can more accurately survey the physical location of the contact that will connect and between contact, form and connect: use digital imaging technology, can survey these positions with ± 1 μ m or better precision, and the element positioning accuracy of current the best is about generally ± 30 μ m.Other advantages of the present invention comprise can application standard form element and need not do special handle as " forming concavo-convex ", to be installed to interpolater first-class, in finished product production, reduced step or technology number, for example need not encapsulate fragile wire bonding piece, need not form " jog "; Reduced the difficulty of wire-bonded and expensive; Need not adopt special adhesive.When carrying out deposit with digital method, just can develop model machine, the product of production single products cost-effectively and customization, this is because by adopting appropriate software control just can produce all remodeling.When adopting noncontact rule such as inkjet printing to carry out deposit, can may not be for example on three-dimensional body, to realize on the even curface connecting just.

The present invention comprises also that in its scope the contact that is used for element is electrically connected to the equipment on the associated contacts of circuit, and this equipment comprises: positioner is used for element is positioned the appropriate location with respect to the circuit that it connected; Deposition apparatus has deposition of materials between this two contact, and described material then can form or the treated electrical connector that forms between the contact.

This equipment comprises also that preferably sniffer is with the contact of surveying this element position with respect to associated contacts on the circuit.In this case, above-mentioned deposition apparatus is to be used for deposition of materials between the position of these contacts that detect.

The suitable devices that is used for carrying out these functions as previously discussed promptly.

For this reason, this positioner preferably includes computer-controlled mechanical device as picking up and place manipulator.A positioner can simultaneously or be placed a plurality of elements in turn.

Above-mentioned sniffer preferably includes digital imaging apparatus such as ccd video camera.This sniffer can comprise for example image processing apparatus of data processing equipment, and the data that are processed into the picture measurement device are determined the position of one or more contact simultaneously.

Aforementioned deposition apparatus preferably includes digital printing device as one or many ink-jet printers.

Each parts of the said equipment also all are preferably Computer Control Unit to carry out synchronization job.

The invention still further relates to the element and the circuit of consequent connection, that is circuit comprises by method of the present invention or the element that adopts equipment of the present invention to connect.

Typical case of the present invention use and be included in and produce among the RFID (connection-RFID chip on substrate antenna and may form this antenna) smart card, credit card, electronic security device and with known many other devices of pedestrian.The present invention comprises such electronic product in its scope, this electronic product comprises that this circuit of a circuit then has the element that is connected by method and apparatus of the present invention.

With following Example simultaneously with reference to the accompanying drawings, further specifically describe the present invention now, in the accompanying drawings:

Fig. 1 adopts the method according to this invention to be connected the schematic sectional elevation of the element of substrate upper contact with equipment;

Fig. 2 is the diagrammatic plan view of element shown in Figure 1 and substrate;

Fig. 3 has schematically shown the form of implementation according to equipment of the present invention.

Accompanying drawing describes in detail

Referring to accompanying drawing, Fig. 1 and 2 shows a part of understanding the plastic plate substrate 10 be loaded with the metal drawing lines 12 that forms partial circuit and 14.Drawing lines 12 and 14 ends at the contact that is used for electric device 16, has metallic contact 18 and 20 on the upper surface of this electric device.Have and take up an area of with chip 16 that the zone is corresponding takes up an area of 22 regional of metal heat sinks and be formed on this substrate, can adopt the on-the-spot method for metallising of PCT/GB2004/000358 (WO 2004/068389) to form easily.

Element 16 with picking up-put formula manipulator 24 (being illustrated in Fig. 3), is to be placed on the top of the radiator 22 on the substrate 10 with approximate accurate position under computer installation 26 (being illustrated in Fig. 3) control at least.This substrate and chip are used ccd video camera 28 (being illustrated in Fig. 3) imaging then, and (directly or indirectly) surveys drawing lines 12 and the contact of 14 end and the physical location of the contact on the element 18 and 20.Ccd video camera 28 sends positional information to computer installation 26.Use ink-jet printer 30 (being illustrated in Fig. 3) to be deposited to adhesive between drawing lines end 12 and the contact 18 then and between drawing lines end 14 and the contact 20, form adhesive 32 and 34 sloped region separately, intend the contact of connection approx in conjunction with this two couple.This adhesive is transported to exactly under computer installation 26 control that ccd video camera 28 determines, between the connecting point position that detects.With ink-jet printer 36 (being illustrated in Fig. 3) and equally under computer installation 26 control, make deposition of materials and extension between drawing lines end 12 and contact 18, be positioned on the adhesive ramp 32; Make deposition of materials simultaneously and extension between drawing lines end 14 and contact 20, be positioned on the adhesive ramp 34, described material is arranged at exactly by on the ccd video camera 28 determined connecting point positions bottoms that detect.The material of institute's deposit is for example used the on-the-spot method for metallising of WO 2004/068389, forms or treated each corresponding electrical connector 40 and 42 that forms.These two electrical connectors can form successively or simultaneously.16 of elements are on the circuit that is connected to by substrate 10 carryings.

The present invention will further illustrate with following Example.

Example 1 (adhesive-free)

The polyester sheet that is printed on the flexible Melinex (trade (brand) name) of circuit has 4 connectors, intends being connected on the read-only contactless identification chip of EM4100 of EM Microelectronic supply.The planar dimension of this chip is 1016 * 1041 μ m, and thick 440 μ m are arranging 4 contacts on the chip bottom side.Wherein two contacts are 76 * 76 μ m, and two contacts are 95 * 95 μ m in addition.

Manipulator is put into chip on the substrate to adopt Fuji (trade (brand) name) series of high speed chip " to pick up-put formula ", allows contact manifest visibly on the chip end face.This manipulator can with the precision of ± 66 μ m place 52941 elements/hour.

" NI Vison System 1400 " (trade (brand) name) mechanical video system of using National Instruments then exactly detection chip with respect to the position of printed circuit contact.Said system adopts the RS-170 video camera be connected on the NI PCI-1409 image capture board that combines with LabView (trade (brand) name) software, with the position of chip exactly video picture to substrate, improved the conducting connecting part image of being printed therefrom.

Send this improved image to print head controller Xennia (trade (brand) name) XPC-XJ500, this system drive XaarJet (trade (brand) name) 500/360 printhead, this printhead has 500 nozzles by the 180dpi spacing arrangement, print the little point of 40pL, according to the wide row band scanning whole base plate of 70mm, and the fluid of printing forms the long connector of wide and 5mm of 75 μ m between contact on the PCB and the contact on the chip.

The fluid of being printed can be the activator ink that contains palladium ion, for example gets the prescription of table 1 regulation.The amount of each composition is represented with %w/w in the table 1.

Table 1 UV solidifies the activator ink set

Palladium acetate	2
		Irgacure?1700	3.25
Irgacure?819	1.25
		DPGDA	48
DPHA	3
		Actilane?505	10
Diacetone alcohol	15
		Methoxypropanol	15
PUP?K30	2.5
		Viscosity, cPs (25 ℃)	11.2

Irgacure 1700, Irgacure 819 are trade (brand) names with Actilane 505.PVPK30 is a K30 level polyvinylpyrrolidone, and available from International SpecialityProducts, molecular weight is 60000-70000.Actilane 505 is reactive functional polyester acrylic ester oligomers, and (Manchester UK) supplies with by AKZO Nobel UV Resins.DPHA (double pentaerythritol methacrylate) is six functionalized monomers, and (Dragenbos Belgium) supplies with by UCB.Irgacure 819 and Irgacure 1700 are the UV light trigger, and by Ciba Speciality Chemicals, (Macclesfield UK) supplies with.DPGDA is a dipropylene glycol diacrylate, and (Dragenbos Belgium) supplies with by UCB.

After having printed, the activator ink is solidified into solid film with the ultraviolet 500W lamp that Fusion (trade (brand) name) is equipped with the H bulb.Use reducing agent (dimethylamine borane) that palladium ion is reduced to palladium metal then, produce and be used for the metal coating catalyst for reaction.

Form solution [comprise Enplate 872A (30%w/w), Enplate872B (30%w/w), Enplate 872C (10%w/w), iso-butane (5%w/w), ethylene glycol (20%w/w), with polyethylene glycol 1500 (5%w/w)] with the copper layer then.[Enplate (trade (brand) name) 872A, 872B and 872C are copper coating solution, by Enthone Ltd of Woking, and the UK. supply].Above-mentioned processing can be undertaken by the second inkjet printing stage, was similar to the application activator, maybe can handle by bathing by dipping.This solution applied about 2 minutes, formed the thick copper layer of about 1 μ m, the conducting connecting part between the contact of formation printed circuit and the contact of chip.

Example 2 (setting up adhesive ramp)

Repeat the step of example 1, the processing below increasing.Putting chip and before video picture, the gob that scatters epoxy adhesive by 11 droplets/second speed with Fuji GL-541E glue distributor at a high speed is to the contact of each side of chip near, and the little slope of formation adhesive is with above being used for conducting connecting part printed to.

Example 3

Printing has the polyester sheet of the flexible Melinex (trade (brand) name) of circuit that 4 connectors are arranged, and intends being connected on the read-only contactless identification chip of EM4100 of Em Microelectronics supply.The planar dimension of this chip is 1016 * 1041 μ m, and thick 440 μ m are arranging 4 contacts on the chip bottom side, and wherein two contacts are 76 * 76 μ m, and two contacts are 95 * 95 μ m in addition.

In the chip position, contiguous with contact, with the gob of Fuji (trade (brand) name) GL-541E glue spreader at a high speed by 11 droplets/second speed distribution epoxy adhesive.The adhesive of coating excess is so that form the adhesive falcate slope will print conducting connecting part thereon in the chip both sides when chip is set.

Manipulator is put into chip on the substrate " to pick up the formula of putting " with Fuji CP7 series of high speed chip, allows contact be revealed in visibly on the chip end face.This manipulator can with the precision of ± 66 μ m place 52941 elements/hour.

Use National Instraments then, " NI Vison 1400 System " mechanical video system exactly detection chip with respect to the position of printed circuit contact.This system adopts the RS-170 video camera that is connected on the NI PCI-1409 image capture board that combines with LabView software, with the position of chip exactly video picture to substrate, improved the conducting connecting part image of being printed therefrom.

Send this improved image to print head controller Xennia XPC-XJ500, this system drive XaarJet 500/360 printhead, this printhead has 500 nozzles by the 180dpi spacing arrangement, print the little point of 40pL, according to the wide row band scanning whole base plate of 70mm, and the fluid of printing forms the connector that 75 μ m are wide and 5mm is long between contact on the PCB and the contact on the chip.

The fluid of being printed can be the activator ink that contains palladium ion, for example gets the prescription of regulation in the table 2.The amount of each composition is represented with %w/w in the table 2.

Table 2UV solidifies the activator ink set

Material	％w/w
		Palladium acetate	2
Irgacure?1700	3.25
		Irgacure?819	1.25
DPGDA	30.5
		DPHA	3
Actilane?505	10
		Diacetone alcohol	47.5
PVP?K30	2.5

Irpacure 1700, Irgacure 819 are trade (brand) names with Actilane 505.PVPK30 is a K30 level polyvinylpyrrolidone, and available from International SpecialityProducts, molecular weight is 60000～70000.Actilane 505 is reactive four functionalized polyesters acrylate oligomers, and by AKZO Nobel UV Resins, (Manchester UK) supplies with.DPHA (double pentaerythritol methacrylate) is six functionalized monomers, and (Dragenbo Belgium) supplies with by UCB.Irgacure 819 and Irgacure 1700 are the UV light trigger, and (Macclesfield UK) supplies with by Ciba Speciality Chemicals.DPGDA is a dipropylene glycol diacrylate, and (Dragenbos Belgium) supplies with by UCB.

After having printed, the activator ink is solidified into solid film with the ultraviolet 500W lamp that Fusion is equipped with the H bulb.Be dipped in then in the bath that comprises 1.6% dimethylamine borane (DMAB), handle, palladium ion is reduced to palladium metal, produce and be used for the metal coating catalyst for reaction by reducing agent.

Form solution [comprising Enplate 872A (10.71%w/w), Enplate872B (30%w/w), Enplate 872C (3.57%w/w), water (75%w/w)] with the copper layer then and handle catalyst.[Enplate (trade (brand) name) 872A, 872B and 872C are copper coating solution, are supplied with by Enthone Ltd of Woking (UK)].Described processing can be handled by bathing by dipping.Above-mentioned solution applied about 2 minutes, formed the thick copper layer of about 0.5 μ m, the conducting connecting part between the contact of formation printed circuit and the contact of chip, and the resistivity of this connector is about 3～4 Ω/mm.

Claims (16)

1. the contact of element is electrically connected to the method on the associated contacts in the circuit on substrate or that be used for the circuit on the substrate, comprise with adhesive element is fixed on the substrate, make element outstanding and be step profile from substrate, from then on described adhesive forms substrate surface and guides the slope of this component top surface into, and to the slope between these two contacts, this material then forms or the treated electrical connector that forms between these two contacts with deposition of materials.

2. method according to claim 1 is included in the described material of deposit and applies moistening controlling agent before.

3. method according to claim 1 and 2 is comprising described element is located with respect to the circuit that it connected.

4. method according to claim 3, wherein said element are to locate with respect to described circuit with mechanical means.

5. method according to claim 1, wherein said electrical connector are to get the drawing lines form with required width and length.

6. method according to claim 1, comprising using the position of detection said elements contact with respect to this circuit associated contacts, and with deposition of materials between the position of this contact that detects.

7. method according to claim 6, wherein said component contacts is to be determined by digital imaging apparatus with respect to the position of this circuit associated contacts.

8. method according to claim 1, wherein said material are by the print processing deposit.

9. method according to claim 8, wherein said print processing are that figure punch is handled.

10. method according to claim 7, wherein said material is handled deposit by figure punch, and the position of the material of described deposit and/or pattern are regulated according to the connecting point position of being determined by described digital imaging apparatus.

11. method according to claim 1, wherein said electrical connector is to form by on-the-spot metallization reaction, this metallization reaction comprises depositing metal solion and deposit reductant solution, this metal ion is reacted in solution with reducing agent form described electrical connector, described electrical connector is a conductive metal region.

12. method according to claim 1, the material of wherein said deposit is a metal nanoparticle.

13. method according to claim 1, the material of wherein said deposit is a conducting polymer.

14. method according to claim 1, the material of wherein said deposit are conductive ink or pastel.

15. method according to claim 1, the material of wherein said deposit is a metal precursor.

16. method according to claim 1 forms reaction comprising activator being deposited on the substrate to activate electric conducting material.

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