CN100469218C - Circuit board checker and circuit board checking method - Google Patents

Circuit board checker and circuit board checking method Download PDF

Info

Publication number
CN100469218C
CN100469218C CNB2004800043783A CN200480004378A CN100469218C CN 100469218 C CN100469218 C CN 100469218C CN B2004800043783 A CNB2004800043783 A CN B2004800043783A CN 200480004378 A CN200480004378 A CN 200480004378A CN 100469218 C CN100469218 C CN 100469218C
Authority
CN
China
Prior art keywords
downside
upside
circuit board
base plate
extruder member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004800043783A
Other languages
Chinese (zh)
Other versions
CN1751545A (en
Inventor
下田杉郎
木村洁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISC Co Ltd
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of CN1751545A publication Critical patent/CN1751545A/en
Application granted granted Critical
Publication of CN100469218C publication Critical patent/CN100469218C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Abstract

The invention provides a circuit board measuring device used for electricity measurement, wherein a measured electrode of a measured circuit board is electrically connected to a plurality of measuring electrodes through an anisotropic electro conductive board for electricity measurement, the plurality of the measuring electrodes are formed according to the pattern of the measured electrode, wherein a plurality of supports of the upper side board pressing part and the lower side board pressing part are respectively arranged on the upper side and the lower side of the measured object circuit board by means of a supporting embedding board each, seen form the top of the measuring device, the upper supporting point and the lower supporting point corresponding to the each support of the each base board are arranged on different positions on a plane projected along the thickness direction of the upper side board pressing part and the lower side board pressing part, thus a circuit board with the small measured object electrodes can be measured with high reliability. The invention also provides a measuring method for circuit boards.

Description

The checkout facility and the inspection method that is used for circuit board that are used for circuit board
Technical field
The inspection method that the present invention relates to be used for the checkout facility of circuit board and be used for circuit board.
Background technology
In the electric-examination of circuit board is looked into, measure the resistance between the electrode of checking object circuit board (hereinafter being also referred to as " wanting checked circuit board ").
In the measurement of the resistance of circuit board, adopted for example a kind of device in the past always, the probe PA and the PD that wherein are used for current source are pressed against two inspection object electrodes 81 with probe PB that is used for voltage measurement and PC, on 82 (hereinafter being also referred to as " wanting checked electrode "), and contact with described electrode respectively, they are electrically connected in wanting checked circuit board 80 each other, as shown in figure 15, in this state, between probe PA and PD, provide electric current, as electric current supply from supply unit 83, and this moment is by the probe PB that is used for voltage measurement, the voltage signal that PC detects is processed in electric signal processor 84, so as to determining the resistance value between electrode 81 and 82 that will be measured.
But in above-mentioned method, want the surface possibility of checked electrode 82 and 82 destroyed owing to push probe, because need be used in the probe PB that the probe of electric current PA and PD is provided and is used for voltage measurement utilizes sizable pressure and wants checked electrode 81,82 to contact with PC, these probes are made of metal, and its end is pointed, and it is out of use therefore to make that circuit board becomes.In this case, resistance measurement can not be carried out will being used as on all circuit boards that product provides, and therefore this method can not help to adopt so-called sample inspection, after all, can not increase the output of product.
In order to address the above problem, a kind of checkout facility was proposed in the past, its neutralization wants checked electrode to realize that the link of contact constitutes (for example seeing prior art 1 to 3) by anisotropic conductive plate.
According to this checkout facility, the electrode that is used for the electric current supply is realized contacting with the checked electrode of wanting of wanting checked circuit board by anisotropic conductive plate with the electrode that is used for voltage measurement, do not destroy and want checked electrode so as to realizing electrical connection, make to carry out resistance measurement.
As certain checkout facility of realizing and want the electrical connection of checked electrode by anisotropic conductive plate, use for example a kind of equipment with this spline structure, it comprises epipleural extruder member 91A, it is set on the upper surface side that provides lateral electrode 2 of wanting checked circuit board 1, and has an anisotropic conductive plate 93A on its front surface (lower surface of Figure 16), and lower side panel extruder member 91B, it is set at wants the providing on the lower face side of wanting checked downside electrode 3 of checked circuit board 1, and has an anisotropic conductive plate 93B on its front surface (upper surface of Figure 16), they are provided with like this, make them vertically toward each other, as shown in figure 16.
In this checkout facility (hereinafter being also referred to as " first conventional equipment ") 90, epipleural extruder member 91A and lower side panel extruder member 91B are provided at respectively on base plate 96A and the 96B, described base plate is by a plurality of support 94A, 94B is supporting, described support is bumped into flat tabular support elbow-board 95A respectively, in the 95B, and from supporting elbow-board 95A, 95B vertically extends, and as shown in figure 17, on the base plate 96A by supporting strong point 97A that 94A forms and the strong point 97B that on base plate 96B, forms by support 94B, along base plate 96A, on the plane M4 of the thickness direction projection of 96B, when first conventional equipment 90 by when the top is watched, be positioned at identical position.In Figure 17, the strong point relevant with epipleural extruder member 91A (hereinafter being also referred to as " the upside strong point ") and the strong point (hereinafter be also referred to as " the downside strong point ") relevant with lower side panel extruder member 91B are represented by black circle and white circle respectively.
In Figure 16, label 92A represents the circuit board that is used to check, electrode that is used for the electric current supply that forms on it and the electrode (the two is not shown) that is used for voltage measurement, constitute a pair of and want the checked inspection electrode of going up lateral electrode 2 correspondences, label 92B represents the circuit board that is used to check, electrode that is used for the electric current supply that forms on it and the electrode (the two is not shown) that is used for voltage measurement, their constitute a pair of and want the inspection electrode of checked downside electrode 3 correspondences, label 98A, each circuit board 92A that 98B represents and is used to check, the electrode assembly that 92B and tester (not shown) are electrically connected, label 99A, 99B represent anisotropic conductive plate.
In this first kind of conventional equipment 90, each relevant support insert plate 95A with epipleural extruder member 91A and lower side panel extruder member 91B, 95B is along moving near the direction of wanting checked circuit board 1, support 94A so as to making, 94B is to base plate 96A, 96B pressurization, so as by epipleural extruder member 91A and lower side panel extruder member 91B to wanting checked circuit board 1 pressurization.As a result, set up a kind of measurable state.Under this measurable state, be provided at each lip-deep anisotropic conductive plate 93A of epipleural extruder member 91A and lower side panel extruder member 91B, 93B because pressure and and want checked circuit board 1 each want checked electrode to realize contacting, so as to by carrying out resistance measurement to will checked each electrode exerting pressure.
About generally being used to install the printed circuit board (PCB) of integrated circuit or its analog, before integrated circuit or its analog are mounted, need the wiring pattern of validating circuit plate to have the performance of expection.Therefore, carry out the inspection of its electrical property.As the checkout facility that is used to check the sort circuit plate, known a kind of equipment with such structure, wherein the anisotropic conductive plate is inserted in and checks the object circuit board and according between a plurality of inspection electrodes corresponding to the pattern setting of the inspection object electrode of checking the object circuit board, look into (for example seeing prior art 4) so that check the electric-examination of object circuit board.
As certain checkout facility that is used for the sort circuit plate, for example use a kind of equipment with such structure, wherein provide the 101A of the epipleural extruder member with the circuit board 102 that is used to check respectively, be formed with thereon corresponding to the checked inspection electrode 102A that goes up lateral electrode 2 that wants that checks object circuit board (wanting checked circuit board) 1, with lower side panel extruder member 101B with the circuit board 107 that is used to check, be formed with thereon corresponding to the inspection electrode 107A that wants checked downside electrode 3, they are separately positioned on to have wants wanting checked and going up the upside of lateral electrode 2 and have on the downside of wanting checked downside electrode 3 of checked circuit board 1, they are provided with like this, so that vertically toward each other, as shown in figure 18, and epipleural extruder member 101A and lower side panel extruder member 101B are provided at respectively on the base plate 106, base plate is being supported by a plurality of supports 104, described support is embedded in the flat tabular support insert plate 105, and vertically extends from supporting insert plate 105.
In this checkout facility (hereinafter being also referred to as " second conventional equipment ") 100, anisotropic conductive plate 103 is provided at the circuit board 102 that is used to check and 107 surface separately.In Figure 18, the electrode assembly that the circuit board that is used to check of label 108 expressions and each circuit board 102,107 that is used to check and tester (not shown) is electrically connected, the anisotropic conductive plate of label 109 expressions.
In this second conventional equipment 100, move along the approaching direction of checked circuit board 1 of wanting with each relevant support insert plate 105 of epipleural extruder member 101A and lower side panel extruder member 101B, pressurize by means of supporting 104 pairs of base plates 106 thus, thereby pressurize to wanting checked circuit board 1 by means of epipleural extruder member 101A and lower side panel extruder member 101B.As a result, realize measurable state.
In this second conventional equipment 100, the same with first conventional equipment 90, when second conventional equipment 100 by when the top is watched, along on the plane of the thickness direction projection of base plate, be in identical position at the upside strong point that forms on the base plate 106 and the downside strong point that on base plate 106, forms by the support 104 of being correlated with lower side panel extruder member 101B by the support 104 relevant with epipleural extruder member 101A.
In having the conventional equipment of said structure, the anisotropic conductive plate is an a kind of plate that has conductivity along its thickness direction, or having a plate of pressure-sensitive conductor part, described parts are when by when thickness direction pressurize, have conductivity along thickness direction.Because the anisotropic conductive plate has this feature, make and not use any method for example to weld or mechanical engagement just can realize being electrically connected closely, and make the strain that utilizes mechanical impact or utilization to absorb therein just can easily realize being flexible coupling, it is used as a connector, is used to utilize this feature to realize being electrically connected.
On the other hand, in recent years, the size of the electrode in circuit board and spacing or gap are tending towards diminishing, so that realize high integrated level.
At the checkout facility that is used for checking the sort circuit plate, use plate as the anisotropic conductive plate with little thickness so that accurately be electrically connected want checked circuit board want checked electrode and corresponding to the inspection electrode of wanting checked electrode.Anisotropic conductive plate with little thickness relates to such problem: it can not fully absorb the strain that produces by supporting the deflection that the pressurization of base plate is caused, thereby, under measurable state, be tending towards in the dispersion of wanting to produce on the checked circuit board pressure distribution, cause difficulty in want checked circuit board want apply uniform pressure on checked each electrode.
In checkout facility with this thin anisotropic conductive plate, utilize big pressure to check, so that want checked electrode apply the pressure that has certain value at least to all that want checked circuit board, so that realize wanting the state measured of the expectation of checked electrode, and big like this pressure also is applied on the anisotropic conductive plate when each the inspection about each that want checked circuit board.Therefore, the anisotropic conductive plate is easy to deterioration.As a result, because in checkout facility, need to change continually the anisotropic conductive plate, also produce the low problem of checking efficiency.
Thereby in this checkout facility, study, make to increase the thickness of base plate, so that reduce the deflection of the base plate that causes by the pressurization of supporting.
But, when the thickness of the base plate that constitutes checkout facility is big, put on the application point of wanting the pressure on the checked circuit board and plate pressure-producing part by base plate and be formed on when checkout facility is watched from above by supporting along the same position on the plane of the thickness direction projection of plate pressure-producing part.Thereby pressure concentrated on these application points of wanting checked circuit board, and the pressure maximum on these application points, and along with the increase of the distance of leaving the application point, the pressure in the position of leaving the application point diminishes.Thereby cause the dispersion of pressure distribution.As a result, produce and the scattering problem of wanting the relevant status of electrically connecting of checked electrode of wanting checked circuit board.Another problem is that owing to increased the thickness of base plate, the weight of equipment itself has also increased.
When increasing the thickness of base plate in the checkout facility with the base plate that wherein is formed with through hole, also have a problem to be, in its production process, the step that forms through hole in base plate becomes complicated, thereby reduces productivity ratio.
More particularly, when plan formed through hole by a drilling operation in thick base plate, for example, drill bit was easy to destroyed or fractures.Therefore, the such method of general using forms through hole, wherein forms concave hole by carrying out drilling operation from a side of base plate, also carries out drilling operation and forms concave hole at the opposite side of base plate, makes to link to each other with the concave hole of at first mentioning.To carry out repeatedly drilling operation because form a through hole in this way, thus the long time of cost carry out drilling operation, and might not link to each other by the concave hole that each drilling operation forms with the state of expectation, making can not be with high efficient formation through hole.
Prior art 1: Japanese Patent Application Publication 26446/1997;
Prior art 2: Japanese Patent Application Publication 2000-74965;
Prior art 3: Japanese Patent Application Publication 2000-241485;
Prior art 4: Japanese Patent Application Publication 183974/1991.
Summary of the invention
The present invention makes according to above-mentioned situation, its first purpose is, a kind of lightweight checkout facility that is used for circuit board is provided, even when checking that the object circuit board has the inspection object electrode in little size and spacing or gap, it also can be looked into the electric-examination that high reliability is carried out circuit board.
Second purpose of the present invention is, a kind of inspection method that is used for circuit board is provided, even when checking that the object circuit board has the inspection object electrode in little size and spacing or gap, it also can be looked into the electric-examination that high reliability is carried out circuit board.
The 3rd purpose of the present invention is, a kind of lightweight checkout facility that is used for circuit board is provided, even when circuit board has the inspection object electrode in little size and spacing or gap, it also can be looked into the electric-examination that high reliability is carried out circuit board, it can easily carry out miniaturization and oversimplify design, can produce with low cost, and can forbid when checking, making anisotropic conductive plate deterioration.
The 4th purpose of the present invention is, a kind of lightweight checkout facility that is used for circuit board is provided, it has such structure, make it possible to realize high productivity ratio, even and when circuit board had the inspection object electrode in little size and spacing or gap, it also can be looked into the electric-examination that high reliability is carried out circuit board.
According to the present invention, a kind of checkout facility that is used for circuit board is provided, the electric-examination that is used to carry out the object circuit board is looked into, wherein carrying out described electric-examination by means of detected object electrode that be electrically connected to check the object circuit board by the anisotropic conductive plate and a plurality of inspection electrode looks into, described a plurality of inspection electrode is formed according to the pattern corresponding to the detected object electrode, and described checkout facility comprises:
The epipleural extruder member, it is set on the upside of checking the object circuit board, and the lower side panel extruder member, and it is set on the downside of checking the object circuit board,
Wherein, each of described epipleural extruder member and described lower side panel extruder member has a plurality of inspection electrodes, epipleural extruder member and lower side panel extruder member are provided at respectively on the base plate of by a plurality of supported that are embedded in the support insert plate, and the upside strong point supports corresponding to the upside on the upside base plate relevant with the epipleural extruder member, the downside strong point supports corresponding to the downside on the downside base plate relevant with the lower side panel extruder member, they are set at when when checkout facility is watched in the top, along the mutual different position on the plane of the thickness direction projection of epipleural extruder member and lower side panel extruder member.
According to the checkout facility that is used for circuit board of the present invention, preferably, have the anisotropic conductive plate on the surface of epipleural extruder member, have the anisotropic conductive plate on the surface of lower side panel extruder member.
According to the checkout facility that is used for circuit board of the present invention, upside base plate and downside base plate are supported by upside respectively and downside supports pressurization, so as to realizing a kind of state of measuring, check that wherein the object circuit board is by epipleural extruder member and the pressurization of lower side panel extruder member.
According to the checkout facility that is used for circuit board of the present invention, under can the measurement state, by checking the object circuit board and being used for epipleural extruder member and the lower side panel extruder member of checking the pressurization of object circuit board are constituted a compound stack, on whole stack, in the position of supporting by upside respectively and the downside support is pushed according to the upside strong point and the downside strong point, be out of shape by moving with upside base plate, downside base plate along thickness direction.
Under can the measurement state, can be less than the gross thickness of described compound stack, upside base plate and downside base plate between the terminal horizontal during terminal horizontal (tip level) in upside supports and downside support along the gap of the thickness direction of described compound stack.
According to the checkout facility that is used for circuit board of the present invention, preferably, the upside strong point and the downside strong point respectively on upside base plate and downside base plate the form with grid be formed, and
Along on the plane of the thickness direction projection of epipleural extruder member and lower side panel extruder member, have only a downside strong point to be set in the upside unit area of dividing by 4 adjacent upside strong points, and have only a upside strong point to be set in the downside unit area of dividing by 4 adjacent downside strong points.
According to the checkout facility that is used for circuit board of the present invention, gap between the adjacent one another are upside strong point relevant with the upside unit area, and the gap between the adjacent one another are downside strong point relevant with the downside unit area preferably is respectively 10-100mm.
According to the checkout facility that is used for circuit board of the present invention, preferably, each of upside base plate and downside base plate is at least 1 * 10 by resistivity 10The insulating material of Ω .cm constitutes, and has the thickness of 1-10mm.
According to the checkout facility that is used for circuit board of the present invention, preferably, each thickness of upside base plate and downside base plate is at most 5mm.
According to the present invention, a kind of inspection method that is used for circuit board also is provided, described method comprises:
Use the above-mentioned checkout facility that is used for circuit board,
Support upside base plate and the extruding of downside base plate by upside support and downside respectively, can measure state, wherein check the object circuit board by epipleural extruder member and the extruding of lower side panel extruder member thereby form one, and,
This can the measurement state under, on whole composite stack body, in the position of supporting by upside respectively and the downside support is pressurizeed according to the upside strong point and the downside strong point, by moving with upside base plate, downside base plate along thickness direction, make by this composite stack body deformability of checking that object circuit board and epipleural extruder member and lower side panel extruder member constitute, so that the object circuit board is checked in extruding.
According to the present invention, a kind of checkout facility that is used for circuit board also is provided, be used to measure the resistance of checking the object circuit board, wherein by the anisotropic conductive plate be electrically connected a pair of by with separated concern the electrode that is used for the electric current supply of setting and be used for the inspection electrode that the electrode of voltage measurement constitutes and be formed on a plurality of detected object electrodes of checking on the object circuit board each, thereby carry out described measurement, described checkout facility comprises:
The epipleural extruder member, it is set at the upside of checking the object circuit board, and has the anisotropic conductive plate in its surface, and the lower side panel extruder member, and it is set on the downside of detected object electrode, and has the anisotropic conductive plate in its surface,
Each of wherein said epipleural extruder member and lower side panel extruder member has many to checking electrode, and be provided at respectively on the base plate that is supporting by a plurality of support that embeds in the support insert plate, and the upside strong point supports corresponding to the upside on the upside base plate relevant with the epipleural extruder member, the downside strong point supports corresponding to the downside on the downside base plate relevant with the lower side panel extruder member, they are set at when when checkout facility is watched in the top, along the mutual different position on the plane of the thickness direction projection of epipleural extruder member and lower side panel extruder member.
According to the checkout facility that is used for circuit board of the present invention, upside base plate and downside base plate are supported by upside respectively and downside supports pressurization, so as to realizing a kind of state of measuring, wherein check the object circuit board by epipleural extruder member and the extruding of lower side panel extruder member, thereby carry out resistance measurement.
According to the checkout facility that is used for circuit board of the present invention, under can the measurement state, by checking the object circuit board and being used for epipleural extruder member and the lower side panel extruder member of checking the pressurization of object circuit board are constituted a compound stack, on whole stack, in the position of supporting by upside respectively and the downside support is pressurizeed according to the upside strong point and the downside strong point, be out of shape by moving with upside base plate, downside base plate along thickness direction.
According to the checkout facility that is used for circuit board of the present invention, under can the measurement state, can be less than the gross thickness of described compound stack, upside base plate and downside base plate between the terminal horizontal during terminal horizontal in upside supports and downside support along the gap of the thickness direction of described compound stack.
According to the checkout facility that is used for circuit board of the present invention, preferably, each thickness of upside base plate and downside base plate is at most 5mm.
According to the checkout facility that is used for circuit board of the present invention, preferably, the upside strong point and the downside strong point respectively on upside base plate and downside base plate the form with grid be formed, and
Along on the plane of the thickness direction projection of epipleural extruder member and lower side panel extruder member, have only a downside strong point to be set in the upside unit area of dividing by 4 adjacent upside strong points, and have only a upside strong point to be set in the downside unit area of dividing by 4 adjacent downside strong points.
According to the checkout facility that is used for circuit board of the present invention, gap between the adjacent one another are upside strong point relevant with the upside unit area, and the gap between the adjacent one another are downside strong point relevant with the downside unit area preferably is respectively 10-100mm.
According to the checkout facility that is used for circuit board of the present invention, preferably, each of upside base plate and downside base plate is made of the epoxy resin that glass fibre strengthens, and has the thickness of 2-5mm.
According to the present invention, a kind of inspection method that is used for circuit board also is provided, described method comprises:
Use the above-mentioned checkout facility that is used for circuit board, and
A kind of can the measurement state under, wherein by means of supporting upside base plate and the extruding of downside base plate by upside support and downside respectively, check that the object circuit board is by epipleural extruder member and the extruding of lower side panel extruder member, by checking the object circuit board and being used for epipleural extruder member and the lower side panel extruder member of checking the pressurization of object circuit board are constituted a compound stack, on whole stack, in the position of supporting by upside respectively and the downside support is pressurizeed according to the upside strong point and the downside strong point, by along thickness direction and upside base plate, the downside base plate moves together and is out of shape, so that carry out resistance measurement.
According to the checkout facility that is used for circuit board of the present invention, under can the measurement state, the pressure application point that pressure application point that upside supports and downside support is formed on the mutually different position on the plane of the thickness direction projection of epipleural extruder member and lower side panel extruder member, and check the composite stack body that the object circuit board is extruded therein, we can say according to the upside strong point and the downside strong point that constitute described application point, be forced to distortion with base plate, concentrate on the described application point so as to forbidding pressure.The result, because the pressure distribution in checking the object circuit board is uniform, can obtain a kind of like this state, wherein all detected object electrodes in checking the object circuit board are electrically connected on the inspection electrode corresponding to each detected object electrode equably, make to look into the electric-examination that high precision is carried out circuit board.
Because upside base plate and downside base plate are preferably done thinlyyer, so that realize this state, so, can make that the weight of whole checkout facility is lighter by reducing the quality of upside base plate and downside base plate.
Thereby, according to the checkout facility that is used for circuit board of the present invention, can do the anisotropic conductive plate than approaching and do not produce shortcoming, even make when circuit board has the detected object electrode in little size and spacing or little gap, also can look into, can expect to alleviate the weight of measuring equipment itself in addition with the electric-examination that high reliability is carried out circuit board.
According to the checkout facility that is used for circuit board of the present invention, each detected object electrode in checking the object circuit board with check that the conduction between the electrode can be by realizing and can realize by the measurement state by little pressure, so the durable tolerance under the required supercharging of the parts of checkout facility can be lower.As a result, can use durable tolerance is low relatively under supercharging element as can not bringing shortcoming, so as to can be so that the small designization of checkout facility itself and simplification, and can expect to reduce cost as parts.
Because looking into, the electric-examination of inspection object circuit board can utilize little pressure to carry out, the deterioration of the anisotropic conductive plate that the supercharging repeatedly in the time of can stoping by each the inspection causes.Thereby the frequency of the replacing of the anisotropic conductive plate in this checkout facility can be lowered, and therefore can realize high checking efficiency, and can reduce the inspection cost.
In addition, because can preferably use thin base plate according to the checkout facility that is used for circuit board of the present invention, even have the structure that in base plate, forms through hole when this checkout facility, compare with checkout facility with thick base plate, also can shorten and carry out the required time of drilling operation, thereby can form through hole with high efficient, so that realize high productivity ratio.
Description of drawings
Fig. 1 represents being used for the checkout facility of circuit board and checking the object circuit board according to of the present invention of a kind of example;
Fig. 2 is the sectional view with the part of the checkout facility that is used for circuit board shown in the schedule of proportion diagrammatic sketch 1 that amplifies;
Fig. 3 represents the flexibility of checking that the object circuit board need have;
Fig. 4 be illustrated in when see from the top shown in Fig. 1 be used for the checkout facility of circuit board the time, in the position relation between the upside strong point and the downside strong point on the plane of the thickness direction projection of epipleural extruder member and lower side panel extruder member;
Fig. 5 represents to constitute upside adapter and the upside inspection head and the detected object circuit board at the epipleural extruder member of the checkout facility that is used for circuit board shown in Figure 1;
Fig. 6 is illustrated in the front surface of the circuit board that is used to check of the checkout facility that is used for circuit board shown in Figure 1;
Fig. 7 is illustrated in the rear surface of the circuit board that is used to check of the checkout facility that is used for circuit board shown in Figure 1;
Fig. 8 is the sectional view that the line X-X ' along Fig. 6 and the circuit board that is used to check shown in Figure 7 gets;
Fig. 9 is the sectional view of the inspection pin of the expression epipleural extruder member that constitutes the checkout facility that is used for circuit board shown in Figure 1;
Figure 10 (a) is a projection and plane graph of aiming at the position relation between the movable platen of expression downside base plate, and Figure 10 (b) is a projection and sectional view of aiming at the position relation between the movable platen of expression downside base plate;
Figure 11 is the sectional view of the inspection pin of the expression lower side panel extruder member that constitutes the checkout facility that is used for circuit board shown in Figure 1;
Figure 12 represents the state measured of the checkout facility that is used for circuit board shown in Figure 1;
Figure 13 is the sectional view according to the part of the structure of the checkout facility that is used for circuit board of the present invention of representing another kind of example with the ratio of amplifying;
Figure 14 is the sectional view according to the structure of the checkout facility that is used for circuit board of the present invention of the another kind of example of expression;
Figure 15 represents to utilize the equipment of the resistance between electric current supply probe and the electrode of voltage measurement probe measurement in circuit board prevailingly;
Figure 16 represent a kind of example routine the checkout facility that is used for circuit board structure and check the object circuit board;
Figure 17 represent when see from the top shown in Figure 16 be used for the checkout facility of circuit board the time, position in the middle of the strong point on projection plane relation; And
Figure 18 represent another kind of example routine the checkout facility that is used for circuit board structure and check the object circuit board.
[symbol description]
1 checks the object circuit board
2 want the checked lateral electrode that goes up
3 want checked downside electrode
10 checkout facilities
11 check execution area
13 alignment pins
15 aim at movable platen
15A is essentially the hole of rectangle
16 aim at support
19 composite stack bodies
21 upside base plates
The 21A upside strong point
21B is used to check the through hole of pin
22 upsides support
The part that 22A is approaching
The 22B end
23 upsides support insert plate
25 downside base plates
The part that 25A protrudes
The 25B downside strong point
25C is used for the through hole of alignment pin
25D is used to check the through hole of pin
26 downsides support
The part that 26A is approaching
The 26B end
27 downsides support insert plate
30 epipleural extruder members
31 upside adapters
32 circuit boards that are used to check
32A is used for the electrode of electric current supply
32B is used for the electrode of voltage measurement
The 32C termination electrode
32D internal wiring part
The 32E location hole
33 anisotropic conductive plates
35 upsides are checked head
36 check pin
The 36A end
The 36B core
36C major diameter part
The part that 36D is approaching
37 anisotropic conductive plates
The 37A conductive path forms part
The 37B insulated part
38 dividing plates
38A is used to check the through hole of pin
39 leads
50 lower side panel extruder members
50A is used for the through hole of alignment pin
51 downside adapters
52 circuit boards that are used to check
52A is used for the electrode of electric current supply
52B is used for the electrode of voltage measurement
The 52C termination electrode
52D internal wiring part
53 anisotropic conductive plates
55 downsides are checked head
56 check pin
The 56A end
The 56B core
56C major diameter part
56D is near part
57 anisotropic conductive plates
58 dividing plates
58A is used to check the through hole of pin
59 leads
60 epipleural extruder members
61 upside adapters
62 circuit boards that are used to check
62A checks electrode
The 62B termination electrode
62C internal wiring part
63 upsides are checked head
64 anisotropic conductive plates
65 lower side panel extruder members
66 downside adapters
67 circuit boards that are used to check
67A checks electrode
The 67B termination electrode
67C internal wiring part
68 downsides are checked head
69 anisotropic conductive plates
70 checkout facilities
71 upsides are checked head
72 electrode assemblies
73 anisotropic conductive plates
74 upside base plates
75 downsides are checked head
76 electrode assemblies
77 anisotropic conductive plates
78 downside base plates
79 spacers
80 check the object circuit board
81,82 detected object electrodes
83 supply units
84 electric signal processors
PA, PD are used for the probe of electric current supply
PB, PC are used for the probe of voltage measurement
90 checkout facilities
91A epipleural extruder member
91B lower side panel extruder member
The circuit board that 92A, 92B are used to check
93A, 93B anisotropic conductive plate
94A, 94B supports
95A, 95B supports insert plate
96A, the 96B base plate
97A, the 97B strong point
98A, the 98B electrode assembly
99A, 99B anisotropic conductive plate
100 checkout facilities
101A epipleural extruder member
101B lower side panel extruder member
102 circuit boards that are used to check
102A checks electrode
103 anisotropic conductive plates
104 support
105 support insert plate
106 base plates
107 circuit boards that are used to check
107A checks electrode
108 electrode assemblies
109 anisotropic conductive plates
Embodiment
Describe the mode of the present invention of implementing below in detail.
Fig. 1 represent a kind of example according to the structure of the checkout facility that is used for circuit board of the present invention and check the sectional view of object circuit board, Fig. 2 is the sectional view with the part of the checkout facility that is used for circuit board shown in the schedule of proportion diagrammatic sketch 1 that amplifies.
This checkout facility (hereinafter being also referred to as " first checkout facility ") 10 is used for carrying out the conduction inspection of circuit board by the resistance of measuring between the electrode in circuit board.In this checkout facility, epipleural extruder member 30 and lower side panel extruder member 50 are set mutually vertically oppositely, the epipleural extruder member is set at the upside of checking object circuit board (wanting checked circuit board) 1, and on its front surface (lower surface of Fig. 1), has anisotropic conductive plate 33, the lower side panel extruder member is set on the downside of wanting checked circuit board 1, and has anisotropic conductive plate 53 on its front surface (upper surface among Fig. 1).
Wanting in the checked circuit board 1 in the present embodiment wants the checked lateral electrode 2 that goes up to be formed on its upper surface, checked downside electrode 3 to be formed on its lower surface.These want checked downside electrode 3 and them to want the checked lateral electrode 2 that goes up to be electrically connected accordingly.
Want the example of checked circuit board 1 to comprise having for example printed circuit board (PCB) of flexible circuit board.
Want the required degree of flexibility of checked circuit board 1 as follows.
When wanting checked circuit board 1 flatly to be arranged on the following time of state that its two ends are being supported with the interval of 10cm, as shown in Figure 3, the distortion of wanting checked circuit board 1 that its pressurization is caused by the pressure of the 50kgf of top preferably is to want 0.04% of the width b of checked circuit board 1 at least.
Epipleural extruder member 30 is provided on the front surface (lower surface of Fig. 1) of upside base plate 21, upside base plate 21 is being supported by the upsides support 22 that a plurality of (being 4 among Fig. 1) embeds in the flat tabular upside support insert plate 23, described upside supports insert plate for example by the lamination (trade (brand) name: " SUMILITE " of the phenolic resins that contains the fine rule fabric, SUMITOMOBAKELITE Co., Ltd. product) constitute, described upside supports from upside support insert plate 23 and vertically extends.
In an illustrated embodiment, in the rear surface of upside base plate 21 (upper surface of Fig. 1), forming the position of back with the upside strong point 21A that is illustrated, be formed with the engaging groove (not shown), each engaging groove has with upside and supports the internal diameter that the external diameter of 22 end 22B cooperates.The bonding part that upside supports 22 end 22B be inserted in these engaging grooves and and their engage, so as on upside base plate 21, forming upside strong point 21A by upside support 22.
Lower side panel extruder member 50 is provided on the front surface (upper surface of Fig. 1) of downside base plate 25, downside base plate 25 is being supported by the downsides support 26 that a plurality of (being 3 among Fig. 1) embeds in the flat tabular downside support insert plate 27, described downside supports insert plate for example by the lamination (trade (brand) name: " SUMILITE " of the phenolic resins that contains the fine rule fabric, SUMITOMOBAKELITE Co., Ltd. product) constitute, described downside supports from downside support insert plate 27 and vertically extends.
In an illustrated embodiment, on the front surface of downside base plate 25, in being provided with the whole zone of a plurality of inspection pins 56, being formed with is the projection 25A (Figure 10) of rectangle basically.In rear surface (lower surface of Fig. 1) corresponding to the projection 25A of downside base plate 25, in the position that should form the downside strong point 25B that the back will illustrate, be formed with engaging groove, each engaging groove has with downside and supports the internal diameter that the external diameter of 26 end 26B cooperates.The bonding part that downside supports 26 end 26B be inserted in these engaging grooves and and their engage, so as on downside base plate 25, forming downside strong point 25B by downside support 26.
Additional disclosure, the engaging groove in upside base plate 21 and downside base plate 25 not necessarily can not form engaging groove yet on each base plate.
The upside strong point 21A relevant with epipleural extruder member 30 and and the downside strong point 25B that are correlated with of lower side panel extruder member 50 be set at when the time in different position along (hereinafter being also referred to as " specific projection plane ") on the plane of the thickness direction projection of epipleural extruder member 30 and lower side panel extruder member 50 from top (from the top of Fig. 1) first checkout facility 10.
Upside strong point 21A and downside strong point 25B preferably respectively on upside base plate 21 and downside base plate 25 form with grid be formed, shown in the embodiment as described.
Specifically, upside strong point 21A and downside strong point 25B are set on the specific projection plane M1 in mode shown in Figure 4, in the rectangle upside unit area R1 that divides by 4 adjacent upside strong point 21A, in the position that two diagonal intersect, 1 downside strong point 25B only is set, in the rectangle downside unit area R2 that is divided by 4 adjacent downside strong point 25B, the position in that two diagonal intersect only is provided with 1 upside strong point 21A.In Fig. 4, upside strong point 21A and downside strong point 25B are represented by black circle and white circle respectively, and surround a upside unit area R1 and a downside unit area R2 respectively by the long and short dotted line that replaces.
In this checkout facility, the gap between gap between the upside strong point 21A adjacent one another are and downside strong point 25B adjacent one another are preferably is respectively 10-100mm, more preferably is 12-70mm, particularly preferably is 15-50mm.
Have those flexible plates and be used as upside base plate 21 and downside base plate 25.
The required degree of flexibility of upside base plate 21 and downside base plate 25 (hereinafter being also referred to as " specific base plate ") is as follows.
When specific base plate by flatly be arranged on its two ends with the interval of 10cm supported following time of state (referring to Fig. 3), the distortion of the specific base that its pressurization is caused by pressure from top 50kgf preferably be at least this specific base width 0.02%, and preferably, even when its during by the exert pressure of the 50kgf of top, it neither ruptures, also permanent deformation not.
More particularly, as the material of upside base plate 21 and downside base plate 25, use a kind ofly to have at least 1 * 10 10The insulating material of the resistivity of Ω .cm, the resin material that for example has high mechanical strength, polyimide resin for example, mylar, polyamide, phenolic resins, polyacetal resin, poly-(butylene terephthalate) resin, poly-(ethene terephthalate) resin, the syndiotactic polystyrene resin, poly-(penylene sulfide) resin, poly-(ether ethyl ketone) resin, fluorocarbon resin, poly-(ether nitrile) resin, poly-(ether sulfone) resin, polyacrylate resin or polyamide-imide resin, the synthetic resin material that glass fibre is strengthened, the epoxy resin strengthened of glass fibre for example, the mylar that glass fibre is strengthened, the polyimide resin that glass fibre is strengthened, the phenolic resins that glass fibre is strengthened, or the fluorocarbon resin of glass fibre reinforcement, the synthetic resin that carbon fiber is strengthened, the epoxy resin strengthened of carbon fiber for example, the mylar that carbon fiber is strengthened, the polyimide resin that carbon fiber is strengthened, the phenolic resins that carbon fiber is strengthened, or the fluorocarbon resin strengthened of carbon fiber, by at epoxy resin, fill for example silicon dioxide of inorganic material in phenolic resins or its analog, aluminium oxide or boron nitride and the synthetic resin material that obtains are perhaps by at epoxy resin, the synthetic resin material that contains reticulated in phenolic resins or its analog and obtain.Also can use the hard board material that forms by stacked a plurality of plates that constitute by any material in these material of measuring and monitoring the growth of standing timber.
The thickness of each of upside base plate 21 and downside base plate 25 is selected suitably according to the kind of the material that constitutes described base plate.But, for example can be 1-10mm.
In an illustrated embodiment, " thickness of downside base plate 25 " refers to the thickness of the part that forms projection 25A place.The protrusion height of described projection 25A is 0.5-5mm preferably.
Specifically, when each of upside base plate 21 and downside base plate 25 had the structure that is formed with through hole, as first checkout facility 10, its thickness preferably mostly was most 5mm.
When the thickness that should form the base plate of through hole therein is 5mm or when thinner, can form through hole with high efficient by a drilling operation, and do not relate to the bad effect drill bit that for example destroys or fracture, thereby do not need to carry out repeatedly drilling operation for forming a through hole.Thereby, being equipped with thickness is that the checkout facility of 5mm or thinner base plate is compared with the checkout facility that is equipped with thick base plate and can be shortened the required time of drilling operation, in addition, because can form through hole, so can high production efficiency produce with high efficient.
The specific preferred example of upside base plate 21 and downside base plate 25 comprises that thickness is the base plate that the epoxy resin of being strengthened by glass fibre of 2-5mm constitutes.
Support 26 as upside support 22 and downside, can use the cylinder of for example making by brass, aluminium, titanium, stainless steel, copper, iron or their alloy.
Upside support 22 and downside support 26 preferably have the total length of 10-100mm.
The a plurality of upsides that constitute first checkout facility 10 support 22 and can have different total lengths, as long as they can realize specific measurement state.Equally, a plurality of downside supports 26 and can have different total lengths.
The external diameter that constitutes the end 22B of upside strong point 21A or constitute the end 26B of downside strong point 25B preferably is respectively 1-10mm, and upside to support the external diameter of 22 end 22B preferably identical with the external diameter of the end 26B of downside support 26.
In an illustrated embodiment, each upside supports 22 by being fixed to constituting near the continuous end 22B of part 22A near part 22A with described on the upside support insert plate 23, the cross cut end (of a beam) of described end forms upside strong point 21A, and its diameter is less than the diameter near part 22A.On the other hand, each downside supports 26 by being fixed to constituting near the continuous end 26B of part 26A near part 26A with described of downside support insert plate 27, the cross cut end (of a beam) of described end forms downside strong point 25B, and its diameter is less than the diameter near part 26A.Upside support 22 is supported 26 with downside and is had external diameter identical end 22B and 26B.
The epipleural extruder member 30 that constitutes first checkout facility 10 is configured by according to the order of mentioning upside adapter 31 and upside inspection 35 being set from the below of Fig. 1.
As shown in Figure 5, upside adapter 31 is made of the circuit board that is used to check 32 and the flexible anisotropic conductive plate 33 that is set on the front surface (lower surface of Fig. 1 and Fig. 5) of the circuit board 32 that is used to check, and they are fixed by suitable device.
The front surface of the circuit board that is used to check 32 in upside adapter 31, the electrode 32B that constitute to check the electrode 32A that is used for the electric current supply of electrode pair and be used for voltage measurement under the state that is separated from each other according to wanting on the upper surface of wanting checked circuit board 1 checked on the arrangement pattern of lateral electrode 2 be provided with like this, make and want the checked lateral electrode 2 that goes up with respect to one, being positioned at its area equals by wanting checked zone of going up the area in the zone that lateral electrode 2 occupies, as shown in Figure 6.
In Fig. 6, label 32E represents location hole.
Preferably be at least 10 μ m at the electrode 32A that is used for the electric current supply of the circuit board 32 that is used for checking and the gap that is used between the electrode 32B of voltage measurement.If this gap is less than 10 μ m, then by anisotropic conductive plate 33 at the electrode 32A that is used for the electric current supply with to be used for the electric current that flows between the electrode 32B of voltage measurement too big, make to be difficult with high-acruracy survey resistance in some cases.
On the other hand, the upper limit in described gap is determined by the size and the relative size of checked upward lateral electrode 2 and the spacing wanted of each inspection electrode, generally mostly is most 500 μ m.If this chi is too big, then be difficult to undersizedly want the checked lateral electrode 2 that goes up for one, arrange suitably that correspondingly two are checked electrodes.
At the back side of the circuit board 32 that is used for checking (Fig. 1 and 5 upper surface), according to the position of grid point a plurality of termination electrode 32C are set, its spacing for example is 0.2mm, 0.3mm, 0.45mm, 0.5mm, 0.75mm, 0.8mm, 1.06mm, 1.27mm, 1.5mm, 1.8mm or 2.54mm, as shown in Figure 7.Each of these termination electrodes 32C is by internal wiring part 32D and its electrode 32B electrical connection that is used for the electrode 32A of electric current supply accordingly and is used for voltage measurement.
Anisotropic conductive plate 33 in upside adapter 31 is so-called decentralized anisotropic conductive plates, it contains conductive particle P in the basis material that is made of flexible polymeric material, this flexible polymeric material has insulation property under the so directed feasible state of arranging along the thickness direction of anisotropic conductive plate 33 of conductive particle, and, form conductive path by the chain of conductive particle P when measuring state lower edge thickness direction when pressurized.
In this manual, term " can be measured state " and refer to a kind of like this state, wherein want checked circuit board 1 by for example extruding between epipleural extruder member 30 and lower side panel extruder member 50, so as to making that the anisotropic conductive plate is pushed along its thickness direction.
Anisotropic conductive plate 33 preferably has higher conductivity along its thickness direction ratio along the in-plane perpendicular to described thickness direction.Specifically, the anisotropic conductive plate preferably has such electric conductivity, that is, be 1 or lower along the resistance value of described in-plane to the ratio along the resistance value of described thickness direction, and preferably 0.5 or lower.
If described ratio surpasses 1, then uprise at electrode 32A that is used for the electric current supply and the electric current that is used for flowing between the electrode 32B of voltage measurement by this anisotropic conductive plate 33, make to be difficult in some cases with high precision measure resistance.
Upside inspection 35 has a plurality of inspection pins 36, they are set at the position of the identical grid point of the spacing of termination electrode 32C of spacing and upside adapter 31, and elastic anisotropy conductive plate 37 is set on the front surface (lower surface of Fig. 1) of described head, utilizes suitable manner to be fixed.
Each checks that pin 36 is by constituting with the lower part: the end 36A of column, core 36B, itself and end 36A are continuously and have a diameter greater than end 36A, major diameter part 36C, it is continuous with core 36B, and has the diameter bigger than core 36B, and near part 36D, it is continuous with major diameter part 36C, and has the external diameter identical with core 36B, as shown in Figure 9.
Described inspection pin 36 is fixed under such state: end 36A stretches out at the front surface (lower surface of Fig. 9) of plate shaped spacer 38, described plate shaped spacer is set on the front surface (lower surface of Fig. 9) of upside base plate 21, wherein checking being inserted in being used in the upside base plate 21 near part 36D and checking in the through hole 21B of pin of pin 36, the internal diameter that described through hole has and cooperates near the external diameter of part 36D, and be formed on the position of grid point, its spacing be for should being provided with the spacing of checking pin 36, and the core 36B that checks pin 36 and major diameter part 36C are inserted in the through hole 38A that is used for checking pin that forms in the dividing plate 38 and have the shape that cooperates with core 36B and major diameter part 36C.
Each checks pin 36 by lead 39 be provided at the connector (not shown) that upside supports on the insert plate 23 and be electrically connected, lead 39 and be electrically connected near part 36D, and be electrically connected with the tester (not shown) by described connector.
Anisotropic conductive plate 37 in upside inspection 35 is a kind of so-called non-uniform Distribution type anisotropic conductive plates, it is by constituting with the lower part: the path of conduction forms part 37A, has the conductive particle P that in the basis material that constitutes by flexible polymer material, comprises with high density with insulation property, and insulated part 37B, wherein in the basis material that constitutes by flexible polymer material, there is not or seldom has conductive particle P fully with insulation property, and have such structure: form according to pattern corresponding to termination electrode 32C and respectively have a plurality of column conductive paths that area equals the surface in the zone that occupied by termination electrode 32C and form part 37A, by insulated part 37B mutually insulated.When the surface (upper surface of Fig. 5) that conductive path under can the measurement state forms part 37A and its corresponding termination electrode 32C realizes contacting and along its thickness direction when pressurized, by means of each chain formation conductive path of conductive particle P.
In described embodiment, anisotropic conductive plate 37 has irregular shape, wherein on a surface (lower surface of Fig. 5) of a side of the circuit board 32 that is used to check, protrude from the surface (lower surface of Fig. 5) of insulated part 37B on the surface (lower surface of Fig. 5) that conductive path forms part 37A.
Checking that pin 36 has been inserted into being used to of forming by means of drilling operation and has checked under the state of through hole 21B of pin, epipleural extruder member 30 with above-mentioned structure can be by constituting with the lower part according to the order setting of mentioning at preposition on the front surface of upside base plate 21: dividing plate 38, wherein be formed with a plurality of through hole 38A that are used to check pin, anisotropic conductive plate 37, circuit board 32 that is used to check and anisotropic conductive plate 33.
The lower side panel extruder member 50 that constitutes first checkout facility 10 is configured by according to the order of mentioning downside adapter 51 and downside inspection 55 being set from the top of Fig. 1.
In an illustrated embodiment, lower side panel extruder member 50 has the circuit board maintaining body, is used for wanting checked circuit board 1 to remain on the inspection execution area 11 that forms between epipleural extruder member 30 and the lower side panel extruder member 50.In sort circuit plate maintaining body, under such state, be provided for wanting checked circuit board 1 to be arranged on alignment pin 13 on the exact position of checking in the execution area 11: they be fixed to downside check 55 and downside base plate 25 between aligning movable platen 15 on, and wherein each all is inserted into by the through hole 50A that is used for alignment pin that forms in lower side panel extruder member 50 with at the through hole 25C that is used for alignment pin of downside base plate 25 formation.
Aim at movable platen 15 and have the thickness that the protrusion height with the projection 25A of downside base plate 25 cooperates, and movably be fixed to aligning on the downside base plate 25 and support 16 and supporting.Aiming at movable platen 15 is provided with under such state: the projection 25A of downside base plate 25 has been inserted in that position with projection 25A correspondence forms and what have the size that cooperates with projection 25A is among the hole 15A of rectangle, as shown in figure 10 basically.
Downside adapter 51 is made of the circuit board that is used to check 52 and the elastic anisotropy conductive plate 53 that is set on the front surface (upper surface of Fig. 1) of the circuit board 52 that is used to check, and they are fixed by means of suitable method.
Front surface at the circuit board that is used to check 52 of downside adapter 51, constitute the electrode 52A that is used for the electric current supply that checks electrode pair and be used for the electrode 52B of voltage measurement under separated state, according on the lower surface of wanting checked circuit board 1, wanting the arrangement pattern of checked downside electrode 3 to be provided with like this, make and to want checked downside electrode 3 with respect to one, be positioned at its area and equal zone by the area in a zone of wanting checked downside electrode 3 to occupy.
Preferably be at least 10 μ m at the electrode 52A that is used for the electric current supply of the circuit board 52 that is used for checking and the gap that is used between the electrode 52B of voltage measurement.If this gap is less than 10 μ m, then by anisotropic conductive plate 53 at the electrode 52A that is used for the electric current supply with to be used for the electric current that flows between the electrode 52B of voltage measurement too big, make to be difficult with high precision measure resistance in some cases.
On the other hand, the upper limit in described gap is determined by the size and the relative size of checked downside electrode 3 and the spacing wanted of each inspection electrode, generally mostly is most 500 μ m.If this gap is too big, then be difficult to undersizedly want checked downside electrode 3 for one, arrange suitably that correspondingly two are checked electrodes.
At the back side of the circuit board 52 that is used for checking (lower surface of Fig. 1), according to the position of grid point a plurality of termination electrode 52C are set, its spacing for example is 0.2mm, 0.3mm, 0.45mm, 0.5mm, 0.75mm, 0.8mm, 1.06mm, 1.27mm, 1.5mm, 1.8mm or 2.54mm.Each of these termination electrodes 52C is by internal wiring part 52D and its electrode 52B electrical connection that is used for the electrode 52A of electric current supply accordingly and is used for voltage measurement.
Anisotropic conductive plate 53 in downside adapter 51 is so-called decentralized anisotropic conductive plates, it contains conductive particle P in the basis material that is made of flexible polymeric material, flexible polymeric material has insulation property under the so directed feasible state of arranging along the thickness direction of anisotropic conductive plate 53, and, form conductive path by the chain of conductive particle P when measuring state lower edge thickness direction when pressurized.
Anisotropic conductive plate 53 preferably has higher conductivity along its thickness direction ratio along the in-plane perpendicular to described thickness direction.Specifically, the anisotropic conductive plate preferably has such electric conductivity, that is, be 1 or lower along the resistance value of described in-plane to the ratio along the resistance value of described thickness direction, and preferably 0.5 or lower.
If described ratio surpasses 1, then uprise at electrode 52A that is used for the electric current supply and the electric current that is used for flowing between the electrode 52B of voltage measurement by anisotropic conductive plate 53, make to be difficult in some cases with high precision measure resistance.
Downside inspection 55 has a plurality of inspection pins 56, they are set at the position of the identical grid point of the spacing of termination electrode 52C of spacing and downside adapter 51, and elastic anisotropy conductive plate 57 is set on the front surface (upper surface of Fig. 1) of described head, utilizes suitable manner to be fixed.
Each checks that pin 56 is by constituting with the lower part: the end 56A of column, core 56B, itself and end 56A are continuously and have a diameter greater than end 56A, major diameter part 56C, it is continuous with core 56B, and has the diameter bigger than core 56B, and near part 56D, it is continuous with major diameter part 56C, and has the external diameter identical with core 56B, as shown in figure 11.
Described inspection pin 56 is fixed under such state: end 56A stretches out from the front surface (upper surface of Figure 11) of plate shaped spacer 58, described plate shaped spacer is set on the front surface (upper surface of Figure 11) of downside base plate 25, wherein checking being inserted in being used in the downside base plate 25 near part 56D and checking in the through hole 25D of pin of pin 56, the internal diameter that described through hole has and cooperates near the external diameter of part 56D, and be formed on the position of grid point, its spacing be for should being provided with the spacing of checking pin 56, and the core 56B that checks pin 56 and major diameter part 56C are inserted in the through hole 58A that is used for checking pin that forms in the dividing plate 58 and have the shape that cooperates with core 56B and major diameter part 56C.
Each checks pin 56 by lead 59 be provided at the connector (not shown) that downside supports on the insert plate 27 and be electrically connected, lead 59 and be electrically connected near part 56D, and be electrically connected with the tester (not shown) by described connector.
Anisotropic conductive plate 57 in downside inspection 55 has with upside checks the identical structure of anisotropic conductive plate 37 in 35, it is a kind of so-called non-uniform Distribution type anisotropic conductive plate, it is by constituting with the lower part: the path of conduction forms part, has the conductive particle that in the basis material that constitutes by flexible polymer material, comprises with high density with insulation property, and insulated part, wherein in the basis material that constitutes by flexible polymer material, there is not or seldom has conductive particle fully with insulation property, and have such structure: form according to pattern corresponding to termination electrode 52C and respectively have a plurality of column conductive paths that area equals the surface in the zone that occupied by termination electrode 52C and form part, by the insulated part mutually insulated.When the surface that conductive path under can the measurement state forms part and its corresponding termination electrode 52C realizes contacting and along its thickness direction when pressurized, by means of each chain formation conductive path of conductive particle.
In this embodiment, anisotropic conductive plate 37 has irregular shape, and wherein on a surface of a side of the circuit board 52 that is used to check, protrude from the surface of insulated part on the surface that conductive path forms part.
Checking that pin 56 has been inserted under the state of the through hole 25D that checks pin by means of drilling operation in projection 25A being used to of forming, lower side panel extruder member 50 with above-mentioned structure can be by constituting with the lower part according to mentioned order setting at preposition on the front surface of downside base plate 25: aim at movable platen 15, wherein being formed with is the hole 15A of rectangle basically, dividing plate 58, wherein be formed with a plurality of through hole 58A that are used to check pin, anisotropic conductive plate 57, circuit board 52 that is used to check and anisotropic conductive plate 53.
The polymeric material that the elastomeric polymer matter of the basis material of the anisotropic conductive plate of formation formation first checkout facility 10 preferably has cross-linked structure.As the curable polymeric material formation material that can be used for obtaining crosslinked polymeric material, can use multiple material, wherein specific example comprises the diene rubber of conjugation, polybutadiene rubber for example, natural rubber, polyisoprene rubber, polyethylene-butadiene copolymer rubber, and the third rare nitrile-butadiene copolymer rubber, and their hydrogenated products; Block copolymer rubber is styrene-butadiene-two eneyne ter-polymer rubber and styrene-isoprene block copolypeptide for example, and their hydrogenated products; Also have the chlorobutadiene chemglaze, lactoprene, epichlorohydrin rubber, silicon rubber, rare copolymer rubber of ethene-third and ethene-third is rare-diene terpolymer rubber.
When the anisotropic conductive plate of in the above-described embodiment gained requires weather resistance, preferably use any other material outside the conjugated diene rubber.Specifically, it seems, preferably use silicon rubber from the viewpoint of crystallized ability and disposal ability and electrical property.
As silicon rubber, the silicon rubber or the concentrated liquid silicon rubber that obtain by crosslinked action are preferred.Liquid silastic is 10 -1Preferably have when measuring under the shearing of sec and be not more than 10 5The viscosity of pool, and can be concentrated type, addition type and contain any kind in vinyl or the hydroxyl.As specific example wherein, can mention dimethyl-silicon raw rubber, methyl ethylene silicon raw rubber and methyl phenyl vinyl silicon raw rubber.
In the middle of these, the liquid silastic (dimethyl polysiloxane that contains vinyl) that contains vinyl is generally by being hydrolyzed and condensation reaction under the condition that has dimethyl vinyl chlorosilane or dimethyl vinyl alkoxy silane to dimethyldichlorosilane or dimethyl dialkoxy silicane, and then for example comes the fractionation product to obtain by decomposition-precipitation repeatedly.
The liquid silastic that has vinyl at its two ends by to the siloxanes of ring-type for example octamethylcy-clotetrasiloxane exist and carry out anionic polymerization under the condition of catalyst and obtain, for example use the terminator of dimethyl divinylsiloxanes, and select other reaction condition (for example amount of annular siloxane and polymerization terminator) suitably as polymerization.As the catalyst of anionic polymerization effect, can use alkali, for example tetramethyl-ammonium hydroxide, or n-butyl phosphorus hydroxide, perhaps their silicon alkoxide (silanolate) solution.Described reaction is for example carried out under 80-130 ℃ temperature.
On the other hand, the liquid silastic of hydroxyl (dimethyl polysiloxane of hydroxyl) is general by dimethyldichlorosilane or dimethyl dialkoxy silicane are hydrolyzed and condensation reaction under the condition that has dimethyl hydrogen chloromethane silane or dimethyl hydrogen alkoxy silicane, for example by the decomposition that repeats and precipitation product is carried out fractionation subsequently and obtains.
The liquid silastic of hydroxyl is also by carrying out anionic polymerization and obtain existing annular siloxane under the condition of catalyst, for example use dimethyl hydrogen chloromethane silane, methyl dihydro chloromethane silane or dimethyl hydrogen alkoxy silicane be as polymerization terminator, and select other reaction condition (for example amount of annular siloxane and polymerization terminator) suitably.As the catalyst of anionic polymerization, can use alkali, for example tetramethyl-ammonium hydroxide, or n-butyl phosphorus hydroxide, perhaps their silicon alkoxide solution.Described reaction is for example carried out under 80-130 ℃ temperature.
This flexible polymer material preferably has the weight molecular weight Mw (weight average molecular weight definite according to the polystyrene equivalent of standard) of 10000-40000.It seems preferably also have and mostly be 2 molecular weight distributing index (the ratio Mw/Mn of weight average molecular weight Mw that determines according to the polystyrene equivalent of standard and the number average molecular weight Mn that determines according to the polystyrene equivalent of standard) most from the viewpoint of the thermal resistance of the anisotropic conductive plate of gained.
Being used for curing catalysts that cure polymer matter forms material in the above, can be comprised in the plate that is used to obtain the anisotropic conductive plate and form material.As this curing catalysts, can use organic peroxide, aliphatic acid azo-compound, the catalyst of hydrosilylation or analog.
The specific example that is used as the organic peroxide of curing catalysts comprises benzoyl peroxide, two dicyclo benzoyl peroxide, cumyl peroxide and di-tert-butyl peroxides.
The specific example that is used as the aliphatic acid azo-compound of curing catalysts comprises azodiisobutyronitrile.
The specific example that is used as the catalyst of hydrosilylation reactions comprises known catalyst; for example chloroplatinic acid and salt thereof; the siloxanes complex compound of platiniferous unsaturated group; vinylsiloxane-platinum complex; platinum-1; 3-divinyl tetramethyl disiloxane complex compound, the complex compound of three organic phosphines or triorganophosphite and platinum, acetyl group acetate platinum chelate and cyclic diene-platinum complex.
The amount of the curing catalysts that uses is selected suitably according to the kind of polymeric material formation material, kind and other treatment conditions of curing catalysts.But, usually, according to the quality of polymeric material formation material, per 100 parts of quality have 3-15 part curing catalysts.
Form in the material at plate, as required, can contain common inorganic filler, for example SiO 2 powder, colloidal silica, aeroge silica or aluminium oxide.By containing this inorganic filler, can guarantee that this plate forms the thixotropic property of material, its viscosity is uprised, improve the dispersion stabilization of conductive particle, and can strengthen the intensity of the anisotropic conductive plate of gained.
Amount for this inorganic filler that uses does not have specific restriction.But, a large amount of excessively uses is not preferred, and this is because the orientation of the conductive particle that is caused by magnetic field can not realize fully.
The viscosity that plate forms material is preferably under 25 ℃ the temperature in the scope of 100000-1000000cP.
As conductive particle,, use particle with magnetic from allowing their to be it seems by the directed viewpoint of arranging along the thickness direction of the anisotropic conductive plate of gained that makes easily by means of applying magnetic field.The specific example of this conductive particle comprises the metallic particles with magnetic, nickel for example, the particle of iron and cobalt and their alloy, contain this metallic particle, by means of using these particles also to utilize metal for example golden with good conductivity as core granule, silver, palladium or rhodium are electroplated the surface of core granule and the particle that obtains, by means of the particle that uses nonmagnetic metal, the particle of inorganic substances for example the particle of bead or polymer as core granule, and the magnetisable material that utilizes conduction for example nickel or cobalt electroplate the surface of core granule and the particle that obtains, and utilize the magnetisable material of conduction and have the metallic cover core granule of good conductivity and the particle that obtains.
In the middle of these, by means of use by ferromagnetic material for example the nickel particle as core granule and utilize have good conductivity metal particularly gold electroplate its surface and the particle that obtains is preferably used.
Method for the conducting metal on the surface that is used to apply core granule does not have specific restriction.But, for example can apply by chemical coating or plating.
When the particle that obtains by means of utilizing conducting metal to apply the surface of core granule during as conductive particle, it seems from the viewpoint of the conductivity that realizes, the coating rate of conducting metal on particle surface (utilizing the ratio of the area of conducting metal coating to the surface area of core granule) preferably is at least 40%, more preferably being at least 45%, particularly preferably is 47-95%.
Based on core granule, the amount of the conducting metal of coating more preferably is according to quality 1-30% preferably according to the 0.5-50% of quality, be preferably again according to quality 3-25%, and particularly preferably be according to quality 4-20%.When the conducting metal that applies was gold, based on core granule, its coated weight was preferably according to quality 2.5-30%, more preferably is according to quality 3-20%, is preferably according to quality 3.5-17% again.
The content of water preferably mostly is most 5% in conductive particle, more preferably mostly is most 3%, preferably mostly is most 2% again, particularly preferably mostly is most 1%.The conductive particle that these conditions are satisfied in use can prevent or stop generation bubble when polymeric material formation material is cured processing.
According to volume fraction, the ratio of the conductive particle that comprises is preferably 5-60%, more preferably is 8-50%, particularly preferably is 10-40%.
Under the state of the load lower edge of 10-20gf thickness direction, preferably mostly be most 100m Ω along the resistance of the thickness direction of anisotropic conductive plate to anisotropic conductive plate pressurization.
The thickness of each of the anisotropic conductive plate 53 of the anisotropic conductive plate 33 of formation upside adapter 31 and formation downside adapter 51 is 0.05-0.2mm preferably.
Constituting upside checks an anisotropic conductive plate 37 of 35 and constitutes each the thickness 0.1-1.5mm preferably that downside is checked an anisotropic conductive plate 57 of 55.
Anisotropic conductive plate 37 and 57 each thickness refer to the thickness that each conductive path forms part, and conductive path forms preferably 0.02-1.3mm of height that part protrudes from the surface of insulated part.
The decentralized anisotropic conductive plate that constitutes first checkout facility 10 can be produced with following manner.
The flowable plate of preparation forms material like this: form dispersed electro-conductive particle in the material at polymeric material, by means of cured, it will become flexible polymeric material, and reduce the processing that defoams by means of pressure as required.This plate formation material of preparation is injected in the model cavity of the mould that is used for molded anisotropic conductive plate in this way, forms material layer so that form plate under the dispersed state of conductive particle.For example, then a pair of electromagnet is arranged on the upper surface and lower surface of mould, and operate described electromagnet, so as to the thickness direction that forms material layer along plate it is applied parallel magnetic field, so that make at plate and form the such orientation of conductive particle quilt of disperseing in the material layer, so that they are arranged along thickness direction.In this state, plate is formed material layer be cured processing, so as to producing a kind of anisotropic conductive plate, it has the conductive particle that is oriented along the thickness direction arrangement in the flexible polymer material.
The uneven distribution type anisotropic conductive plate that constitutes first checkout facility 10 can be produced with the following methods.
For example, a kind of mould that is used for molded anisotropic conductive plate is provided, it is made of backform and bed die, each of backform and bed die made the as a whole shape that is essentially dull and stereotyped that has, and correspond to each other, and having such structure, the material layer in the feasible molding cavity that is injected between backform and the bed die can be cured by means of heating when described material layer is applied magnetic field.
In order to form the part that has conductivity in place by means of material layer being applied magnetic field, be used for the model of molded anisotropic conductive plate at this, backform and bed die have such structure, it has the mosaic coating that forms by means of the ferromagnetic material part that is made of iron, nickel or its analog is set, the magnetic field that is used in mould produces an intensity distributions, also have by nonmagnetic metal for example copper or or the non-magnetic part that forms of resin, they alternately are provided with, and make to interconnect on by the ferromagnetic material base plate that for example iron or nickel constitute.The ferromagnetic material part is set up according to the pattern that forms the pattern of part corresponding to the conductive path that will form.
The molded surface of backform is flat, and the molded surface of bed die has the slight scrambling that forms part in the anisotropic conductive plate corresponding to the conductive path that will form.
The above-mentioned mould that is used for molded anisotropic conductive plate is used with the following methods and is used to produce the anisotropic conductive plate.
By in polymeric material forms material, comprising the moulding material that conductive particle with magnetic obtains, it will become flexible polymeric material by means of solidifying, at first injected in the molding cavity of the mould that is used for molded anisotropic conductive plate, thereby formed the moulding material layer.
Ferromagnetic material in each of backform and bed die part and non-magnetic material part are used to the moulding material layer of formation is applied the magnetic field with intensity distributions along its thickness direction then, thereby conductive particle is accumulated in the ferromagnetic material part of backform and between the ferromagnetic material part of the bed die under the described part of backform by means of magnetic force, and further make the conductive particle orientation, make and arrange along its thickness direction.In this state, the moulding material layer is cured processing, thereby produces the anisotropic conductive plate, it has such structure: the conductive path of a plurality of cylindricalitys forms part and is insulated the part mutually insulated.
The anisotropic conductive plate that first checkout facility 10 is not limited to only product of anisotropic conductive plate coverlet wherein and production is set at the structure on the circuit board that other parts for example are used to check, these plates can integrate at its production process other parts that neutralize.
In having first checkout facility 10 of said structure, the electric-examination of checked circuit board 1 to look into and carry out with following manner.
Wanting checked circuit board 1 to be arranged on by the circuit board maintaining body checks in the execution area 11.In this state, upside supports insert plate 23 and downside support insert plate 27 is moved along the approaching direction of checked circuit board 1 of wanting respectively, push upside base plate 21 and downside base plate 25 respectively so as to making upside support 22 and downside support 26, thereby along moving epipleural extruder member 30 and lower side panel extruder member 50 near the direction of wanting checked circuit board 1.As a result, checked circuit board 1 by epipleural extruder member 30 and 50 extruding of lower side panel extruder member.
As shown in figure 12, by wanting checked circuit board 1 and the epipleural extruder member 30 of the described circuit board of extruding and the compound stack 19 that lower side panel extruder member 50 constitutes, the positions of supporting 26 extruding respectively according to upside strong point 21A and downside strong point 21B by upside support 22 and downside above whole stack, by moving and deflection along thickness direction with upside base plate 21 and downside base plate 25, and, thereby realize to measure state with the wavy warpage of rule.
Even under can the measurement state, the movable platen 15 of aligning also and non-can the measurement state under like that, be in owing to aim at the state that supports 16 motion and can slide.
This can the measurement state under, first checkout facility 10 is so constructed: support 22 end horizontal (hereinafter being also referred to as " upper horizontal ") and support the gross thickness of gap between 26 the end horizontal (hereinafter being also referred to as " lower horizontal ") (hereinafter being also referred to as " upside supports and the gap of downside between supporting ") less than composite stack body 19, upside base plate 21 and downside base plate 25 at downside at upside along the thickness direction of compound stack 19.
Top " thickness of composite stack body 19 " refers to epipleural extruder member 30, wants the gross thickness of checked circuit board 1 and lower side panel extruder member 50.
Top " gap between upside support and downside support " refers in upside support 22 with at (hereinafter being also referred to as " boundary the surface ") M2 of the border surface between the upside base plate 21 on the upper horizontal and in downside support 26 with between the border surface between the downside base plate 25 on the lower horizontal (hereinafter being also referred to as " downside border surface ") M3, along thickness direction perpendicular to composite stack body 19, gap when boundary surface M2 is positioned at the top of downside border surface M3, as shown in figure 12.Thereby in this manual, wherein the position between boundary surface M2 and the downside border surface M3 concerns that situation about being reversed is considered to be in state very close to each other between upside support and the downside support.
If upside support and the gap of downside between supporting too big, then composite stack body 19 can not be able to be out of shape with upside base plate 21 and downside base plate 25 with downside strong point 25B according to upside strong point 21A in the measurement state.
With the mobile status in the R1 of upside unit area is the mobile status that example specifies composite stack body 19 under can the measurement state.The ratio of deflection e (seeing Figure 12) in the R1 of upside unit area and the gap c (see figure 4) between two upside strong point 21A on the diagonal that constitutes upside unit area R1 is preferably 1 down to 0.02%, more preferably is 0.5 down to 0.04%.
Under can the measurement state, for example be set to 110-250kgf for the pressure of wanting checked circuit board 1.
Under this can the measurement state, all on wanting checked circuit board 1 want checked on lateral electrode 2 be electrically connected by its corresponding inspection electrode pair in anisotropic conductive plate 33 and the upside adapter 31 respectively, each of described inspection electrode pair is to being made of electrode 32A that is used for the electric current supply and the electrode 32B that is used for voltage measurement, and the termination electrode 32C of this upside adapter 31 respectively the conductive path by anisotropic conductive plate 37 form part 37A and upside and check that an its corresponding inspection pin 36 of 35 is electrically connected.
On the other hand, all checked downside electrodes 3 of wanting on wanting checked circuit board 1 are electrically connected by its corresponding inspection electrode pair in anisotropic conductive plate 53 and the downside adapter 51 respectively, each of described inspection electrode pair is to being made of electrode 52A that is used for the electric current supply and the electrode 52B that is used for voltage measurement, and the termination electrode 52C of this downside adapter 51 respectively the conductive path by anisotropic conductive plate 57 form part and downside and check that an its corresponding inspection pin 56 of 55 is electrically connected.
From tester supplying electric current between the electrode that is used for the electric current supply, detect by tester and to be used for the voltage signal between the electrode of voltage measurement and to handle, can measure thus want checked on lateral electrode 2 and want resistance in the checked downside electrode 3.
According to the first above-mentioned checkout facility 10, under can the measurement state, the mutually different position of pressure application point on specific projection plane M1 of the pressure application point of upside support 22 and downside support 26 is formed with the form of grid, and extruding therein wants the composite stack body 19 of checked circuit board 1 to be forced to distortion with downside strong point 25B with upside base plate 21 and downside base plate 25 according to the upside strong point 21A that forms described application point, concentrates on the application point so as to prevention pressure.The result, because the pressure distribution in wanting checked circuit board 1 is uniform, can obtain a kind of state, wherein all electrodes in wanting checked circuit board 1 (wanting checked goes up lateral electrode 2 and want checked downside electrode 3) are electrically connected to being used for the electric current supply and being used for the electrode of voltage measurement of its correspondence equably, feasiblely can carry out the resistance inspection of circuit board with high precision.
Because upside base plate 21 and downside base plate 25 are preferably done thinlyyer, so that realize a kind of like this state:, make that the weight of whole first checkout facility 10 is lighter by reducing in upside base plate 21 and the downside base plate 25 quality of each.The quality of each in upside base plate 21 and the downside base plate 25 is reduced to half of base plate quality of the checkout facility of the routine that is configured for circuit board in fact at most.
Thereby, according to first checkout facility 10, can do the anisotropic conductive plate than approaching and do not produce shortcoming, even make when circuit board has the detected object electrode in little size and spacing or little gap, also can look into, can expect to alleviate the weight of measuring equipment itself in addition with the electric-examination that high reliability is carried out circuit board.
Because the pressure distribution in wanting checked circuit board 1 is uniform, can use anisotropic conductive plate as each the anisotropic conductive plate 33 and 35 that constitutes upside adapter 31 and downside adapter 51 suitably with following structure, in this structure, conductive particle is comprised in the whole zone of the basis material that is made of the flexible polymer material that has insulation property under even directed state.
In addition, because realize the state of to measure with upside base plate 21 and 25 distortion of downside base plate by making composite stack body 19, making does not need to use its total length separately to be used to form upside strong point 21A and downside strong point 25B by those supports with high precision equalization as a plurality of upsides supports 22 and downside support 26, they are the pressure application points in upside base plate 21 and downside base plate 25 each, as long as checkout facility has and can obtain the structure that this can measure state.As a result, can easily produce first checkout facility 10.
Because the conduction between each of the detected object electrode in wanting checked circuit board 1 (wanting checked goes up lateral electrode 2 and want checked downside electrode 3) and the inspection electrode pair can realize and can realize by the measurement state by little pressure, so can make durable tolerance required under pressurized state little.As a result, can use durable tolerance is quite low under pressurized state part part, thereby can expect the miniaturization and the simplification of checkout facility itself, and can reduce production cost as first checkout facility 10.
Because can utilize little pressure to want the electric-examination of checked circuit board 1 to look into, so can stop the anisotropic conductive plate 33,37,53 that when each the inspection, causes and 57 deterioration by the pressurization that repeats.Thereby, can reduce the frequency of in first checkout facility 10, changing anisotropic conductive plate 33,37,53 and 57, make it possible to achieve high checking efficiency, and can reduce the inspection cost.
In addition, can use thin plate as upside base plate 21 and downside base plate 25, thereby make that can form each required through hole of described structure by a drilling operation (specifically, is used to check the through hole 21B of pin, 25D and be used for the through hole 25C of alignment pin).Thereby, can shorten the required time of drilling operation, compare, can improve the success rate of drilling operation with the checkout facility that is equipped with thick base plate to need repeatedly drilling operation to form through hole, therefore can form through hole with high efficient, thereby obtain high productivity ratio.
Figure 13 is the sectional view according to the part of the structure of the checkout facility that is used for circuit board of the present invention of representing another kind of example with the ratio of amplifying.
This checkout facility (hereinafter also being called as " second checkout facility ") is used for all being formed with the conduction inspection of the circuit board of detected object electrode (wanting checked electrode) on two surface.In this checkout facility, epipleural extruder member 60 and lower side panel extruder member 65 are set like this, make them relative mutual vertically, described epipleural extruder member 60 is set at the upside of checking object circuit board (wanting checked circuit board) 1, and have according to a plurality of inspection electrode 62A corresponding to the pattern formation of wanting checked upward lateral electrode 2 of wanting checked circuit board 1, and on its front surface (lower surface of Figure 13), has anisotropic conductive plate 33, described lower side panel extruder member 65 is set on the downside of wanting checked circuit board 1, and have a plurality ofly according to the inspection electrode 67A that forms corresponding to the pattern of wanting checked downside electrode 3 of wanting checked circuit board 1, anisotropic conductive plate 53 is equipped with and on its front surface (upper surface of Figure 13).
Remove the structure of epipleural extruder member and lower side panel extruder member different outside, second checkout facility has the structure identical with first checkout facility 10, and use circuit board as checking object with flexibility as first checkout facility, 10, second checkout facility.In Figure 13, the parts with structure identical with first checkout facility be given with first checkout facility in identical label.
In this embodiment, second checkout facility is got circuit board with inspection object circuit board same structure relevant with first checkout facility as checking object.
Even in second checkout facility, the same with first checkout facility 10, the downside strong point that provides the upside strong point that forms on the upside base plate 21 of epipleural extruder member 60 thereon and provide formation on the downside base plate 25 of lower side panel extruder member 65 thereon is set at when from the top (from the top of Figure 13) when seeing second checkout facility, along on the mutually different position on the plane (specific projection plane) of the thickness direction projection of epipleural extruder member 60 and lower side panel extruder member 65.
Specifically, the upside strong point and the downside strong point are respectively formed on upside base plate 21 and the downside base plate 25 with the form of grid.
When the strong point is formed with the form of grid in this way, gap between the gap between the upside strong point adjacent one another are and the downside strong point adjacent one another are preferably is respectively 10-100mm, more preferably being 12-70mm, particularly preferably is 15-50mm.
In second checkout facility, epipleural extruder member 60 is so constructed: upside adapter 61 that is made of circuit board 62 that is used to check and anisotropic conductive plate 33 according to the order setting of mentioning from the below of Figure 13 and upside check 63, and described upside inspection 63 is by constituting with anisotropic conductive plates 64 by means of upside base plate 21 and dividing plate 38 fixing inspection pins 36.
The circuit board that is used to check 62 that constitutes the upside adapter 61 in the epipleural extruder member 60 has such structure: provide on its front surface according to corresponding to want checked circuit board 1 want checked on the inspection electrode 62A that forms of the pattern of lateral electrode 2, the position that (upper surface of Figure 13) gone up according to grid point in its rear surface is provided with a plurality of termination electrode 62B, described grid point for example has 0.2mm, 0.3mm, 0.45mm, 0.5mm, 0.75mm, 0.8mm, 1.06mm, 1.27mm, 1.5mm, the spacing of 1.8mm or 2.54mm.
Each termination electrode 62B at the circuit board 62 that is used for checking is electrically connected by internal wiring part 62C and its corresponding electrode 62A that checks.
The anisotropic conductive plate 64 that constitutes the upside inspection 64 in the epipleural extruder member 60 is so-called decentralized anisotropic conductive plates, wherein in the basis material that constitutes by flexible polymeric material, contain conductive particle, the flexible polymer material has insulation property so directed making under the state of arranging along the thickness direction of anisotropic conductive plate 64, and has such structure: in the time can measuring state lower edge thickness direction plate is pressurizeed, form conductive path by the chain of conductive particle P.This anisotropic conductive plate 64 is fixed by suitable method.
Anisotropic conductive plate 64 preferably has the thickness of 0.1-1.5mm, and can obtain by utilize above-mentioned plate to form material according to above-mentioned production method.
The epipleural extruder member 60 of said structure can be produced like this: embed therein on the front surface that the upside base plate 21 of checking pin 36 is arranged according to the order of mentioning and wherein be formed with a plurality of dividing plate 38, anisotropic conductive plate 64, the circuit board 62 that is used to check and anisotropic conductive plates 33 that are used to check the through hole of pin in the positional alignment of regulation.
In this second checkout facility, lower side panel extruder member 65 is so constructed: the downside adapter 66 that constitutes by circuit board 67 that is used to check and anisotropic conductive plate 53 according to the order setting of mentioning from the top of Figure 13, check 68 by the downside that constitutes with fixing inspection pin 56 of downside base plate 25 and dividing plate 58 and anisotropic conductive plate 69.
The circuit board that is used to check 67 that constitutes the downside adapter 66 in the lower side panel extruder member 65 has such structure: provide the inspection electrode 67A that forms according to corresponding to the pattern of wanting checked downside electrode 3 of wanting checked circuit board 1 on its front surface, and the position that (lower surface among Figure 13) gone up according to grid point in its rear surface is provided with a plurality of termination electrode 67B, the spacing of grid point for example is 0.2mm, 0.3mm, 0.45mm, 0.5mm, 0.75mm, 0.8mm, 1.06mm, 1.27mm, 1.5mm, 1.8mm or 2.54mm.
In each of the termination electrode 67B of the circuit board 67 that is used for checking by internal wiring part 67C with check that electrode 67A is electrically connected.
The anisotropic conductive plate 69 that constitutes the downside inspection 68 in the lower side panel extruder member 65 is so-called decentralized anisotropic conductive plates, wherein in the basis material that constitutes by flexible polymeric material, contain conductive particle, the flexible polymer material has insulation property so directed making under the state of arranging along the thickness direction of anisotropic conductive plate 69, and this conductive plate has such structure: in the time can measuring state lower edge thickness direction plate is pressurizeed, formed conductive path by the chain of conductive particle.This anisotropic conductive plate 69 is fixed by suitable method.
Anisotropic conductive plate 69 preferably has the thickness of 0.1-1.5mm, and can obtain by utilize above-mentioned plate to form material according to above-mentioned production method.
The lower side panel extruder member 65 of said structure can be produced like this: embed in its projection 25A on the front surface that the downside base plate 25 of checking pin 56 is arranged according to the order of mentioning and the aligning movable platen 15 of the hole 15A that wherein is formed with substantial rectangular is set in the position of regulation, wherein is formed with dividing plate 58, anisotropic conductive plate 69, the circuit board 67 that is used to check and the anisotropic conductive plate 53 of a plurality of through holes that are used to check pin.
In having second checkout facility of said structure, as first checkout facility 10, want checked circuit board 1 by epipleural extruder member 60 and 65 extruding of lower side panel extruder member, by wanting checked circuit board 1 and the epipleural extruder member 60 of the described circuit board of extruding and the composite stack body that lower side panel extruder member 65 constitutes, in the position of supporting the extruding stack respectively according to the upside strong point and the downside strong point by upside support and downside, by moving and deflection along thickness direction with upside base plate 21 and downside base plate 25, and, thereby realize to measure state with the wavy warpage of rule.
This can the measurement state under, between the lower horizontal that upper horizontal that upside supports and downside support, along the thickness direction of composite stack body, the gap between upside support and downside support is less than the gross thickness of composite stack body, upside base plate 21 and downside base plate 25.
As this second checkout facility can the measurement state under the example of the state that is moved of composite stack body, under the identical mode of the example of the state that is moved of being correlated with first checkout facility 10, the degree b of deflection is preferably 1 down to 0.02% to the ratio in the gap between 2 upside strong points on the diagonal that constitutes the upside unit area in the upside unit area, more preferably is 0.5 down to 0.04%.
Under can the measurement state, for example be set to 110-250kgf for the pressure of wanting checked circuit board 1.
This can the measurement state under, want all on the checked circuit board 1 want checked on its corresponding inspection electrode 62A of lateral electrode 2 by anisotropic conductive plate 33 and upside adapter 61 be electrically connected, the termination electrode 62B of described upside adapter 61 is electrically connected with its corresponding inspection pin 36 of upside inspection 63 respectively by anisotropic conductive plate 64.On the other hand, wanting all on the checked circuit board 1 to want checked downside electrode 3 to be electrically connected with its corresponding inspection electrode 67A of downside adapter 66 respectively by anisotropic conductive plate 53, the termination electrode 67B of described downside adapter 66 is electrically connected with its corresponding inspection pin 56 of downside inspection 68 respectively by anisotropic conductive plate 69.
In this way, want checked circuit board 1 want checked go up lateral electrode 2 and want checked downside electrode 3 respectively with upside inspection 63 in its corresponding inspection pin 36 and the downside inspection 68 its corresponding inspection pin 56 be electrically connected, thereby realize a kind of state that they have been electrically connected with the check circuit of tester, carry out required electric-examination in this state and look into.
According to the second above-mentioned checkout facility, under can the measurement state, the mutually different position of pressure application point on specific projection plane that pressure application point that upside supports and downside support is formed with the form of grid, and wherein the extruding composite stack body of wanting checked circuit board 1 is forced to be out of shape waveform shape with formation rule according to the upside strong point that forms described application point with the downside strong point and upside base plate 21 and downside base plate 25, concentrates on the application point so as to prevention pressure.The result, because the pressure distribution in wanting checked circuit board 1 is uniform, can keep a kind of state, wherein all electrodes in wanting checked circuit board 1 (wanting checked goes up lateral electrode 2 and want checked downside electrode 3) are electrically connected on the inspection electrode 62A and 67A of its correspondence equably, feasible can looking into the electric-examination that high reliability is carried out circuit board.
Because upside base plate 21 and downside base plate 25 are preferably done thinlyyer, so that realize a kind of like this state:, make that the weight of whole second checkout facility is lighter by reducing in upside base plate 21 and the downside base plate 25 quality of each.In fact the quality of each of upside base plate 21 and downside base plate 25 is reduced to half of base plate quality of the checkout facility that is at most the routine that is configured for circuit board.
Thereby, according to second checkout facility, can be with doing the anisotropic conductive plate thinly with first checkout facility, 10 identical modes and not producing shortcoming, even make when circuit board has the detected object electrode in little size and spacing or little gap, also can look into, can expect to alleviate the weight of measuring equipment itself in addition with the electric-examination that high reliability is carried out circuit board.
Because the pressure distribution in wanting checked circuit board 1 is uniform, so can use anisotropic conductive plate suitably as the anisotropic conductive plate with following structure, in this structure, conductive particle is comprised in the whole zone of the basis material that is made of the flexible polymer material that has insulation property under even directed state.
In addition, because realize the state of to measure with upside base plate 21 and 25 distortion of downside base plate by making the composite stack body, making does not need to use its total length separately to be used to form the upside strong point and the downside strong point by those supports with high precision equalization as a plurality of upsides supports and downside support, they are the pressure application points in upside base plate 21 and downside base plate 25 each, as long as checkout facility has and can obtain the structure that this can measure state.As a result, can easily produce second checkout facility.
Because each of the detected object electrode in wanting checked circuit board 1 (wanting checked goes up lateral electrode 2 and want checked downside electrode 3) and check that the conduction between electrode 62A, the 67A can realize by the measurement state by little pressure realization, so can make the required durable tolerance of under pressurized state each part little.As a result, can use durable tolerance is quite low under pressurized state part part, thereby can expect the miniaturization and the simplification of checkout facility itself, and can reduce production cost as second checkout facility.
Because can utilize little pressure to want the electric-examination of checked circuit board 1 to look into, can stop the anisotropic conductive plate 33,64,53 that when each the inspection, causes and 69 deterioration by the pressurization that repeats.Thereby, can reduce the frequency of in second checkout facility, changing anisotropic conductive plate 33,64,53 and 59, make it possible to achieve high checking efficiency, and can reduce the inspection cost.
In addition, can use thin plate, thereby make and to form each required through hole of described structure by a drilling operation as upside base plate 21 and downside base plate 25.Thereby, can shorten the required time of drilling operation, compare, can improve the success rate of drilling operation with the checkout facility that is equipped with thick base plate to need repeatedly drilling operation to form through hole, therefore can form through hole with high efficient, thereby obtain high productivity ratio.
Though above the present invention has been carried out specific description, the invention is not restricted to the embodiments described, can add various remodeling to it.
For example, the checkout facility that is used for circuit board can be such: be provided at tabular upside base plate 74 and upside inspection on the downside base plate 78 71 and downside inspection 75 respectively by respectively by plate electrode device 72 and 76 and be fixed and the anisotropic conductive plate 73,77 that is arranged on the front surface separately (Figure 14 is positioned at the surface on the sidepiece of wanting checked circuit board 1) of described electrode assembly 72,76 constitutes, as shown in figure 14.In the electrode assembly 72,76 each has the locational a plurality of connection electrode (not shown) that are set at grid point, and the grid point has and the upside adapter 31 on its front surface and the identical spacing of termination electrode (not shown) of downside adapter 51.Each of these connection electrode is by means of the lead (not shown) and by the electrode pin (not shown) be provided at upside respectively and support the connector (not shown) that insert plate 23 and downside support on the insert plate 27 and be electrically connected, and further is electrically connected by described connector and tester (not shown).In Figure 14, label 79 expressions are used for fixing the spacer of the alignment pin 13 of forming circuit plate maintaining body, in the middle of the parts of checkout facility 70,, give and the identical label of first checkout facility 10 shown in Figure 1 having the element with the element same structure of first checkout facility.
The structure that is used for the checkout facility of circuit board is not limited to such structure: the upside strong point and the downside strong point are formed respectively like this, make to be arranged on the respective base regularly, and can have such structure: the upside that forms the strong point support and the downside support according to other parts for example the ordered state of lead arrange with irregular state.
At this checkout facility that is used for circuit board, anisotropic conductive plate decentralized or the non-uniform Distribution type can be used as the anisotropic conductive plate that constitutes checkout facility suitably.In addition, the conductive path that has protrusion on its one or both sides forms those anisotropic conductive plates that part has irregular surface, those anisotropic conductive plates that perhaps do not have scrambling can be by suitably as the anisotropic conductive plate of non-uniform Distribution type.
[example]
Below with concrete example explanation the present invention.But, the invention is not restricted to these examples.
＜example 1 〉
Produced a kind of checkout facility (hereinafter being also referred to as " checkout facility (1) ") that is used for the circuit board of following condition according to structure shown in Figure 1, it is applicable to the inspection part of track conveying type automated circuit board inspection machine " STARREC V5 " (being made by NIDEC-READ CORPORATION).
When producing this checkout facility (1), thickness is that the plate of 4.0mm is used as the upside base plate, make a through hole can utilize a drilling operation to form, with thickness is 6.0mm's thereby will form the downside base plate that a through hole need carry out repeatedly drilling operation and compare, can shorten forming the drilling operation time that through hole is required, thereby can enough high efficient form through hole.
In checkout facility (1), as shown in Figure 4, the upside strong point and the downside strong point are formed with the form of grid respectively, and arrange in such a way, make on specific projection plane M1, downside strong point 25B is set in the rectangle upside unit area R1 that is divided by 4 adjacent upside strong point 21A on the position that two diagonal intersect, and upside strong point 21A is set in the rectangle downside unit area R2 that is divided by 4 adjacent downside strong point 25B on the position that two diagonal intersect.
(1) upside adapter:
[circuit board that is used to check]
The size that is used for the electrode of electric current supply:
0.06mm×0.15mm
The size that is used for the electrode of voltage measurement:
0.06mm×0.15mm
The electrode and the gaps between electrodes that is used for voltage measurement that are used for the electric current supply: 90 μ m
The size of termination electrode: diameter is 0.4mm
The material of basis material:
The epoxy resin that glass fibre strengthens
Maximum ga(u)ge: 1.0mm
[anisotropic conductive plate]
The thickness of size: 110mm * 110mm * 0.1mm
Conductive particle:
Material: gold-plated nickel particle,
Average particulate diameter: 20 μ m
Content: 18%, by volume
The flexible polymer material:
Material: silicon rubber,
Hardness: 40
At the resistance that can measure state lower edge thickness direction: 0.1 Ω
Along the resistance value of thickness direction to ratio along the resistance value of in-plane: 1000 or higher
(2) upside is checked head:
[checking pin]
Material: talmi gold
The size of tip portion:
External diameter is 0.35mm, and total length is 0.1mm
The size of core:
External diameter is 0.48mm, and total length is 1.8mm
The size of major diameter part:
External diameter is 0.55mm, and total length is 0.1mm
Size near part:
External diameter is 0.48mm, and total length is 3.0mm
Gap between the adjacent inspection pin: 0.75mm
[anisotropic conductive plate]
Size: 110mm * 110mm
Conductive path forms the thickness of part: 0.6mm
Conductive path forms the external diameter of part:
0.25mm
Conductive path forms the protrusion height of part: 0.05mm
Conductive particle:
Material: gold-plated nickel particle,
Average particulate diameter: 35 μ m
Content: by volume 13%
The flexible polymer material:
Material: silicon rubber,
Hardness: 30
[dividing plate]
Material: the epoxide resin material " FR-4 " that glass fibre strengthens
The thickness of size: 200mm * 346mm * 1.9mm
(3) upside base plate
Material: the epoxide resin material " FR-4 " that glass fibre strengthens
The thickness of size: 200mm * 346mm * 4.0mm
Quality: 0.5kg
(4) upside supports:
Material: brass
Size:
The external diameter of tip portion: 4mm
Total length: 67mm
Gap between adjacent upside supports:
Horizontal (hereinafter also abbreviating " laterally " as): 32.25mm among Fig. 1
Perpendicular to horizontal direction (hereinafter also abbreviating " vertical direction " as): 24.75mm
(5) downside adapter
[circuit board that is used to check]
The size that is used for the electrode of electric current supply:
0.06mm×0.15mm
The size that is used for the electrode of voltage measurement:
0.06mm×0.15mm
The electrode and the gaps between electrodes that is used for voltage measurement that are used for the electric current supply: 90 μ m
The size of termination electrode: diameter is 0.4mm
The material of basis material:
The epoxy resin that glass fibre strengthens
Maximum ga(u)ge: 1.0mm
[anisotropic conductive plate]
The thickness of size: 110mm * 110mm * 0.1mm
Conductive particle:
Material: gold-plated nickel particle,
Average particulate diameter: 20 μ m
Content: 18%, by volume
The flexible polymer material:
Material: silicon rubber,
Hardness: 40
At the resistance that can measure state lower edge thickness direction: 0.1 Ω
Along the resistance value of thickness direction to ratio along the resistance value of in-plane: 1000 or higher
(6) downside is checked head:
[checking pin]
Material: talmi gold
The size of tip portion:
External diameter is 0.35mm, and total length is 0.1mm
The size of major diameter part:
External diameter is 0.55mm, and total length is 1.8mm
Size near part:
External diameter is 0.48mm, and total length is 3.0mm
Gap 0.75mm between the adjacent inspection pin
[anisotropic conductive plate]
Size: 110mm * 110mm
Conductive path forms the thickness of part: 0.6mm
Conductive path forms the external diameter of part:
0.25mm
Conductive path forms the protrusion height of part: 0.05mm
Conductive particle:
Material: gold-plated nickel particle,
Average particulate diameter: 35 μ m
Content: by volume 13%
The flexible polymer material:
Material: silicon rubber,
Hardness: 30
[dividing plate]
Material: the epoxide resin material " FR-4 " that glass fibre strengthens
The thickness of size: 100mm * 338mm * 1.9mm
[aligning movable platen]
The thickness of size: 100mm * 338mm * 2.95mm
(7) downside base plate:
Material: the epoxide resin material " FR-4 " that glass fibre strengthens
The thickness of size: 100mm * 338mm * 6.0mm
The protrusion height of projection: 3.0mm
Quality: 0.4kg
(8) downside supports:
Material: brass
Size:
The external diameter of tip portion: 4mm
Total length: 65mm
Gap between adjacent downside supports:
Laterally: 32.25mm
Vertical direction: 24.75mm
(9) the upside strong point and the downside strong point:
Gap between the adjacent upside strong point:
Laterally: 32.25mm
Vertical direction: 24.75mm
Cornerwise length in the upside unit area (the gap c among Fig. 4): about 41mm
Gap between the adjacent downside strong point:
Laterally: 32.25mm
Vertical direction: 24.75mm
Cornerwise length in the downside unit area: about 41mm
Gap (d among Fig. 4) between the downside strong point and the upside strong point in the upside unit area: about 20mm
In checkout facility (1), use zero defect circuit board conduct to want checked circuit board to carry out performance test (measuring the durability of minimum squeeze pressure and definite anisotropic conductive plate) according to each following method with following standard.The measurement result of minimum squeeze pressure is as shown in table 1, and the result who determines of the durability of anisotropic conductive plate is as shown in table 2.
In performance test, confirmed: by by flawless circuit board and extruding epipleural extruder member of described zero defect circuit board and the compound stack that the lower side panel extruder member constitutes, in the position of supporting extruding according to the upside strong point and the downside strong point respectively by upside support and downside, move along thickness direction with upside base plate and downside base plate and, can realize the state measured of checkout facility (1) with wavy the shape deflection and the distortion of rule.
[standard of zero defect circuit board]
The thickness of size: 100mm * 100mm * 0.8mm
Want the checked lateral electrode that goes up:
Minimum electrode size: diameter is 0.3mm,
Arrangement pitch: 0.75mm,
Number of electrodes: 7312
Want checked downside electrode:
Minimum electrode size: diameter is 0.3mm,
Arrangement pitch: 0.75mm,
Number of electrodes: 3784
[performance test]
(1) measurement of minimum squeeze pressure:
The checkout facility of being produced (1) is installed in the inspection part of track conveying type automated circuit board inspection machine " STARREC V5 ", then the zero defect circuit board that provides is arranged in the checkout facility (1).The squeeze pressure of track conveying type automated circuit board inspection machine " STARREC V5 " is changed in the scope of 100-250kgf step by step, when the electric current supplying electrode in every pair of inspection electrode is applied the electric current of 1mA, by the conduction resistance value of wanting checked electrode of voltage measurement electrodes measurement, under each squeeze pressure condition, measure 10 times about the zero defect circuit board.
The conduction resistance value of measuring reaches 100 Ω or higher checkpoint (hereinafter referred to as " NG checkpoint ") is judged as defective conducting, so that calculate the ratio (hereinafter referred to as " ratio of NG checkpoint ") of the quantity of NG checkpoint to total quantity of checkpoint.Ratio in the NG checkpoint be 0.01% or minimum squeeze pressure more hour be used as minimum squeeze pressure.
In the measurement of this conduction resistance value, measuring relevant squeeze pressure with this is released after the measurement of finishing conduction resistance value, so that make checkout facility return non-pressurised state, and when the measurement of carrying out conduction resistance value next time, apply the squeeze pressure of prescribed strength again.
Because in the zero defect circuit board, want checked on the quantity of lateral electrode be 7312, wanting the quantity of checked downside electrode is 3784, and each squeeze pressure condition is carried out 10 times and is measured, and " ratio of NG checkpoint " conclusivelys show the ratio (to hereinafter equally suitable) of NG checkpoint to 110960 checkpoints of being calculated by formula (7312+3784) * 10=110960.
In a kind of checkout facility, it seems from the viewpoint that reality is used, need make the ratio of NG checkpoint mostly be 0.01% most.If the ratio of NG checkpoint surpasses 0.01%, the check result that may lead to errors in some cases then wherein flawlessly wants checked circuit board be judged as defective.Thereby has the galvanoscopic possibility that to carry out circuit board with high reliability.
When can becoming low at the squeeze pressure of minimum, a kind of checkout facility want the electric-examination of checked circuit board to look into lower pressure.If the pressure in a kind of checkout facility when checking can be set to low, then when checking, can stop by what pressure caused and want for example deterioration of anisotropic conductive plate and the circuit board that is used to check of checked circuit board and parts, and can use durable tolerance is low under pressurized conditions part part, make expectation realize the miniaturization and the simplification of checkout facility as checkout facility.As a result, can improve the durability of checkout facility itself and reduce the production cost of checkout facility.
(2) durability of anisotropic conductive plate determines
The checkout facility of being produced (1) is installed in the inspection part of track conveying type automated circuit board inspection machine " STARREC V5 ", then the zero defect circuit board that provides is arranged in the checkout facility (1).After the number of times to zero defect circuit board pressurization regulation under by the squeeze pressure condition of track conveying type automated circuit board inspection machine " STARREC V5 " at 130kgf, under the condition of the squeeze pressure of 130kgf, when the electric current supplying electrode in every pair of inspection electrode is applied the electric current of 1mA, by the conduction resistance value of wanting checked electrode of voltage measurement electrodes measurement, measure altogether 10 times about the zero defect circuit board.The conduction resistance value of measuring reaches 100 Ω or higher checkpoint (NG checkpoint) is judged as defective conducting, so that calculate the ratio (ratio of NG checkpoint) of the quantity of NG checkpoint to the checkpoint sum.
Then, except the anisotropic conductive plate in checkout facility (1) replaces with new anisotropic conductive plate, with above-mentioned identical condition under flawless circuit board is carried out the pressurization of stipulated number, and be the squeeze pressure condition changing 150kgf, after this, except the squeeze pressure condition is changed to 150kgf measures the conduction resistance value, to calculate the ratio of NG checkpoint with above-mentioned identical mode.
In the measurement of this conduction resistance value relevant with anisotropic conductive plate durability, squeeze pressure about this measurement is released after the measurement of finishing conduction resistance value, get back to non-pressurised state so that make checkout facility, and when carrying out the measurement next time of conduction resistance value, apply the squeeze pressure of the intensity of regulation again.
＜reference examples 1 〉
Produced a kind of checkout facility (hereinafter being also referred to as " checkout facility of contrast (1) ") that is used for circuit board, except following, it has and the identical structure of checkout facility (1): the thickness of upside base plate is set to 10.0mm, the thickness of downside base plate is set to 13.0mm, the external diameter of the tip portion of each was set to 6.0mm during upside support and downside supported, between upside supports and the lateral clearance of downside between supporting be set to 32.25mm respectively, the gap of vertical direction is set to 24.75mm respectively, and the upside strong point and the downside strong point are provided with by following mode.
Because in the checkout facility (1) of this contrast, compare with checkout facility (1), use has the base plate of big thickness as upside base plate and downside base plate, need repeatedly drilling operation so form a through hole, the time that forms the required drilling operation of through hole is elongated, therefore compare with checkout facility (1), productivity ratio reduces.
Except the contrast circuit board of use producing (1), the minimum squeeze pressure of anisotropic conductive plate and durability are to be determined with example 1 identical mode.The measurement result of minimum squeeze pressure is shown in table 1, the durability of anisotropic conductive plate determine the results are shown in table 2.
In contrast circuit board (1), the upside strong point and the downside strong point are formed with the form of grid respectively, and be set up in mode shown in Figure 17, when seeing contrast circuit board (1) from the top, upside strong point 97A and downside strong point 97B are positioned at the same position on the projection plane.In Figure 17, the dotted line of the unexpected misfortune that a common unit region R 4 that is formed by upside strong point 97A and downside strong point 97B is replaced.
In contrast circuit board (1), between the adjacent upside strong point and the clearance distance between the downside strong point laterally be respectively 32.25mm, vertically be respectively 24.75mm, cornerwise length of the diagonal of upside unit area and downside unit area (the gap c of Figure 17) all is 41mm.Additional disclosure, the gap d shown in Figure 4 of contrast circuit board (1) is 0mm.
[table 1]
Figure C200480004378D00551
[table 2]
Figure C200480004378D00561
＜example 2 〉
Produced a kind of checkout facility (hereinafter being also referred to as " checkout facility (2) ") that is used for the circuit board of following condition according to structure shown in Figure 13, it is applicable to the inspection part of track conveying type automated circuit board inspection machine " STARREC V5 " (being made by NIDEC-READ CORPORATION).
When producing this checkout facility (2), thickness is that the plate of 4.0mm is used as the upside base plate, make a through hole can utilize a drilling operation to form, with thickness is 6.0mm's thereby will form the downside base plate that a through hole need carry out repeatedly drilling operation and compare, can shorten forming the drilling operation time that through hole is required, thereby can enough high efficient form through hole.
In checkout facility (2), the upside strong point and the downside strong point are formed with the form of grid respectively, and arrange by this way, make on specific projection plane M1, downside strong point is set in the rectangle upside unit area of being divided by 4 adjacent upside strong points on the position that two diagonal intersect, and upside strong point is set in the rectangle downside unit area of being divided by 4 adjacent downside strong points on the position that two diagonal intersect.
(1) upside adapter:
[circuit board that is used to check]
Check the sum of electrode: 7312
The minimum size of checking electrode:
60μm×150μm
The sum of termination electrode: 3784
The size of smallest end electrode:
60μm×150μm
The material of basis material:
The epoxy resin that glass fibre strengthens
Maximum ga(u)ge: 1.0mm
[anisotropic conductive plate]
The thickness of size: 110mm * 110mm * 0.1mm
Conductive particle:
Material: gold-plated nickel particle,
Average particulate diameter: 20 μ m
Content: 18%, by volume
The flexible polymer material:
Material: silicon rubber,
Hardness: 40
(2) upside is checked head:
[checking pin]
Material: talmi gold
The size of tip portion:
External diameter is 0.35mm, and total length is 0.1mm
The size of core:
External diameter is 0.48mm, and total length is 1.8mm
The size of major diameter part:
External diameter is 0.55mm, and total length is 0.1mm
Size near part:
External diameter is 0.48mm, and total length is 3.0mm
Gap between the adjacent inspection pin: 0.75mm
[anisotropic conductive plate]
The thickness of size: 110mm * 110mm * 0.25mm
Conductive particle:
Material: gold-plated nickel particle,
Average particulate diameter: 35 μ m
Content: by volume 13%
The flexible polymer material:
Material: silicon rubber,
Hardness: 30
[dividing plate]
Material: the epoxide resin material " FR-4 " that glass fibre strengthens
The thickness of size: 200mm * 346mm * 1.9mm
(3) upside base plate
Material: the epoxide resin material " FR-4 " that glass fibre strengthens
The thickness of size: 200mm * 346mm * 4.0mm
Quality: 0.5kg
(4) upside supports:
Material: brass
Size:
The external diameter of tip portion: 4mm
Total length: 67mm
Gap between adjacent upside supports:
Laterally: 32.25mm
Vertical direction: 24.75mm
(5) downside adapter
[circuit board that is used to check]
Check the sum of electrode: 7312
The minimum size of checking electrode:
60μm×150μm
The sum of termination electrode: 3784
The size of smallest end electrode:
60μm×150μm
The material of basis material:
The epoxy resin that glass fibre strengthens
Maximum ga(u)ge: 1.0mm
[anisotropic conductive plate]
The thickness of size: 110mm * 110mm * 0.1mm
Conductive particle:
Material: gold-plated nickel particle,
Average particulate diameter: 20 μ m
Content: 18%, by volume
The flexible polymer material:
Material: silicon rubber,
Hardness: 40
(6) downside is checked head:
[checking pin]
Material: talmi gold
The size of tip portion:
External diameter is 0.35mm, and total length is 0.1mm
The size of major diameter part:
External diameter is 0.55mm, and total length is 1.8mm
Size near part:
External diameter is 0.48mm, and total length is 3.0mm
Gap between the adjacent inspection pin: 0.75mm
[anisotropic conductive plate]
The thickness of size: 100mm * 110mm * 0.25mm
Conductive particle:
Material: gold-plated nickel particle,
Average particulate diameter: 35 μ m
Content: by volume 13%
The flexible polymer material:
Material: silicon rubber,
Hardness: 30
[dividing plate]
Material: the epoxide resin material " FR-4 " that glass fibre strengthens
The thickness of size: 100mm * 338mm * 1.9mm
[aligning movable platen]
The thickness of size: 100mm * 338mm * 2.95mm
(7) downside base plate
Material: the epoxide resin material " FR-4 " that glass fibre strengthens
The thickness of size: 100mm * 338mm * 6.0mm
The protrusion height of projection: 3.0mm
Quality: 0.4kg
(8) downside supports:
Material: brass
Size:
The external diameter of tip portion: 4mm
Total length: 65mm
Gap between adjacent upside supports:
Laterally: 32.25mm
Vertical direction: 24.75mm
(9) the upside strong point and the downside strong point:
Gap between the adjacent upside strong point:
Laterally: 32.25mm
Vertical direction: 24.75mm
Cornerwise length in the upside unit area:
About 41mm
Gap between the adjacent downside strong point:
Laterally: 32.25mm
Vertical direction: 24.75mm
Cornerwise length in the downside unit area:
About 41mm
The downside strong point in the upside unit area and the gap between the upside strong point: about 20mm
In checkout facility (2), the zero defect circuit board that use is used in example 1 is as wanting checked circuit board, except in the measurement of the minimum squeeze pressure of example 1, measuring the conduction resistance value checking in the electrode when checking that electrode applies the electric current of 1mA, with with example 1 in carry out minimum squeeze pressure the identical mode of measurement carry out performance test, and measure the conduction resistance value except in example 1, when determining the durability of anisotropic conductive plate, when the inspection electrode being applied the electric current of 1mA, checking in the electrode, to carry out another kind of performance test with the identical mode of durability of in example 1, determining the anisotropic conductive plate, the squeeze pressure condition of 130kgf is changed and is 150kgf, and the squeeze pressure condition of 150kgf is changed and is 180kgf.The measurement result of minimum squeeze pressure is shown in table 3, the durability of anisotropic conductive plate determine the results are shown in table 4.
In performance test, confirmed: by by zero defect circuit board and extruding epipleural extruder member of described zero defect circuit board and the compound stack that the lower side panel extruder member constitutes, in the position of supporting by upside respectively and the downside support is pushed according to the upside strong point and the downside strong point, move along thickness direction with upside base plate and downside base plate and, can realize the state measured of checkout facility (2) with wavy the shape deflection and the distortion of rule.
＜reference examples 2 〉
Produced a kind of checkout facility (hereinafter being also referred to as " checkout facility of contrast (2) ") that is used for circuit board, except following, it has and the identical structure of checkout facility (2): the thickness of upside base plate is set to 10.0mm, the thickness of downside base plate is set to 13.0mm, the external diameter of the tip portion of each was set to 6.0mm during upside support and downside supported, between upside supports and the lateral clearance of downside between supporting be set to 32.25mm respectively, the gap of vertical direction is set to 24.75mm respectively.
Because in the checkout facility (2) of this contrast, compare with checkout facility (2), use has the base plate of big thickness as upside base plate and downside base plate, form a through hole and need repeatedly drilling operation, the time that forms the required drilling operation of through hole is elongated, therefore compare with checkout facility (2), productivity ratio reduces.
Except the contrast circuit board of use producing (2), the minimum squeeze pressure of anisotropic conductive plate and durability are to be determined with example 2 identical modes.The measurement result of minimum squeeze pressure is shown in table 3, the durability of anisotropic conductive plate determine the results are shown in table 4.
In contrast circuit board (2), the upside strong point and the downside strong point with contrast circuit board (1) in the upside strong point condition identical with the downside strong point under be formed with the form of grid respectively.
[table 3]
Figure C200480004378D00621
[table 4]

Claims (17)

1. checkout facility that is used for circuit board, be used to check that the electric-examination of object circuit board looks into, wherein carry out described electric-examination and look into by means of the detected object electrode of checking the object circuit board being electrically connected to a plurality of inspection electrodes by the anisotropic conductive plate, described a plurality of inspection electrode is according to being formed corresponding to the pattern of checking the object electrode, and described checkout facility comprises:
The epipleural extruder member, it is set on the upside of checking the object circuit board, and the lower side panel extruder member, and it is set on the downside of checking the object circuit board,
Wherein, in described epipleural extruder member and the described lower side panel extruder member each has a plurality of inspection electrodes, epipleural extruder member and lower side panel extruder member are provided at respectively on the base plate that is being supported by a plurality of supports that are embedded in the support insert plate, and the upside strong point supports corresponding to the upside on the upside base plate relevant with the epipleural extruder member, the downside strong point supports corresponding to the downside on the downside base plate relevant with the lower side panel extruder member, they are set at when watching this checkout facility from the top, along the mutual different position on the plane of the thickness direction projection of epipleural extruder member and lower side panel extruder member;
Wherein under can the measurement state, by checking the object circuit board and being used for epipleural extruder member and the lower side panel extruder member of checking the extruding of object circuit board are constituted a compound stack, on whole stack, in the position of being supported by upside respectively and the downside support is pushed according to the upside strong point and the downside strong point, this stack is out of shape by moving with upside base plate, downside base plate along thickness direction.
2. the checkout facility that is used for circuit board as claimed in claim 1, wherein, the surface of epipleural extruder member has the anisotropic conductive plate, and the surface of lower side panel extruder member has the anisotropic conductive plate.
3. the checkout facility that is used for circuit board as claimed in claim 1 or 2, wherein, upside base plate and downside base plate are supported by upside respectively and downside supports extruding, so as to realizing a kind of state of measuring, check that wherein the object circuit board is by epipleural extruder member and the extruding of lower side panel extruder member.
4. the checkout facility that is used for circuit board as claimed in claim 1 or 2, wherein under can the measurement state, between the terminal horizontal during terminal horizontal in upside supports and downside support along the gap of the thickness direction of described compound stack less than the gross thickness of described compound stack, upside base plate and downside base plate.
5. the checkout facility that is used for circuit board as claimed in claim 1 or 2, wherein, the upside strong point and the downside strong point respectively on upside base plate and downside base plate the form with grid be formed, and
Along on the plane of the thickness direction projection of epipleural extruder member and lower side panel extruder member, have only a downside strong point to be set in the upside unit area of dividing by 4 adjacent upside strong points, and have only a upside strong point to be set in the downside unit area of dividing by 4 adjacent downside strong points.
6. the checkout facility that is used for circuit board as claimed in claim 5, wherein, gap between the adjacent one another are upside strong point relevant with the upside unit area, and the gap between the adjacent one another are downside strong point relevant with the downside unit area is 10-100mm.
7. the checkout facility that is used for circuit board as claimed in claim 1 or 2, wherein, each in upside base plate and the downside base plate is at least 1 * 10 by resistivity 10The insulating material of Ω cm constitutes, and has the thickness of 1-10mm.
8. the checkout facility that is used for circuit board as claimed in claim 1 or 2, wherein, the thickness of each in upside base plate and the downside base plate is at most 5mm.
9. inspection method that is used for circuit board, described method comprises:
Use the checkout facility that is used for circuit board as claimed in claim 1 or 2,
Support upside base plate and the extruding of downside base plate by upside support and downside respectively, can measure state, wherein check the object circuit board by epipleural extruder member and the extruding of lower side panel extruder member thereby form one, and
This can the measurement state under, by checking that object circuit board and epipleural extruder member and lower side panel extruder member constitute compound stack, on whole compound stack, in the position of supporting by upside respectively and the downside support is pushed according to the upside strong point and the downside strong point, by being moved with upside base plate, downside base plate along thickness direction, this stack makes this stack distortion, so that the object circuit board is checked in extruding.
10. checkout facility that is used for circuit board, be used to measure the resistance of checking the object circuit board, wherein by means of by the anisotropic conductive plate a pair of by with the separated electrode that is used for the electric current supply that concerns setting be used for inspection electrode that the electrode of voltage measurement constitutes and be electrically connected to each that is formed on a plurality of detected object electrodes of checking on the object circuit board, thereby carry out described measurement, described checkout facility comprises:
The epipleural extruder member, it is set at the upside of checking the object circuit board, and has the anisotropic conductive plate on its surface, and the lower side panel extruder member, and it is set on the downside of checking the object circuit board, and has the anisotropic conductive plate on its surface,
Wherein, in described epipleural extruder member and the lower side panel extruder member each has many to checking electrode, and be provided at respectively on the base plate that supports by a plurality of support that embeds in the support insert plate, and the upside strong point supports corresponding to the upside on the upside base plate relevant with the epipleural extruder member, the downside strong point supports corresponding to the downside on the downside base plate relevant with the lower side panel extruder member, they are set at when watching this checkout facility from the top, along the mutual different position on the plane of the thickness direction projection of epipleural extruder member and lower side panel extruder member;
Wherein under can the measurement state, by checking the object circuit board and being used for epipleural extruder member and the lower side panel extruder member of checking the extruding of object circuit board are constituted a compound stack, on whole stack, in the position of being supported by upside respectively and the downside support is pushed according to the upside strong point and the downside strong point, this stack is out of shape by moving with upside base plate, downside base plate along thickness direction.
11. the checkout facility that is used for circuit board as claimed in claim 10, wherein, upside base plate and downside base plate are supported by upside respectively and downside supports extruding, so as to realizing a kind of state of measuring, wherein check the object circuit board by epipleural extruder member and the extruding of lower side panel extruder member, thereby carry out resistance measurement.
12. as claim 10 or the 11 described checkout facilities that are used for circuit board, wherein, under can the measurement state, between the terminal horizontal during terminal horizontal in upside supports and downside support along the gap of the thickness direction of described compound stack less than the gross thickness of described compound stack, upside base plate and downside base plate.
13. as claim 10 or the 11 described checkout facilities that are used for circuit board, wherein, the thickness of each is at most 5mm in upside base plate and the downside base plate.
14. as claim 10 or the 11 described checkout facilities that are used for circuit board, wherein, the upside strong point and the downside strong point respectively on upside base plate and downside base plate the form with grid be formed, and
Along on the plane of the thickness direction projection of epipleural extruder member and lower side panel extruder member, have only a downside strong point to be set in the upside unit area of dividing by 4 adjacent upside strong points, and have only a upside strong point to be set in the downside unit area of dividing by 4 adjacent downside strong points.
15. the checkout facility that is used for circuit board as claimed in claim 14, wherein, gap between the adjacent one another are upside strong point relevant with the upside unit area, and the gap between the adjacent one another are downside strong point relevant with the downside unit area is 10-100mm.
16. as claim 10 or the 11 described checkout facilities that are used for circuit board, wherein, each in upside base plate and the downside base plate is made of the epoxy resin that glass fibre strengthens, and has the thickness of 2-5mm.
17. an inspection method that is used for circuit board, described method comprises:
Use as claim 10 or the 11 described checkout facilities that are used for circuit board, and
A kind of can the measurement state under, in this state, upside base plate and downside base plate are pushed by means of supporting by upside support and downside respectively, check that the object circuit board is by epipleural extruder member and the extruding of lower side panel extruder member, by checking the object circuit board and being used for epipleural extruder member and the lower side panel extruder member of checking the extruding of object circuit board are constituted a compound stack, on whole stack, in the position of supporting by upside respectively and the downside support is pushed according to the upside strong point and the downside strong point, by this stack along thickness direction and upside base plate, the downside base plate moves together and makes this stack distortion, so that carry out resistance measurement.
CNB2004800043783A 2003-01-17 2004-01-15 Circuit board checker and circuit board checking method Expired - Fee Related CN100469218C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003010074 2003-01-17
JP010074/2003 2003-01-17
JP203846/2003 2003-07-30

Publications (2)

Publication Number Publication Date
CN1751545A CN1751545A (en) 2006-03-22
CN100469218C true CN100469218C (en) 2009-03-11

Family

ID=36606082

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800043783A Expired - Fee Related CN100469218C (en) 2003-01-17 2004-01-15 Circuit board checker and circuit board checking method

Country Status (1)

Country Link
CN (1) CN100469218C (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8310256B2 (en) * 2009-12-22 2012-11-13 Teradyne, Inc. Capacitive opens testing in low signal environments
KR101338332B1 (en) * 2013-08-16 2013-12-06 주식회사 에스아이 플렉스 Bbt jig for fpcb inspection
CN111834757B (en) * 2020-08-07 2021-12-31 中车大连机车车辆有限公司 Connector detection device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4968931A (en) * 1989-11-03 1990-11-06 Motorola, Inc. Apparatus and method for burning in integrated circuit wafers
US5477160A (en) * 1992-08-12 1995-12-19 Fujitsu Limited Module test card
US6297652B1 (en) * 1999-02-24 2001-10-02 Jsr Corporation Electric resistance measuring apparatus and method for circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4968931A (en) * 1989-11-03 1990-11-06 Motorola, Inc. Apparatus and method for burning in integrated circuit wafers
US5477160A (en) * 1992-08-12 1995-12-19 Fujitsu Limited Module test card
US6297652B1 (en) * 1999-02-24 2001-10-02 Jsr Corporation Electric resistance measuring apparatus and method for circuit board

Also Published As

Publication number Publication date
CN1751545A (en) 2006-03-22

Similar Documents

Publication Publication Date Title
US6297652B1 (en) Electric resistance measuring apparatus and method for circuit board
CN100539061C (en) Probe device is equipped with the wafer inspection equipment of this probe device and chip detection method
CN100397711C (en) Anisotropic conductive connector and production method therefor and inspectioon unit for circuit device
US7541823B2 (en) Circuit board checker and circuit board checking method
CN1806368B (en) Anisotropic conductive connector device and production method therefor and circuit device inspection device
EP1365479B1 (en) Anisotropic conductive connector, its manufacture method and probe member
US8124885B2 (en) Anisotropically conductive connector and anisotropically conductive connector device
US7160123B2 (en) Plural layer anisotropic conductive connector and its production method
US7384280B2 (en) Anisotropic conductive connector and inspection equipment for circuit device
CN100468867C (en) Anisotropic conductive sheet, its manufacturing method and its application
US6604953B2 (en) Anisotropically conductive sheet and connector
KR20080059260A (en) Anisotropic conductive connector and inspection equipment of circuit device
US20060154500A1 (en) Anisotropic conductive connector and wafer inspection device
US6870385B2 (en) Anisotropic conductive sheet and wafer inspection device
JPS61250906A (en) Conductive elastomer sheet
CN1926437B (en) Circuit board inspecting device and circuit board inspection method
CN100469218C (en) Circuit board checker and circuit board checking method
CN100489548C (en) Circuit board inspection device
EP1662614A1 (en) Anisotropic conductive sheet process for producing the same, and circuit board inspection apparatus
JP4099905B2 (en) Support for anisotropic conductive sheet and anisotropic conductive sheet with support
JP2004239900A (en) Device and method for inspecting circuit board
JP3700722B2 (en) Circuit board inspection apparatus and circuit board inspection method
JP3801195B1 (en) Circuit device inspection electrode device, manufacturing method thereof, and circuit device inspection device
JP2005100968A (en) Anisotropic conductive sheet, its manufacturing method, and inspection device for circuit board
JP2001015190A (en) Anisotropic conductive sheet and its manufacture

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: KYOWA MACHINERY CO., LTD. ISC

Free format text: FORMER OWNER: JSR CORP.

Effective date: 20140905

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20140905

Address after: Gyeonggi Do, South Korea

Patentee after: ISC Co., Ltd.

Address before: Tokyo, Japan

Patentee before: JSR Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090311

Termination date: 20160115

EXPY Termination of patent right or utility model