CA2452656A1 - A method of depositing an inorganic film on an organic polymer - Google Patents

A method of depositing an inorganic film on an organic polymer Download PDF

Info

Publication number
CA2452656A1
CA2452656A1 CA002452656A CA2452656A CA2452656A1 CA 2452656 A1 CA2452656 A1 CA 2452656A1 CA 002452656 A CA002452656 A CA 002452656A CA 2452656 A CA2452656 A CA 2452656A CA 2452656 A1 CA2452656 A1 CA 2452656A1
Authority
CA
Canada
Prior art keywords
inorganic material
polymer composition
polymer
polymer substrate
alumina
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002452656A
Other languages
French (fr)
Other versions
CA2452656C (en
Inventor
Steven M. George
John D. Ferguson
Alan W. Weimer
Christopher A. Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Colorado
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2452656A1 publication Critical patent/CA2452656A1/en
Application granted granted Critical
Publication of CA2452656C publication Critical patent/CA2452656C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4417Methods specially adapted for coating powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/06Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing polymers
    • B01J31/069Hybrid organic-inorganic polymers, e.g. silica derivatized with organic groups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/042Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • C08J7/0423Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/043Improving the adhesiveness of the coatings per se, e.g. forming primers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/046Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/048Forming gas barrier coatings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02Pretreatment of the material to be coated
    • C23C16/0272Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/08Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal halides
    • C23C16/14Deposition of only one other metal element
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34Nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/403Oxides of aluminium, magnesium or beryllium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/442Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using fluidised bed process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • C23C16/45555Atomic layer deposition [ALD] applied in non-semiconductor technology
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2231/00Catalytic reactions performed with catalysts classified in B01J31/00
    • B01J2231/10Polymerisation reactions involving at least dual use catalysts, e.g. for both oligomerisation and polymerisation
    • B01J2231/12Olefin polymerisation or copolymerisation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2231/00Catalytic reactions performed with catalysts classified in B01J31/00
    • B01J2231/70Oxidation reactions, e.g. epoxidation, (di)hydroxylation, dehydrogenation and analogues
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations

Abstract

Inorganic materials are deposited onto organic polymers using ALD methods. Ultrathin, conformal coatings of the inorganic materials can be made in this manner. The coated organic polymers can be used as barrier materials, as nanocomposites, as catalyst supports, in semiconductor applications, in coating applications as well as in other applications.

Claims (37)

1. A method for depositing an inorganic material on a polymer substrate material comprising conducting a sequence of at least two self limiting reactions at the surface of said polymer substrate to deposit the inorganic material onto the surface of said polymer substrate.
2. The method of claim 1, wherein said self-limiting reactions are conducted at a temperature below the temperature at which the polymer substrate degrades, melts or softens enough to lose its physical shape, and the self limiting reactions are conducted using reactants that are gasses under the conditions of the reactions
3. The method of claim 1 or 2, which is an ALD process.
4. The method of any of claims 1-3, wherein at least one of the reactants wets the surface of the polymer substrate.
5. The method of any of claims 1-4, wherein the polymer substrate is in the form of a film.
6. The method of any of claims 1-4, wherein the polymer substrate is in the form of a particulate.
7. The method of claim 6, wherein the method is conducted by fluidizing a bed of the particulate polymer substrate.
8. The method of claim 1 or 2, wherein the inorganic material is alumina.
9. The method of claim 8, wherein the alumina is deposited by repeating the reaction sequence:
Al-(CH8)* + H2O .fwdarw. Al-OH* + CH4 (A1) Al-OH* + Al(CH3)3 .fwdarw. Al-O-Al(CH3)2* + CH4 (B1)
10. The method of claim 8, wherein an additional inorganic material is deposited over the alumina.
11. The method of claim 1 or 2, wherein the inorganic material is deposited in the form of a continuous film.
12. The method of claim 11, wherein the continuous film is ultrathin and conformal.
13. The method of claim 12, wherein the continuous film has a thickness of from 0.5 nanometer to 200 nanometers.
14. The method of any of the preceding claims wherein the polymer substrate contains functional groups through which the inorganic material forms chemical bonds to the polymer substrate.
15. The method of claim 14 wherein the functional group is halogen, hydroxyl, carbonyl, carboxylic acid, primary amine, secondary amine, or mixture of two or more thereof.
16. The method of any of the preceding claims wherein the polymer substrate is low density polyethylene, linear low density polyethylene, substantially linear polyethylene, high density polyethylene, polypropylene, polybutylene, polystyrene, poly(naphthalene); a polymer of a conjugated diene, polyethylene terephthalate, polymethyl methacrylate, polyvinyl chloride, or an organosilicone polymer.
17. A polymer composition comprising polymer substrate having deposited thereon an inorganic material in the form of a film or discrete particles having a thickness of 200 nm or less.
18 The polymer composition of claim 17 wherein the inorganic material is in the form of a continuous film.
19. The polymer composition of claim 18 wherein the continuous film is conformal.
20. The polymer composition of any of claims 17-19 wherein the inorganic material is alumina.
21. The polymer composition of claim 20 wherein another inorganic material is deposited over the alumina.
22. A polymer composition comprising a polymer substrate having an inorganic material deposited thereon made in according with method of any of claims 1-16.
23. The polymer composition of any of claims 17-22 which is fabricated into a bag, bottle or other container.
24. The polymer composition of claim 23 wherein the inorganic material provides a gas and vapor diffusion barrier for the bag, bottle or other container.
25. A method comprising depositing an active catalyst onto the polymer composition of any of claims 17-22 to form a supported catalyst.
26. A supported catalyst made according to the method of claim 25.
27. A method comprising melt processing the polymer composition of any of claims 17-22 to form a fabricated article.
28. The method of claim 27, wherein the fabricated article comprises a nanocomposite of the inorganic material in the polymer substrate.
29. A fabricated article made according to claim 27.
30. The fabricated article of claim 29, which is a structural component of a vehicle, appliance or building.
31. The polymer composition according to claim 22, in which the inorganic material is alumina.
32. The polymer composition according to claim 31, in which a second inorganic material is deposited over the alumina.
33. The polymer composition of claim 32, in which the second inorganic material forms an ultrathin, conformal coating.
34. The polymer composition of claim 32, in which the second inorganic material is titanium nitride or tantalum nitride.
35. A semiconductor device comprising a copper or aluminum interconnect insulated with the polymer composition of claim 34.
36. A coating composition comprising the polymer composition of any of claims 22.
37. A method of making a nanocomposite, comprising melt processing the polymer composition of any of claims 17-22.
CA2452656A 2001-07-18 2002-07-16 A method of depositing an inorganic film on an organic polymer Expired - Lifetime CA2452656C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US30652101P 2001-07-18 2001-07-18
US60/306,521 2001-07-18
PCT/US2002/022742 WO2003008110A1 (en) 2001-07-18 2002-07-16 A method of depositing an inorganic film on an organic polymer

Publications (2)

Publication Number Publication Date
CA2452656A1 true CA2452656A1 (en) 2003-01-30
CA2452656C CA2452656C (en) 2010-04-13

Family

ID=23185674

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2452656A Expired - Lifetime CA2452656C (en) 2001-07-18 2002-07-16 A method of depositing an inorganic film on an organic polymer

Country Status (5)

Country Link
US (2) US20040194691A1 (en)
EP (1) EP1425110B1 (en)
JP (1) JP4295614B2 (en)
CA (1) CA2452656C (en)
WO (1) WO2003008110A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9051441B2 (en) 2012-03-29 2015-06-09 Xerox Corporation Process for chemical passivation of polymer surfaces

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7476420B2 (en) 2000-10-23 2009-01-13 Asm International N.V. Process for producing metal oxide films at low temperatures
FI118014B (en) 2000-10-23 2007-05-31 Asm Int Process for making alumina thin films at low temperatures
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
CN100390105C (en) 2003-03-26 2008-05-28 圣戈本陶瓷及塑料股份有限公司 Silicon carbide ceramic components having oxide layer
WO2004105149A1 (en) * 2003-05-16 2004-12-02 E.I. Dupont De Nemours And Company Barrier films for plastic substrates fabricated by atomic layer deposition
US20050056219A1 (en) * 2003-09-16 2005-03-17 Tokyo Electron Limited Formation of a metal-containing film by sequential gas exposure in a batch type processing system
US20050172897A1 (en) * 2004-02-09 2005-08-11 Frank Jansen Barrier layer process and arrangement
US7767220B2 (en) * 2004-04-23 2010-08-03 Boston Scientific Scimed, Inc. Implantable or insertable medical articles having covalently modified, biocompatible surfaces
US20050252449A1 (en) 2004-05-12 2005-11-17 Nguyen Son T Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
US8501277B2 (en) 2004-06-04 2013-08-06 Applied Microstructures, Inc. Durable, heat-resistant multi-layer coatings and coated articles
DE102005025083B4 (en) * 2005-05-30 2007-05-24 Infineon Technologies Ag Thermoplastic thermoset composite and method for bonding a thermoplastic material to a thermoset material
US7648927B2 (en) 2005-06-21 2010-01-19 Applied Materials, Inc. Method for forming silicon-containing materials during a photoexcitation deposition process
US7651955B2 (en) 2005-06-21 2010-01-26 Applied Materials, Inc. Method for forming silicon-containing materials during a photoexcitation deposition process
US7798096B2 (en) 2006-05-05 2010-09-21 Applied Materials, Inc. Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool
US20080014380A1 (en) * 2006-05-12 2008-01-17 Steven Jones Iridescent film with barrier properties
CA2603458C (en) * 2006-09-21 2015-11-17 Smith International, Inc. Atomic layer deposition nanocoatings on cutting tool powder materials
US20080100202A1 (en) * 2006-11-01 2008-05-01 Cok Ronald S Process for forming oled conductive protective layer
JP5717967B2 (en) * 2006-11-13 2015-05-13 ザ・リージエンツ・オブ・ザ・ユニバーシティ・オブ・コロラド Molecular layer deposition method for producing organic or organic-inorganic polymers
US7776395B2 (en) * 2006-11-14 2010-08-17 Applied Materials, Inc. Method of depositing catalyst assisted silicates of high-k materials
US7749574B2 (en) 2006-11-14 2010-07-06 Applied Materials, Inc. Low temperature ALD SiO2
US20080119098A1 (en) * 2006-11-21 2008-05-22 Igor Palley Atomic layer deposition on fibrous materials
US20080138538A1 (en) * 2006-12-06 2008-06-12 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
US7781031B2 (en) * 2006-12-06 2010-08-24 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
US20080138624A1 (en) * 2006-12-06 2008-06-12 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
US20080248263A1 (en) * 2007-04-02 2008-10-09 Applied Microstructures, Inc. Method of creating super-hydrophobic and-or super-hydrophilic surfaces on substrates, and articles created thereby
US8236379B2 (en) 2007-04-02 2012-08-07 Applied Microstructures, Inc. Articles with super-hydrophobic and-or super-hydrophilic surfaces and method of formation
EP2219793A4 (en) 2007-10-17 2014-05-14 Univ Princeton Functionalized substrates with thin metal oxide adhesion layer
WO2009079571A2 (en) * 2007-12-17 2009-06-25 Life Technologies Corporation Methods for detecting defects in inorganic-coated polymer surfaces
US20130020507A1 (en) 2010-06-17 2013-01-24 Life Technologies Corporation Methods for Detecting Defects in Inorganic-Coated Polymer Surfaces
US11084311B2 (en) 2008-02-29 2021-08-10 Illinois Tool Works Inc. Receiver material having a polymer with nano-composite filler material
US7659158B2 (en) 2008-03-31 2010-02-09 Applied Materials, Inc. Atomic layer deposition processes for non-volatile memory devices
FI122032B (en) * 2008-10-03 2011-07-29 Teknologian Tutkimuskeskus Vtt Fiber product having a barrier layer and process for its preparation
KR20110100618A (en) * 2008-12-05 2011-09-14 로터스 어플라이드 테크놀로지, 엘엘씨 High rate deposition of thin films with improved barrier layer properties
FI20095947A0 (en) * 2009-09-14 2009-09-14 Beneq Oy Multilayer Coating, Process for Manufacturing a Multilayer Coating, and Uses for the Same
KR101714814B1 (en) * 2009-09-22 2017-03-09 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Method of applying atomic layer deposition coatings onto porous non-ceramic substrates
WO2011047210A2 (en) 2009-10-14 2011-04-21 Lotus Applied Technology, Llc Inhibiting excess precursor transport between separate precursor zones in an atomic layer deposition system
US8637123B2 (en) * 2009-12-29 2014-01-28 Lotus Applied Technology, Llc Oxygen radical generation for radical-enhanced thin film deposition
EP2580371A2 (en) 2010-06-08 2013-04-17 President and Fellows of Harvard College Low-temperature synthesis of silica
JPWO2012020771A1 (en) * 2010-08-13 2013-10-28 旭硝子株式会社 LAMINATE AND METHOD FOR PRODUCING LAMINATE
US11038144B2 (en) 2010-12-16 2021-06-15 Samsung Display Co., Ltd. Organic light-emitting display apparatus
TWI429526B (en) 2011-12-15 2014-03-11 Ind Tech Res Inst Low water-vapor permeable composite film and packaging structure
US20150099126A1 (en) 2012-04-25 2015-04-09 Konica Minolta, Inc. Gas barrier film, substrate for electronic device and electronic device
RU2600042C2 (en) * 2012-05-14 2016-10-20 Пикосан Ой Application of coating on fine particles using atomic deposition unit
TWI592310B (en) * 2012-10-18 2017-07-21 凸版印刷股份有限公司 Laminate, gas barrier film, and manufacturing method thereof
EP3092259A4 (en) * 2013-12-03 2017-07-26 Bar Ilan University Polyolefins having long lasting hydrophilic interfaces
KR20150109984A (en) * 2014-03-21 2015-10-02 삼성전자주식회사 Gas barrier film, refrigerator having the same and method of manufacturing the gas barrier film
WO2016011412A1 (en) 2014-07-17 2016-01-21 Ada Technologies, Inc. Extreme long life, high energy density batteries and method of making and using the same
WO2016012046A1 (en) * 2014-07-24 2016-01-28 Osram Gmbh Method for producing a barrier layer and carrier body comprising such a barrier layer
EP3176284B1 (en) 2014-07-29 2021-03-10 Toppan Printing Co., Ltd. Laminate body and manufacturing method thereof, and gas barrier film and manufacturing method thereof
US10420370B2 (en) * 2014-11-17 2019-09-24 R.J. Reynolds Tobacco Products Moisture barriers for paper materials
JP6011652B2 (en) * 2015-02-02 2016-10-19 凸版印刷株式会社 Gas barrier laminate and method for producing the same
WO2016209460A2 (en) 2015-05-21 2016-12-29 Ada Technologies, Inc. High energy density hybrid pseudocapacitors and method of making and using the same
US10692659B2 (en) 2015-07-31 2020-06-23 Ada Technologies, Inc. High energy and power electrochemical device and method of making and using same
US10364491B2 (en) 2016-11-02 2019-07-30 Georgia Tech Research Corporation Process to chemically modify polymeric materials by static, low-pressure infiltration of reactive gaseous molecules
TW201823501A (en) * 2016-11-16 2018-07-01 美商陶氏全球科技有限責任公司 Process for producing thin coatings on film
JP6568127B2 (en) * 2017-03-02 2019-08-28 株式会社Kokusai Electric Semiconductor device manufacturing method, program, and recording medium
US11024846B2 (en) 2017-03-23 2021-06-01 Ada Technologies, Inc. High energy/power density, long cycle life, safe lithium-ion battery capable of long-term deep discharge/storage near zero volt and method of making and using the same
US11038162B2 (en) 2017-05-31 2021-06-15 Alliance For Sustainable Energy, Llc Coated semiconductor particles and methods of making the same
US11344850B2 (en) * 2017-10-27 2022-05-31 Michael Tsapatsis Nanocomposite membranes and methods of forming the same
JP7003859B2 (en) * 2018-07-13 2022-01-21 住友金属鉱山株式会社 Manufacturing method of surface-coated near-infrared shielding fine particles and surface-coated near-infrared shielding fine particles
US11629403B2 (en) * 2018-10-19 2023-04-18 Rosemount Aerospace Inc. Air data probe corrosion protection
US11117346B2 (en) 2019-07-18 2021-09-14 Hamilton Sundstrand Corporation Thermally-conductive polymer and components
US11535958B2 (en) 2019-08-09 2022-12-27 Raytheon Technologies Corporation Fiber having integral weak interface coating, method of making and composite incorporating the fiber
CN112175220B (en) * 2020-09-03 2023-01-03 广东以色列理工学院 High-temperature-resistant modified polypropylene film and preparation method and application thereof
FR3119104B1 (en) * 2021-01-28 2024-02-02 Commissariat Energie Atomique Process for forming a metal-organic network
CN113564527B (en) * 2021-08-10 2022-06-07 中国科学院兰州化学物理研究所 Anti-irradiation hydrogen-free carbon film polymer lubricating material and preparation method and application thereof
CA3216897A1 (en) 2021-08-23 2023-03-02 Florian CARRE Spacer with moisture barrier
CN114318292B (en) * 2021-12-31 2024-03-29 中储粮成都储藏研究院有限公司 Method for coating flame-retardant film layer by chemical vapor deposition method
WO2023201094A2 (en) 2022-04-14 2023-10-19 Forge Nano, Inc. Methods of reactive drying a separator during battery manufacturing, dried separators, and batteries containing the separator
CN114907566B (en) * 2022-05-11 2023-03-14 江南大学 Polyimide-metal monoatomic composite material and preparation method and application thereof
CN114958036B (en) * 2022-06-30 2023-12-01 丰田自动车株式会社 Pearlescent pigment and preparation method thereof

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3597579A (en) * 1970-06-25 1971-08-03 Western Electric Co Method of trimming capacitors
JPS5825221B2 (en) * 1977-12-12 1983-05-26 株式会社クラレ FET reference electrode
JPS60103024A (en) * 1983-11-09 1985-06-07 Mitsui Toatsu Chem Inc Manufacture of aluminum hydroxide powder and alumina powder
US5271969A (en) * 1985-10-29 1993-12-21 Atsushi Ogura Method of manufacturing metal oxide ceramic composite powder
US5705265A (en) * 1986-03-24 1998-01-06 Emsci Inc. Coated substrates useful as catalysts
US5603983A (en) * 1986-03-24 1997-02-18 Ensci Inc Process for the production of conductive and magnetic transitin metal oxide coated three dimensional substrates
US4888203A (en) * 1987-11-13 1989-12-19 Massachusetts Institute Of Technology Hydrolysis-induced vapor deposition of oxide films
US5362667A (en) * 1992-07-28 1994-11-08 Harris Corporation Bonded wafer processing
US5273942A (en) 1990-10-19 1993-12-28 Rutgers University Ceramic powder useful in the manufacture of green and densified fired ceramic articles
US5306666A (en) 1992-07-24 1994-04-26 Nippon Steel Corporation Process for forming a thin metal film by chemical vapor deposition
US5389401A (en) * 1994-02-23 1995-02-14 Gordon; Roy G. Chemical vapor deposition of metal oxides
JP2776268B2 (en) * 1994-10-07 1998-07-16 王子製紙株式会社 Zinc-deposited substrate for metallized capacitor and method for producing the same
JPH09202963A (en) * 1995-08-25 1997-08-05 Abcor Inc Production of metallized island coated product without executing etching
US5681775A (en) 1995-11-15 1997-10-28 International Business Machines Corporation Soi fabrication process
CA2259691A1 (en) * 1996-07-11 1998-01-22 The University Of Cincinnati Electrically assisted synthesis of particles and films with precisely controlled characteristics
US5916365A (en) * 1996-08-16 1999-06-29 Sherman; Arthur Sequential chemical vapor deposition
US6090442A (en) 1997-04-14 2000-07-18 University Technology Corporation Method of growing films on substrates at room temperatures using catalyzed binary reaction sequence chemistry
KR100252049B1 (en) 1997-11-18 2000-04-15 윤종용 The atomic layer deposition method for fabricating aluminum layer
US6042929A (en) * 1998-03-26 2000-03-28 Alchemia, Inc. Multilayer metalized composite on polymer film product and process
US5985175A (en) * 1998-08-19 1999-11-16 Osram Sylvania Inc. Boron oxide coated phosphor and method of making same
US6200893B1 (en) 1999-03-11 2001-03-13 Genus, Inc Radical-assisted sequential CVD
US6475276B1 (en) * 1999-10-15 2002-11-05 Asm Microchemistry Oy Production of elemental thin films using a boron-containing reducing agent
US6203613B1 (en) * 1999-10-19 2001-03-20 International Business Machines Corporation Atomic layer deposition with nitrate containing precursors
JP4556282B2 (en) 2000-03-31 2010-10-06 株式会社デンソー Organic EL device and method for manufacturing the same
US20020003403A1 (en) 2000-04-25 2002-01-10 Ghosh Amalkumar P. Thin film encapsulation of organic light emitting diode devices
US20010052752A1 (en) 2000-04-25 2001-12-20 Ghosh Amalkumar P. Thin film encapsulation of organic light emitting diode devices
WO2002004477A2 (en) * 2000-07-06 2002-01-17 Cuno, Inc. Combination of microporous membrane and solid support for microdiagnostics
US6664186B1 (en) * 2000-09-29 2003-12-16 International Business Machines Corporation Method of film deposition, and fabrication of structures
AU2002217978A1 (en) * 2000-12-01 2002-06-11 Clemson University Chemical compositions comprising crystalline colloidal arrays
WO2002071506A1 (en) 2001-02-15 2002-09-12 Emagin Corporation Thin film encapsulation of organic light emitting diode devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9051441B2 (en) 2012-03-29 2015-06-09 Xerox Corporation Process for chemical passivation of polymer surfaces

Also Published As

Publication number Publication date
JP2004535514A (en) 2004-11-25
JP4295614B2 (en) 2009-07-15
CA2452656C (en) 2010-04-13
WO2003008110A1 (en) 2003-01-30
EP1425110B1 (en) 2014-09-03
US20040194691A1 (en) 2004-10-07
US9376750B2 (en) 2016-06-28
EP1425110A1 (en) 2004-06-09
EP1425110A4 (en) 2007-11-07

Similar Documents

Publication Publication Date Title
CA2452656A1 (en) A method of depositing an inorganic film on an organic polymer
JP2004535514A5 (en)
Mackus et al. From the bottom-up: toward area-selective atomic layer deposition with high selectivity
US11401385B2 (en) Ordered nanoscale domains by infiltration of block copolymers
Khan et al. Area-selective atomic layer deposition using Si precursors as inhibitors
George Atomic layer deposition: an overview
Moni et al. Vapor deposition routes to conformal polymer thin films
Avila et al. Real-time observation of atomic layer deposition inhibition: Metal oxide growth on self-assembled alkanethiols
Liao et al. Self-assembly of organic monolayers on aerosolized silicon nanoparticles
US20160351443A1 (en) Inorganic ald film on an organic polymer surface
Kim et al. Applications of atomic layer deposition to nanofabrication and emerging nanodevices
George et al. Surface chemistry for molecular layer deposition of organic and hybrid organic− inorganic polymers
Kemell et al. Surface modification of thermoplastics by atomic layer deposition of Al2O3 and TiO2 thin films
Xu et al. A DFT study of the Al2O3 atomic layer deposition on SAMs: effect of SAM termination
Chopra et al. Selective growth of titanium nitride on HfO2 across nanolines and nanopillars
Liang et al. Nanocoating hybrid polymer films on large quantities of cohesive nanoparticles by molecular layer deposition
EP2955017A1 (en) Gas barrier laminate having excellent moisture barrier properties
Niinistö et al. In situ quadrupole mass spectrometry study of atomic-layer deposition of ZrO2 using Cp2Zr (CH3) 2 and water
TW201315601A (en) Layered product, gas barrier film, and manufacturing method thereof
Zhang et al. Area-selective molecular layer deposition of polyimide on Cu through Cu-catalyzed formation of a crystalline interchain polyimide
Kim et al. Nanopatterned area-selective vapor deposition of PEDOT on SiO2 vs Si-H: improved selectivity using chemical vapor deposition vs molecular layer deposition
Zheng et al. Area-selective atomic layer deposition of TiN using trimethoxy (octadecyl) silane as a passivation layer
Vähä-Nissi et al. Growth of thin Al2O3 films on biaxially oriented polymer films by atomic layer deposition
Zdanovich et al. Formation of Ziegler‐type catalytic systems on the surface of multi‐walled carbon nanotubes for the production of composite materials by in situ polymerization
Foroughi-Abari et al. Atomic layer deposition for nanotechnology

Legal Events

Date Code Title Description
EEER Examination request
MKEX Expiry

Effective date: 20220718